Che5700 陶瓷粉末處理

Casting Techniques
Slip casting (e.g. drain casting, solid casting), tape
casting, gel casting, centrifugal casting, etc
Prepare proper slurry (proper viscosity), fill into mold
or direct forming, dehydration (or solvent), de-molding,
drying, sintering, post-fabrication, product
Can be used to get complex shape products
Uniformity of slurry: very important
Dispersion of slurry: can be judged by sediment height
(an index)
anisometric particles, easy to show preferred direction,
e.g. plate particle, tend to be parallel to casting surface

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Che5700 陶瓷粉末處理

Schematics of Slip Casting

Drain casting: dilute solution (5%), porous mole,
particle adsorb on mold wall, form thin layer, pour extra
solution, de-molding and other processing
Rate of dehydration affect particle packing

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Che5700 陶瓷粉末處理

Mechanism of Slip Casting

Flow resistance: mold and cake
Darcy law applied to get relationship between
pressure drop and velocity; usually mold resistance
greater than cake resistance
PT = applied pressure + suction pressure from mold

Filtration theory: sample thickness and time relation

PT kPT
  ( c   m )vo L [
2
]t
L  ( c   m )(1   )
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Che5700 陶瓷粉末處理

Viscosity of Slurry

viscosity too high or

low: not ideal
Also slurry may have
yield strength
Good stability for
storage life

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Che5700 陶瓷粉末處理

Schematics of Solid Casting

Solid casting:
concentrated
slurry pour into
mold,
dehydration,
de-molding
and other
processing;

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Che5700 陶瓷粉末處理

Strength of Product

Product strength
increase gradually
Due to increasing
density, strength
comes from
interaction between
particles, with help
from binder

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Che5700 陶瓷粉末處理

Filter Pressing

In general: slip casting rely on

capillary action to remove water,
filter pressing: from applied
pressure, can reach higher density
Cake may be compressible: S =
compressibility index
another possibility: vacuum
filtering

 c  P T
S

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Che5700 陶瓷粉末處理

Sedimentation
Casting/Centrifugal Casting
Different casting process
Sedimentation: slower rate; add centrifuge to
increase rate of sendimentation
Well dispersed suspension, very slow sendimentation,
can reach higher density; different particle size,
different rate  different effect, i.e. may be size
distribution inside the cake (sediment)  to product,
poor effect  always differential shrinkage
Centrifugal casting: suitable for tube making; r2 for
g as the acting force
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取自TA Ring, 1996
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取自TA Ring,
1996;

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Che5700 陶瓷粉末處理

Porous Mold Materials

Gypsum: frequently used; plaster of Paris CaSO4. .5H2O +
H2O  gypsum CaSO4. 2H2O
Today’s technology: good smooth surface, high ultimate
porosity, micron-sized pores, short setting time, small
dimensional expansion on setting (for easy release), low
cost
Often use hot water to get uniform mold
Porosity: depending on mixing, electrolyte in water, T etc.
parameters
Limitations : low compressive strength when partially
saturated with water  erosion; when in contact with acid
or alcohol, gypsum life becomes shorter
New generations of polymer mold, with similar pore
structure, high strength, corrosion resistant 11
 when making mold, too much water, low strength, greater
adsorption
Taken from JS Reed, 1995; when mold drying, avoid too
high temperature, will cause dehydration

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Che5700 陶瓷粉末處理

Dip Coating

Pull at an angle and

speed to get coating;
film thickness depend
on slurry rheology; for
Newtonian fluid

 xy
 g sin 
y
U
hmax 
g sin 
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Che5700 陶瓷粉末處理

Particle Orientation
Taken from TA
Ring, 1996;

Dip coating:
shear force
may cause
special
arrangement
of particles to
minimize
resistance

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Che5700 陶瓷粉末處理

Problems of Slip Casting

Implies optimized viscosity and gelation  by proper

additives; slurry rheology, casting rate, cast property, drying
and burn-out rate = balance of these parameters 15
 Taken from JS Reed, 1995; case A, range of “good” cast
is wider and favorable; S = soft; H = hard;
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Che5700 陶瓷粉末處理

Gel Casting
Refer to cases where binder (monomer) can polymerize,
make system a gel; fill in a mold (of complex shape) 
stimulate reaction to gelation  de-mold  thermal
treatment to product

