EEE 1011

AUTOMATED TEST
ENGINEERING
Course objective
• 1. Aims to provide knowledge about the testing of IC’s using
automated Testing Equipment (ATE).
• 2. Providing hands-on in Simulation software’s used to simulate the
evaluation conditions.
• 3. Practical knowledge imparted on usage in PCBA testing for its full
functional behavior
Course outcomes
• 1. Discover the possible component faults that can occur in electronic
manufacturing.
• 2. Classify the faults that can occur in PCBs.
• 3. Analyze and develop practical skills involved in troubleshooting.
• 4. Test the Various parameters involved in ATE
• 5. Utilize the complete board functional testing.
• 6. Design and analyze the board functional Testing.
• 7. Distinguish the details of Boundary Scan testing and Board Testing to
understand the equipment used in automated testing.
• 8. Design and conduct the experiments, as well as analyze and interpret data
Syllabus
• Module:1 Introduction To pcb Assemblies: Printed Circuit Board (PCB)-types of PCB-multilayer
PCBs-Plat Plated though Hole Technology Surface Mount Technology (SMT) – Ball Grid Array
(BGA) Technology – PCB Bare board manufacturing process – Bare board testing– PCB
Inspection methods – Visual, Optical and X-ray Inspection systems– Electrical tests in PCBs

• Module:2 PCBA Troubleshoot Methods: PCB assembly troubleshoot – locating faults & Manual
troubleshoot – Online & Offline troubleshoot – Fault types and causes in circuits – Tools and
instruments for usage – DMM(Digital Multimeter) – CRO (Cathode Ray Oscilloscope) - Logic
probes – Logic pulser – Logic Analyzer.

• Module:3 PCBA Troubleshoot Methods: Automated Testing of PCBs – Out-circuit & In-circuit
test methods – VI Trace Technique – signature analysis – Board Functional Testing Techniques–
Boundary Scan Test Strategy & methods – External Instrumentation in Automated Testing – PCB
diagnostic testers – Diagnostic Testing technique.
Syllabus
• Module:4 Automated Test Techniques: Automated Test Techniques – Various parameters – AC –
DC Parametric testing– QA testing– Identify and troubleshoot the failures of parameters–
Environmental, Electrical Standards & Requirements for IC testing – In-circuit Testing
methodologies – Back Driving – functional test– Digital, Analog and Mixed Signal ICs– Guarding
Technique – VI Trace Technique of components – Boundary Scan Test for components on board
– In-circuit measurement of passive components – Kelvin measurement – Test Fixtures – Types
of Test Fixtures – Bed of Nails Fixtures – Card Edge Test Fixtures – Reverse Engg to rebuild the
Schematic Diagram using ATE and Software.

• Module:5 Board Functional Testing (BFT): Board Functional Test (BFT) techniques – Go-No-go
Test – Cluster Test – Guided Probe Backtracking Technique – Simulators – Online and Offline
Simulation - Fault Simulation– Comprehensiveness of Board program – Fault Dictionary–
Analysis – BS and Non-BS device testing– BCSS– Interface adaptor or personality adaptor(Pod) -
Sample board programming and testing – External Instrumentation used for board testing – PXI
Instrumentation – Integration of PXI instruments.
Syllabus
• Module:6 DFT: Design for testability (DFT)- test issues – Fault Models –– Boundary Scan Test–
Self Test design – ATE for test.

• Module:7 DFM: Design for manufacturability (DFM) - Manufacturing phases in industry

oriented Production process – strategies – new strategy for DFM – benefits of new strategies –
ATE for manufacturing – Various applications.