TITLE: MECHATRONICS

04/15/23 1
INTRODUCTION
Mechatronics is a term coined by the Japanese to describe the
integration of mechanical and electronic Engineering. More
specifically, it refers to the multidisplinary approach to product and
manufacturing system design. It represents the next generation
machines, robots and smart mechanism for carrying out work in
variety of environments-predominantly factory automation, office
automation and home automation-as shown in figure-1.1
Fig 1.1Domains of mechatronics.

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SCOPE OF MECHATRONICS:
Until the 1970s, most industrial products –machine tools, manufacturing
equipment, consumer product, home appliances, etc. were largly
mechanical systems with very limited electrical or electronic content.
However, since the seventies there as been a dramatic change in the
technology of these products,mainly, an increasing content of electric
and electronic system integrated with the mechanical part of the
products,viz.,mechatronics.Examples of products which have already
moved to mechatronics technology from simple mechanical products are:
•Machine tools incorporating computer numerical control (CNC),
electronic measuring systems, precision mechanical parts such as balls-
screws, antifriction guide ways, etc.
•Electronic watches incorporating fine mechanical parts and
sophisticated electronic circuits.
•Electronic consumer products-washing machines, electronic cooking
appliances etc.;
•Office equipment-fax, plainpapercopiers, etc and entertainments
products VCRs, videos, etc.
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SEMICONDUCTOR
Definition: Semiconductor is a material whose Electrical conducting property lies in
between that of metals and non-metals (conductors and insulators).
SEMICONDUCTOR
Chips are made on wafers of semiconductor material predominantly silicon, with
some use of gallium arsenide and other Alternatives. These wafers are disc-
shaped, anywhere from three to 12 inches across and (as the name implies) very thin.
A single wafer can hold anywhere from a hundred to several thousand individual
chips, depending on how big each chip is. (Each individual chip on a wafer is called
a "die," and its area referred to as "die size").
Virtually every chip in the world is composed of three basic elements: a collection
of active components (such as transistors or memory cells), of chips are being made
simultaneously. Each chip can contain 10 million transistors or storage for over 128
million. Wafers are usually processed in lots of 25; a large wafer fab will start work
on about 20,000 to 30,000 wafers each month, and thus can have trillions or
quadrillions of transistors or memory cells under construction at any given time.
LISTS OF EXPERIMENTS
1. Semiconductor fabrication
2. Chemical vapour deposition

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SEMICONDUCTOR FABRICATION (MANUFACTURING)

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Fig: 1.2 NASA’s GLENN RESEARCH LABORATORY.
Semiconductor device fabrication is the process used to create
chips, the integrated circuits that are present in everyday electrical and
electronic devices. It is a multiple-step sequence of photographic and
chemical processing steps during which electronic circuits are gradually
created on a wafer made of pure semiconducting material. Silicon is the
most commonly used semiconductor material today, along with gallium
arsenide, germanium, and some other materials.

WAFERS
A typical wafer is made out of extremely pure silicon that is grown into
mono-crystalline cylindrical ingots (boules) up to 12 inches (300 mm) in
diameter using the Czochralski process. These ingots are then sliced into
wafers about 0.75 mm thick and polished to obtain a very regular and
flat surface.
Once the wafers are prepared, many process steps are necessary to
produce the desired semiconductor integrated circuit.
Processing
Tests
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Packaging
 PROCESSING
• In semiconductor device fabrication, the various processing steps fall
into four general categories: deposition, removal, patterning, and
modification of electrical properties.
• Deposition is any process that grows, coats, or otherwise transfers a
material onto the wafer. Available technologies consist of physical
vapor deposition (PVD), chemical vapor deposition (CVD),
electrochemical deposition (ECD) etc.
• Removal processes are any that remove material from the wafer either
in bulk or selective form and consist primarily of etching processes,
{ Dry etching refers to the removal of material, typically a masked
pattern of semiconductor material, by exposing the material to a
bombardment of ions usually a plasma of nitrogen, chlorine and boron
trichloride that dislodge portions of the material from the exposed
surface }both wet etching { Chemical etching (sometimes called
chemical milling or wet etching) is the process of using acids, bases or
other chemicals to dissolve away unwanted materials such as metals,
semiconductor materials or glass.
• Modification of electrical properties has historically consisted of
doping transistor sources and drains originally by diffusion furnaces
and later by ion implantation.
WAFER TEST
The highly serialized nature of wafer processing has increased the demand for
metrology in between the various processing steps. Wafer test metrology
equipment is used to verify that the wafers are still good and haven't been
damaged by previous processing steps.

DEVICE TEST

The fab tests the chips on the wafer with an electronic tester that presses tiny
probes against the chip. The machine marks the bad chips with a drop of dye.
A good chip design made by a good process will have more than 90% yield.
Somewhere between 0% and 70% yield wastes too much silicon, losing
money.

PACKAGING
Once tested, the wafer is scored and then broken into individual dice.
Only the good, undyed chips go on to be packaged.
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Fig 1.3 CHEMICAL VAPOUR DEPOSITIONS.

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Chemical vapour deposition (CVD) is a chemical process often used in
the semiconductor industry for the deposition of thin films of various
materials. CVD is widely used in the semiconductor industry, as part of
the semiconductor device fabrication process, to deposit various films
includingcarbon fiber, filaments, carbon nanotubes, SiO2, silicon-
germanium, tungsten, silicon nitride, titanium nitride. The CVD process is
also used to produce synthetic diamonds.

Types of chemical vapor deposition

Low-pressure CVD (LPCVD) - CVD processes at subatmospheric

pressures. Reduced pressures tend to reduce unwanted gas phase
reactions and improve film uniformity across the wafer. Most modern
CVD process are either LPCVD or UHVCVD.

Ultrahigh vacuum CVD (UHVCVD) - CVD processes at a very low

pressure, typically below 10-6 Pa (~ 10-8 torr). Caution: in other fields, a
lower division between high and ultra-high vacuum is common, often
10-7 Pa.
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ADVANTAGES:
•The steps involved in the manufacturing of semiconductor is simpler.

•.Even though a large quantity of Transistor can be produced in a single chip it’s
rate is adorable.

•These semiconductors are used to create integrated chips which are widely used
in electrical and Electronic devices.

•Using Chemical vapour deposition high growth rates can be obtained.

DISADVANTAGES:
•The chemicals used in the manufacturing of semiconductor are Hazardous.

•The chips Manufactured are Delicate that damage of the chips are possible so
care should be taken.
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CONCLUSION:
•Semiconductor fabrication helps in the creation of integrated
chips where as chemical vapour deposition helps to create both
integrated chips and synthetic diamonds.

•The entire manufacturing process from start to packaged chips

ready for shipment takes six to eight weeks.

REFERENCES:
•Vacuum Technology - Vocabulary - part 1: General terms as quoted by UK
National Physical Laboratory Retrieved from
http://en.wikipedia.org/wiki/Chemical_vapor_deposition

•Mechatronics by N Ramajuna chairman & MD HMT limited.

Tata Mcgraw-Hill publication ltd.
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Thank You

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