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Micro Component

System
Model Name MM-E330D

Model Code MM-E330D/EN

SERVICE MANUAL
Micro Component System Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram
MM-E330D

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
2. Product Specification ......................................................................................................................... 2 − 1
2.1. Product Feature ....................................................................................................................... 2 − 1
2.2. Specifications.......................................................................................................................... 2 − 2
2.3. Specifications Analysis ............................................................................................................. 2 − 4
2.4. Accessories ............................................................................................................................ 2 − 5
2.4.1. Supplied Accessories ................................................................................................... 2 − 5
3. Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1. Main Set Disassembly and Reassembly........................................................................................ 3 − 1
3.2. DECK Disassembly and Reassembly ........................................................................................... 3 − 7
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1. No Power................................................................................................................... 4 − 2
4.1.2. No Output .................................................................................................................. 4 − 4
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 − 5
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 − 5
4.2.2. Check AMP in Power Protection .................................................................................... 4 − 6
4.3. MICOM, MPEG Initialization & Update ...................................................................................... 4 − 7
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 − 8
4.4.1. The inserting method of Region Code after replacing the Main PBA ..................................... 4 − 8
5. PCB Diagram ................................................................................................................................... 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. FRONT PCB Top .................................................................................................................... 5 − 2
5.2.1. Pin Connection ........................................................................................................... 5 − 3
5.3. FRONT PCB Bottom ............................................................................................................... 5 − 4
5.4. MAIN PCB Top ...................................................................................................................... 5 − 5
5.4.1. Pin Connection ........................................................................................................... 5 − 6
5.4.2. Test Point Wave Form .................................................................................................. 5 − 7
5.5. MAIN PCB Bottom.................................................................................................................. 5 − 8
5.6. SMPS PCB Top....................................................................................................................... 5 − 9
5.6.1. Pin Connection ........................................................................................................... 5 − 10
5.7. SMPS PCB Bottom .................................................................................................................. 5 − 11
6. Schematic Diagram ........................................................................................................................... 6 − 1
6.1. Overall Block Diagram ............................................................................................................. 6 − 1
6.2. FRONT ................................................................................................................................. 6 − 2

i Copyright© 1995-2013 SAMSUNG. All rights reserved.


Contents

6.3. MAIN-1................................................................................................................................. 6 − 3
6.3.1. Test Point Wave Form .................................................................................................. 6 − 4
6.4. MAIN-2................................................................................................................................. 6 − 5
6.5. MAIN-3................................................................................................................................. 6 − 6
6.6. MAIN-4................................................................................................................................. 6 − 7
6.7. SMPS .................................................................................................................................... 6 − 8

Copyright© 1995-2013 SAMSUNG. All rights reserved. ii


1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning:


Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturer’s warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test:

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies.

With the unit completely reassembled, plug the AC cord directly into a AC outlet. With the unit’s power switched from
the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - screwheads, metal cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


1. Precaution

5) Insulation Resistance Cold Check:


(1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example: screwheads, metal cabinets, antenna port, etc. If any of the exposed metallic parts has a return path to the
chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist. See Figure 1.2
Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC
and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage.
Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice:


Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the original—even if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement
components that have the same ratings, especially for flame resistance and dielectric strength specifications. A
replacement part that does not have the same safety characteristics as the original might create shock, fire or other
hazards.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-2


1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the unit’s AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :


Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying power–this is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-4


2. Product Specification

2. Product Specification

2.1. Product Feature

■ Power
• 2.0 ch : 70 W Total RMS / 800 W PMPO ( Front : 35W/ch)
• TI Amp

■ Special Functions in 2012


• Total Ripping: Record all tracks of DISC ,the file is copied into USB device totally
• Connectivity
• USB Host
• Portable Audio In (3.5 phi Stereo Jack)
• AUX
• Disc
• Type : 1 Tray
• Compatible
- E330 : MP3, CD / CD-R, RW, WMA
- E330D : DVD, DVD±R, DVD±RW, MP3, CD / CD-R, RW, WMA

2-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.2. Specifications

■ MM-E330 Basic Specifications


Weight 1.44 Kg

Dimensions 200 (W) x 142 (H) x 207 (D) mm


General Operating Temperature
+5 °C ~ +35 °C
Range

Operating Humidity Range 10 % to 75 %

Signal/noise ratio 62 dB

FM Tuner Usable sensitivity 10 dB

Total harmonic distortion 0.4 %

CD : 12 cm (COMPACT Reading Speed : 4.8 ~ 5.6 m/sec.


Disc (1 Disc)
DISC) Maximum Play Time : 74 min.

Speaker output 35 W (8 Ω) x 2 (MM-E330)

Frequency range 20 Hz ~ 20 KHz

Amplifier S/N Ratio 70 dB

Channel separation 60 dB

Input sensitivity (AUX) 900 mV

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-2


2. Product Specification

■ MM-E330D / MM-E320D Basic Specifications


Weight 1.44 Kg

Dimensions 200 (W) x 142 (H) x 207 (D) mm


General Operating Temperature
+5 °C ~ +35 °C
Range

Operating Humidity Range 10 % to 75 %

Signal/noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.6 %

Reading Speed : 3.49 ~ 4.06 m/sec.


DVD (Digital Versatile Disc)
Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Disc (1 Disc)
CD : 12 cm (COMPACT Reading Speed : 4.8 ~ 5.6 m/sec.
DISC) Maximum Play Time : 74 min.

Y : 1.0 Vp-p (75 Ω load)

Video/Audio Component Video Pr : 0.70 Vp-p (75 Ω load)

Pb : 0.70 Vp-p (75 Ω load)

35 W (8 Ω) x 2 (MM-E330D)
Front speaker output
10 W (4 Ω) x 2 (MM-E320D)

Frequency range 20 Hz ~ 20 KHz


Amplifier
S/N Ratio 70 dB

Channel separation 60 dB

Input sensitivity (AUX) 900 mV

NOTE

• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.
• Design and specifications are subject to change without prior notice.
• For the power supply and Power Consumption, refer to the label attached to the product.

2-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.3. Specifications Analysis

Model Name MM-E320D / MM-E330D / MM-E330 MX-C630D

Photo

2.0 ch 70 W (E330 / E330D)


OUTPUT POWER 2.0 ch 200 W
2.0 ch 20 W (E320D)

FRONT DISPLAY VFD VFD

SLEEP O O

DIMMER O O

CD/DVD DVD/CD DVD

MP3 O O

USB HOST O O

CD RIPPING O O

TAPE X O

AUDIO IN O O

HEADPHONE O O

FM / RDS FM FM

REMOTE KEY 45 KEY / 23 KEY 32 KEY

DUAL VOLTAGE O O

SPK IMPENDANCE 8 Ohm 4 Ohm

TIP

O : Feature Included
X : Not Included

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-4


2. Product Specification

2.4. Accessories

2.4.1. Supplied Accessories

Accessories Item Item code Remark

Remote Control AH59-02427A

Batteries (AAA) 4301-000115

Local Samsung Dealer

FM Antenna AH42-00021A

AH68-02664F
User’s Manual AH68-02664G
AH68-02664H

2-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. Main Set Disassembly and Reassembly


CAUTION

• Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

• Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

• In order to assemble reverse the order of disassembly.

