BondMaster Sales Force

Training Presentation
Table of Contents
 Introduction
 Test Modes
– Pitch-Catch
» RF Method
» Impulse Method
» Swept Method

– MIA (Mechanical Impedance Analysis)

– Resonance
 BondMaster Probes
 BondMaster Accessories and
Consumables
 Use of Composites
 New Product Developments
 Conclusions
Introduction
 Adhesive-bonded components and
structures have become an
important part of manufacturing, not
only in the aerospace industry but
also in the automotive, wood-based
panel, and marine industries.
 Quality, reliable bonds are
extremely important to the integrity
of composite structures throughout
their service life.
 The wide range of materials and
configurations used in multilayered
structures and the need for
nondestructive evaluation of bonds
has resulted in many different types
of testing equipment and methods
being used.
Introduction
Ultrasonic and acoustic
inspection methods have
been quite successful
over the last 30 years.
However, no single
inspection method has
been found adequate for
the wide variety of
applications seen today.
BondMaster History
 Previous Generations of Equipment
– MIA 2500/3000
– Acoustic Flaw Detector (AFD)
– BondMaster (Military)
– BondMaster (Lightweight)
– BondMaster 1000/1000+/1000e+
BondMaster 1000e+

Signal display

Status Charge indicator

line data
Setup

Menu soft keys

Alarm LEDs
Increase/decrease keys Power button

Function keys

Immediate
execution keys
Charge connector

SmartKnob
 BondMaster Demonstration Kit
 BondMaster Training Kit:  Enhanced Probe Kit:
 Training presentation Ordering number: B1000-PK-01
 Software  MIA: S-MP-5L
 Hard copies of procedures and  PC: S-PC-P13L
documents
 PC: S-PC-P12L
 Instrument:  Resonance: S-PR-3L
Ordering number: B1000EP-I-C  Resonance: S-PR-4L
 BondMaster 1000e+ All mode Base Unit  Resonance: S-PR-5L
 Color LCD Display Module  Cable: SBM-CPM-P11
 VGA Cable, Color Display  Cable: SBM-CR-P6
 Power Cord
 Couplant 4 oz
 Li-Ion Battery
 Probe case
 UBC - universal Battery Charger
 Cable UBC to Li-Ion Instrument  Sample Kit:
 Protective Cover – Single Battery Ordering number: NEC-8207
Instrument
 Basic Carrying Case
Presented below
 Operating Manual
 Calibration certificate
Overview of Composites
 In composite components
you are generally looking DISBOND
for three types of flaws.

 Disbond in Honeycomb
structure, Delamination, and
Porosity.
DELAMINATION
SUBSURFACE POROSITY

LAMINATED STRUCTURE LAMINATED

STRUCTURE
Overview of Composites
Different material type can be
used for the skin
 Aluminum
 Fiberglass
 Graphite
 Hybrid
 Kevlar
The core that is used in
composite component structures
comes in different material type
and density
 Aluminum
 Fiberglass
 Nomex
 Rohacell
Overview of Composites
 In the Reference Skin
Standards the defect are
manufactured into the
Standards as we
manufacture them.
 On the Honeycomb
defects are volumetric Adhesive
defects and not Teflon Core
inserts.
 The defects represent an
impact on the piece. Skin
Inserts
Overview of Composites
 Then the Standard is
cured in an autoclave
or the oven depending
on the cure
specifications
 Curing in autoclave
increase the quality of
the components.
Sample Kit NEC-8207
Sample Kit Contents
 NEC-6217-1

 Carbon-fiber skin on
Nomex® honeycomb core

 Defects – milled core holes

(4), 19.0 mm (¾ in.) diam.
– 50.8 mm (2 in.) from edges

* For Honeycomb, all defects are volumetric defects and

not Teflon inserts. They are representation of an impact
on the piece.
Sample Kit Contents
 NEC-6217-1
Sample Kit Contents
 WS-2

