DEC50143 – CMOS INTEGRATED CIRCUIT

DESIGN & FABRICATION

TOPIC 1 – INTRODUCTION TO INTEGRATED CIRCUIT (IC)
Topic 1 – Introduction to Integrated Circuit (IC)

Lesson Learning Outcome

Upon completion of this topic, students should be able to:

remember theory on Integrated Circuit (IC)

understand the evolution of IC

understand the classification of ICs

Topic 1 – Introduction to Integrated Circuit (IC)

1.1 INTODUCTION TO IC
Topic 1 – Introduction to Integrated Circuit (IC)

What is Integrated Circuit? 4

Integrated circuit is an electronic circuit

formed on a small piece of semiconductor
material, which performs the same function
as a larger circuit made from discrete
components.

Integrated Circuits are usually called ICs or

Chips.

Discrete components on PCB

Comparison Between Discrete Circuit and Integrated Circuit
Topic 1 – Introduction to Integrated Circuit (IC)

APPLICATIONS OF INTEGRATED CIRCUIT 6

HOME APPLIANCES

PORTABLE
DEVICES

TRANSPORTATION

MEDICAL
EQUIPMENT
Topic 1 – Introduction to Integrated Circuit (IC)

Advantages of IC over Discrete Components 7

SMALLER SIZE HIGHER RELIABILITY

Hundred times smaller than discrete
circuits
LESSER WEIGHT
As large number of components can be packed
into a single chip, so weight is reduced
Failure rate is low due to absence of
soldered connection, few interconnections
and small temperature
LOW POWER CONSUMPTION
As the size is small, less power is
consumed

CHEAPER EASY REPLACEMENT

The mass production technique has helped to In case of failure , chip can easily be
reduce the price replaced
Topic 1 – Introduction to Integrated Circuit (IC)

The Inside of Dual-In- Line Package (DIP) IC 8

(Encapsulation)

Die Attach
Adhesive
Topic 1 – Introduction to Integrated Circuit (IC)

IC PACKAGES 9

DEFINITION OF IC PACKAGING

The process of electrically connecting

the input / output (I/O) of the chip / die
to the connection pad of the package and
protect the chip / die from hazard
potential.

Different types of IC Packages

Topic 1 – Introduction to Integrated Circuit (IC)

FUNCTIONS OF IC PACKAGES 10

PROVIDES INTERCONNECTION
Packaging provides the interconnection
from the IC to the printed circuit board
(PCB).

ENVIRONMENTAL PROTECTION
To protect ICs from external
environment in order to ensure
reliability and performance.

MECHANICAL PROTECTION
To provide mechanical protection to the
ICs.
Topic 1 – Introduction to Integrated Circuit (IC)

TWO TYPES OF PACKAGING MATERIAL 11

HERMETIC - CERAMIC PACKAGING NON-HERMETIC – PLASTIC PACKAGING

Ceramic packaging is used for the IC packages that Plastic packaging uses an epoxy polymer to encapsulate
require either maximum reliability or high-power. the wirebonded die and the
leadframe.
Hermetic seal means sealed against moisture.
Topic 1 – Introduction to Integrated Circuit (IC)

TWO TYPES OF IC PACKAGING BASED ON PCB ASSEMBLY 12

THROUGH HOLE TECHNOLOGY (THT) SURFACE MOUNT TECHNOLOGY (SMT)

THT is the process by which component leads are SMT is a method for producing electronic circuits
placed into drilled holes on a bare PCB. The process in which the components are mounted or placed
was standard practice until the rise of SMT in the directly onto the surface of printed circuit
1980s board(PCBs).
Topic 1 – Introduction to Integrated Circuit (IC)

TWO TYPES OF IC PACKAGING BASED ON PCB ASSEMBLY 13

Examples of Through-Hole Technology (THT) IC Examples of Surface-Mount Technology (SMT) IC

EVOLUTION IN IC PACKAGING 14
 ISSUES IN IC / SEMICONDUCTOR INDUSTRY 15

Green IC Packaging

Also known as sustainable packaging, is the use of materials and manufacturing

methods for the packaging of goods that has a low impact on both energy
consumption and on the environment so as to address environmental concern.

