Project Title

Saurav Shankarnarayan (RA1811002010452), Niranjan Oommen(RA1811002010426)

Project Guide – Mr. Sivashankar M
Batch No.: T37

ABSTRACT RESULTS AND DISCUSSION

 
As the computing power of today's electronic devices has improved, the heat
generated by their processors has increased exponentially. Effective cooling
methods are of the utmost importance as these processors only operate in a
predefined temperature range. Another limitation that designers are
gradually making is the dimensional constraints as today's electronic devices
keep getting smaller and more compact. The most widespread heat
dissipation method currently used are heat sinks, as they are one of the
relatively smaller ways to dissipate heat and have no moving parts, making
them less prone to failure. This report documents the heat sinks using phase
change material for cooling supercomputer processors.

INTRODUCTION

Electronic cooling through phase change material (PCM) based heat sinks has
developed in recent years due to the desperate need of better cooling
systems for CPUs and high performance processor chips. Among the other
viable options for electronic cooling, PCMs have gained interest because they
are readily available and more cost friendly than the other options.

Heat sinks are designed to have a large surface area to volume ratio and have
fins of different profiles based on the requirement. A heat sink can be cooled
by either natural convection or by forced convection. Forced convection
ensures better heat transfer away from the heat sink, but its drawback is that
there are more moving parts in the device as a fan is required. Studies show
that filling a heat sink with PCM ensures better heat removal than in natural
convection and less chance of failure than in forced convection.

OBJECTIVE

To determine the total number of fins required to obtain a

high efficiency and work out the best way to incorporate a
PCM in a heat sink for electronic application considering the
surface area to volume ratio thus obtaining a good thermal
efficiency.
METHODOLOGY
Conduct material testing to understand properties of material selected.
Design a heat sink with the optimum fin orientation.
Fabricate the heat sink according to design decided.
CONCLUSION
We examined the importance of heat sink optimization towards furthering
the digital capabilities of electronic devices. From our study of heat sinks
we understood that heat removal from the heat sink by means of a PCM is
a very effective and relatively inexpensive method for heat removal. The
various parameters of the heat sink also could be modified to improve the
thermal performance of the heat sinks. This project also studies how PCMs
can be implemented in the heat sink and the benefits of doing so.

Physical testing of the heat sink to obtain the results.

REFERENCES
[1] Khudhur DS, Al-Zuhairy RC, Kassim MS. Thermal analysis of heat
transfer with different fin geometry through straight plate-fin heat sinks.
International Journal of Thermal Sciences. 2022 Apr 1;174:107443.
[2] Hosseinizadeh SF, Tan FL, Moosania SM. Experimental and numerical
studies on performance of PCM-based heat sink with different
configurations of internal fins. Applied Thermal Engineering. 2011 Dec
1;31(17-18):3827-38.
[3] Debich B, El Hami A, Yaich A, Gafsi W, Walha L, Haddar M. Design
optimization of PCM-based finned heat sinks for mechatronic components:
A numerical investigation and parametric study. Journal of Energy Storage.
2020 Dec 1;32:101960.Experime
[4] Yuan K, Shi J, Aftab W, Qin M, Usman A, Zhou F, Lv Y, Gao S, Zou R.
Engineering the thermal conductivity of functional phase change materials
for heat energy conversion, storage, and utilization. Advanced Functional
Materials. 2020 Feb;30(8):1904228.

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