 Glass top skin on

aluminum core

 Defects – milled core

holes (2), 25.4 mm (1
in.) diam.
– 50.8 mm (2 in.) from
edges
Sample Kit Contents
 WS-2
Sample Kit Contents
 NEC-6312

 Aluminum skin on
aluminum core

 Defects – milled core

holes (2), 19.0 mm (¾
in.) diam.
– 63.5 mm (2½ in.) from
edges
Sample Kit Contents
 NEC-6312
Sample Kit Contents
 NDICRS-002

 Carbon-fiber
monolithic step wedge

 Defects – graphite
inserts (6), 19.0 mm
(¾ in.) diam.
– 57.2 mm (2¼ in.) from
bottom
Sample Kit Contents
 NDICRS-002

* On that
sample defects
are graphite
inserts.
Test Modes
 There are three test modes and five
inspection methods available with
the BondMaster 1000e+.

 The optimum method is selected

using representative test standards
that represent both bond and
disbond conditions.

 The selected method and any

adjustments can be set up in the
laboratory and stored in memory for
later use in the field.
Pitch-Catch Test Mode
 The pitch-catch mode is very easy in terms of calibration
and requires no couplant.
 One element transmits (pitches) a burst of acoustic
energy into the test part and a separate element receives
(catches) the sound propagated across the test piece as
shown in Figure 1.
 The sound waves are propagated in a plate-wave mode
across the test piece between the two probe tips. The
return signals are detected and a phase-amplitude
display is used to show the effect of good and bad bonds
on the sound path.
Pitch-Catch Mode

Figure 1 mode
Figure 1 Pitch-catch
 Diagram of a Pitch-Catch Probe

 Probe configurations include

fixed or spring-loaded tips and
narrowband or broadband
frequencies, as well as standard
and high-voltage configurations.

 Pitch-catch probes capable of

broadband frequency and high
voltage offer additional
capabilities, for thicker
laminates or stiffer materials.
Figure 2 Cross-sectional view
of a typical pitch-catch probe.
Pitch-Catch Mode
RF Method

The pitch-catch RF method uses a

dual-element, point-contact, dry-
coupled probe. For the RF method,
the raw RF signals from the probe tip
are displayed.

To calibrate, the user positions a time

gate at the optimum point to monitor
the response of the received signal
most affected by the defect. This
optimizes data displayed via the
flying dot on the RUN displays.
Pitch-Catch Mode
RF Method
With the pitch-catch RF method, the
received signal bypasses the
amplitude or phase-amplitude
detectors. The frequency is selected
that shows maximum sensitivity to
the disbond condition and to the
material thickness of the part being
tested.

An adjustable amplitude gate can be

used to select a suitable threshold
level, to indicate good and bad bond
conditions.

* To optimize the signal, a bandpass

from 0 kHz to 35 kHz can be
selected, to reduce noise around the
test part.*
Pitch-Catch Mode
RF Method
To calibrate, null the probe on a good bond condition. Next, move the probe to
a bad bond condition and adjust the gain so as to provide a signal from the
bad bond that exceeds a defined alarm-box threshold, The user has a
choice of viewing data as a time-base display (amplitude-only), phase-
amplitude display (flying dot), or split-screen display (RUN2). An alarm
gate can be used with the time-base, flying-dot, or split-screen displays.
The three display modes are shown in Figures 3, 4, and 5.

Figure 3 Time-base display for RF Figure 4 Flying-dot display for RF method Figure 5 RUN2 display for RF method
method

* The split-screen display is a new option of the BondMaster 1000e+

Pitch-Catch Mode
lmpulse Method
The pitch-catch impulse method
uses the same dual-element,
point-contact, dry-coupled probe
as the pitch-catch RF method.

To calibrate, the user positions a

time gate at the optimum point to
monitor the response of the
receive signal most affected by the
defect. This optimizes the data
displayed by the flying dot on the
RUN display.