Description Description Photo

1. Unfasten 10 screws of the set.


: BH 3 * 10 BLACK

CAUTION

Be careful not to make any scratches as you remove them.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-1


3. Disassembly and Reassembly

Description Description Photo

2. Unconnected the wire.


Wire

3. Separate the Top panel.

3-2 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

4. Unfasten 6 Screws in SMPS and MAIN ASSY.


: BH 3 * 8 SILVER

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-3


3. Disassembly and Reassembly

Description Description Photo

5. Detach two hooks at the same time.

Hook2

Hook1

6. Unfasten 4 screws.
: BH 3 * 8 SILVER

3-4 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

7. Unfasten 2 screws.
: BH 3 * 8 SILVER

8. Separate the DECK and BOTTOM part.

9. Unfasten 4 screws.
: BH 3 * 10 BLACK

10. Separate the FRONT ASSY.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-5


3. Disassembly and Reassembly

Description Description Photo

11. Unfasten 2 screws, Seperate the KEY ASSY.


: BH 3 * 8 SILVER

3-6 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

3.2. DECK Disassembly and Reassembly

Description Description Photo

1. Separate Tray - Disc from DECK.


OP
HOOK
EN/CLOS E

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-7


3. Disassembly and Reassembly

Description Description Photo

2. Lift up Holder-Cable, separate Traverse-DECK.

HOOK

3-8 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

Holde r-Ca ble

Holde r-Chuck Holde


Tra y-
r-Ca
disble
c

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-9


4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz

Voltage/DIV 1 Vol/DIV 1 Vol/DIV 1 Vol/DIV

TIME/DIV 1 uS/DIV 10 ns/DIV 0.1 uS/DIV

4-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.1.1. No Power

No P owe r

Che ck MAIN P CB No Che ck MAIN P CB No


Che ck or re pla ce S MP S .
UIC1 UD2 5.3V? P CN 14 # (5.3 V)?

Ye s Ye s

Che ck VFD No
Volta ge in MAIN P CB P CN1 Che ck or re pla ce S MP S .
6 ~ 8 #?

Ye s

(1)
Che ck re s e t IC circuit in No Che ck s igna l
MAIN PC B UX1/2 pa rt ok? a nd s igna l pa tte rn.

* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-1.

Che ck pa tte rn or re pla ce


MICOM IC.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-2


TIC1

NC

LPI
TUAR1

FMI
OPTION

/RST
100OHM 1 2 TUR6

RFGND
TU_RST

4-3
3 4 6 20 10KOHM
TU_CE /SEN NC 1/16W
5 6 7 19
TU_CLK SCLK MGND1 GPO1
7 8 8 18
TU_DA SDIO GPO2/INT- TU_RDS

SI4705-B20-ZM0R
9 17 TR1
RCLK GPO3/DCLK 100OHM
10 16
VIO DFS
TR2

7
5
3
1
0OHM

LOUT
ROUT

DGND VDD
DOUT

GND
4. Troubleshooting

FM
TC9

TU3.3V_P W

TAR1
(1) TU3.3V_P W
11
12
13
14
15

10KOHM
22UF

8
6
4
TUC1 TC13

(1)
FM
(TO MPEG )
(TO MPEG )
(TO MPEG )
100NF 10UF

2 DGND
TR3
0OHM
UCN3

(FROM MPEG )

DGND

0.01OHM
TBD1
10UF

10UF
INSW_370

RESET_P
STB
OUTSW_370
(1)

VFD_CE
RXD
ACK

VFD_DO
VFD_CLK

TC2L

TC2R

VD3.3VA_PW
U_5V_PW

U_5V_PW
UC1
TC1R 220PF UC8
(1)

3 1
22PF 22PF
UX2
100NF

UC2 UR38

UIC1
UC9

220PF 10KOHM 10MHZ


UX1

OPEN_UCN2
UR28

TC1L UR27
22PF 32.768HZ
UC3 UR37
220PF 10KOHM 1MOHM 3 Q2 Q1 2

2
4
6
8
7
5
3
1
DGND

100OH M

<Fig. 4-1>
TR1L

TR1R
100OH M
150OHM

DGND
TUR3
33KOHM
4 Q3 Q0 1

UAR2

UAR4
100OH M
TUR4

1
3
5
7
8
6
4
2

UCN1
33KOHM

* 5.4. Ma in PCB Top


100OHM
1 2

DGND
3 4
5 6

USB_EN

USB_FL G
7 8

(1)
UAR6
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49

100OHM

D5V_PW
UBR1 UPC1
10KOHM
CF2
CF1

VDD1
VSS1
/RES

UAR5 100NF
DGND

P10/SO0
P82/AN2
P81/AN1
P80/AN0
XT2/AN11
XT1/AN10

1 48 100OHM
UBC1 10UF P12/SCK0 P83/AN3
P11/SI0/SB0

1 2

TUNER_R
2

TUNER_L
P13/SO1 P84/AN4
47
P 7 3 / I NT3 / T0 I N

3 4
UBC2 10UF 3 46
P14/SI1/SB1 P85/AN5

IC3 0
5 6
P72/INT2/T0IN/NKIN
P71/INT1/T0HCP/AN9
P70/INT0/T0LCP/AN8

4 P15/SCK1 P86/AN6
45
UBR2 7 8 UR9
UC18100NF 5 P16/T1PWML PC0
44 8 7 1KOHM
10KOHM UC19100NF 6 43 6 5
DGND
P17/T1PWMH/BUZ PC1

4
5
UC20100NF 7 42 4 3 TUAR2
PWM2 PC2
UC21100NF 8 41 2 1 100OHM
PWM3 PC3

IN
9 VDD2 PC4
40
UC33 100NF
UIC1

EN/EN#
UC4 10 VSS2 PC5/DBGP0
39
100NF

/FLT
11 38

UBIC1
OUT
P00 PC6/DBGP1

GND
UC22100NF 12 37
P01 PC7/DBGP2
* 6.3. Ma in-1

UC23100NF 13 36

3
2
1
P02 VDD3

Copyright© 1995-2013 SAMSUNG. All rights reserved.


UC24100NF 14 35 UC32
P03 VSS3

PCN 1
USB_FLG 100OHM
P20/INT4/T1IN/INT6
P24/INT5/T1IN/INT7
4. Troubleshooting

4.1.2. No Output

No output

Che ck MAIN P CB No
P CN1 3# : +25V? Che ck or re pla ce S MP S .

Ye s

Che ck No
MAIN P CB MIC1 (88/89#) Che ck MIC1 s igna l input
output s igna l? a nd s igna l pa tte rn.

Ye s

Che ck MAIN P CB
IC30L/R (TAS 5342ADDV) No Che ck IC30 (TAS 5342ADDV)
a nd input a nd output sig na l input a nd s igna l pa tte rn.
sig na l?

Ye s

Che ck MICOM IC (UIC1) No Che ck s igna l input a nd s igna l


a nd MIC1 MP EG (ES S ) pa tte rn or re pla ce S MP S .
sig na l?

Ye s

Re pla ce UIC1 a nd MIC1.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-4


4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

■ Cases of the SMPS Protection.


1) If there is over current at the AMP IC. (Speaker Wire Short)

2) If temperature of the AMP IC is over 150 ℃.

3) There is no power supply for amp.

■ Protection Circuit operates when power problem occurs in the SMPS.


Protection
Location Pin No. Remark
Open Short

CNM801
+ 5.4 V (4 #) X X
(P4)
SMPS PCB
CNM801 + PVDD (E330/330D :
X O
(P3) + 25 V (3 #)

CNM801
+ 5 V, power on (5 #) X O
(P5)

4-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.2.2. Check AMP in Power Protection

If you think, there are problems at the AMP Part, you can check the PCB without disassembling the set.

CAUTION

Do not connect the power cord during the test!

Measurement Resistance using Tester

R CH 18 kΩ

L CH 18 kΩ

If Measured Resistance is very different from above


numbers, There is a Problem.
→ AMP Part Problem

2 CH S P E AK E R O U T
SET

2CH S P EAKER OUTP UT

RIGHT

GND

LEF T

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-6


4. Troubleshooting

4.3. MICOM, MPEG Initialization & Update

■ Micom Reset & MPEG Reset


• During “No Disc” Displayed, push the “STOP” button 5 second. After displayed “INITIALIZE” set will power
off automatically.

■ Micom Update (Only for Flash Micom)


• Method 1) MAIN PCB OPEN_UCN2 for update JIG. To update Micom, it need Computer, Rom Writer, USB Cables.
• Method 2) Insert USB Memory, and play. “Updating” will be displayed. Set will be power off when finish.

■ Micom & MPEG Version Check


1) Power On.

2) CD open status.

3) Push the number NEXT for 5 seconds, check the Micom version.

4) Push the number PREVIOUS for 5 seconds, check the MPEG version.

■ MPEG Update Method


1) Prepare Rom file at USB Memory.

2) Insert USB Memory, and play. “Updating” will be displayed and glisten. Set will be power off → on.