Green IC

• Energy-efficient integrated circuits for high-performance, mobile and ubiquitous

micro and nano systems.
• Improvement bring large benefits to the environment and drive the evolution of
everyday electronic objects through their form factor and battery lifetime (e.g.,
mobile systems, Internet of Things).
 ISSUES IN IC / SEMICONDUCTOR INDUSTRY 16

Restriction of Hazardous Substances (RoHS)

• RoHS is the acronym for Restriction of Hazardous Substances. RoHS, also known
as Directive 2002/95/EC, originated in the European Union and restricts the use of
specific hazardous materials found in electrical and electronic products.

• The substances banned under RoHS are lead (Pb), mercury (Hg), cadmium (Cd),
hexavalent chromium (CrVI), polybrominated biphenyls (PBB) and polybrominated
diphenyl ethers (PBDE).

• The restricted materials are hazardous to the environment and pollute landfills, and
are dangerous in terms of occupational exposure during manufacturing and
disposal.
 APPROACHES TO ISSUES 17

• Elimination of the use of lead in semiconductor packaging due to growing recognition

of the dangers of heavy metals, particularly lead, in the environment.
• Regulations are based on a large body of scientific evidence that lead, absorbed into
the body through water or food, becomes a cumulative poison, which can lead to a
variety of health problems.
 APPROACHES TO ISSUES … cont’d 18

• Global adoption of green manufacturing requirements designed to protect the

environment from further lead contamination.
 RoHS 19

• EU legislation restricting the use of hazardous substances in electrical and electronic equipment
(EEE) and promoting the collection and recycling of such equipment has been in force since
February 2003.
• The legislation provides for the creation of collection schemes where consumers return their used
waste EEE free of charge. The objective of these schemes is to increase the recycling and/or re-use
of such products.
• The legislation also requires certain hazardous substances (heavy metals such as lead, mercury,
cadmium, and hexavalent chromium and flame retardants such as polybrominated biphenyls (PBB)
or polybrominated diphenyl ethers (PBDE)) to be substituted by safer alternatives. Waste EEE poses
environmental and health risks if inadequately treated.
 WEEE / RoHS 20

• Waste from Electrical and Electronic Equipment (WEEE) Directive, which became effective in the
European Union (EU) in 2005, plans to hold manufacturers financially responsible for the collection
and recycling of all used electronics in the EU.

• Applying to all electronics products, this new EU regulation covers all future and “historic” waste.

• Waste EEE poses environmental and health risks if inadequately treated.

• The aim is to increase the amount of waste EEE that is appropriately treated and to reduce the
volume that goes to disposal.
 ROHS COMPLIANCE DEFINITION 21

• The RoHS directive aims to restrict certain dangerous substances commonly used in
electronic and electronic equipment.
• Any RoHS compliant component is tested for the presence of Lead (Pb), Cadmium (Cd),
Mercury (Hg), Hexavalent chromium (Hex-Cr), Polybrominated biphenyls (PBB), and
Polybrominated diphenyl ethers (PBDE).
For Cadmium and Hexavalent chromium, there must be less than 0.01% of the
substance by weight at raw homogeneous materials level.
For Lead, PBB, and PBDE, there must be no more than 0.1% of the material, when
calculated by weight at raw homogeneous materials.
For Mercury, must have 100 ppm or less of mercury and the mercury must not have
been intentionally added to the component.
• In the EU, some military and medical equipment are exempt from RoHS compliance.
Topic 1 – Introduction to Integrated Circuit (IC)

1.2 EVOLUTION OF IC
Topic 1 – Introduction to Integrated Circuit (IC)

HISTORY OF IC INVENTION 23

1947 1956 1960 1972

First BJT was invented by First bipolar IC constructed Fairchild Engineering First Microprocessor (4004)
Bardeen, Shockley & by Jack Kilby. provides first IC prototype. invented at Intel.
Brattain.
Topic 1 – Introduction to Integrated Circuit (IC)

IC GENERATIONS 24

NO. OF
TRANSISTORS
YEAR TECHNOLOG PER CHIP EXAMPLE
Y
1947-1950 Transistor -
1

1951-1960 Discrete Component FET, Diode

1

1961-1966 SSI Logic Gates, Flip-Flop

(Small Scale Integration) 10

1967-1971 MSI Counter, Multiplexer

(Medium Scale Integration) 100 – 1,000

1972-1980 LSI RAM, Microprocessor

(Large Scale Integration) 1,000 – 20,000
VLSI 16bits, 32 bits Microprocessor
1981-1990 (Very Large Scale Integration) 1,000 – 1,000,000

1990-2000 ULSI Graphic Microprocessor

(Ultra Large Scale Integration) 1,000,000 – 10,000,000
GSI Multi-core Microprocessor
2000- Nowadays (Giga Scale Integration) > 10,000,000
Topic 1 – Introduction to Integrated Circuit (IC)