* To optimize the signal, a band

pass of up to 35 kHz can be
selected to reduce noise around
the test part.*
Pitch-Catch Mode
lmpulse Method

The user can choose to view data as a time-base display (amplitude-only), phase-amplitude display
(flying dot), or split-screen display (RUN2). An alarm gate can be used with the time-base, flying-
dot, or split-screen displays. The three display modes are shown in Figures 3, 4, and 5.

Figure 6 Time-base display for impulse method Figure 7 Phase-amplitude display for impulse method Figure 8 RUN2 display for impulse method
Pitch-Catch Mode
Swept Method

For the pitch-catch swept method, one

element generates a frequency sweep
as defined by the operator. The swept
frequency provides a circular display.

The swept signal is monitored and

processed via a second element; the
difference between the effect of good
and bad bonds on the sound path is
detected.

* The user can now choose to drive the

swept mode using a low-, medium-, or
high-repetition rate, making this
method a very fast way to inspect.*
Pitch-Catch Mode
Swept Method

To calibrate, null the probe on a good bond condition. Next, move the probe to a bad bond
condition and adjust the gain so as to provide a signal from the bad bond that exceeds a
defined alarm-box threshold, as shown in Figure 10a. The good bond signal will appear to
have a lower amplitude, as shown in Figure 10b. No contact with the test part (probe lift-
off) results in a considerably decreased amplitude displayed by the circular pattern, as
shown in Figure 10c. The frequency range between 5 kHz and 100 kHz used in this test
method is well suited for detecting both near-surface and far-surface disbonds.

Figure 10a Disbond Figure 10b Bond Figure 10c No contact

Figure 10 Pitch-catch swept method signal patterns

Pitch-Catch Mode
Swept Method

The swept frequency is represented by a circular pattern with some minor resonance
loops, as shown in Figure 9.

Figure 9 Pitch-catch swept method signal display

In a bond condition, a proportion of the plate-wave energy is attenuated by the structure

below the inspection surface. This results in less signal amplitude being displayed on the
instrument. In a disbond condition, the waves travel between the transmit (pitch) element
and the receive (catch) element with very little attenuation or damping from the bonded
structure. The result is a greater signal amplitude being displayed. This effect is most
easily seen with the pitch-catch swept method.
MIA Mode
The MIA (mechanical impedance analysis) inspection method uses a single-
tipped, dual-element probe. The drive element, coupled to the test piece
through a plastic cone and wear shoe, generates audible sound waves into
the test part.

Mass (brass)

Drive element

Receive element
MIA Mode
When the drive and receive elements are nulled, they vibrate
together at the same phase and amplitude, as shown in Figure 12.
When the probe is placed on a structure, the receiving element is
affected by the sample stiffness, which varies from bonded to
unbonded conditions. This change is monitored as a comparison
between the drive and receive phase and amplitude signals.
MIA Mode
The MIA drive element generates
sound waves and the receive
element detects the effect of the
structure on probe-tip loading.
During setup, the drive frequency
is swept from 2 kHz to 10 kHz to
establish the optimum test
frequency, as shown in Figure 13.
Testing is then performed at a
fixed frequency.

Figure 13 Frequency-sweep display

MIA probes have a point-contact area suitable for use on irregular or curved
surfaces. The MIA method works well to detect disbonds and crushed core
conditions.
MIA Mode

To calibrate, the user initiates a

software-controlled frequency
sweep across the complete probe-
frequency range on both good and
bad bond samples. The instrument
automatically evaluates the sweep
data and chooses the optimum
inspection frequency.

Figure 14 MIA swept frequency display

Once the optimum test frequency has been chosen, testing is performed at this fixed
frequency. Figure 14 shows the frequency-sweep display during calibration. This
data can be evaluated as absolute phase-amplitude or differential phase-amplitude.
Resonance Mode
The contact transducer is driven at
its resonance frequency and coupled
to the test part using a low-viscosity
couplant, such as AC B1. This is
critical for obtaining repeatable
results. Standard UT couplant should
not be used.
Impedance changes in the sensor
are analyzed to detect changes in the
test part.
BondMaster 1000e+ resonance
probes are essentially undamped
piezoceramic transducers.