3) The disc is automatically ejected. (If you use USB memory, detach USB memory.)

4-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.4. Buyer-Region Code Setting Method

4.4.1. The inserting method of Region Code after replacing the Main PBA

NOTE

• When replacing the Main PBA and System Micom should be inserted the region code.

• The set is not working properly if you don't insert the region code.

• The region code is inserted by the remote control.

1) Press “FUNCTION” button several times to change to AUX mode.

<MM-E330> <MM-E320D / MM-E330D>

2) Press “ENTER” button more than 5 seconds.

<MM-E330> <MM-E320D / MM-E330D>

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-8


4. Troubleshooting

3) After step (2), you can see “TEST − −” on the VFD. Insert number “46” to select Region Code.

TES T − −
4) After step (3), you can see “− − −” on the VFD.
Insert the Region Code corresponding model with “0 ~ 9” buttons on the remote control.

−−−
5) Turn the Power off.

4-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

Table 4.1 MM-E330 Option Table

Region Code Area

60 Africa, Pakistan

61 BRAZIL, CHILE, PERU, ARGINTINA, COMBIA

62

63 China (semi_mic)

64 Europe

65 HONGKONG

66 JAPAN

67 KOR

68 Latin American

69 Mexico

70 Philippines

71 Russia (full_mic)

72 Russia (semi_mic)

73 South Africa

74 Taiwan

75 USA, CANADA

76 Newzealand

77 England

78 Australia

79 Iran (HACO)

80 India

81 Israel

82 Middle Asia, Moroco, Algeria

83 Indonesia, Asia

84 Singapore

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-10


4. Troubleshooting

Table 4.2 MM-E330D Option Table

Region Code Area

90 Africa, Pakistan

91 BRAZIL, CHILE, PERU, ARGINTINA, COMBIA

92

93 China (semi_mic)

94 Europe

95 HONGKONG

96 JAPAN

97 KOR

98 Latin American

99 Mexico

100 Philippines

101 Russia (full_mic)

102 Russia (semi_mic)

103 South Africa

104 Taiwan

105 USA, CANADA

106 Newzealand

107 England

108 Australia

109 Iran (HACO)

110 India

111 Israel

112 Middle Asia, Moroco, Algeria

113 Indonesia, Asia

114 Singapore

4-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

Table 4.3 MM-E320D Option Table

Region Code Area

30 Africa, Pakistan

31 BRAZIL, CHILE, PERU, ARGINTINA, COMBIA

32

33 China (semi_mic)

34 Europe

35 HONGKONG

36 JAPAN

37 KOR

38 Latin American

39 Mexico

40 Philippines

41 Russia (full_mic)

42 Russia (semi_mic)

43 South Africa

44 Taiwan

45 USA, CANADA

46 Newzealand

47 England

48 Australia

49 Iran (HACO)

50 India

51 Israel

52 Middle Asia, Moroco, Algeria

53 Indonesia, Asia

54

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-12


5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram

RMCN1 RFCN1 UCN1 CN1


CD_VR LOADP _DC LOADP _DC CD_VR GND GND
CD_MP D LOADN_DC LOADN_DC CD_MP D D_P D_P
CD_LD S LED_N S LED_N CD_LD D_N D_N
LD_GND S LED_P S LED_P LD_GND GND GND
SW INS W INS W SW REMOTE REMOTE
F- OUTS W OUTS W F- VFD_CE VFD_CE
T- DGND DGND T- VFD_CLK VFD_CLK
T+ DCLOAD_P DCLOAD_P T+ DGND DGND
F+ DCLOAD_N DCLOAD_N F+ VFD_DO VFD_DO
C C KEY_AD KEY_AD
D D AUX_L AUX_L
A A AUX_R AUX_R
F F 5.2V 5.2V
VCC VCC US B5V US B5V
VREF VREF US B5V US B5V
GND GND DGND DGND
DVD_VR DVD_VR VFD- VFD-
DVD_MP D DVD_MP D VFD+ VFD+
DVD_LD DECK DVD_LD -VP -VP
RF RF HP _MUTE HP _MUTE
VCC_5V VCC_5V HP _S ENS HP _S ENS
HP _R HP _R
HP _L HP _L
CNM801 P CN1 FRONT
GND_S DGND
GND_S DGND
B25v P VDD +25v
A5.3V D5.3V
P S _ON P _ON
-28V -VP
B+3.4V VFD+
B-3.4V VFD-
S MP S MAIN

5-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2. FRONT PCB Top

KC N 1
(1) CN1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-2


5. PCB Diagram

5.2.1. Pin Connection

1) CN1
MAIN PCB Connection

Pin No. Signal


1 GND
2 D_P
3 D_N
4 GND
5 REMOTE
6 VFD_CE
7 VFD_CLK
8 DGND
9 VFD_DO
10 KEY_AD
11 AUX_L
12 AUX_R
13 5.2V
14 USB5V
15 USB5V
16 DGND
17 VFD-
18 VFD+
19 -VP
20 HP_MUTE
21 HP_SENS
22 HP_R
23 HP_L

5-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.3. FRONT PCB Bottom

VIC 1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-4


5. PCB Diagram

5.4. MAIN PCB Top

UCN3
R F IC 1

MIC1
IC 3 0

(1) OPEN_ UCN2

U IC 1
RFCN1

MIC2

(4)
R MC N 1

UCN1
(3)
(2) P CN1

TP1

5-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.4.1. Pin Connection

1) RFCN1 3) PCN1
DVD MECHA CONTROL ALL VOLTAGE SUPPLY

Pin No. Signal Pin No. Signal


1 CD_VR 1 DGND
2 CD_MPD 2 DGND
3 CD_LD 3 PVDD +25v
4 LD_GND 4 D5.3V
5 SW 5 P_ON
6 F- 6 -VP
7 T- 7 VFD+
8 T+ 8 VFD-
9 F+
10 C 4) UCN1

11 D FRONT PANEL CONTROL

12 A Pin No. Signal


13 F 1 GND
14 VCC 2 D_P
15 VREF 3 D_N
16 GND 4 GND
17 DVD_VR 5 REMOTE
18 DVD_MPD 6 VFD_CE
19 DVD_LD 7 VFD_CLK
20 RF 8 DGND
21 VCC_5V 9 VFD_DO
10 KEY_AD
2) RMCN1 11 AUX_L
DVD MOTOR CONTROL 12 AUX_R
Pin No. Signal 13 5.2V
1 LOADP_DC 14 USB5V
2 LOADN_DC 15 USB5V
3 SLED_N 16 DGND
4 SLED_P 17 VFD-
5 INSW 18 VFD+
7 OUTSW 19 -VP
8 DGND 20 HP_MUTE
9 DCLOAD_P 21 HP_SENS
10 DCLOAD_N 22 HP_R
23 HP_L

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-6


5. PCB Diagram

5.4.2. Test Point Wave Form

TP1

5-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.5. MAIN PCB Bottom

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-8


5. PCB Diagram

5.6. SMPS PCB Top

C N M8 0 1 (1)

5-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.6.1. Pin Connection

1) CNM801
MAIN PCB Connection

Pin No. Signal


1 GND_S
2 GND_S
3 B25v
4 A5.3V
5 PS_ON
6 -28V
7 B+3.4V
8 B-3.4V

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-10


5. PCB Diagram

5.7. SMPS PCB Bottom

5-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

• The Main Micom IC is LC87F5M64. It’s smaller version of LC87F5NC8A at last year. MPEG chip is ES8396SCD.
• The Main Micom control every IC in this PCB.
• Video signal is come from DVD Mecha and go to the MPEG IC. Then MPEG IC decode this signal to real video signal.
• Audio signal is come from DVD Mecha, TUNER, AUX, MIC. Then MPEG IC decode and convert to analogue signal.
• This signal go to the Crystal Amplifier. And amplified signal is Low Pass Filtered. This signal is real audio signal.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-1


