Professional Documents
Culture Documents
Studio Workflow
Harry Peterson
Senior Director of IC Technology
Pixelworks Inc
Co-authors:
Angus Tang
Marc Ranger
Introduction
■ Trends:
— What we can build is limited by our ability to manage
complexity
— Co-design is everywhere
— Schedules keep shrinking
— Interaction among disciplines becomes tighter
— Simulators are more powerful
— ATE becomes relatively more expensive
■ Focus of this presentation:
— Methodology for co-design of test program and mixed-
signal chip
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Objective:
Minimize Time to (Profitable) Revenue
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
The Idea
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Methodology
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Testbench, in the virtual world
■ Resources for generating stimuli:
— Dozens of types of signal generators exist
— For this session, we just look at PWL and
PULSE
■ Resources for analyzing responses:
— EZWave
— Third-party (Kimotion) software mines data so
that we can automate regression tests
— Custom scripts bridge the gap between
Simulation software and ATE software
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Testbench, in the real (ATE) world
■ Resources for generating stimuli:
— AWG (Arbitrary Waveform Generator)
— Pin Driver
— Other
■ Resources for analyzing responses:
— Waveform digitizer
— Comparator
■ Other resources:
— Active load
— Active and passive circuits on load board or probe card
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
EDA Tool Selection
■ Why we chose ADMS:
— Allows us to efficiently move between accurate
transistor-level analysis and fast top-level
analysis.
— Efficient
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
ATE Resource Selection
■ Credence D10
— Powerful mixed-signal capability
— Good analog performance
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Test Generation Methodology / Digital
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Test Generation Methodology (Mixed-signal)
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Enabling technology for mixed-signal test
ICStudio
■ An integrated, user-friendly environment
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Approach
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Case Study: video AFE
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
DUT and the Simulation Testbench /1
Digital stimulus
Verilog
ADC
under
Test Monitors
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
DUT and the Simulation Testbench /2
■ The top-level testbench allows us to characterize the
ADC and extract important performance parameters
such as INL, DNL, and ENOB.
Digital stimulus
Verilog
ADC
under
Test Monitors
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
DUT and the Simulation Testbench /3
■ The digital stimulus block generates the
necessary clock and control signals to the ADC.
■ Digital stimuli are implemented as a Verilog
block.
Digital stimulus
Verilog
ADC
under
Test Monitors
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
DUT and the Simulation Testbench /4
■ The analog stimulus block generates a ramp
signal so that the output of the ADC can be
measured for linearity. Analog stimuli are
modeled behaviorally in Verilog AMS.
Digital stimulus
Verilog
ADC
under
Test Monitors
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Case Study: video AFE
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Mapping the simulation testbench
to the ATE testbench /1
■ The digital stimuli are translated into test
vectors in ATE tester format.
■ The digital module of the D10 tester accepts
test vectors in STIL format, which can be
readily generated from simulation.
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Mapping the simulation testbench
to the ATE testbench /2
Top-level Test Bench
Test_Bench_behavioral.va
.
.
. Analog stimulus
//ramp input
Verilog AMS
module single_ended_ramp (.amplitude(1.0), .offset(0.5)...) Ramp(Rin_0, VSSA);
. v
.
. t
ADC_Test.cpp
.
.
.
void AWG_setup(double amplitude, double offset, string signal...)
{
/*********************************** AWG SETUP ***************************************/
. Sapphire D-10
. AWG
cscTester->AWG()->Signal(signal)->OutputCtrl()->setOptimization(OPTIMIZE_FOR_NOISE);
cscTester->AWG()->Signal(signal)->OutputCtrl()->setAmplitude(amplitude);
cscTester->AWG()->Signal(signal)->OutputCtrl()->setCommonOffset(offset);
cscTester->AWG()->Signal(signal)->OutputCtrl()->setClockFrequency(awg_freq);
cscTester->AWG()->Signal(signal)->WaveformCtrl()->setSource(AWG_WAVEFORM_MEMORY);
cscTester->AWG()->Signal(signal)->WaveformCtrl()->setActiveWaveform(wfid);
cscTester->AWG()->Signal(signal)->WaveformCtrl()->setWaveformRepeat(ULONG_MAX);
.
.
}
.
.
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Mapping the simulation testbench
to the ATE testbench /3
■ Using the method described, the bulk of the
ATE test program can be generated from the
simulation testbench, before first silicon is
available.
■ Test program development time and effort is
reduced.
■ This flow bridges the communication gap
between test engineers and designers.
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Next steps
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Next steps /1
Use Kimotion ‘Breaker’ tool to help mine simulation data
so we can make specs more executable
Design variables Specifications Process and Environment
■ User-defined
testbenches measure
important circuit
performances Eldo
■ Breaker exercises KtModels
testbenches to find AdvanceMS
most likely and/or …
worst-case violations
for each performance
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Next steps /2
Use Mentor ‘Checkerboard’ tool to greatly improve speed
and effectiveness of chip-level simulation
Verification engineer traditionally has access to two types of block descriptions
■ .