Cross-sectional view opposite:

Resonance Mode
The instrument automatically selects
the resonance frequency of the
probe in air by sweeping over the
frequency range and locating the
phase null. Figure 15 confirms
correct operation of the probe.
Figure 15 Correct probe operation
Resonance is generally used for
detecting skin-to-skin disbonds
such as with aircraft lap joints. This
mode also works well for disbonds
and delaminated materials. In
many cases the depth of
delaminations can be estimated
using the signal-phase rotation.
Resonance Mode
Coupling the probe to the test part causes the part to act as a damping member,
reducing the amplitude and increasing the bandwidth of the transducers as well
as changing the resonance frequency. By nulling out the good bond signal, the
phase- and amplitude-vector end points of a disbond are compared to the good
bond on an impedance-plane coordinate display. The phase is indicated by the
rotation of the spot, and the amplitude by the distance from the center null point.
The signals on the display appear as shown in Figure 16.

Figure 16 Phase-amplitude display of resonance RUN1 mode

BondMaster Probes
Pitch-Catch Probes
 S-PC-P1 Low-frequency, fixed tips, 17.1 mm (0.674 in.) tip spacing.
 S-PC-P1L “L” (linked), low-frequency, fixed tips, 17.1 mm (0.674 in.) tip spacing.
 S-PC-P2 Low-frequency, spring-loaded tips, 19 mm (0.750 in.) tip spacing.
 S-PC-P2L “L” (linked), low-frequency, spring-loaded tips, 19 mm (0.750 in.) tip
spacing.
 S-PC-P3 High-frequency, spring-loaded tips, 19 mm (0.750 in.) tip spacing.
 S-PC-P3L “L” (linked), high-frequency, spring-loaded tips, 19 mm (0.750 in.) tip
spacing.
 S-PC-P11 Broadband, spring-loaded tips, 17.1 mm (0.674 in.) tip spacing.
 S-PC-P11L “L” (linked), broadband, spring-loaded tips, 17.1 (0.674 in.) mm tip spacing.
 S-PC-P12 Broadband, fixed tips, 17.1 mm (0.674 in.) tip spacing, high voltage.
 S-PC-P12L “L” (linked), broadband, fixed tips, 17.1 mm (0.674 in.) tip spacing, high
voltage.
 S-PC-P13 Broadband, spring-loaded tips, 17.1 mm (0.674 in.) tip spacing, high
voltage.
 S-PC-P13L “L” (linked), broadband, spring-loaded tips, 17.1 mm (0.674 in.) tip spacing,
high voltage.
 SPO-5629P Broadband, spring-loaded tips, 12.7 mm (0.500 in.) tip spacing.
 SPO-5629PL “L” (linked), broadband, spring-loaded tips, 12.7 mm (0.500 in.) tip spacing.
 BondMaster Probes
Pitch-Catch Probes (Continued)

 SPO-5629PHV Broadband, spring-loaded tips, 12.7 mm (0.500 in.) tip spacing, high
voltage.
 SPO-5629PLHV “L” (linked), broadband, spring-loaded tips, 12.7 mm (0.500 in.) tip
spacing, high voltage.
 SPO-5752 Broadband, spring-loaded, three elements.
 SPO-5752L “L” (linked), broadband, spring-loaded, three elements.

http://www.olympusndt.com/data/File/bondmaster1000eplus/BM_Probe_Catalog.en.pdf
BondMaster Probes
MIA (Mechanical Impedance Analysis) Probes

 S-MP-1 Right-angle probe, 12.7 mm (0.500 in.) tip diameter.