Moore’s Law 25

“ The number of transistors and

resistors on a chip doubles every
24 months. ”
- Gordon E. Moore

IVideo
Topic 1 – Introduction to Integrated Circuit (IC)

Moore’s Law 26

Moore's 1965 graph says that components on integrated Intel used Moore’s Law as their technology roadmap.
circuits were doubling each year at constant cost (in 1975 he
reduced that to 18 months per doubling).
Topic 1 – Introduction to Integrated Circuit (IC)
Topic 1 – Introduction to Integrated Circuit (IC)

Evolution in DRAM Chip Capacity 27

ANALYSIS ONE:
Evolution of DRAM starts in 1980.

ANALYSIS TWO:
The early DRAM has the capacity of about
64Kbit/chip or about one page of a
storybook.

ANALYSIS THREE:
Until 2010, the capacity of DRAM is
about 64 Mbit/chip or about the capacity
of human DNA.
Topic 1 – Introduction to Integrated Circuit (IC)

Die Size Growth 28

ANALYSIS ONE:
About 7% growth of die size per year.

ANALYSIS TWO:
About two times growth of die size in 10
years.

ANALYSIS THREE:
Die size grows by 14% to satisfy
Moore’s Law.
Topic 1 – Introduction to Integrated Circuit (IC)

Moore’s Law Impact 29

Economic Impact

“
As more transistors fit into smaller spaces, processing power increased and
energy efficiency improved, all at a lower cost for the end user. This
development increased productivity and resulting cheap and powerful
computing.

Technological Impact
All of the modern computing technology we know and enjoy existed
from the foundation laid by Moore’s Law. From the Internet itself, to
social media and modern data analytics, all these innovations stem
directly from Moore and his findings.

Societal Impact
The foundational force of Moore’s Law has driven
breakthroughs in modern cities, transportation,
healthcare, education, and energy production.
Topic 1 – Introduction to Integrated Circuit (IC)

1.3 CLASSIFICATION OF IC
Topic 1 – Introduction to Integrated Circuit (IC)

CLASSIFICATION OF IC 31
Topic 1 – Introduction to Integrated Circuit (IC)

TYPES OF SEMICONDUCTOR 32

Semiconductor Substance:
Materials that have the resistance levels between those of a conductor and an
insulator are referred to as semiconductors. They are quite common, found in
almost all electronic devices.
Good examples of semiconductor materials are germanium, selenium, and silicon.

Compound Semiconductor :
A compound semiconductor is a semiconductor composed of elements from two
or more different groups of the periodic table.
For example - one element from column III, and one from column V, of the Periodic
Table -- the so-called compound III-V semiconductors, such as Galium Arsenide
(GaAs), Indium Phosphide (InP), Galium Nitrite (GaN).
Topic 1 – Introduction to Integrated Circuit (IC)

TYPES OF SEMICONDUCTOR 33

Semiconductor Substance:
Applications of germanium, selenium, and silicon.
i. logic gates and digital circuits (i.e. microprocessors)
ii. analogue circuits such as oscillators and amplifiers.
iii. high voltage applications
Applications of Compound Semiconductor 34

Galium Arsenide (GaAs)

Some electronic properties of gallium arsenide are superior to those of silicon.
- in mobile phones, satellite communications, microwave point-to-point links and
higher frequency radar systems
-in the manufacture of Gunn diodes for the generation of microwaves
-in infrared light-emitting diodes, laser diodes, solar cells and optical windows
Applications of Compound Semiconductor 35

Indium Phosphide
•It has superior electron velocity due to which it is used in high-
frequency and high-power electronics.
•It has a direct bandgap unlike many semiconductors hence is used for
optoelectronics devices like laser diodes.
 36

Galium Nitrite (GaN)

- significantly outperform comparable silicon based devices in terms of higher

switching frequency and efficiency
- GaN has emerged as the leading semiconductor material for higher-power microwave
switches and amplifiers, although GaAs is still the material of choice for low noise.
Topic 1 – Introduction to Integrated Circuit (IC)

CLASSSIFICATION OF IC BASED ON CIRCUIT FUNCTION 37

 IC that operates with analogue signal input and output.

 Analogue signal – Continuous signal with sinusoidal
waveform.
 Example : Op-Amp, Power Amplifier, Multiplier
Comparator, Voltage Regulator.

