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Typical Application
VOUTPUTB
VOUTPUTA
2
OUTPUTA
A3425
VSupply 1 3
VCC OUTPUTB
100 Ω
GND
4
0.1 uF
A3425DS-Rev. 7
Ultra-Sensitive Dual-Channel Quadrature
A3425
Hall-Effect Bipolar Switch
Description (continued)
quadrature. The patented chopper stabilization technique cancels that are symmetrical between the two switches.
offsets in each channel, and provides stable operation over the The A3425 is available in a plastic 8-pin SOIC surface mount
operating temperature and voltage ranges. An on-chip regulator package (L) and a plastic 4-pin SIP (K), both in two operating
allows the use of this device over a wide operating voltage range. temperature ranges. Each package is available in a lead (Pb) free
Post-assembly factory programming provides sensitive switchpoints version with 100% matte tin plated leadframe.
Selection Guide
Part Number Packing* Mounting Ambient, TA
A3425EK-T Bulk, 500 pieces/bag
4-pin SIP through hole
A3425EKTN-T 13-in. reel, 4000 pieces/reel
–40ºC to 85ºC
A3425EL-T Bulk, 500 pieces/bag
8-pin SOIC surface mount
A3425ELTR-T 13-in. reel, 3000 pieces/reel
A3425LK-T Bulk, 98 pieces/bag
4-pin SIP through hole
A3425LKTN-T 13-in. reel, 4000 pieces/reel
–40ºC to 150ºC
A3425LL-T Bulk, 500 pieces/bag
8-pin SOIC surface mount
A3425LLTR-T 13-in. reel, 3000 pieces/reel
*Contact Allegro for additional packing options.
VCC
Programmable
Regulator
Trim
8 Bits
Channel A
4 Bits
Element
E1 Low- Output
Amp Pass
Filter Drive
Channel B
4 Bits
OUTPUTB
Sample and Hold
Hall
Dynamic Offset
Cancellation
Element
E2 Low- Output
Amp Pass
Filter Drive
GND
OPERATING CHARACTERISTICS Valid over operating temperature ranges unless otherwise noted; typical data applies to
VCC = 12 V, and TA = 25ºC
Characteristic Symbol Test Conditions Min. Typ. Max Units
ELECTRICAL CHARACTERISTICS
Supply Voltage1 VCC Operating; TA ≤ 150°C 3.3 – 18 V
Output Leakage Current IOUTPUT(OFF) Either output – <1 10 μA
Output Rise Time tr CLOAD = 20 pF, RLOAD = 820 Ω – 1.8 – μs
Output Fall Time tf CLOAD = 20 pF, RLOAD = 820 Ω – 1.2 – μs
ICC(OFF) B < BRP(A) ,B < BRP(B) – 3.5 6.0 mA
Supply Current
ICC(ON) B > BOP(A) ,B > BOP(B) – 4.0 6.0 mA
Both outputs; IOUTPUT(SINK) = 20 mA; B > BOP(A),
Low Output Voltage VOUTPUT(ON) – 160 500 mV
B > BOP(B)
Output Sink Current IOUTPUT(SINK) – – 20 mA
Output Sink Current, Continuous2 IOUTPUT(SINK)C TJ < TJ(max) ,VOUTPUT = 12 V – – 70 mA
Output Sink Current, Peak3 IOUTPUT(SINK)P t < 3 seconds – – 220 mA
Chopping Frequency fC – 340 – kHz
TRANSIENT PROTECTION CHARACTERISTICS
Supply Zener Voltage VZ ICC = 15 mA 28 33 37 V
Supply Zener Current4 IZ VS = 28 V – – 9.0 mA
Reverse-Battery Current IRCC VRCC = –18 V, TJ < TJ(max) – 2 15 mA
OPERATING CHARACTERISTICS (continued) Valid over operating temperature ranges unless otherwise noted; typical
data applies to VCC = 12 V, and TA = 25ºC
EMC
Contact Allegro MicroSystems for EMC performance.