6. Schematic Diagram

6.2. FRONT
D5V

POWER D5V
VZD1

R3
22OHM

P21
P20
50V 50V VFD-

1G
2G
3G
4G
5G
6G
7G
FGND UZ3.3BSA

1/8W
AUDIO 10UF 100NF

VPC1

VPC2
25V
50V
47UF

44
43
42
41
40
39
38
37
36
35
34
100NF

1N4148
VC4

VD2

VC5

VDD
GR1
GR2
GR3
GR4
VSS

SG24/GR5
SG23/GR6
SG22/GR7
SG21/GR8
SG20/GR9
FGND
1 33
LED1
2
LED1
SG19/GR10 32 P19
3
LED2 SG18/GR11
31 P18
4
LED3 SG17/GR12
30 P17
1/8W
5
LED4 VEE
29 -VP
51KOHM
VR5 6
OSC
MC3401 SG16/K S16
28 P16
7
DOUT VIC1 SG15/K S15
27 P15
8
DIN SG14/K S14
26 P14
9
CLK SG13/K S13
25
P13
10
STB SG12/K S12
24
P12
11
K1 SG11/K S11
23
P11
50V
100NF
K2
SG10/K S10
P10

SG1/KS1
SG2/KS2
SG3/KS3
SG4/KS4
SG5/KS5
SG6/KS6
SG7/KS7
SG8/KS8
SG9/KS9
DC1

VDD
VSS
DC2
TP TP TP TPTP TP TP TP TP TP TP TPTP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP TP
50V

12
13
14
15
16
17
18
19
20
21
22
100NF DGND TP59 TP57TP56TP55TP54TP53TP52TP51TP50TP49TP8TP48TP47 TP46TP45TP44TP43TP42TP41TP40TP38TP37 TP35TP34TP33TP32TP31TP22
TP336 TP28
FGND

TP TP TP TP TP TP TPTP TP TPTP TPTP

P1
P2
P3
P4
P5
P6
P7
P8
P9
TP1 TP2 TP60 TP3 TP4 TP5 TP6 TP30 TP7TP62
TP63
TP64
TP65
7BT-317NBK
UNDEFINED

VFD

P21
P20
P19

P18
P17

P16
P15
P14

P13
P12
P11

P10
1G

7G

6G

5G

4G

3G

2G

F+
F+
P9
P8

P7
P6

P5
P4
P3
P2
P1
F-
F-
CN1

9
8
7
6
5
4
3

2
1
32
31

30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
50V
100NF 50V
HP_L 1 HP_L 100NF
HP-R HP_R VC7

VC6
2
HP_SENS 3 HP_SENS VC9
HP_MUTE HP_MUTE FGND

VC8
4

1G

7G

6G

5G

3G

2G
10UF

P9
P8
P7
P6
P5
P4
P3
P2
P1
P21
P20
P19
P18
P17
P16
P15
P14

P13
P12
P11
P10
-VP -VP

4G
5 10UF
50V
VFD+ 6 VFD+ 50V
VFD- 7 VFD-
VFD_GND 8
USB5.4V 9 USB5.4V
USB5.4V
D5V
10
11 D5V
FGND
USB 5.4V
11160-204136-01
USBJ1 VFD+
AUX_R 12 50V
AUX_L
1 MGND1
13 100NF 2
KEY_AD1 14 KEY_AD1

USBC2
VFD_DO
3 VFD-
15 USBC1 4 FGND
DGND 16
VFD_CLK 17 10UF
VFD_CE 18 50V MGND2
REMOTE 19
DGND 20 REMOTE
D_N 21
D_P 22 DGND D5V
DGND 23
TP TPTP TP
USBTI USBT2 USBT3 USBT4
D5V

H/P CIRCUIT

100OHM

100OHM

100OHM

100OHM
52806-2310

DGND TC38-103-01

10KOHM
AJ1

LR5

LR4

LR3

LR2
1/8W 7
TP TP TP TP TP TP TPTP TP 6 HP_SENS
1/8W
330OHM HPJ 1

HR1
TP61 TP10 TP11 TP12 TP13 TP14 TP15 TP16 TP23 AR1L330OHM 2 7
AR1R 3

AUX 6

LED3

LED1
L1 33UH
4

LED4

LED2
5 HP_L
HR2L 47OHM 2
1/8W 1/8W

TC38-103-01
1 HP_R
3
50V 50V 47KOHM47KOHM HR2R L2 33UH 4
47OHM
220PF 220PF 5

2N5401AT
HR5R
100KOHM

100KOHM
HR5L

HC2L 47NF
AC1R

100NF
47NF
AC1L

330OHM
AR2R
AR2L

E
LR1

HC2R

HC1
C
B LED1
LQ1

C
E

E
DGND

HQ1
B

HQ2A
DGND

HQ2

HQ1A
4.7KOHM

4.7KOHM

4.7KOHM
HR3A

4.7KOHM
HR4A
HR3

HR4

HP_MUTE
DGND

REMOCOM CIRCUIT FUCTION KEY CIRCUIT


DGND
UZ5.6BSB
REMZD1

KEY_AD1
5.6

D5V
1/8W
KSM-953TH4Y
22O HM
REMOTE 1/8W 1 MGND1
OUT 1/8W
22O HM R2
REMCOM

D5V
2 KR9 1/8W 1/8W 1/8W 1/8W 1/8W 1/8W 1/8W 1/8W 1/8W
VCC
820OHM 1.2KOHM 1.5KOHM 1.8KOHM 2.2KOHM 3 . 3 KOHM 4.7KOHM 6.8KOHM 1 0 KOHM
R1
3 MGND2 KR3A KCN1 KCN2 KR3 KR4 KR5 KR6 KR7 KR8 KR1 KR10
UZ5.6BSB
REMZD2

OPC1

GND
OPC2
100NF

10KOHM
4.7UF

22-05-7025
5.6

SW1

SW2
50V

50V

2 1

KSW2
22-05-7025

SW3

SW4

SW5

SW6

SW7

SW8

KSW1
1 2

DGND TP TP TP TP
TP19 TP18 TP21 TP20
DGND
DGND

6-2 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.3. MAIN-1
OPEN_UCN2
POWER MAIN-SMPS PCB
U5V_PW
5NC JIG
1

10022HS-06B
M24V_PW D5V_PW
AUDIO 2
(TUNER)

P19B
P20B

P16B
P18B

PU_CHECK
REMOTE_IN
3

U_RESET_P
P7B

P6B
P8B
P16
4

KEY_AD1
PCN1

TU_RDS

TU_CLK

TU_RST
TU_DA
TU_CE
P_ON
5

DGND
U_RESET_P

P_CTL
6

TXD
1

100KOHM
100KOHM

UR17

100KOHM

UC34
UR16

UR18
DGND 2

100NF
DGND
PVDD24V
3
D5.2V 4 DGND

1 100OHM
5

7 1KOHM
P_ON1 P_ON 1

UPC1

3 TUAR2
6

UR9
-28V -VP

100NF
VFD+ 7 VFD+ DGND

UC14100NF
100NF
VFD- 8

2
4
6
8
5
VFD-

2
4
6
8

MPR7
100OHM

1KOHM
UAR6
DGND
P7
P6
P5
P15B
P19
P20
P18

P15

UC33
48 100OHM
1
3
5
7
8
6
4
2
UAR5
1
3
5
7

35 UC32
TP 1

UC31
UC30
UC35
100NF

TPRX
TPTX
100NF
100NF
100NF

100NF
FP14B1

Q1

Q0
32.768HZ
FP10B
FP11B
FP12B
FP13B

FP14B
FP15B
FP19B
FP20B
FP21B
FP22B
FP23B
FP24B
FP25B

UX1
UC8
FP1B
FP2B
FP3B
FP4B
FP5B
FP6B
FP7B
FP8B
FP9B

22PF

UC16
42

UC17
UCN3

47
46
45
44
43

41
40
39
38
37
36

34
33
U_5V_PW

100NF
Q2

Q3
UCN1 USB5V_PW D5V_PW DGND 1

VDD3
PC5/DBGP0
PC6/DBGP1
PC7/DBGP2

VSS3
PC0
PC1
PC2
PC3
PC4

P30
P31
P83/AN3
P84/AN4
P85/AN5
P86/AN6
3

4
UAR3
100OH M
TO AMP 3
23 49
P70/INT0/T0LCP/AN8 P32/UTX1
32 1 2 UART_TX 2
HP_L HP_L UC9 3 4 UD3 UART_TX
50 31
P71/INT1/T0HCP/AN9 P33/URX1
22 HP_R
100NF DGND UART_RX
HP_R 51
P72/INT2/T0IN/NKIN P34/UTX2
30 5 6 4
21 HP_SENS TI_RST UART_RX
HP_SENS 52 P 7 3 / I NT3 / T0 I N P 3 5 / URX2
29 7 8 5
HP_MUTE 20 TI_SD
F_HP_MUTE 53 /RES P36
28 100NF
-28V 19 UC29
-VP 54 XT1/AN10 P37
27 100NF DGND
18 UC28
TP 1

