CMOS Fabrication

Vikash Sharma AP ECE Department

Outline
 Overview of CMOS
 CMOS Fabrication Process Overview
 CMOS Fabrication Process
 Problems with Current CMOS Fabrication
 Future Changes in CMOS Fabrication
 What is CMOS?

http://en.wikipedia.org/wiki/CMOS
 Complementary metal–oxide–semiconductor (CMOS)
 Has many different uses:
 Integrated Circuits
 Data converters
 Integrated transceivers
 Image sensors
 Logic circuits
What is CMOS?

NAND Circuit
CMOS Fabrication Process
Overview

http://lsmwww.epfl.ch/Education/former/2002-
2003/VLSIDesign/ch02/ch02.html
 CMOS Fabrication Process
1. Create a pattern.
2. Oxidize small layer, about 1µm
thick.
3. Place photoresist on top of
SiO2
4. Place mask(pattern) above
photoresist and expose it to
UV light.
CMOS Fabrication Process
CMOS Fabrication Process
 CMOS Fabrication Process
1. Etch away SiO2 using HF
acid or plasma.
2. Remove remaining
photoresist with acids.
 CMOS Fabrication Process
 To create a n well:
 Diffusion
 Heat wafer in Arsenic gas chamber until diffusion occurs.
 Ion Implantation
 Arsenic or phosphorous are implanted in window.

SiO2

n well
CMOS Fabrication Process
 CMOS Fabrication Process
 A thin layer of oxide is
deposited.
 A thin layer of polysilicon is
deposited using Chemical
Vapor Deposition (CVD) .

n well
p substrate
CMOS Fabrication Process

http://en.wikipedia.org/wiki/Chemical_vapor_deposition
 CMOS Fabrication Process
 Remove oxide layer using
acid.
 Dope open area using Ion
implantation or diffusion.

p+ n+ n+ p+ p+ n+
n well
p substrate
CMOS Fabrication Process

Metal
Thick field oxide
p+ n+ n+ p+ p+ n+

n well
p substrate
CMOS Fabrication Process
Problems with Current CMOS Fabrication

 Optical lithography is limited by the light frequency.

 Material limitations
 Yield limitations
 Space limitations
Future Changes in CMOS Fabrication

 Material changes like using high-k materials.

 Design changes
 SOI(Silicon On Insulator)
 Double Gate (Finfet)
 Twin-Tub Process
Future Changes in CMOS Fabrication
Future Changes in CMOS Fabrication
Future Changes in CMOS Fabrication

http://www.fujitsu.com/downloads/MAG/vol39-1/paper02.pdf
References
 CMOS Digital Integrated Circuit Design - Analysis and Design by S.M. Kang and Y.
Leblebici
 http://www.fujitsu.com/downloads/MAG/vol39-1/paper02.pdf
 “Introduction to VLSI Circuits and Systems,” John Wiley and Sons, 2002
 http://lsmwww.epfl.ch/Education/former/2002-2003/VLSIDesign/ch02/ch02.html
 http://en.wikipedia.org/wiki/Chemical_vapor_deposition
 users.ece.utexas.edu/~adnan/vlsi-05/lec0Fab.ppt
 http://en.wikipedia.org/wiki/CMOS
 www.usna.edu/EE/ee452/LectureNotes/02-
_CMOS_Process_Steps/08_Simple_CMOS_Fab.ppt
 http://en.wikipedia.org/wiki/Silicon_on_insulator
 access.ee.ntu.edu.tw/course/VLSI_design_90second/data/Chapter%203%20Part2%2003-20-
2002.doc