20
19
18 VCC(max)
17
Maximum Allowable VCC (V)
16
15
14 Package L, 4-layer PCB
13 (RθJA = 80 ºC/W)
12
11 Package L, 1-layer PCB
10 (RθJA = 140 ºC/W)
9
8 Package K, 1-layer PCB
7 (RθJA = 177 ºC/W)
6
5
4
3 VCC(min)
2
20 40 60 80 100 120 140 160 180
Temperature (ºC)
1300
P
1200 (R ack
θJ ag
1100 A = e
1000 80 L, 4
ºC -la
900 Pa /W ye
(R
cka ) rP
800 θJA
ge C
B
L
= 1 , 1-
700 40 lay
ºC er P
600 Pac /W
) CB
500 (R kage K
θJA = , 1-
400 177 la
ºC/ yer PC
300 W) B
200
100
0
20 40 60 80 100 120 140 160 180
Temperature, TA (°C)
Regulator
Sample and Hold
Low-
Amp Pass
Filter
V+
VOUTPUT(OFF)
Switch to High
Switch to Low
VOUTPUT
VOUTPUT(ON)(sat)
B+
BOP
BRP
BHYS
Channel A
M agnetic Field
at Hall Element E1
Channel B
M agnetic Field
at Hall Element E2
Channel A
Output Signal
at OUTPUTA
Channel B
Output Signal
at OUTPUTB
VOUTPUTB
VOUTPUTA
2
OUTPUTA
A3425
VSupply 1 3
VCC OUTPUTB
GND
0.1 uF 4
Regulated supply
VOUTPUTB
VOUTPUTA
2
OUTPUTA
A3425
VSupply 1 3
VCC OUTPUTB
100 Ω
GND
4
0.1 uF
Unregulated supply
The device must be operated below the maximum junction Example: Reliability for VCC at TA = 150°C, package L, using
temperature of the device, TJ(max). Under certain combinations of minimum-K PCB
peak conditions, reliable operation may require derating sup-
Observe the worst-case ratings for the device, specifically:
plied power or improving the heat dissipation properties of the
RθJA = 140 °C/W, TJ(max) = 165°C, VCC(max) = 18 V, and
application. This section presents a procedure for correlating
ICC(max) = 6 mA.
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.) Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate ΔTmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, This provides the allowable increase to TJ resulting from internal
K, of the printed circuit board, including adjacent devices and power dissipation. Then, invert equation 2:
traces. Radiation from the die through the device case, RθJC, is
relatively small component of RθJA. Ambient air temperature, PD(max) = ΔTmax ÷ RθJA = 15°C ÷ 140 °C/W = 107 mW
TA, and air motion are significant external factors, damped by Finally, invert equation 1 with respect to voltage:
overmolding.
VCC(est) = PD(max) ÷ ICC(max) = 107 mW ÷ 6 mA = 18 V
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental The result indicates that, at TA, the application and device can
relationships used to estimate TJ, at PD. dissipate adequate amounts of heat at voltages ≤VCC(est).