1MOHM
1

UR27
10MHZ
VFD+ VFD+ 1 2

UX2
17 55 XT2/AN11 P27/INT5/T1IN
26 DGND
MAIN_MUTE

2
VFD- VFD- 56 VSS1 P26/INT5/T1IN
25 3 4 UR1
16 UIC1 F_HP_M UTE

3
DGND 57 CF1 P25/INT5/T1IN
24 5 6 100OH M
USB5.4V 15 UR28 HP_SENS
14 58
CF2 P24/INT5/T1IN/INT7
23 7 8
USB5.4V 150OHM 59
VDD1 P23/INT4/T1IN
22 1 2 UAR1
5.8V 13 SDA1
12 INSW_370 60
P80/AN0 P22/INT4/T1IN
21 3 4 100OHM SCK1
AUX_R AUX_R 61
P81/AN1 P21/INT4/T1IN
20 5 6
AUX_L 11 OUTSW_370 WC1
AUX_L STB 1 2 62 P82/AN2 P20/INT4/T1IN/INT6
19 7 8
KEY_AD1 10 KEY_AD1 (FROM MPEG) 3 4

P17/T1PWMH/BUZ
9 RESET_P 63 P10/SO0
18 100NF UC27
(TO MPEG) DGND
P07/T7O
VFD_DO VFD_DO 5 6 UR8
64 17 100OHM

P16/T1PWML
P11/SI0/SB0
8 (TO MPEG) RXD P06/T6O
P_ON1

P14/SI1/SB1
DGND 7 8

P12/SCK0

P15/SCK1

P05/CKO
7

P13/SO1
VFD_CLK (TO MPEG) ACK

PWM2
PWM3
VFD_CLK 100NF UC26

VDD2
VSS2
6

10KOHM

P00
P01
P02
P03
P04
UAR2

10KOHM
VFD_CE

UR38
WC

UR37
VFD_CE 100OH M
REMOTE 5 U_5V_PW UR7 SCK

VCC_UIC3
REMOTE_IN

10
11
1

9
4

12

14
2
3
4
5
6

8
UR6

13

15
16
GND

U_5V_PW
SDA
D_N 3 UR5
D_N
2

VCC
D_P 2.2KOHM

UR30
100OHM
D_P 2.2KOHM
GND 1 2.2KOHM

8
7
6
5
USD2

TU_RDS

SDA
VCC

SCL
/WC
8 7

GND_UIC3
UR29100OHM
VFD_CE

UC18100NF
UC19100NF
UC20100NF
UC21100NF
6 5

UC22100NF
UC23100NF
UC24100NF

UC25100NF
FCZ100E-23SS-K VFD_CLK
FP21

FP25
FP1
FP2
FP3
FP4
FP5
FP6
FP7
FP8
FP9

GNG-6
FP10
FP11
FP12
FP13
FP14

FP15
FP19
FP20

FP22
FP23
FP24

4 3
FP141

VSS
NC
NC
E2
UC15
2 1

UC4

UC5
100NF

100NF

100NF
VFD_DO

1
2
3
4
TU3.3V_PW UAR4

UC1

UC2

UC3
220PF

220PF

220PF
100OH M
DGND OPTION
UIC3

0OHM
10KOHM

TR2
TUR6

TR1
100OHM

FM
1/16W
DGND DGND

USB_EN
DGND

USB_FLG
SI4705-B20-ZM0R
MGND1

20
19
18
17
16
TIC1
GPO3/DCLK

FM_S
GPO1
NC

DFS
GPO2/INT-

TR3
TC1 0OHM TC2L TR1L
1 15

U_5V_PW
100OH M
MGND3

10PF NC DOUT 10U F UR31

U_5V_PW
1 2 14

U5V_PW
22KOHM

RESET
TUNER_L
MGND1

TJ1 3
FMI LOUT
13 FM
RFG ND ROUT TUNER_R
4 12
TVT1

TL1

100NH
TC2

LPI GND TC2R TR1R S-6415A42-M3T1U


2PF
MGND2

5 11 10U F 100OH M D5V_PW UD1


/RST
DGND VDD UIC2
FM_RDS
TR11

TC1L
0.01OHM UR2
0OHM

33KOHM

33KOHM
TC1R
TC13

TUR3

TUR4
3 1

22PF
22PF
/RESET,RESET
RCLK
SCLK

U_RESET_P
SDIO
/SEN

DGND VDD
VIO

10UF

10KOHM

UC13
GND

UC11
UC10

UC12

UC7
10UF

10UF

10NF
100NF
TX1 TU3.3V_PW VD3.3VA_PW UD2

100NF
DGND
6
7
8
9
10

32.768HZ TBD1 0.01OHM

2
DGND 1 4
Q0 Q3
2
4
6
8

0.01OHM
TC9

TUC1

DGND RESET IC OPTION


100NF

2 Q1 Q2 3 DGND
22UF
10NF

D5V_PW USB5V_PW
100OHM 1

UBIC1
3
5
TUAR1

5 1
TC11

TC12

OUT
IN
22PF

GND 2
22PF

1 2 DGND
TUC4

3 4 USB_EN 4 EN/EN#
/FLT 3
5 6

10UF
10UF
7 8

UBC4
UBR1

10KOHM
10KOHM

UBC3

100NF
DGND

10UF
TAR1
10KOHM

UBC1
UBC2
UBR2
TIC1 OPT ION SPEC TUR9 TUR18
1204- 002700 FM 4702 0 OH M 0 OH M
USB_FLG
TU_RST

TU_CLK
TU_DA
TU_CE

1204- 003347 AM 4730 OMIT OMIT


1204- 003345 RDS 4705 OMIT 0 OH M
DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-3


