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Universal Hardware Platform of

ZXC10-3GCN Devices
V0603

ZTE University
Mobile-MSS/WDSS Group
ZTE University univ.zte.com.cn
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Course Objectives

Understand Universal Hardware


Platform of ZXC10-3GCN Devices
Understand Function and Structure
of Subsystems
Understand Boards Principle
Understand Subsystems Connection

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Advanced Unified All-IP Platform
ZXC10-3GCN Devices


 Based
Basedon
onunified
unifiedall-IP
all-IPplatform.
platform.

 Shared
Sharedthe
thesame
samehardware
hardware
platform
platformwith
withRAN.
RAN.
ZXC10 MGW ZXC10 MSCe

 High
Highcapacity
capacityand
andDual
Dual
switching
switchingnetwork.
network.

 Shared
Sharedthe
thesame
samehardware
hardware
platform
platformwith
withZTE
ZTETD-SCDMA
TD-SCDMA
and
andWCDMA
WCDMAproducts,
products,which
which ZXC10 HLRe ZXC10 SCPe
have
havealready
alreadydeployed
deployed
worldwide.
worldwide.

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Modularized Structure, Easy Expansion
ZXC10-3GCN
ZXC10-3GCN
ZXC10
ZXC10 MGW
MGW ZXC10
ZXC10 MSCe
MSCe ZXC10
ZXC10 HLRe
HLRe
ZXC10 MSCe
Easy 1 1 1
Expansion
ZXC10 MGW
2 2 2

ZXC10 HLRe 3 3 3

4 4 4

 For
Forsome
somesmall
smallcapacity
capacitysituation,
situation,one
oneZXC10-3GCN
ZXC10-3GCNRack Rackcan
canmake
makedifferent
differentshelves
shelvesact
actas
asdidi
fferent
fferentNEs
NEstotosave
savecost
costand
androom
roomspace
spaceininthe
theinitial
initialphase.
phase.
 With
Withthe
thecapacity
capacityincrease,
increase,ZTE
ZTEcan
canadd
addboards,
boards,Shelves,
Shelves,Racks
Rackstotomake
makethe
theexpansion
expansionvery
veryee
asy.
asy.

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Subsystems of ZXC10-3GCN Devices

• The ZXC10-3GCN includes multiple NEs, which are const


ructed on the basis of some hardware subsystems and boar
d components. In terms of function, the subsystems fall int
o four types :
– BUSN: Resource Subsystem
– BCTC: Signaling Control Subsystem
– BPSN: Core Packet Switching Subsystem
– BCSN: Core Circuit Switching Subsystem
• Each subsystem adopts a standard shelf with 17 slots.

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BUSN: Resource Subsystem

• The resource subsystem BUSN


concentrates or converts various
peripheral access modes into the
circuit service stream, IP data
stream, and IP control stream. The
signals switched in the subsystem
include TDM signals, Ethernet
media stream, Ethernet control
stream, clock signal, and other
control signals.

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BCTC: Signaling Control Subsystem

• The control subsystem bears


signaling processing board, BCTC
protocol processing board, main
control board, and so on. It
transits and processes control
streams to construct a distributed
processing platform for the
system.
• The signals in the control
subsystem include TDM signal,
control stream Ethernet, clock
signal, and other control signals.

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BPSN: Core Packet Switching
Subsystem

BPSN
• The packet switching sub
system can provide the c
ore switching of 80 Gbps
. It has good packet data
dispatching and traffic m
anagement functions.

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BCSN: Core Circuit Switching Subsystem

BCSN
• In the MGW, the circuit
switching subsystem is
used to implement
large-capacity
(64K~256K ) circuit
switching.

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Hardware Structure of ZXC10 MGW
Small
BUSN
Capacity

Large
Capacity

BUSN BPSN BCTC


…..

…..
Main
.

.
BCTC

BUSN BCSN

BCTC

To OMC

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Hardware Structure of ZXC10 MSCe

• ZXC10 MSCe consists of one or several BCTC subsystems.

To OMC Large
Capacity
Small
Capacity
BCTC

…..
BCTC Main

.
BCTC

BCTC

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Hardware Structure of ZXC10 HLRe

• ZXC10 HLRe consists of one or several BCTC subsystems.

