UNIT 5

THERMAL
MANAGEMENT

Prepared by Ezad Razif B Ahmat Rozali

LEARNING OUTCOMES

1. Realize the purpose and the need for

thermal management of electronic
components.

2. Describe the various cooling methods

typically used in microelectronics
components and the requirements.
INTRODUCTION
 Thermal management is an important aspect of all
facets of semiconductor engineering.

 Heat generated by electronic devices and circuitry

must be dissipated to improve reliability and
prevent premature failure

 Techniques for heat dissipation can include

heatsinks and fans for air cooling, and other forms
of computer cooling such as liquid cooling
INTRODUCTION

 Circuit designers - minimize the power

consumption of the device and distribute the
heat more evenly over the die

 Assembly engineers - design their packages

to be more efficient in dissipating the heat
generated by the device.
PURPOSE OF THERMAL MANAGEMENT

 The resistance to the flow of electrical current through

the leads, poly-silicon layers, and transistors comprising
a semiconductor device, results in significant internal
heat generation within an operating microelectronic
component.

 In the absence of cooling that is heat removal

mechanisms make the temperature of such an
operating component would rise at a constant rate until
it reaches a value at which the electronic operation of
the device ceases or the component loses its reliability.
PURPOSE OF THERMAL MANAGEMENT

 Primary and foremost aim of electronics thermal

management is to prevent the catastrophic failure(CF).
 CF is an immediate and total loss of electronic function and
package integrity.
 CF is often related with a large temperature rise, which may
lead to a drastic deterioration of the packaging materials in
semiconductor behavior like:
1) Fracture
2) Delaminating
3) Melting
4) Vaporization
5) Combustion
COOLING REQUIREMENT

First Level Package (Multichip

Module)

(Single Chip Module)

Second Level Package (Printed Wiring

Board, PWD)

Third Level Package (Motherboard or

backplane)

Illustration of electronics packaging levels

COOLING REQUIREMENT
COOLING METHOD

1) Heat sinks
2) Thermal Vias
3) Jet Impingement cooling
4) Immersion Cooling
COOLING METHOD
COOLING METHOD
HEAT SINKS
What is heat sinks??

 Metal structure with 1 or more flat surfaces to

ensure good thermal contact with component to
be cooled & array of comb or fin to increase surface
contact with air & thus the rate of heat dissipation
 made from good thermal conductor; silver, gold,
copper & Aluminium
 The shape of the fin is rarely rectangular, with a fin
thickness which is larger at the base than at the fin
tip.
HEAT SINKS

 Function : by transfer thermal energy from an

object high temperature to a second object
lower temperature
 Rated : °C/W
 Low °C/W value is more efficient than
heatsink with high °C/W value.
HEAT SINKS

Typical commercial parallel plate in pin fin heat sinks

THERMAL VIAS

What is Thermal Vias???

 Thermal vias embedded in the board are alternative
to reduce the resistance to heat flow, especially in
the direction perpendicular to the plane of the PWB.

Heat Transfer through

BGA by Thermal Vias
JET IMPINGEMENT COOLING
 Jet impingement Cooling is an attractive mechanism for
thermal management because of its capability for high heat
transfer rates.
 Impingement jets can either be air-powered or use some
form of liquid, typically water.

the spent fluid from a single nozzles

or an array of nozzles, flows outward
in a narrow channel bounded by the
plate containing the nozzle and the
impingement surface.
JET IMPINGEMENT COOLING
JET IMPINGEMENT COOLING

 Micro jet structure

IMMERSION COOLING

What is immersion cooling???

 To eliminate of the solid-solid interface
resistance
 Operate in a closed loop, where the vapour of
the dielectric liquid is condensed and
returned to the electronic enclosure.
 IMMERSION COOLING

Two closed loop immersion cooling systems. (a) Remote condenser / immersion cooling
module for electronic components; (b) Vapor space condenser / immersion cooling module
EXERCISE
1) What is the purpose of doing thermal
management in microelectronic’s packaging?
2) Explain definition of catastrophic failures?
3) What a differences between passive cooling
technique and active cooling technique?
4) List down the cooling methods that used in
electronics components.
5) Explain briefly about heat sinks.
6) Explain briefly thermal vias.
7) Explain about immersion cooling method in
thermal management system.