 S-MP-1L “L” (linked), right-angle probe, 12.7 mm (0.500 in.) tip diameter. Cannot be
used with BMM-H spring-loaded housing.
 S-MP-2 Straight probe, 6.3 mm (0.250 in.) tip diameter.
 S-MP-2L “L” (linked), straight probe, 6.3 mm (0.250 in.) tip diameter. Cannot be
used with BMM-H spring-loaded housing.
 S-MP-3 Right-angle probe, 12.7 mm (0.500 in.) tip diameter.
 S-MP-3L “L” (linked), right-angle probe, 12.7 mm (0.500 in.) tip diameter. Can be
used with BMM-H spring-loaded housing.
 S-MP-4 Right-angle probe, 6.3 mm (0.250 in.) tip diameter.
 S-MP-4L “L” (linked), right-angle probe, 6.3 mm (0.250 in.) tip diameter. Can be
used with BMM-H spring-loaded housing.
 S-MP-5 Right-angle probe, 12.7 mm (0.500 in.) tip diameter.
 S-MP-5L “L” (linked), right-angle probe, 17.1 mm (0.674 in.) tip diameter. Internally
spring-loaded, three-position tension adjustment for greater consistency
and accuracy. Well suited for overhead inspection. Features removable
Delrin wear shoe.
BondMaster Probes
MIA (Mechanical Impedance Analysis) Probes, Continued

 BMM-H Designed for use with S-MP-3 and S-MP-4 probes. Ensures constant
pressure is being applied to the part. Also greatly enhances stability while
keeping the probe perpendicular to the inspection surface. Incorporates a
Teflon wear shoe. Spring-loaded probe holder.
BondMaster Probes
Resonance Probes

 S-PR-1 35 kHz (±5 kHz) in a 15.9 mm (0.625 in.) diameter case.

 S-PR-1L “L” (linked), 35 kHz (±5 kHz) in a 15.9 mm (0.625 in.) diameter case.

 S-PR-2 65 kHz (±10 kHz) in a 15.9 mm (0.625 in.) diameter case.

 S-PR-2L “L” (linked), 65 kHz (±10 kHz) in a 15.9 mm (0.625 in.) diameter case.

 S-PR-3 110 kHz (±10 kHz) in a 15.9 mm (0.625 in.) diameter case.
 S-PR-3L “L” (linked), 110 kHz (±10 kHz) in a 15.9 mm (0.625 in.) diameter case.

 S-PR-4 165 kHz (±10 kHz) in a 12.7 mm (0.500 in.) diameter case.

 S-PR-4L “L” (linked), 165 kHz (±10 kHz) in a 12.7 mm (0.500 in.) diameter case.
 S-PR-5 250 kHz (±10 kHz) in a 9.5 mm (0.375 in.) diameter case.
BondMaster Probes
Resonance Probes (Continued)

 S-PR-5L “L” (linked), 250 kHz (±10 kHz) in a 9.5 mm (0.375 in.) diameter case.

 S-PR-6 330 kHz (±10 kHz) in a 9.5 mm (0.375 in.) diameter case.

 S-PR-6L “L” (linked), 330 kHz (±10 kHz) in a 9.5 mm (0.375 in.) diameter case.
BondMaster Accessories and
Consumables
 Cables
– SBM-CPM-P11 (MIA and pitch-
catch)
– SBM-CR-P4 (4-pin resonance
probes)
– SBM-CR-P6 (6-pin resonance
probes)
– SBM-CR-P7 (7-pin resonance
probes)
 Probe Tips
– Fixed or spring-loaded
– Oval or mushroom
 Stabilization Feet
– Chiseled or rounded
 Resonance Couplant
– AC B1 or mineral oil
Use of Composites
As an example, the Cessna Citation III airplane is
constructed almost entirely from composites. This
single airplane contains many types of bonded
material, as shown in Figure 17.

What probe should we use?

