Interconnect and Packaging

Lecture 3: Skin Effect

Chung-Kuan Cheng
UC San Diego

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Outlines

I. Transmission Line Model

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I. Transmission Line Model
i(z,t)

RΔl LΔl RΔl LΔl

RΔl LΔl RΔl LΔl

Voltage drops through serial resistance and inductance

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I. Interconnect Model
• Telegrapher’s equation:
dV ( z , t ) dI ( z , t )
  RI ( z , t )  L
dz dt
dI ( z , t ) dV ( z , t )
 C  GV ( z , t )
dz dt
• Propagation Constant:
  ( R  jL)(G  jC)    j
• Wave Propagation:
z  jz  jt
V ( z, t )  V0 e ,v  z / t   / 
• Characteristic Impedance
Z  ( R  jL) /(G  jC)

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I. Interconnect Model
• Propagation Constant:
  ( R  jL)(G  jC)    j
1
  j   4 ( LC ) 2   2 [( LG ) 2  ( RC ) 2 ]  ( RG ) 2  RG   2 LC
2
1
j  4 ( LC ) 2   2[( LG ) 2  ( RC ) 2 ]  ( RG ) 2  RG   2 LC
2

• Wave Propagation:
z  jz  jt
V ( z, t )  V0 e ,v  z / t   / 
• Characteristic Impedance
Z  ( R  jL) /(G  jC)

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I. Interconnect Model (Constants)

• AWG (American Wire Gauge

• Characteristic Impedance of Air  /   376.8

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 II. Spectrum of Configurations   ( R  jL)(G  jC)    j

RLGC R L G C
0001 ( jwC ) Capacitance
0010 ( G ) Shunt
0011 ( G + jwC ) Leaky Capacitance
0100 ( jwL ) Inductance
0101 ( jwL )( jwC ) Lossless LC Line
0110 ( jwL )( G ) Skin Effect Derivation
0111 ( jwL )( G + jwC ) Skin Effect + Permitivity
1000 ( R ) Resistance
1001 ( R )( jwC ) RC Line
1010 ( R )( G ) Leaky Resistance
1011 ( R )( G + jwC ) Leaky RC Line
1100 ( R + jwL ) Lossy Inductance
1101 ( R + jwL )( jwC ) Lossy LC Line
1110 ( R + jwL )( G ) Lossy and Leaky Inductance
1111 ( R + jwL )( G + jwC ) Transmission Line

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III. Skin Effect
  ( R  jL)(G  jC ) Assuming that resistance and capacitance
are negligible.
 jLG
LG LG
 j
2 2

Skin Depth

2



(Equivalent Depth of Uniform Current)

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IV. Coaxial Cable
 ln( b / a) 60
Z0   ln( b / a)
 2 r
1 1 1 2 R
R (  ),   , 
2 a b  2Z 0

d
 0  ln b / a  1  a / b
da
b / a  3.6  Z 0  77
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IV. Coaxial Cable: Inductance
a  Ir2
b I
 ( r , b)   dr   dr
r 2r a 2 a 2r

I I
 (a  r ) 
2 2
ln b / a
4a 2
2

a I
LI   (r , b) 2 2rdr
2
0 a
 
L  ln b / a
8 2
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IV. Coaxial Cable: Inductance
 I I
Li I    rdr  
0 p 2p
 1  1 1 
Li   ,R  
2 p p 2 p p 2

R  Li

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IV. Coaxial Cable: Inductance

 ( ) I 0 (a j  )
Zi  /m
2a I1 (a j  )
 ( )  j /(  j )

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IV. Coaxial Cable: Impedance

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 IV. Coaxial Cable: Impedance
R  RDC
2
 RAC
2

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HW1: Remarks on z900
• Chip (Processor)
• 10x17 sqmm, 38W, 918MHz, 250MIPS
• 128bits to each L2 cache chip
• 280um pitch chip to MCM
• MCM
• 127x127sqmm, 5xTerabits/s, 459MHz
• 20 Processors, 8x4MB Memory
• 11Knets, 95mm max length on critical path
• 1ns on MCM, 1.4ns off MCM
• 33um think film pitch, 396um ceramic substrate
• 101Kpins, 35.3pin/sqcm
• 4224pins/1735pg to PCB

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Remarks
• Board
• 553x447sqmm, 1 MCM, 64GB memory, 24 STI
• 7 mils pitch (3.3width/4sep)
• 24GB/s IO, 1GB/s bus, 240lines/MBA (6GB/s),
• 10pairs/STI, 9 signals/1 clock
• 3516nets, 19,788pins (signals + pg), 8pins/sqcm

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