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The process and cutting tool
• The process is performed by a cutting tool, which oscillates at
high frequency, typically 20-40 kHz, in abrasive slurry.
• The shape of the tool corresponds to the shape to be produced in
the workpiece.
• The high-speed reciprocations of the tool drive the abrasive grains
across a small gap against the workpiece .
• The tool is gradually fed with a uniform force.
• The impact of the abrasive is the energy principally responsible
for material removal in the form of small wear particles that are
carried away by the abrasive slurry.
• The tool material, being tough and ductile, wears out at a much
slower rate.
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Ultrasonic Machining
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Elements of ultrasonic machining
• The tool is oscillated by a
longitudinal magnetostriction
• A magnetic field variation at
ultrasonic frequencies
• The length of a ferromagnetic object
changes
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Material removal
• Occurs when the abrasive particles, suspended in the slurry
between the tool and work piece, are struck by the down stroke
of the vibration tool.
• The impact propels the particles across the cutting gap,
hammering them into the surface of both tool and work piece.
Collapse of the cavitation bubbles in the abrasive suspension
results in very high local pressures.
• Under the action of the associated shock waves on the abrasive
particles, micro cracks are generated at the interface of the
work piece.
• The effects of successive shock waves lead to chipping of
particles from the work piece.
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Material removal
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The basic components of the cutting
action are believed to be
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• Small, tabletop-sized units to large-capacity machine tools,
• Bench units, and as self-contained machine tools.
• Power range from about 40 W to 2.5 kW.
• The power rating strongly influences the material removal
rate.
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Subsystems of USM System
A C
E D
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A
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B
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B
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B
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B
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C
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D
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E
• The criteria for selection of an abrasive for a particular application
include hardness, usable life, cost, and particle size.
• Diamond is the fastest abrasive, but is not practical because of its
cost.
• Boron carbide is economical and yields good machining rates.
• Silicon carbide and aluminum oxide are also widely used.
• Coarse grits exhibit the highest removal rates,when the grain size
becomes comparable with the tool amplitude, cut more slowly.
• The larger the grit size, the rougher the machined surface.
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E
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E
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The acoustic head is the
most complicated part of
the machine.
It must provide a static
force, as well as the high
frequency vibration.
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Example
- Basic machine layout
Magnetostrictive materials
should have a good
coupling of magnetic and
mechanical energy
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Basic machine layout
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• If a tool is designed to increase flow, better cutting speeds will occur.
• Tools
- hard but ductile metal
- stainless steel and low carbon
- aluminum and brass tools wear near 5 to 10 times faster
• ABRASIVE SLURRY
- common types of abrasive
- boron carbide (B4C) good in general, but expensive
- silicon carbide (SiC) glass, germanium, ceramics
- corundum (Al2O3)
- diamond (used for rubies , etc)
- boron silicon-carbide (10% more abrasive than B4C)
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• liquid
- water most common
- benzene
- glycerol
- oils
• high viscosity decreases mrr
• typical grit size is 100 to 800
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Variation of the cutting rate (CR) as a function of the cutting depth (p).
29
30
• UM effectively machines precise features in hard, brittle materials such as
glass, engineered ceramics,CVD SiC- Chemical Vapor Deposition Silicon Carbide ,
quartz, single crystal materials, PCD - Polycrystalline diamond, ferrite, graphite ,
glassy carbon, composites, piezoceramics.
• A nearly limitless number of feature shapes—including round, square and odd-
shaped thru-holes and cavities of varying depths, be machined with high quality and
consistency.
• Aspect ratios as high as 25-to-1 are possible, depending on the material type and size.
• The machining of parts with preexisting machined features or metallization is
possible without affecting the integrity of the preexisting features or surface finish of
the workpiece.
• USM machined surfaces exhibit a good surface integrity and the compressive stress
induced in the top layer enhances the fatigue strength of the workpiece.
• The quality of an ultrasonic cut provides reduced stress and a lower likelihood of
fractures that might lead to device or application failure over the life of the product.
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• Ultrasonic machines have a relatively low MRR. Material removal
rates are quite low, usually less than 50 mm3/min.
• The abrasive slurry also "machines" the tool itself, thus causing
high rate of tool wear , which in turn makes it very difficult to hold
close tolerances.
• The slurry may wear the wall of the machined hole as it passes back
towards the surface, which limits the accuracy, particularly for small
holes.
• The machining area and the depth of cut are quite restricted
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• Used for machining hard and brittle metallic alloys,
semiconductors, glass, ceramics, carbides etc.
• Used for machining round, square, irregular shaped
holes and surface impressions.
• Machining, wire drawing, punching or small blanking
dies.
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Square cavities, round
through holes and crossing
beams in a 4-in. borosilicate
wafer.
Honeycomb structure
machined on the back of a A UM-machined square hole in
silicon mirror for NASA 0.0175-in. thick glass. The machined
feature exhibits a clean edge, and the
natural corner radius is < 0.005 in.
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• Mechanics of material removal - brittle fracture caused by impact of
abrasive grains due to vibrating at high frequency
• Medium - slurry
• Abrasives: B4C; SiC; Al2O3; diamond; 100-800 grit size
• Vibration freq. 15-30 KHz, amplitude 25-100 micro m
• Tool material soft steel
• Material/tool wear = 1.5 for WC workpiece, 100 for glass
• Gap 25-40 micro m
• Critical parameters - frequency, amplitude, tool material, grit size, abrasive
material, feed force, slurry concentration, slurry viscosity
• Material application - metals and alloys (particularly hard and brittle),
semiconductors, nonmetals, e.g., glass and ceramics
• Shape application - round and irregular holes, impressions
• Limitations - very low mrr, tool wear, depth of holes, and cavities small.
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