MIA or pitch-catch
Pitch-catch
Resonance

Resonance

N/A
MIA or pitch-catch
Figure 17 Citation III airplane composition
Pitch-catch
Use of Composites
1. Monolithic carbon 8mm (resonance) 2. Carbon skins 3-4mm (resonance), Carbon/Rohacell (P-C or MIA) 3. Monolithic carbon & titanium (resonance)
4. Carbon/Nomex (P-C, low drive) 5. Carbon/foam (N/A) 6. Carbon/Nomex (P-C) 7. Carbon/alum. (P-C or MIA)
8. Carbon/alum. (MIA = thick, P-C = thin) 9. Same as #3 10. Carbon/alum. (P-C or MIA) 11. Same as #2

10
8
11
9
5

6 7
4

1 3

Rear impact support Rear upper/lower suspension Headrest Barge boards Front suspension Front wing

Rear and end wing Engine cover Intake fairings Chassis Nose
 Use of Composites
SKIN SUBSTRATE DEFECT MODE PROBE(S)
Aluminum: 0.125 hex. cell, 5056 aluminum 38.1 mm (1.5 in.) diam. disbond between adhesive and Resonance Res.: S-PR-1,-2,-3,-4
7075 T-6 aluminum, 0.5 mm (0.02 honeycomb with 0.05 mm (0.002 skin (adhesive precured to core in defect area). Pitch-catch All pitch-catch
in.) thick in.) wall

Aluminum: 0.125 hex. cell, 5056 aluminum 38.1 mm (1.5 in.) diameter disbond between adhesive Resonance Res.: S-PR-1,-2,-3,-4
7075 T-6 aluminum, 2.0 mm (0.080 honeycomb with 0.05 mm (0.002 and skin (adhesive pre-cured to core in defect area). MIA All MIA
in.) thick in.) wall

Aluminum: Aluminum honeycomb, 12.7 mm 38.1 mm (1.5 in.) by 127.0 mm (5 in.) by 3.2 mm (1/8 in.) Resonance Res.: S-PR-1,-2,-3
25.4 mm (0.016 in.) alumninum (0.5 in.) thick core cut out MIA All MIA
bonded w/ plastic lock Pitch-catch All pitch-catch

Fiberglass: NONE 25.4 mm (1 in.) by 25.4 mm (1in.) delamination between Resonance All Res.
Fiberglass, 5 plies, top layer 1.2 top layer and others MIA All MIA
mm (0.045 in.); Pitch-catch All pitch-catch
all other layers, 1.5 mm (0.060 in.)

Graphite: Aluminum honeycomb, 3.1 lb/ft, Teflon insert, 19.1 mm (¾ in.) diameter, between core Resonance All Res.
Five ply of 5 mil pregreg graphite 12.7 mm (½ in.) thick and skin.

Graphite: Aluminum honeycomb, 3.1 lb/ft, Teflon insert, 12.7 mm (½ in.) diameter, between 3 rd and Resonance Res.: S-PR-3,-4,-5,-6
Five ply of 5 mil pregreg graphite 12.7 mm (½ in.) thick 4th ply.

Graphite: Aluminum honeycomb, 2.3 lb/ft, Teflon insert, 12.7 mm (½ in.) by 9.5 mm (3/8 in.), Resonance Res.: S-PR-3,-4,-5,-6
Five ply of 5 mil pregreg graphite 12.7 mm (½ in.) thick between 3rd and 4th ply.

Graphite: Aluminum honeycomb, 2.3 lb/ft, 1.6 mm (1/16 in.) core cut out, 25.4 mm (1 in.) diameter Resonance Res.: S-PR-1,-2,-3,-4
Five ply of 5 mil pregreg graphite 12.7 mm (½ in.) thick MIA All MIA
Pitch-catch All pitch-catch

Graphite: Aluminum honeycomb, 3.1 lb/ft, 1.6 mm (1/16 in.) core cut out, 25.4 mm (1 in.) diameter Resonance Res.: S-PR-1,-2,-3,-4
Five ply of 5 mil pregreg graphite 12.7 mm (½ in.) thick MIA All MIA
Pitch-catch All pitch-catch