To OMC Large
Capacity
Small
Capacity
BCTC

…..
BCTC Main

.
BCTC

BCTC

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Principle of the Resource Subsystem

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Boards in BUSN Shelf

• UIM (Universal Interface Module)


– Media stream Ethernet switching
– Control stream Ethernet switching
– 16K TDM switching or access
• DTB (Digital Trunk Board)/DTEC (Digital Trunk Echo Ca
ncellation)
– Provide 32 E1/T1
• SDTB ( SONET Digital Trunk Board )
– SDTB is the STM-1 optical trunk board. It provide one
155M SDH channel.

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Boards in BUSN Shelf _Cont.

• MRB (Media Resource Board)


– Provides resource function for 480 channels of tone/voice, DTMF,
MFC, and conference call.
• VTCD (Voice Transcoder)
– Supports codec functions such as SMV, EVRC, QCELP, G.723.1,
G.729, and G.711.
• MNIC (Multi-service Network Interface Card)
– Provides 1 GE optical interface, or 4 FE interfaces, or 2~4 STM-1
POS interfaces to the external network.
• CLKG (CLOCK Generator)
– Provides global synchronization clock signals for all the units in th
e 3GCN.

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BUSN Shelf Slot Layout
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

S D D D S S M V U U M M M M C C M
P T T T D D N T I I P P N N L L R
B B B E T T I C M M B B I I K K B
C B B C D C C G G

• Slots 9 and 10: support UIM only.


• Slots 15 and 16: CLKG only can be inserted to here.

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Principle of Signaling Control Subsystem

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Boards in BCTC Shelf

• UIM (Universal Interface Module)


• MNIC (Multi-service Network Interface Card)
• CLKG (CLOCK Generator)
• SPB (Signaling Process Board)
– Providing 16 E1/T1 interfaces.
– Processing MTP2 and lower layers of SS7 (128 signaling links max.)
• MPB (Main Process Board)
– MPB is the main processing board of the system.
– Adopts 2 independent Pentium III CPU units.
• CHUB (Control HUB )
– Provides 46 external 100M Ethernet interfaces to connect to the UIMs
of other subsystems.
– Provide one internal GE interface to connect to the UIM in the shelf.

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BCTC Shelf Slot Layout
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

M M M M M M M M U U M M C C C C
N N P P P P P P I I P P L L H H
I I B B B B B B M M B B K K U U
C C G G B B

• Slots 9 and 10: support UIM only.


• Slots 1~8 and 11~12: support MPB, SPB, and MNIC.
• Clock slots 13~14: support CLKG. Slot 13 also supports SPB.
• Convergence slots 15~16: support CHUB. One SPB can also be
inserted.
• Slot 17: An independent CHUB can be inserted in this slot for
interconnecting the second sets of control Ethernets. It also supports
the SPB or the single-CPU MPB.
• No media stream Ethernet is available in any slot.

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Principle of Core Packet Switching Subsystem

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Boards in BPSN Shelf

• UIM (Universal Interface Module)


• PSN (Packet Switch Network )
– The PSN is the packet data center of all other
subsystems.
– Provides switching capacity of 5G~80G.
• GLI (Gigabit Ethernet Line Interface)
– The GLI is a line interface board with four GE
interfaces.

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BPSN Shelf Slot Layout
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

G G G G G G P P G G G G G G U U
L L L L L L S S L L L L L L I I
I I I I I I N N I I I I I I M M
# # # # # # # # # # # # # #
0 1 2 3 8 9 0 1 10 11 4 5 6 7

• The PSNs are always inserted in Slots 7 and 8. They may work in the a
ctive/standby or load sharing mode.
• The UIMs are always inserted in Slots 15 and 16.
• Slots 1~6 and 9~14 are used for inserting GLI #0~11.
• GLI #0~1, #2~3, #4~5, #6~7, #8~9, and #10~11 can work independentl
y or in the active/standby mode.
• The MNIC board can be inserted in Slot 17 as required.

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Principle of Core Circuit Switching Subsystem

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Boards in BCSN Shelf

• UIM (Universal Interface Module)


• TSNB (TDM Switch Network Board)
– The TSNB can provide circuit switching of
64K~256K.
• TFI (TDM Fiber Interface)
– The TFI stays between the TSNB in the Core Circuit
Switching Subsystem and the UIM in the resource
subsystem to provide bridging function for the high-
speed TDM signal connections between the two
subsystems.