PD = VIN × IIN (1) Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
ΔT = PD × RθJA (2) RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
TJ = TA + ΔT (3)
PD = VCC × ICC = 12 V × 4 mA = 48 mW
ICC(off) ICC(off)
8 8
7 7
6 6
5 3.3 V
Current (mA)
Current (mA)
5
-40°C
4 18 V
4
25°C
3 150°C 3
2 2
1 1
0 0
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
ICC(on) ICC(on)
8 8
7 7
6 6
5
Current (mA)
5
Current (mA)
-40°C
4 4 3.3 V
25°C
18 V
3 150°C 3
2 2
1 1
0 0
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
400
Vsat (mV)
300 Ch. A
Ch. B
200
100
0
-50 0 50 100 150 200
Temperature (°C)
20 20
BOP BOP
Switchpoint (G)
Switchpoint (G)
10 10 3.3 V
-40°C
0 0 12 V
BRP 25°C BRP
18 V
-10 150°C -10
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
20 20
BOP BOP
Switchpoint (G)
Switchpoint (G)
10 10 3.3 V
-40°C
0 BRP 25°C 0 BRP 12 V
150°C 18 V
-10 -10
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
Temperature (°C)
VCC (V)
25 25
BOP - BRP (G)
BOP - BRP (G)
20 20
-40°C 3.3 V
15 25°C 15 12 V
150°C 10 18 V
10
5
5
0
0 -50 0 50 100 150 200
0 5 10 15 20
VCC (V) Temperature (°C)
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
20 20
Ch. A - Ch. B (G)
Ch. A - Ch. B (G)
10 10
-40°C 3.3 V
0 25°C 0 12 V
150°C -10 18 V
-10
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
30 30
20 20
10 10
BOP + BRP (G)
30 30
20 20
10 10
BOP + BRP (G)
0 -40°C 0 3.3 V
25°C 12 V
-10 -10
150°C 18 V
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
ICC(off) ICC(off)
8 8
7 7
6 6
5 3.3 V
Current (mA)
Current (mA)
5
-40°C
4 18 V
4
25°C
3 150°C 3
2 2
1 1
0 0
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
ICC(on) ICC(on)
8 8
7 7
6 6
5
Current (mA)
5
Current (mA)
-40°C
4 4 3.3 V
25°C
18 V
3 150°C 3
2 2
1 1
0 0
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
400
Vsat (mV)
300 Ch. A
Ch. B
200
100
0
-50 0 50 100 150 200
Temperature (°C)
20 20
BOP BOP
Switchpoint (G)
Switchpoint (G)
10 10 3.3 V
-40°C
0 0 12 V
BRP 25°C BRP
18 V
-10 150°C -10
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
20 20
BOP BOP
Switchpoint (G)
Switchpoint (G)
10 10 3.3 V
-40°C
0 BRP 25°C 0 BRP 12 V
150°C 18 V
-10 -10
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
Temperature (°C)
VCC (V)
25 25
BOP - BRP (G)
BOP - BRP (G)
20 20
-40°C 3.3 V
15 25°C 15 12 V
150°C 10 18 V
10
5
5
0
0 -50 0 50 100 150 200
0 5 10 15 20
VCC (V) Temperature (°C)
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
20 20
Ch. A - Ch. B (G)
Ch. A - Ch. B (G)
10 10
-40°C 3.3 V
0 25°C 0 12 V
150°C -10 18 V
-10
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
30 30
20 20
10 10
BOP + BRP (G)
30 30
20 20
10 10
BOP + BRP (G)
0 -40°C 0 3.3 V
25°C 12 V
-10 -10
150°C 18 V
-20 -20
-30 -30
0 5 10 15 20 -50 0 50 100 150 200
VCC (V) Temperature (°C)
.208 5.28
.203 5.16
D .0394 1.00 C
NOM
.0828 2.10 .063 1.60
D
NOM .059 1.50
.0520 1.32
.138 3.51 NOM B
.133 3.38 D
E1 E2
.033 0.84
.045 1.14 A NOM
MIN
1 2 3 4
.019 0.48
.014 0.36 .050 1.27
NOM
Dimensions in inches
Millimeters in brackets, for reference only
Case dimensions exclusive of mold flash or gate burrs
Mold flash .010 [0.25] MAX, gate burr .008 [0.20] MAX, dambar protrusion .004 [0.10] MAX
Exact case and lead configuration at supplier discretion within limits shown
A Dambar removal protrusion (8X)
B Ejector mark on opposite side
C Active Area Depth .0165 [0.42] NOM
D Hall elements E1, E2 (not to scale)
6.20 .244
5.80 .228
0.25 [.010] M B M
5.00 .197
A
4.80 .189
D 1.96 .077
NOM
D 1.00 .039 8º
NOM 0º
8 B C
0.25 .010
0.17 .007
D 1.96 .077
E1 E2
NOM
4.00 .157
3.80 .150
1.27 .050
A
0.40 .016
1 2
D 1.40 .055
NOM 0.25 .010
8X C SEATING PLANE
SEATING
0.10 [.004] C PLANE GAUGE PLANE