Graphite: 25.4 mm (1 in.) thick aluminum 25.4 mm (1 in.) diameter between skin and core Teflon Resonance Res.: S-PR-2,-3
3.2 mm (0.125 in.) thick graphite honeycomb inserts
epoxy
 Use of Composites
SKIN SUBSTRATE DEFECT MODE PROBE(S)
Graphite: Solid titanium, 5.1 mm ( 0.2 in.) Teflon insert, 12.7 mm (½ in.) diameter, between Resonance All Res.
Five ply of 5 mil pregreg graphite thick adhesive and core

Graphite: Solid titanium, 5.1 mm ( 0.2 in.) Teflon insert, 5.1 mm ( 0.2 in.) by 25.4 mm (1 in.), Resonance All Res.
Five ply of 5 mil pregreg graphite thick between adhesive and core

Monolithic graphite: NONE Teflon insert, 12.7 mm (½ in.) diameter, 1.3 mm (0.050 Resonance 3,4,5,6 Res.
Monolithic graphite epoxy 12.7 in.) deep
mm (½ in.) thick

Titanium: Five ply of 5 mil prepreg graphite Disbond between graph./epox. skin and alum. Core, 19.1 Resonance 1,2,3,4 Res.
0.3 mm (0.012 in.) thick titanium bonded to 4.8 mm (0.188 in.) mm (¾ in.) Teflon insert, between the graph./epox. and MIA 2,4 MIA
aluminum honeycomb, 25.4 mm adhesive
(1 in.) thick

Titanium: Aluminum honeycomb, 12.7 mm Teflon insert, 6.4 mm (¼ in) by 152.4 mm (6 in.) Resonance 1,2,3 Res.
0.4 mm (0.015 in.), titanium (½ in.) thick
bonded with plastic lock
Selling the BondMaster 1000e+
 BondMaster 1000e+ has updated electronics and
software interface.
 The BondMaster 1000e+ is the ONLY three-
mode instrument on the market today.
– This is considerably easier to justify than 3
individual instruments.
 Continued support and development from ONDT
 ONDT calibration allows requested software
upgrades at no extra cost.
 Global product-support network
– Sell ONDT as much as you sell the
BondMaster.
Selling the BondMaster 1000e+
 Know the instrument and know the applications.
– Verify the pin configuration of resonance
probes.
 Consider various industries.
– Aerospace, auto racing, automotive, composite
manufacturing, marine, sports
 Interchangeable screens
– Monochrome LCD, EL, Color LCD (99%)
 Read the BondMaster User’s Manual.
BondMaster Overview
 Competitive equipment (past generations)
– Fokker Bond Tester (resonance mode)
– Sondicator (pitch-catch mode)

Fokker bond tester

Bond Master Overview
 Competitive equipment (current generation)
– MIZ21 R/SR (eddy current, pitch-catch, and
resonance)
Bondascope 300
The instrument uses a pitch-catch, dry-ultrasonic technique. Audible and visual
alarms are available. The alarms may be triggered by changes in the phase or t
he amplitude.

The Bondascope has a liquid crystal display (LC

D), which shows the waveform through the mate
rial.

The screen can also show a “bond profile”

mode, which is a unique B-scan style
presentation, to easily show local
anomalies. This simplifies the task of the
operator.
New Product Developments
 Newly defined probe kits
– To include P-13 pitch-catch
probe BondMaster 1000e+
P1L-01
 Composite materials
training
– Work in progress
 New probe developments
– Differential pitch-catch,
S-PC-DHV
– Pitch-catch MIA probe
General Rules of Thumb
 Skin-to-core defects: use MIA or pitch-catch
– Best starting point: pitch-catch RF method, P13
probe
 Skin-to-skin defects: use resonance
– Best starting point is a 165 kHz probe
 Lower frequency = greater penetration
Overview and Conclusions
 The use of a single instrument offering
multiple inspection methods allows
inspection of a wide variety of composite
materials and configurations.

 The pitch-catch, MIA, and resonance

methods, as discussed, each have
particular advantages in terms of
application solutions. These methods
are defined in aircraft NDT manuals.
Customer Support

Andréanne Potvin Aaron Greenbank Ken Low

Technical support Product manager Technical support