6. Schematic Diagram

6.3.1. Test Point Wave Form

TP1

6-4 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.4. MAIN-2
VD3.3VA_PW
DVD ONLY
POWER DVD VIDEO OPTION

PU_CHECK
MVC11
VIDEO VTP3

RFC10

RFR53
RFR51
10PF

10KOHM
4.7OHM

22UF
BD2
CDAC
VC BLUE
0.01OHM

MVC10

MVC12
MVR4
M5V_PW

75OHM
A
21
MVL4

150PF

150PF
RFR57 1.8UH
10OHM

MVD4
RFC 16
E
RFQ2 B DVDLD 100NF
C
RFR54
220OHM

4.7KOHM
100KOHM

RFR16
100KOHM
RFR56
RFC12

RFR58

RFR59

100KOHM
MVC8

DVDLDO
RFIC2 VTP4
10PF

MVREF

DVDVR

PUHRF

1NF
RF5V_PW M5V_PW

RFT10
RFT11
RFT12
RFT13
RFT14
RFT15
RFT16
1 8 RFR 17 BD1

RF5V
RFT1
RFT2
RFT3
RFT4
RFT5
RFT6
RFT7
RFT8
RFT9
Y

GND
OUT1 1KOHM GRE EN
RFD1 VCC
2 IN1- 7 MOCTL YDAC
OUT2
3 6

MVC7
75OHM
IN1+

MVR3
0.01OHM DVDLDO VJK1 LOADP_ DCMOP 0.01OHM

MVC9
IN2-
4 5

RFR20
MVL3

1MOHM

150PF

150PF
RFC14 GND RFR 23

RFR18
2.2KOHM
23 IN2+ 1.8UH
VCC_5V 10KOHM 2

RFC17
22
RF PUHRF

RFR22
1

3.3KOHM
100KOHM

100NF
RFR55

RFR60
RFC15

RFC13
330UF

47KOHM
21

RFD3
DVDLDO

100NF
DVD_LD 3

1NF
20

RFR21
RFR19

22KOHM
DVD_MPD

18KOHM
19 MVC5
DVD_VR DVDVR 10PF VIDEO VTP1 5
18 BD5
GND 17
4
VREF MVREF VDAC
6
16 YELLOW
VCC

MVC4
MVR2
15

MVC6
0.01OHM

75OHM
F F MVL2

150PF
RFC2 LOADN_DCMON

150PF
14
E E DGND RFR 24 B 1.8UH
13 4.7UF RFR 25
A A 680OHM 10KOHM

MVD2
12
D D
11
C C VD3.3VA_PW
10
B B MVC2
9 VTP5
F+ FOCUS_P 10PF

RF5V_PW
8 BD8

DVDLDO
T+ TRACK_P U

DVDVR
MVREF

CDLDO

PUHRF
7 TRACK_N UDAC

CDVR
RFR49

10KOHM
T-

MPD
RFC3

RFR3
RED

4.7OHM
6

SW

MVC1
FOCUS_N 0.01OHM

MVR1
F-

MVC3
75OHM
22UF

E
F

150PF
5 MVL1
SW SW

150PF
1.8UH

GND_SCREW1
GND_SCREW2
GND_SCREW3
4

GND_SCREW
LD_GND 3 RFR4
CD_LD CDLDO E 220OHM
2
CD_MPD MPD RFQ1 CDLD

OPTION
OPTION
OPTION
B
1

100NF
100PF
100PF
100PF
100PF
100PF
100PF
100PF
100PF
100PF
CD_VR CDVR C

27PF
RFC5

1NF
DGND
DGND
GNDB
MVREFB

DVDVRB
DVDLDOB
PUHRFB

RFCN1
RFT1B
RFT2B
RFT3B
RFT4B
RFT5B
RFT6B
RFT7B
RFT8B
RFT9B
RFT10B
RFT11B
RFT12B
RFT13B
RFT14B
RFT15B
RF5VB1

RF5VB2

RFC6

EMC1
EMC2
EMC3
EMC4
EMC5
EMC6
EMC7
EMC8
EMC9
EMC10
EMC11
1NF
CDLDO

RFC20

47KOHM
RFR5
RFD2

100NF
DGND
C
SER VO EMC DGND
LOADN_DCMON
LOADP_DCMOP

DCLOAD_N
DCLOAD_P

DGND
SLED_N
SLED_P

OUTSW
GNDB9
INSW

RMCN1
INSW_370
OUTSW_370
SP+ 1 LOADP_DCMOP
SP- 2 LOADN_DCMON

DVDVR
SL- 3

CDVR
SLED_N
SL+ 4 MR37 VDD1.35V_PW D5V_PW MPQ1 M5V_PW

SW
SLED_P VD3.3VA_PW
5 15KOHM RF5V_PW VD3.3VA_PW
INSW INSW
6 OUTSW 3 2
OUTSW 7
3 2
VIN VOUT

D
MPC1A

MPC1 S
GND MR38

MPR1
100KOHM
D+ 8 15KOHM

1UF
ADJ
DCLOAD_P

1UF

G
1
9

RFR32

RFR30

RFR28

RFR26
10KOHM

10KOHM
D- DCLOAD_N MIC5 1

RFR6

22OHM

22OHM

22OHM
RMC1

RMR2
RMC2

RMR1
47KOHM

47KOHM
100NF

100NF

100NF
100PF
MPR5
LOADN_BDCMON

1OHM
3.3V_CTL
OUTSWB
LOADP_BDCMOP

GND9

DCLOAD_NB
INSWB

DCLOAD_PB

10KOHM
MPR2
SLED_NB
SLED_PB

296MHZ EMC
MPC2
RFR31 RFR 27

10UF
1KOHM

RFQ5

RFQ3
C C 1KOHM

MPC5
MPC4
B B
DVD/CD MRR6 OPTION

MPC3
DGND 4.7KOHM MPR3

MPQ2
E E C

22UF
B
RFR 29 OPTION
RFQ4 C 1KOHM 1KOHM E

MPR4
10KOHM
B

OPTION
CD ONLY
E

P_CTL
DVD ONLY DGND
DGND

RFR48
33OHM
DA
RFC18 RFR47
RFIC1 100NF 3.3KOHM
M5V_PW E
DRV
RFR33 RFR46
22KOHM 1KOHM
1 28 DC/DC CO NVERTER
22KOHM
RFR43

FOCUS 2
VINFC MUTE
TRB_1 BIAS
27 MR92
RFR34 3 26
MGND1

6.8KOHM REGO2 VINTK TRACK P_ON


4 25 RFR42 1KOHM VDD1.35V_PW
R3001

SLEGN RFR45 1KOHM


10KOHM

VINSL+ TRB_2
5 24 39KOHM
REGO1 OPOUT OPOUT MIC7
6 23
RFR40

ML6
1MOHM

CLOSE FWD VINLD SPIN DLE MGND1


RFR41

7 22 D5V_PW ML5 0.01OHM


27KOHM

OPEN 8
REV GND RFR44 RFR39 1 8
Vcc1 VCTL 21 1KOHM 1.2KOHM 2
PGND NC
7
9 20 VIN LX SS 4.7 UH

MR94
DCLOAD_N VOTR- OPIN 3 6

3.3KOHM
10 19 RFR38 AGND EN
DCLOAD_P
11
VOTR+ Vcc2
18 10KOHM
4 FB COMP
5 ML7
SLED_N VOSL+ VOLD- LOADN_DCMON MR95 0.01OHM
12 17
MGND2

10UF

SLED_P VOSL- VOLD+


RFR36 DGND
FOCUS_N 13 VOFC- VOTK- 16 TRACK_N
RFR37
2.2OHM 3.3KOHM
MC978.2KOHM

14 15 3.6KOHM
MC91

MC92

MR96
PC1

FOCUS_P VOFC+ VOTK+ TRACK_P


100NF

MC110

MC101
10UF

10KOHM

M5V_PW
MC95
MR91

22UF
33NF

22UF
RFR35 LOADP_DCMOP DRAWN BY
2.2OHM
RFR1
10KOHM
10KOHM

hezhenwe n F
RFR2

2.2NF

CHECKED BY
RFC1

RFC19

330UF
10UF

hezhenwe n
APPROVED BY
DGND
_
DGND TOTAL PAGE NO.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-5


6-6
VIDEO
AUDIO
POWER
6.5. MAIN-3
6. Schematic Diagram

PL3

1
0
1
0
1
1
1
1
0
0
0
0

OTP
PLL2
MC74
100NF

0
SLEGN
FOCUS

1
1
0
0
1
1
0
TRACK
1 54

PLL1
VD3.3VA_PW
SPI NDLE
VDD VSS
2 53
DB0 DQ0 DQ15 DB15

CRYSTAL
3 52
VDDQ VSSQ

1
0
1
0
1
0
1
0

TEST MODE
DCLK INPUT
4 51

PLL0

CLK SOURCE
DB1 DQ1 DQ14 DB14 MC61
MC103 5 50 MC79 470NF

NORMAL MODE
DB2 DQ2 DQ13 DB13
100NF 6 49
VSSQ VDDQ
7 48 MC62 10NF

5.0

5.5
6.0
4.5
DB3 DQ3 DQ12 DB12

MULTI

5.75
5.25
4.75
MC75 8 47 100NF

BYPASS
DB4 DQ4 DQ11 DB11
9 46 MC63

1
0
VDDQ VSSQ 470NF
10 45
DB5 DQ5 DQ10 DB10 MC64

135
100NF 11 44 MC78

162
N/A
DB6 DQ6 DQ9 DB9 10NF

148.5
121.5
FREP
12 43

155.25
141.75
128.25
VSSQ VDDQ
MC76

MIC2
13 42
DB7 DQ7 DQ8 DB8
14 41 100NF
VDD VSS
15 40

TEST MODE
DQM LDQM NC

S_L S_P_OPTION
100NF 16 39
DWE# /WE UDQM DQM

NORMAL MODE
17 38

VD3.3VA_PW
CAS# /CAS CLK DSCK
18 37
RAS0# /RAS CKE
19 36 MR54 MR49
CS0# /CS NC 4.7KOHM
20 35 4.7KOHM
MC1 15PF MR1 RAS1# A13 A11 MA11
MR2 21 34
MC2 15PF RAS2# A12 A9 MA9 MC65

