Presentation on

COOLING OF MICROPROCESSOR WITH MICROCHANNELS

OF
BACHELOR OF ENGINEERING
IN
MECHANICAL ENGINEERING
By
17221A0315-C .Hari sri sai ram
17221A0353-P.R.G.Varaprasad
17221A0343-K.V.S.S.H.V.Varma
17221A0349-M.S.D.Manikanta
17221A0317-C.Ravi kishore
Under the guidance of
prof .A.RAMAKRISHNA

Department of Mechanical Engineering ;BVC Engineering College, Odalarevu

(Approved by AICTE, New Delhi & Accredited by NAAC with “A” Grade, Accredited by NBA, Permanently
Affiliated to JNT University, Kakinada)

ODALAREVU
CONTENTS
• Introduction
• Problem statement
• Literature Review
• Objectives
• Methodology
• References
 Introduction
 A heat exchanger is a system used to transfer heat between two or more
fluids.
 Heat exchangers used in both cooling and heating processes.
 The fluids may be separated by a solid wall to prevent mixing or they may
be indirect contact.
 The main of the project is maintaining proper heat transfer from
microprocessors.
 Problem statement

• A processor in high-performance workstation may run hot due to a

heavy use.
• The over heat run the risk of doing damage to our computer and
randomly power down.
• Leads to malfunctioning of the system.
• Due to over heat the system will completely seize up or fail.
 Literature Review

A review of liquid flow and heat transfer in microchannels

with emphasis to electronic liquid cooling

APARESH DATTA1, DIPANKAR SANYAL2, AMIT AGRAWAL3,* and AJOY KUMAR DAS4
1Department of Mechanical Engineering, National Institute of Technology Durgapur, Durgapur 713209, India
2Department of Mechanical Engineering, Jadavpur University, Kolkata 700032, India
3Department of Mechanical Engineering, Indian Institute of Technology Bombay, Powai, Mumbai 400076,
4Department of Mechanical Engineering, National Institute of Technology Agartala, Agartala 799046, India
e-mail: amit.agrawal@iitb.ac.in; aagrawal.iitb@gmail.com
MS received 1 January 2019; revised 19 June 2019; accepted 26 August 2019
Since the realization of microchannel devices more than three and half decades ago with water as
the cooling fluid providing heat transfer enhancement, significant progress has been made to improve the cooling
performance. Thermal management for electronic devices with their ever-widening user profile remains the
major driving force for performance improvement in terms of miniaturisation, long-term reliability, and ease of
maintenance. The ever-increasing requirement of meeting higher heat flux density in more compact and pow-
erful electronic systems calls for further innovative solutions. Some recent studies indicate the promise offered
by processes with phase change and the use of active devices.

• Enrico Santi, ... Kang Peng, in Power Electronics Handbook (Fourth Edition), 2018
• 6.6.3.2 Liquid Cooling
• Liquid cooling has higher thermal transfer efficiency than air cooling and is used in high-power modules. The power module baseplate is thermally
connected to a so-called cold plate, which is liquid-cooled. A liquid cooling system is required, as shown in Fig. 6.19. The cooling liquid in the
system, such as water, is pumped into the inlet of the cold plate, is heated by the heat flow from the module, flows out from the outlet, and
transfers the heat to the cooling radiator. The cold water is gathered in the coolant tank and recirculated. Liquid cooling provides superior thermal
performance compared with air cooling, but it incurs additional cost and may affect reliability due to possible coolant leaks.
 Objective

• Liquid cooling in microchannels is a highly successful method of removing

excess heat from the circuits ,with water being the most common heat
transfer fluid.
• The importance of using water cooling over air cooling is due to enhanced
thermal properties of water.
• Higher level of efficiency.
• Improves overclocking potential.
• Sustains cool temperatures over time.
• Good for warmer climates.
• Less noise.
 Liquid cooling is best way to cool a microprocessor because liquid transfers heat much
more efficiently than air.
 Liquid cooling refers to cooling by means of the convection (or)circulation of the liquid.
 Liquid cooling also makes your personal computer run quieter because you won`t have
fans constantly running at high rpm.
 Air coolers are quite good at relocating heat away from the microprocessor but the heat
is dispersed in case of the liquid coolers do a better job of relocating that heat outside of
the system via the fans on the radiator.
 References

• [1] Qu, W., Mudawar, I., Lee, S., and Wereley, S.T., “Experimental and
Computational Investigation of Flow Development and Pressure Drop in a
Rectangular Microchannel,vol.128,no.1,2006,pp.1-9.
• [2] Li, J., Peterson, G.P., and Cheng, P., “Three-dimensional analysis of heat
transfer in a micro-heat sink with single phase flow,” International Journal of
Heat and Mass Transfer, vol. 47, no. 19-20, 2004, pp. 4215-4231.
• [3] Qu, W. and Mudawar, I., “Analysis of three-dimensional heat transfer in
micro-channel heat sinks,” International Journal of Heat and Mass Transfer, vol.
45, no. 19, 2002, pp. 3973-3985.
• [4] Farnam, D.S., “Comparative analysis of microchannel heat sink configurations
subject to a pressure constraint,” Binghamton University, M.S. Thesis , 2007