Can be used for dense product or porous product, former

case: concentrated slurry to get high density packing

Linear shrinkage is about 0.5 – 1.5%

Volume of binding phase/volume of particles ~ 16%

Mold not necessary porous material, can be made of a

variety of materials

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Che5700 陶瓷粉末處理

Control of Defects in Cast

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Che5700 陶瓷粉末處理

Discussions on Defects
Non-uniformity in wall thickness: due to non-uniformity
from mold, non-uniformity in water adsorption or casting
rate; or erosion non-uniformity in mold etc.
distortion: come from stress in green body, or differential
shrinkage during drying, e.g. warping
crack: difference in adhesion between object and mold wall,
differential volumetric shrinkage, especially at joint; or very
large agglomerates
void: could be due to trapped air
Bubbles and pin-holes: comes from during pouring; pin-hole
on the surface may come from removing excess slurry
Surface irregularity: come from irregularity on mold surface,
water adsorption non-uniformity, during pouring of high
viscosity slip etc.
Microscopic defects: incomplete dispersion, contamination,
unadsorbed additive; etc.
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Che5700 陶瓷粉末處理

Tape Casting
Or called doctor blade method; often used to fabricate
thin, plate-like products, such as substrate
High productivity, if continuous process, green tape first,
then cut into appropriate sizes; can be multilayer
“laminated” products
Appropriate viscosity is of vital importance
In general, particle size around 1 μm, or specific surface
area of 2 – 5 m2/g
An-isometric particles may align preferentially during
casting, to form special structure;
Tapes of Tyflon, Mylar are often used as carrier, may be
coated with de-molding compound (脫模劑) for easy
removal
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Common tape casting equipment; from JS Reed, 1995

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Che5700 陶瓷粉末處理

Doctor Blade

d xy
dp / dx  ( gL  Papplied ) / W 
dy
Belt moving velocity + pressure gradient  effect of
motion
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 MLCC= multilayer ceramic capacitor
LTCC = low temperature co-fired ceramics

Taken
from TA
Ring,
1996
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Che5700 陶瓷粉末處理

Slurry Compositions

Change to water system: a common trend for

environmental reasons; need to overcome drying-shrinkage
problem 26
Che5700 陶瓷粉末處理

Additives

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Che5700 陶瓷粉末處理

Quantity Effects

Too much lubricant,

lower tensile
strength; increase
strain-to-failure

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Che5700 陶瓷粉末處理

Binder Quantity

Tape casting: Vb/Vp ~ 15 –

25%
high MW binder, can offer
higher strength and
toughness green body, not
moving during drying
(migration with solvent)
Yet binder has to be
removed during calcination

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Che5700 陶瓷粉末處理

Tape Thickness

Pressure flow under the blade + planar laminar flow

by the carrier
Thickness = f(height under blade, speed of carrier,
drying shrinkage, viscosity of slurry)
Dr = (density of slurry)/(density of as-dried tape);ho
cast thickness at the blade; L = length of tape
Drying stage: shrinkage mostly in the thickness; not
much in the lateral direction  thus use Dr

H  ADr ho [1  h P /( 6s vL)]

2
o
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Che5700 陶瓷粉末處理

Uniformity Issue
High rate and high
viscosity, beneficial
to product uniformity

Industrial scale: 25
m long, several
meters wide, 1500
mm/min speed, tape
thickness: 25-1250
m are common;

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Che5700 陶瓷粉末處理

Drying
Drying rate ~ temperature and solvent content of the
drying air; initial: solvent evaporation, drying rate about
constant
Capillary force to transport liquid inside green body:
mechanism during rate decreasing region

Shrinkage occurs: particle closer to each other

Binder often not moving, lubricant can move
Last item: vapor transport may be rate determining
step, tape becomes more elastic

Final density ~ 55-60% of TD; 35% organics, 15%

porosity
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Che5700 陶瓷粉末處理

Shaping and Laminating

Individual steps: scale become smaller and smaller;
0402; 0201, etc.

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Che5700 陶瓷粉末處理

Binder Burnout

Need certain gas

permeability to allow
organics to burn out
and vented;
Bond strength
between layers:
important issue
during burnout stage;
Strength related to
pressure during
forming,
temperature and
time 34
Che5700 陶瓷粉末處理

Defects

Agglomerate inhibit sintering in that region; differential

shrinkage lead to crack; bubbles & poor surface cause
poor contact between layers

Difference between metal line and neighboring ceramics;

gas pressure from binder burnout may cause problem
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Che5700 陶瓷粉末處理

Effects of Some Parameters

Effects
bubble skinning crack
•More solvent decrease NA may increase
•Higher temperature decrease increase NA
•Increase solvent
evaporation rate NA increase increase
•Faster pouring
• rate NA NA NA
•Air rate up NA NA increase
•Inorganic NA lower NA

Ideal slip: high solid content, low viscosity, solvent not

causing skinning and trap air bubble, drying system can
remove gas and rapid drying
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取自JS Reed, 1995;
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