Transistor-accurate netlists Ideal behavioral models are fast, but
slow, but capture all effects modeling extra effects requires tuning
vdd
X6
vdd vdd biasgbp biasp
m3a biasp m3b vss vss casgbp casp
.param cload=2.5p l={l3} w={w3} m={mout+min} l={l3} w={w3} m={mout+min} n2a in casgbn casn
caspa caspb
caspa out biasgbn biasn
outn outp C7 C8 gainboostp
C1 C2
{cgbp} {cgbp}
vss
{cload} {cload}
n2b X5
vss
vdd vdd biasgbp biasp
n2a
vss vss casgbp casp
n2b in casgbn casn
m4a m4b
vdd caspa caspb vdd caspb out biasgbn biasn
l={l4} w={w4} m={mout} l={l4} w={w4} m={mout}
gainboostp
A
C3 C4 vdd vdd biasgbp biasp
vss vss casgbp casp
{ccm} {ccm} n3a in casgbn casn
cmreg
casna out biasgbn biasn
gainboostn
l={l5} w={w5} m={mout} l={l5} w={w5} m={mout}
casna casnb
l={l2} w={w2} m={min} l={l2} w={w2} m={min}
inp vss vss inn m5a m5b
m2b m2a X4
vdd vdd biasgbp biasp
casna casnb
vss vss casgbp casp
n1a C5 C6 n3b in casgbn casn
n3a n3b
casnb out biasgbn biasn
{cgbn} {cgbn}
gainboostn
vss vss
l={l1} w={w1} m={min} l={l1} w={w1} m={min}
biasn2 biasn2
m1a m1b l={l6} w={w6} m={mout} cmreg l={l6} w={w6} m={mout}
BIASING
m6a m6b vdd vdd biasp biasp
outp outp X7
vss vss casp casp
outn outn reg
ibias ibias casn casn
cmout ref
biasn2 biasn2 biasn biasn
vss
X2
.param cload=2.5p caspa caspb
caspa out biasgbn biasn
outn outp C7 C8 gainboostp
C1 C2
{cgbp} {cgbp}
vss
{cload} {cload}
n2b X5
vss
vdd vdd biasgbp biasp
n2a
vss vss casgbp casp
n2b in casgbn casn
m4a m4b
vdd caspa caspb vdd caspb out biasgbn biasn
l={l4} w={w4} m={mout} l={l4} w={w4} m={mout}
gainboostp
Captures impact of
vss vss casgbp casp
{ccm} {ccm} n3a in casgbn casn
cmreg
casna out biasgbn biasn
gainboostn
l={l5} w={w5} m={mout} l={l5} w={w5} m={mout}
casna casnb
l={l2} w={w2} m={min} l={l2} w={w2} m={min}
inp vss vss inn m5a m5b
m2b m2a X4
vdd vdd biasgbp biasp
casna casnb
vss vss casgbp casp
n1a C5 C6 n3b in casgbn casn
n3a n3b
casnb out biasgbn biasn
{cgbn} {cgbn}
gainboostn
vss vss
l={l1} w={w1} m={min} l={l1} w={w1} m={min}
biasn2 biasn2
m1a m1b l={l6} w={w6} m={mout} cmreg l={l6} w={w6} m={mout}
BIASING
m6a m6b vdd vdd biasp biasp
outp outp X7
vss vss casp casp
outn outn reg
ibias ibias casn casn
cmout ref
biasn2 biasn2 biasn biasn
vss
X2
block’s effects
on system behavior
vdd
X6
vdd vdd biasgbp biasp
m3a biasp m3b vss vss casgbp casp
.param cload=2.5p l={l3} w={w3} m={mout+min} l={l3} w={w3} m={mout+min} n2a in casgbn casn
caspa caspb
caspa out biasgbn biasn
outn outp C7 C8 gainboostp
C1 C2
{cgbp} {cgbp}
vss
{cload} {cload}
n2b X5
vss
vdd vdd biasgbp biasp
n2a
vss vss casgbp casp
n2b in casgbn casn
m4a m4b
vdd caspa caspb vdd caspb out biasgbn biasn
l={l4} w={w4} m={mout} l={l4} w={w4} m={mout}
gainboostp
interactions
m3a biasp m3b vss vss casgbp casp
.param cload=2.5p l={l3} w={w3} m={mout+min} l={l3} w={w3} m={mout+min} n2a in casgbn casn
caspa caspb
caspa out biasgbn biasn
outn outp C7 C8 gainboostp
C1 C2
{cgbp} {cgbp}
vss
{cload} {cload}
n2b X5
vss
vdd vdd biasgbp biasp
n2a
vss vss casgbp casp
n2b in casgbn casn
m4a m4b
vdd caspa caspb vdd caspb out biasgbn biasn
l={l4} w={w4} m={mout} l={l4} w={w4} m={mout}
gainboostp
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Next steps /3
Pull software development and validation
into this codesign loop
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Next steps /4
Integrate yield-analysis and
product-engineering capabilities
■ Yield Analysis Options
1. Corners Analysis
■ Corners are based on digital performance criteria
■ Requires many simulations
■ Leads to overdesign – more so with newer processes
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Next steps /4
Integrate yield-analysis and
product-engineering capabilities
■ KtModeler improves
the accuracy of
behavioral models.
— Behavioral
simulations can see
issues previously
caught only with spice
simulation.
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
Acknowledgements
■ Pixelworks executive support:
— Hans Olsen
■ Pixelworks engineering team:
— Jenkin Wong, Thomas Nasralla, Mike Parrish, Jay Sulima,
Pri Nallahandi, Liang Yuan
■ Insyte (ATE Consultant):
— Peter Lindholm
■ Mentor:
— Sam Wasche, Christian Mayer, Brandon Barnes,
Vamsi Rachapudi
■ Credence:
— Ken Skala
■ Kimotion:
— Bart De Smedt, Walter Daems
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007
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HWP, Integrating Physical Test into the IC Studio Workflow, March 2007