Professional Documents
Culture Documents
v03.0514
0 -10
7 9 11 13 15 17 19 21 23 7 9 11 13 15 17 19 21 23
FREQUENCY (GHz) FREQUENCY (GHz)
2Fo
15
16
OUTPUT POWER (dBm)
5
12 4Fo
-5
4.5V
8 5.0V
5.5V -15
4 3Fo
-25
Fo
0 -35
7 9 11 13 15 17 19 21 23 7 9 11 13 15 17 19 21 23
FREQUENCY (GHz) FREQUENCY (GHz)
Output Power vs. Input Power Supply Current vs. Input Power
20 105
15 100
OUTPUT POWER (dBm)
10
95
5
Idd (mA)
90
0
85
-5
8GHz
14GHz 80
-10 20GHz
75
-15
-20 70
-10 -8 -6 -4 -2 0 2 4 6 8 10 -10 -8 -6 -4 -2 0 2 4 6 8 10
Input Return Loss vs. Temperature Output Return Loss vs. Temperature
0 0
FREQ. MULTIPLIERS - ACTIVE - SMT
+25C
-4 -4 +85C
-40C
RETURN LOSS (dB)
-12 -12
+25C
-16 +85C -16
-40C
-20 -20
3 4 5 6 7 8 9 10 11 12 7 9 11 13 15 17 19 21 23
FREQUENCY (GHz) FREQUENCY (GHz)
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER
50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2]
[1] H573
HMC573LC3B Alumina, White Gold over Nickel MSL3
XXXX
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Pin Description
Pin Number Function Description Interface Schematic
FREQ. MULTIPLIERS - ACTIVE - SMT
Application Circuit
Component Value
C1, C2 100 pF
C3, C4 1,000 pF
C5, C6 2.2 µF
Evaluation PCB