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v04.0210
SMT GaAs HBT MMIC x16 ACTIVE
FREQUENCY MULTIPLIER, 9.9 - 11.0 GHz OUTPUT
7
6
-10 5
-15
+25 C
+85 C
-40 C
4
3
2
-20 dBm
-15 dBm
-10 dBm
-5 dBm
5
0 dBm
1 +5 dBm
-10 -40 C
RETURN LOSS (dB)
7
-15
6
5 -20
4 -25
3 Vcc=4.5V
Vcc=5.0V -30
2 Vcc=5.5V
-35
1
0 -40
9.6 10 10.4 10.8 11.2 11.6 0 0.5 1 1.5 2 2.5 3
-5
RETURN LOSS (dB)
-10
+25 C
-15 +85 C
-40 C
-20
8 9 10 11 12 13 14 15
FREQUENCY (GHz)
0 -20
-40
-10
Pin= 0dBm
-60 Pin= -10dBm
-20
-80
5 -30
-40
-100
-120
-50 -140
FREQ. MULTIPLIERS - ACTIVE - SMT
-160
-60 2 3 4 5 6 7
10 10 10 10 10 10
0 2 4 6 8 10 12 14 16 18 20 22 24 26
OFFSET FREQUENCY (Hz)
FREQUENCY (GHz)
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3]
[1] H445
HMC445LP4 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1
XXXX
[2] H445
HMC445LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Pin Description
Pin Number Function Description Interface Schematic
The pins are not connected internally; however, all
1, 2, 5 - 14,
N/C data shown herein was measured with these pins
17, 18, 20 - 24
connected to RF/DC ground externally.
5
external DC voltage applied to RF IN.
Evaluation PCB