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NXP 将 Flagship 4D 成像雷达芯片投入生产

( NXP Ramps Flagship 4D Imaging Radar Chip to Production )

QNS2202-0014 2022 年 03 月 05 《五道口电力电子观察》



来源 : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-4D-
Imaging-Radar-Chip-to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html 作者: NXP Semiconductors N.V. | Jan. 04, 2022

NXP 将 Flagship 4D 成像雷达芯片投入生产

2022 年 1 月 4 日, NXP 半导体公司( NASDAQ:NXPI )宣布对其行业领先的汽车雷达产品组合进行两


次更新,目前在全球 20 家顶级原始设备制造商中设计。业界首款专用 16nm 成像雷达处理器 NXP
S32R45 已投入批量生产,初始客户规模将于 2022 年上半年启动。此外,新的 NXP S32R41 已被引入,
以将 4D 成像雷达的优势扩展到更多的车辆。这些处理器一起服务于 L2+ 到 L5 自治扇区,使 4D 成像雷
达能够进行 360 度环绕感知。
成像雷达将雷达的能力从探测笨重物体扩展到通过高分辨率点云“看到”车辆环境,从而增强环境测绘
和场景理解。这些图像可以在复杂的城市场景中对物体进行分类,例如易受伤害的道路使用者和车辆,
例如摩托车行驶在大型运货卡车附近,或者儿童进入停着的汽车之间的道路。此外,成像雷达需要能够
同时测量速度,并在距离 300m (超过人类视力范围)的范围内对物体进行分类。它还需要识别快速行
驶的车辆,并将其与较慢的车辆,甚至与驾驶员道路上的静态障碍物(如丢失的轮胎)区分开
来。 NXP 通过其最新的成像雷达处理器更新来满足这些需求。

文章链接 : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-4D-Imaging-Radar-Chip-
to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html

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Source : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-
4D-Imaging-Radar-Chip-to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html Author: NXP Semiconductors N.V. | Jan. 04, 2022

NXP Ramps Flagship 4D Imaging Radar Chip to Production


Jan. 04, 2022, NXP Semiconductors (NASDAQ: NXPI) has announced two updates to its industry leading
automotive radar portfolio, now designed-in at 20 top global OEMs. The 
industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, has been released into mass
production, with initial customer ramp-up starting in the first half 2022. Additionally, the new NXP S32R41
has been introduced to extend 4D imaging radar’s benefits to a much larger number of vehicles. Together
these processors serve the L2+ through L5 autonomy sectors, enabling 4D imaging radar for 360-degree
surround sensing.
Imaging radar extends radar’s ability beyond detecting bulky objects to “seeing” a vehicle’s environment
through fine resolution point clouds that enhance environmental mapping and scene understanding. These
images enable the classification of objects, such as vulnerable road-users and vehicles, in complex urban
scenarios, such as a motorcycle driving close to a large delivery truck or a child entering a roadway between
parked cars. In addition, imaging radar needs to be able to simultaneously measure velocity and classify
objects at distances of up to 300m, beyond the range of human eyesight. It also needs to identify fast-moving
vehicles and distinguish them from slower ones or even static obstacles, like a lost tire, in the driver’s path.
NXP addresses these needs with its latest imaging radar processor updates.

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NXP 将 Flagship 4D 成像雷达芯片投入生产
NXP 的 4D 成像雷达是第一款在短距离、中距离和长距  NXP’s 4D imaging radar is the first to deliver concurrent 3-in-1 multi-mode
radar sensing across short-, mid- and long-range operation, enabling the
离操作中同时提供三合一多模式雷达感应的雷达,能够 simultaneous sensing of a very wide field of view around the car. To achieve
同时感应汽车周围非常广阔的视野。为了实现这一点, this, NXP leverages an innovative architecture to boost performance beyond
NXP 利用创新的体系结构,通过利用 192 个虚拟天线 raw sensor hardware capabilities with a low-complexity sensor configuration
utilizing 192 virtual antenna channels. The boost is enabled by the
通道的低复杂度传感器配置,将性能提升到原始传感器 combination of proprietary radar hardware acceleration which can deliver up
硬件能力之外。通过结合专有的雷达硬件加速功能(可 to 64x the compute performance of standard processors, super-resolution
提供高达标准处理器 64 倍的计算性能)、超分辨率雷 radar software algorithms to achieve sub-degree angular resolution and
advanced MIMO waveforms that allow simultaneous operation of antenna
达软件算法(可实现亚度角分辨率)和先进的 MIMO 波 channels. This architecture also helps overcome the limitations of other high-
形(可同时操作天线通道),实现了这种提升。这种体 resolution sensors like LIDAR and high antenna count massive MIMO radar,
系结构还有助于克服其他高分辨率传感器的局限性,如 whose cost and complexity limit their applications to a narrow set of use
cases.
LIDAR 和高天线数的大规模 MIMO 雷达,它们的成本和
复杂性将其应用限制在一系列狭窄的用例中。

