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  • 1FF0102018.03 DC 2117 Solderability Test Silde Sample

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    QuýNguyễn
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    This document reports the results of solderability tests performed on expired material with date codes 2117 and 2122. Solderability was tested on both the factory interface and end customer interface by applying solder paste before and after reflow processes. The conclusion for all bags tested was that solder covered over 95% of the copper pads, indicating the material passed the solderability test.

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    This document reports the results of solderability tests performed on expired material with date codes 2117 and 2122. Solderability was tested on both the factory interface and end customer interface by applying solder paste before and after reflow processes. The conclusion for all bags tested was that solder covered over 95% of the copper pads, indicating the material passed the solderability test.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    6 views5 pages

    1FF0102018.03 DC 2117 Solderability Test Silde Sample

    Uploaded by

    QuýNguyễn
    This document reports the results of solderability tests performed on expired material with date codes 2117 and 2122. Solderability was tested on both the factory interface and end customer interface by applying solder paste before and after reflow processes. The conclusion for all bags tested was that solder covered over 95% of the copper pads, indicating the material passed the solderability test.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 5

    SOLDERABILITY TEST – EXPIRED MATERIAL

    1. Material information

    Row Labels HW Date code Telit quality direction

    perform solderability solderability test on both sides:


    1FF0102018.03 3990401814 2117/2122 Fih interface: solderability test
    End customer side: solderability test after reflow, baking
    SOLDERABILITY TEST – EXPIRED MATERIAL

    2. Factory interface
    2.1 Process flow

    Check material Solder printing VQ Reflow Result

    2.2 Result

    1FF0102018.03
    Solder paste before reflow Solder paste after reflow
    Date code: 2117

    Bag 1

    Bag 2

     Conclusion: Solder cover over 95% copper pad  OK


    SOLDERABILITY TEST – EXPIRED MATERIAL

    2. End customer interface


    2.1 Process flow

    Reflow 2nd Baking 16h Solder printing VQ Reflow Result

    2.2 Result

    1FF0102018.03
    Solder paste before reflow Solder paste after reflow
    Date code: 2117

    Bag 3

    Bag 4

     Conclusion: Solder cover over 95% copper pad  OK


    SOLDERABILITY TEST – EXPIRED MATERIAL

    2. Factory interface
    2.1 Process flow

    Check material Solder printing VQ Reflow Result

    2.2 Result

    1FF0102018.03
    Solder paste before reflow Solder paste after reflow
    Date code: 2122

    Bag 1

    Bag 2

     Conclusion: Solder cover over 95% copper pad  OK


    SOLDERABILITY TEST – EXPIRED MATERIAL

    2. End customer interface


    2.1 Process flow

    Reflow 2nd Baking 16h Solder printing VQ Reflow Result

    2.2 Result

    1FF0102018.03
    Solder paste before reflow Solder paste after reflow
    Date code: 2122

    Bag 3

    Bag 4

     Conclusion: Solder cover over 95% copper pad  OK

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