EXPERIMENT 2

Aim :- Soldering and desoldering of electronics component on PCB.

Apparatus required:-Solder, Flux, soldering Iron, PCB

Theory:-

Solder :- Solder is a fusible metal alloy used to join together metal workpieces and
having a melting point below that of the work pieces.

The alloy used for soldering consist of tin(Sn) and lead(Pb). Melting point of this
alloy depends on the fraction of Sn, Pb.melting of of some commonly used
composition of Sn and Pb is given below

Fig 2.1 Solder

Sn/Pb

63/37 :-melts at 1830C(361.40F) (eutectic:-the only mixture that melts at a

point,instead of over a range)
60/40 :-melting point ranges from 183-2900C

FLUX :- In high-temperature metal joining processes (welding, brazing and

soldering), the primary purpose of flux is to prevent oxidation of the base and filler
materials. Tin-lead solder (e.g.) attaches very well to copper, but poorly to the
various oxides of copper, which form quickly at soldering temperatures. Flux is a
substance which is nearly inert at room temperature, but which becomes
strongly reducing at elevated temperatures, preventing the formation of metal
oxides. Additionally, flux allows solder to flow easily on the working piece rather
than forming beads as it would otherwise.

The role of a flux in joining processes is typically dual: dissolving of the oxides on
the metal surface, which facilitates wetting by molten metal, and acting as an
oxygen barrier by coating the hot surface, preventing its oxidation. In some
applications molten flux also serves as a heat transfer medium, facilitating heating
of the joint by the soldering tool or molten solder.

Fluxes for soft soldering are typically of organic nature, though inorganic fluxes,
usually based on halogenides and/or acids, are also used in non-electronics
applications. Fluxes for brazing operate at significantly higher temperatures and
are therefore mostly inorganic; the organic compounds tend to be of supplementary
nature.
 Fig 2.2 Soldering flux

Desoldering:-In electronics, desoldering is the removal of solder and components

from a circuit board for troubleshooting, repair, replacement, and salvage.
Specialized tools, materials, and techniques have been devised to aid in the de-
soldering process. For desoldering we heat the solder upto melting temperature and
then use desoldering pump.
 Fig 2.3 Desoldering

A desoldering pump, colloquially known as a solder sucker, is a manually-

operated device which is used to remove solder from a printed circuit board. There
are two types: the plunger style and bulb style. (An electrically-operated pump for
this purpose would usually be called a vacuum pump.)

The plunger type has a cylinder with a spring-loaded piston which is pushed down
and locks into place. When triggered by pressing a button, the piston springs up,
creating suction that sucks the solder off the soldered connection. The bulb type
creates suction by squeezing and releasing a rubber bulb.

The pump is applied to a heated solder connection, then operated to suck the solder
away

Preacautions :-

1 Never touch the element or tip of the soldering iron. It is very hot (about 400°C)
and will burn
 2 Hold wires to be heated with tweezers, pliers or clamps to avoid receiving
burns from objects that are heated.

3 Turn unit off or unplug the iron when not in use .

4 always return the soldering iron to its stand when not in use. Never put it down
on your workbench.

Result and conclusion :- write in your own words.