1.2KOHM

1.2KOHM

DGND
22 33 10UF
A10/AP A8

MR47
MR45
MC3 15PF MR3 MA10 MA8

VD3.3VA_PW
23 32
MC4 15PF MR4 MA0 A0 A7 MA7
4.7KOHM 24 31
MR6 MA1 A1 A6 MA6
4.7KOHM 25 30

DGND
MR8 4.7KOHM MA2 A2 A5 MA5 MC66
4.7KOHM MC77 26 29 100NF
MA3 A3 A4 MA4

MIN
4.7KOHM
PUHRF

4.7KOHM 27 28

F
E
C
B

D
A
VDD VSS

1KOHM
1KOHM
100NF

MR48
MR46

OTP
PLL3
PLL2
PLL1
PLL0
DGND

S_P_OPTION

RESET_P
RXD
S_P_OPTION
RAS1#
RAS2#
MA10
MA11

OTP
D_P

MA0
MA1
MA2
MA3
MA9
MA8
MA7
MA6
MA5
MA4
D_N
MPD
MC105

OPOUT
VD3.3VA_PW
470PF MC59
100PF

TP_GND1
MC12

MR20
MR16

1KOHM
1KOHM
100NF

33OHM
MR52
33OHM

MR53
680PF
MC58

MR19

100NF
100NF
MC102

MC72
100OHM
2.7KOHM

MR51
MC67

MR15
2.7KOHM

100NF
100NF
100NF 100NF

100NF
100NF

MC73
MC71
MC70
MC69
MC68

296MHZ EMC
100NF
100NF
10UF

MR50
MC56

MC60
100NF
MC55

MC57

VD3.3VA_PW
VDD1.35V_PW

PLL0
PLL1
PLL3
PLL2
7.5KOHM

MC54

216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
VD3.3VA_PW

10UF
TPI

H
G
F
E
D
C
B
A

VSS
VDD
VSS
VDD
VDD
VSS
TRO
SLO
FOO
DMO
SLV
MIN
VGA
VPA

VS33
VD33
VD33
DVCC
REFD
CDPD
DRFP
DRFN

MR44 MC53
AVS33
AVD33

MAR1
33OHM
DCS1 _B
DMA[0]
DMA[1]
DMA[2]
DMA[3]
DMA[9]
DMA[8]
MDA[7]
DMA[6]
SYSCL K
DMA[5]
DMA[4]
USB_ DP
USB_ DM

470KOHM

DRAS1 _B
DRAS2 _B
DMA[10]
DMA[11]
100NF
USB_ AGND
USB_ VCCA
USB_ RREF
USB_ VDDA

1 2 1 DCS0_B SPNP
162
CS0#
3 4 2 DRAS0_B SPNN
161
RAS0# MOCTL
5 6 3 160 MC52 1NF
CAS# DCAS_B AGC1 MR43
7 8 4 159 MC51 100PF 10KOHM
DWE# DWE_B AGC2
MC6 5 158
MR9 33OHM VSS DVDPD MPD
100NF 6 157
DSCK DSCK VBO MVREF
MR10 7 VDD CDLD
156
33OHM CDLD
DQM 8 DQM DVDLD
155
MC50 DVDLD
MC5 9 154 MR42 10KOHM
VD33 REX
15PF 10 153 MC49 22NF
VS33 PI MIN
1 2 MC7 11 152 10PF
DB7 DB[7] V165O DA
3 4 100NF 12 151
DB6 DB[6] FE
DB5 5 6 13 DB[5] TE
150
FE TE

MC48
7 8 14 149 MC45 4.7NF
DB4 DB[4] MB
15 148 MC44 1NF 296MHZ EMC
MAR2 33OHM VSS DB 10UF
1 2 16 147 MC43 150NF
DB3 DB[3] MP MC42
DB2 3 4 17 DB[2] VGB
146 VD3.3VA_PW
5 6 18 DB[1] VPB
145
DB1 100NF
7 8 19 DB[0] OPEN/VOBS
144 MAR6 1 2
DB0 OPEN
MAR3 33OHM 20 VDD OPENSW
143 100OHM 3 4 INSW
1 2 21 DB[8] CLOSE/VOBS1
142 5 6
DB8 CLOSE
3 4 MC8 22 141 7 8
DB9 DB[9] CLOSESW OUTSW
5 6 100NF 23 140 MR55
DB10 DB[10] AMPSTBY DRV
7 8 24 139 100OHM
DB11 DB[11] SR[32]
25 138 296MHZ EMC
MAR4 VD33 SOUT
33OHM 26 137 MC28 100PF
MAR5 VS33 SIN
1 2 MC9 27 136 MC29 100PF
MIC1

DB12 DB[12] VS33


3 4 100NF 28 135 VDD1.35V_PW
DB13 DB[13] VD33 MC40
5 6 29 134 MC41 100NF 100NF
DB14 DB[14] VDD
7 8 30 DB[15] SR[15]
133
DB15 DVD/CD
33OHM 31 VSS VD33
132 MP3.3V
LOG_TXD
32 AUX[7] VSS
131
33 130 MC104
LOG_RXD AUX[6] SR[14]
34 VDD SR[13]
129
VD3.3VA_PW 35 128 100NF
MC10 AUX[5] SR[31]
100NF 36 127
AUX[4] SR[33]
4.7KOHM MR5 37 126
AUX[3] SR[34]
38 VD33 SR[35]
125
39 VS33 SR[36]
124
MC11 40 123
RESET_B OP[12]
100NF 41 122
4.7KOHM

MR58

AUX[2] SR[20]
10KOHM
MR21

I2C_SCL 42 AUX[1] SR[21]


121
I2C_DAT 100OHM 43 AUX[0] SR[22]
120
44 SPI_CS2 SR[23]
119
TI_RST
MD1 45 118
SPI_CS3 SR[24]
MR24 MR59 46 117
SPI_CLK SPI_CLK SR[25]
150OHM 47 116
VSS SR[26]
SPI_DI MR25 48 SPI_DI SR[27]
115
33OHM 49 114
SPI_DO SPI_DO SR[30]
MR26 MC99 50 SPDIF_IN SR[06]
113
VD3.3VA_PW

33OHM 100NF 51 112


VDD SR[05]
52 SPDIF_OUT SR[04]
111
53 110
MR22
33OH M

VD33PLL SR[03]
MR100 54 109
VS33PLL VD33
MR23 2.2KOHM
MC39
10KOHM MC13 100NF
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VID_XO
VID_XI
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33V DAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33A DAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VD33AADC
LINE_IN_L1
LINE_IN_R1
LINE_IN_L2
LINE_IN_R2
LINE_IN_L3
LINE_IN_R3
VDDAADC
MIC_L
MIC_R
VS33A ADC
VDD
SR[00]
SR[01]
SR[02]
VSS

VD3.3VA_PW
OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
VD33

10UF

MC14
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108

100NF MR13
DGND

SPI _CS

MC37
SPI _CS3

2.7KOHM
MR57
MR56

100NF
ML1

0.01O HM
100N F

100N F
100N F
MC20

MC16
MR29

MC15
390OH M

SPI _DI
SPI _CS
100N F
MC21

MR12
MR14
MR32
MR33
MR34
MR35

100 OHM
1KOHM

MR11100OHM
100OHM
100OHM
4
3
2
1

4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

VD3.3VA_PW
VDD1.35V_PW

100N F
100N F
MC100

3_DI 1_CS_B
E2

MC22
NC
NC

VSS

3_DI_B
33OH M

1_CS
MR27

6_GND_B
MIC3

MC30
MC31
MC32
MC33

4
3
2
1
A_LCH

OPLCH
A_RCH

DGND
/WC

OPR CH
SCL
VCC

SDA

6_GND
VDD1.35V_PW

VD3.3VA_PW

MR11/12

/CS
5
6
7
8

GND

MR28 MC80
DO(IO1)
DGND

100NF
/WP(IO2)
1KOHM-->100OHM

MC24
MIC4

100KOHM 100NF MC26 MC35 MR79


DGND

/HOLD(IO3)