文章链接 : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-4D-Imaging-Radar-Chip-
to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html
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NXP 将 Flagship 4D 成像雷达芯片投入生产
NXP 成像雷达更新 NXP imaging radar update
 The introduction of the S32R41 delivers the industry’s first 16nm radar
S32R41 的推出为 L2+ 自动驾驶应用定制了业界首款 processor tailored for L2+ autonomous driving applications, which some
16nm 雷达处理器,一些行业分析师预计,到 2030 年, industry analysts project could account for close to 50% of vehicle production
该处理器将占汽车产量的近 50% 。传统的高分辨率传感 by 2030. The L2+ segment, which was not well served by classical high-
resolution sensors, will now benefit from 4D imaging radar sensing with up to
器无法很好地为 L2+ 段提供服务,现在,它将受益于 4D six corner, front and rear radar sensors in 360-degree surround fashion.
成像雷达传感,最多有六个角、前后 360 度环绕式雷达  The S32R45 radar processor is the flagship of NXP’s 6th generation
传感器。 automotive radar chipset family. It helps to enable increasingly autonomous
driving, from L2+ through the most demanding L5 use cases, where more
S32R45 雷达处理器是 NXP 第六代汽车雷达芯片组系列 than ten imaging radar sensors per vehicle may be required. It also addresses
的 flagship 产品。它有助于实现越来越自主的驾驶,从 transportation, traffic management and other industrial applications where
L2+ 到最苛刻的 L5 用例,每辆车可能需要 10 个以上的 reliable high-resolution sensing is required.
成像雷达传感器。它还涉及运输、交通管理和其他需要
可靠高分辨率传感的工业应用。

文章链接 : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-4D-Imaging-Radar-Chip-
to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html
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NXP 将 Flagship 4D 成像雷达芯片投入生产

文章链接 : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-4D-Imaging-Radar-Chip-
to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html
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NXP 将 Flagship 4D 成像雷达芯片投入生产

文章链接 : https://www.globenewswire.com/newsrelease/2022/01/04/2361073/0/en/NXP-Ramps-Flagship-4D-Imaging-Radar-Chip-
to-Production-Adds-New-Product-Tailored-for-Fast-Growing-L2-Market.html
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备注

 备注 1
NXP 的 flagship S32R45 和新的 S32R41 处理器为 L2+ 到 L5 自治提供服务,使 4D 成像雷达能够进行 360 度环绕感
知。
 备注 2
基于通用架构, S32R 雷达处理器支持软件重用和跨自动驾驶级别的可扩展雷达平台开发。
 备注 3
NXP 的 S32R45 和 S32R41 雷达处理器与 NXP TEF82xx RFCMOS 收发器的结合,提供了生产就绪成像雷达解决方
案所需的精细角度分辨率、处理能力和范围。 S32R 平台为软件重用和快速开发提供了一个通用体系结构,以及高性
能硬件安全引擎、 OTA 更新支持和符合最新网络安全标准。

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评论

 评论 1
Torsten Lehmann 说:“ NXP 新的成像雷达处理器通过创建高分辨率图像来增强对物体的检测和分类,从而塑造车辆
了解周围世界的方式,这是改善道路安全和拯救生命的关键一步。”
 评论 2
Torsten Lehmann 说:“扩展的 S32R 系列利用了我们在雷达处理、超分辨率算法和先进的 MIMO 波形方面的领先地
位,为快速增长的 L2+ 车辆市场带来成像雷达的好处。”

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联系方式

 北京乾勤科技发展有限公司

电话: 010 - 82642324


传真: 010 - 82641640
地址: 北京市海淀区智造大街 D 栋 106
邮编: 100190
信箱: service@qianqin.com.cn
网址: www.qianqin.com.cn

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技术服务

智能车 QQ 群 B 站——智能车开发 淘宝—— Aurix 开发工具 公众号

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IGBT/MOSFET 双脉冲测试平台( DUT )

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电机负载模拟器 (QSVPWMBench)

 北京乾勤科技的 QSVPWMBench 电机负载模拟测试系统,


由 SVPWM 矢量信号发生器(用于模拟向三相全桥功率
主电路提供 PWM 驱动信号的 DSP 或单片机)、高压可
调直流电源、三相负载电感(用于模拟电机负载的)、
水冷机组、传感器组件和上位机软件,以及被测组件组
成。被测组件为三相全桥,根据不同的被测 IGBT/SiC
MOSFET ,提供对应的测试工装。设备采用电感负载,
为无源型负载模拟器。

 系统可测试被测组件在特定工况(开关频率,基波频率,
电流等)和特定冷却系统参数(水温,流量)之下的温
升,进行功率模块的电流能力验证,明确模块的工作条
件,为模块在实际系统中的使用提供依据。同时,也可
以用于直流母线电容的纹波电流能力和温升验证。

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