 IC that operates with digital signal input and output.

 Digital signal – Discrete signal with square waveform.
 Example : Logic Gates, Flip – Flop , Counter
Microprocessor.

 IC that contains both digital and analogue circuits on the

same chip.
 Mixed Signal– often used to convert analogue signal to
digital signal so that digital devices can process the signal.
 Example : Cell phones IC, Portable technologies
Analogue to Digital Converter (ADC).
Topic 1 – Introduction to Integrated Circuit (IC)
CLASSIFICATION OF IC BASED ON FABRICATION METHOD
Monolithic
 All active and passive
components are fabricated on a
single silicon chip.
 The most popular fabrication
method because of low cost.
 Has high reliability.
 Disadvantage :
i. isolation problem
ii. passive component range is
limited
iii.circuit design is not flexible
38
Hybrid
Film
 Combination of two or more chips.
 Components are fabricated on
 Use both fabrication technique :
insulator chip, e.g. ceramic or glass.
monolithic + film.
 Only passive components are  Active components are fabricated
fabricated using film technology.
using monolithic method.
 Passive component range is
 Passive components are fabricated
 wider.
using film method.
 Isolation problem is lessen.
 Circuit design is flexible – active  Circuit design is the most flexible.
component is added external.
 Disadvantage:
i. Costly
 Disadvantage :
i. Higher cost
ii. Less reliability
ii. Large physical size
Topic 1 – Introduction to Integrated Circuit (IC)

CLASSIFICATION OF IC BASED ON FBRICATION METHOD 39

• Comparison between monolithic, film and hybrid method

Characteristics Monolithic Film Hybrid

1. Components on chip Active and Passive Passive (Resistor & Active and Passive
capacitor)
Silicon (Si)
Conductor layer on Silicon and
2. Substrate material Germanium (Ge)
insulator insulator
Gallium Arsenide
(glass, ceramic)
(GaAs)
Surface on top of Use metal Interconnection between
3. Interconnection method two or more chips/die
substrate (Al or gold)
Bipolar, MOS, Thin film =0.5µm Combination of monolithic
4. Technology used
GaAs Thick film =25µm and film

5. Size Moderate Small Large

Film IC
40
Topic 1 – Introduction to Integrated Circuit (IC)
CLASSIFICATION OF IC BASED ON TRANSISTOR TYPE
Bipolar IC
 3 Types of Bipolar IC:
i. Transistor-Transistor Logic
(TTL)
ii. Emitter-Couple Logic (ECL)
iii. Integrated Injection Logic
(I2L)
 Analogue devices usually
fabricated using bipolar
transistor.
41
MOSFET IC
 Combination of two or more
chips.
 Use both fabrication
technique : monolithic + film.
 Active components are
fabricated using monolithic
method.
 Passive components are
fabricated using film method.
 Circuit design is the most
flexible.
 Disadvantage:
i. Costly
ii. Less reliability
Topic 1 – Introduction to Integrated Circuit (IC)

42

REFLECTION
Topic 1 – Introduction to Integrated Circuit (IC)
CONCLUSION
Integrated circuit (also
01 referred to as a chip) is a set
of electronic circuits built on
one small piece of
semiconductor material,
normally silicon.
Evolution of Integrated
02 Circuit starts in 1956 and
still on going until today.
43
Integrated Circuit
03 generation can be
classified based on
integration scale namely
SSI, MSI, LSI, VLSI,
ULSI and GSI.
Integrated Circuit can be
04 classified based on its
fabrication method, transistor
type and circuit function.
Topic 1 – Introduction to Integrated Circuit (IC)

TUTORIAL
QUESTIONS
 Topic 1 – Introduction to Integrated Circuit (IC)

TUTORIAL QUESTIONS
1. What is an integrated circuit or chip?
2. Explain Moore’s Law prediction over digital Integrated Circuit (IC) evolution.
3. Define the abbreviations SSI, MSI, LSI, and VLSI.
4. Differentiate between analogue integrated circuit, digital integrated circuit and mixed-signal
circuits.
5. Compare monolithic IC, film IC and hybrid IC in terms of their production cost.
6. Explain between bipolar transistor technology, MOSFET technology and BiCMOS
technology
7. Explain the relationship between mixed-signal circuits and BiCMOS technology
8. Explain the relationship between Through Hole devices and Through Hole technology.
9. Explain Surface Mount Devices (SMD) and Surface Mount Technology (SMT).
10. Describe the following : types of IC packaging material, types of IC packaging