DI(IO0)

MX1
CLK
VCC
10UF
10UF
10UF
10UF

27MHZ
MC81 100NF 100NF MR60
5
6
7
8

100NF VCC_MIC4
ML3
MC27
220U F

3.3V4 0.01OHM MR61


27PF
27PF

MC90
DGND

220UF
MC17
MC18

2_CLK_B MR17 2.2KOHM


22OHM

820OHM 2.2KOHM
ML8

2_CLK
VD3.3VA_PW

2.2KOHM
ML2 0.01O HM

4_DO_B
4_DO
MD4

BAT54C
VDD1.35V_PW

STB
I2C_WP

TXD
ACK
I2C_DAT
I2C_SC L

MR66
CDAC

UDAC
VDAC
YDAC
VD3.3VA_PW
AUX_L
AUX_R

10KOHM
I2C_WP
TUNER_L
TUNER_R

296MHZ 21 6MHZ EMC

SPI _DO

5SP_3.3
SPI _CLK
VD3.3VA_PW

5SP_3.3B
Copyright© 1995-2013 SAMSUNG. All rights reserved.
6. Schematic Diagram

6.6. MAIN-4
M24V_PW
POWER

3.3OHM
AUDIO

100NF AR16
50V

AC19 1UF
470UF
AC20

AC17

AC18
P12V _PW

10NF
R1004

10OHM DGND
AR15

1UF

1UF
10OHM

C1003

AC16
IC30
TAS5342ADDV SPK_L_P

AC24L

AC40L
1 44 AC21

27KOHM
AC35L1UF
18OHM330PF
GVDD_B
43 33NF

3.3OHM 3.3OHM 10NF


GVDD_A
2 /OTW

100NF
BST_A

AC47
DGND 3 NC 42

TI_RST
L80

1NF
NC
4 NC 41

AR17L
PVDD_A
5 40

AR27
AR23
U_5V_ PW M24V_PW TI_SD /SD 1 4

AC36
PVDD_A
OPLC H 6 PWM_A 39
OUT_A
TI_RST
7 /RESET_ AB 38

18OHM
5.6KOHM GND_A
R1002 8 37 2 3

AC25L AR18L
PWM_B

1UF
R1001 GND_B

AC41L AR28
9 36

AR24 27KOHM
RA14

0OHM OC_ADJ

R+
100NF
OUT_B DGND

L+
35 AC22

R-
10

AC34L

L-
GND DGND TP1

AC46
AR13

100PF
PVDD_B
22KOHM

1NF
11 34

C1002
AGND
12 BST_B
33 33NF AC26 SPJK1

330PF

MGND2
100KOH M

10NF
VREG
BST_C
AD1 E C1001 13 32 100N F

AC37
M3
B 14 PVDD_C
31 AC23 4
C M2 SPK_L_M 2
+ -

1UF
OUT_C
30 33NF SPK_L_M
AD2

1N4148WS AQ1 AC15 15 M1 AC27 SPK_R_P


6.2

100NF 16 GND_C
29 SPK_R _P SPK_R_M
1
SRA2203S OPR CH PWM_C 100N F DGND

AC42R
C 3

100NF

MGND1
- +
GND_D
A_MUTE B 17 28 SPK_L_P

AC32R

18OHM 330PF

AR25 27KOHM
/RESET_ CD

1UF
AC30 AC31 3.3OHM
AQ2 18 OUT_D
27

3.3OHM 10NF
E
PWM_D
SRC1203S

100NF

AC35R
P12V _PW PVDD_D
19 26

50V AC1 470UF


DGND

AC45
NC L81

AR20
PVDD_D AC28

1NF
AC38
R1005 20 NC 25 33NF

18OHM AR21R
NC
21 24

AR29
10OHM VDD 1 4 DGND
BST_D
22 GVDD_C 23
GVDD_D P12V_PW
AMP MUTE CIRCUIT DGND R1003

10NF

3.3OHM
2 3

1UF
AC29
10OHM

1UF
AR22R

AC43R AR30
AR26 27KOHM
100NF
AR19 DGND

100NF

AC34R
DGND

AC44
10UF
10OH M

1UF
1UF
C1006

AC106
C1004

C1005

1NF
AC33R
330PF
DGND

10NF
AC39
J7 SPK_R _M
SHORT(GND)
SHORT(GND) J8
DGND

SGND DGND

HPR11
A_MUTE 22KOHM
HP_R 47UF HPC23
P12V_PW
HPR22 47UF HPC24 HPC10 150PF
4.7KOHM C
B HPQ3L 47UF HPC27
M24V_PW P12V _PW 0OHM KTD1304 E
AQ3 A_LCH HPR26 HPC4 HPR12 680OH M HPC20
AR4 AR5 KN3904S HPR8 HPC14 22PF
HPR27

10OHM
100 OHM 100 OHM OPLC H

HPR13
C

AQ4 0OHM 2.2UF 8.2KOHM 10UF HPR10


1/4W 1/4W KN3904S F_HP_MUTE 2.7KOHM
HPR18
B

D5V_P W HPQ2 HPQ1L HPQ2L

47KOHM
HPR6

HPC6

HPC7
1KOHM
B
10UF 16V

HPR1 HPR4 HPR24

10UF
2.2NF
C C
AR7
1OHM
1/16W
AC2

C
B B
100NF 50V 1OHM

E
1/16W

10UF
10UF
AR8

4.7KOHM E 4.7KOHM E HPR19


0OHM

2 OUT1 VCC 8
3 IN1- OUT2 7
4 IN1+ IN2- 6
IN2+ 5
HPC1

SRA2203S
KTD130 4 KTD130 4 10KOHM
HPC2
10UF

100NF
AR6
10UF

10KOHM
HPC11
1 IC1001
25V 10UF
AC4

AC5

HPR3

10UF
1KOHM
1KOHM

HPC3

VEE
AD5

HPR17
10UF 16V

5.1
AC3

HPC18
HPC22
SGN D HPR21
HPQ1 KTC3875SS-BL

47KOHM
HPR7

HPC8
HPC9
SGND HPR2 HPR5 E HPR25 E

HPC17
C

330UF

HPR20
1KOHM

10UF
AD4

2.2NF
B

10KOHM
MAIN_MUTE B B
C C HPC19
7.5

4.7KOHM E 4.7KOHM 4.7KOHM


HPQ1R HPQ2R 22PF
KTD130 4 KTD130 4
0OHM HPC5 HPR9 HPC15
DGND OPR CH HPR28 HPR16 680OH M
HPR29 8.2KOHM HPR15 2.7KOHM
A_RCH 2.2UF E 10UF HPC13 SGN D
0OHM B 47UF HPC25
KTD1304 C HPQ3R
HPR23 47UF HPC28 150PF
4.7KOHM 47UF HPC26
HP_L
HPR14
22KOHM

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-7


6. Schematic Diagram

6.7. SMPS

POWER

+
-

SQD201 1K

GND_S

GND_P
GND_S

L N
GND_S

CN801S

GND_P

GND_S

6-8 Copyright© 1995-2013 SAMSUNG. All rights reserved.


GSPN (GLOBAL SERVICE PARTNER NETWORK)
Area Web Site

Europe, MENA,
https://gspn1.samsungcsportal.com
CIS, Africa
E.Asia, W.Asia,
https://gspn2.samsungcsportal.com
China, Japan
N.America, S.America https://gspn3.samsungcsportal.com

This Service Manual is a property of Samsung Electronics


Co.,Ltd.
© 2013 Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under
All rights reserved.
applicable International and/or domestic law.
Printed in Korea

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