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BCSN Shelf Slot Layout
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

T T T T T T U U T T T T C C
F F F F S S I I F F F F L L
I I I I N N M M I I I I K K
B B G G

• Slots 9 and 10: support UIM only.


• Slots 5 and 7: A pair of TSNBs can be inserted to provide 64K~256K sw
itching capacity.
• Slots 1~4 and 11~14:Insert four pairs of TFIs; each pair can provide 64
K timeslots.
• If no TFI is configured in Slot 3/4/11/12/13/14, MPB can be inserted.
• One pair of MNICs can also be inserted in Slots 13 and 14.
• Clock slots 15~16: They support CLKG.
• Slot 17: It supports the single-CPU MPB or the MNIC.

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Principle of UIM

• Sub-card: (Optional)
– GCS : Provide internal interconnection between
GEs to realize a control plane.
– GXS : Provide an external media plane optical i
nterface GE.
• Either 16K circuit switching or TDM access c
an be realized by UIM.

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UIM Categories

UIMU UIMT UIMC

16K circuit switching √ × ×

TDM access × √ ×

Sub-card GXS GXS GCS

BCTC/BCSN/
Shelf Supported Single BUSN Multi BUSNs
BPSN

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MNIC Categories

• IPI: Provide 4 Service FE interfaces.


• SIPI: Provide 4 Control FE interfaces and signaling proces
sing function. Its processes SIGTRAN bottom-layer signali
ng protocols, forwards IP packets, and forwards the SCTP
packets received from the IP network to the SMP for proce
ssing. When receiving a routing packet, it should forward t
he packet to the RPU so that the RPU maintains the routin
g table. One suite of HLRe system only needs two SIPI bo
ards working in the 1+1 backup or load sharing mode.
• USI: Provides the interface between the SMP and the datab
ase server. One suite of HLRe system only needs two USI
boards working in the 1+1 backup mode.

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MPB

• Categories:
– OMP: Operation Main Processor
– SMP: Signal Main Processor
– CIB: Charge Interface Board
• MPB adopts 2 units of Pentium III CPU for load sharing.
Each CPU unit provides four 100M Ethernet interfaces.
• Active/standby changeover
– The two CPU units on the same MPB can be
independently changed over.
– when you press RESET button on the panel or want to
remove the active board, the two CPU units are notified
to change over at the same time.

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Agenda

 Overview of ZXC10-3GCN Devices


Hardware Structure
 Resource Subsystem
 Signaling Control Subsystem
 Core Packet Switching Subsystem
 Core Circuit Switching Subsystem
 Boards Introduction
 Interconnection of Subsystems

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Typical Connection

G U
L BPSN I
IP Service I M
Stream

U C
Control
I H
BUSN M
Stream
U BCTC
B

TDM
Service Stream T U
F I
I BCSN M

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Connection between BCTCs

U
I BCTC
M

U
I
BCTC M
U
I BCTC
M

3* BCTCs

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Connection between BCTCs _Cont.

U
I BCTC
M

C
H
BCTC U U
B I BCTC
M

U
I BCTC
At most 24 BCTCs totally M

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Connection between BUSNs (IP)

IP Service Stream
U U
2* BUSNs I
BUSN
I Control Stream BUSN
M M

G BPSN U
L I
I M
IP Service Stream

BUSN U U BUSN U
BUSN
     I
M
I I
M
M

Control Stream

C
H
At most 22 BUSNs totally
BCTC U
B
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Connection between BUSNs (TDM)

2* BUSNs

BUSN U
I
M

T BCSN U
TDM Service F I
Stream I BCTC M

BUSN U

    
I Control Stream
M

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Connection between BUSNs (TDM) _Cont
.

T BCSN U
F I
I M
TDM Service
Stream

BUSN U U BUSN U
BUSN
     I
M
I I
M
M

Control Stream

C
H
At most 16 BUSNs totally
BCTC U
B

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Control Subsystem Merge into Core
Circuit Switching Subsystem

1 2 3 4 5 6 7 8 9 1 1 1 1 1 1 1 1
0 1 2 3 4 5 6 7

T T T T T T U U T T T T C C
F F F F S S I I F F F F L L
I I I I N N M M I I I I K K
/ / B B / / / / G G
M M M M M M
P P P P P P
B B B B B B

Slots 13/14 : 1 pair of MNICs also can be inserted here.

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Thanks !
Questions are welcome

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