SUPERIOR FLUX & MFG.

ELECTRONICS PRODUCTS
 Superior Flux & Mfg. Co. founded in
1932.
 1949 introduced Superior Supersafe®
No. 30, first Battelle formula flux.
 1995 introduced SyberGel and
TM

SyberLiquid for repair/rework

TM

and hand-soldering.
 PRODUCT LINE
 Solder Pastes
 Tacky Fluxes
 Wave Solder Fluxes
 Component Tinning Fluxes
 Wire Tinning Fluxes
 Hand Solder Fluxes
 Copper and Nickel Pre-Cleaners
 Saponifier
 Descaler
 Dross Reduction Powder
 SOLDER PASTE
 3000 Series Conventional No-Clean
 4000 Series Synthetic, Low-Residue No-
Clean
 8000 Series Water-Soluble
 9000 Series Rosin Mildly Activated (RMA)
 Solders: 63Sn/37Pb
62Sn/36Pb/2Ag
Lead-Free
 3000 SERIES NO-CLEAN
SOLDER PASTE
 Classification: IPC ANSI-J-STD 004,
Type ROL0
 Meets and exceeds Bellcore
standards.
 Pin-testable post-solder joints.
 Translucent residue.
 Capable of printing 12 mil pitch.
 4000 SERIES SYNTHETIC
NO-CLEAN SOLDER PASTE
 Classification: IPC ANSI J-STD-004,
Type REL0.
 Meets and exceeds Bellcore standards.
 Translucent, protective post-solder
residue.
 Pin-testable post-solder joints. General
residue levels of 2.5 – 3.3%. In proper
conditions, can be as low as 1.1%.
 Capable of printing 12 mil pitch.
 8000 SERIES WATER-
SOLUBLE SOLDER PASTE
 Passes Bellcore
 Passes IPC
 Residues are truly water-soluble.
 Post-reflow residues can be left on boards
for extended time and NOT reduce SIR
values.
 Post-solder residues do not foam in
aqueous cleaning systems.
 Capable of printing 12 mil pitch.
 9000 SERIES RMA
SOLDER PASTE
 Exceptional reflow profiling
characteristics.
 Capable of printing 16 mil pitch.
 Superior wetting characteristics.
 Residues can be aqueous cleaned
using SyberKleen 2000 Saponifier.
RECOMMENDED REFLOW
PROFILE: 63Sn/37Pb and
62Sn/36Pb/2Ag
REFLOW PROFILE FOR
LEAD-Free
 APPLICATION METHODS
 Screen printing
 Cartridge printing
 Dispensing
 WHAT SETS SUPERIOR
SOLDER PASTES APART?
1. All are non-halide.
2. All have a minimum 12 hour open-time between
printing, placement, and reflow.
3. All are formulated for high-speed dispensing.
4. All No-Clean and RMA pastes can be aqueous
cleaned in Superior SyberKleen 2000 Saponifier .
5. NO slumping.
6. NO tomb-stoning when stencil and reflow profile
are properly set.
7. NO white residues on PCBs.
 WHAT SETS SUPERIOR
SOLDER PASTES APART? (cont.)
8. Consistent rheology, thixotropy, and viscosity
from lot-to-lot.
9. Consistent, clear, pin-testable residues with all
No-Cleans.
10. Consistent metal-load due to no pre-thinning or
post-thinning manufacturing process.
11. 4000 Series Synthetic No-Clean residues act as
protective barrier against humidity and outside
elements.
12. 8000 Series Water-Soluble residues can be
washed any time after reflow. SIR values
remain the same when PCBs are cleaned three
(3) minutes or three (3) days after reflow.
 SOLDER PASTE STORAGE
Shelf life for all solder pastes extended
with freezer-storage first formulations.

Freezer Storage (0ºC and below): 9-12 months.

Refrigerator Storage (1-12ºC): 3-9 months.
Room temperature storage (18-23ºC): 3 months.
 TACKY FLUXES
 4000 Synthetic No-Clean
 3000 Conventional No-Clean
 8000 Water-Soluble
 9500 High Temperature

Applications:
 BGA Attachment and Repair
 Custom manufacturing applications
 Dispensable applications
 Preform soldering
 WAVE SOLDERING FLUXES
Flux-types
 No-Clean
 Water-Soluble
 RMA

Flux-base
 VOC-FREE
 Alcohol-based

Applications
 63Sn/37Pb, LEAD-Free.
 WAVE SOLDERING FLUX
APPLICATION METHODS
 Spray
 Foam
 Drag
 Wave
 NO-CLEAN
WAVE SOLDERING FLUXES
VOC-Free:
 No. 420 (Spray or Foam)
 No. 425
Alcohol-based
 No. 312
 No. 315
 No. 340
 RFE 14Y3N

All No-Clean fluxes classified as:

IPC ANSI J-STD 004 Type ORL0
 WATER-SOLUBLE
WAVE SOLDER FLUXES
 Alcohol-based
 No. 84
 RFE 301-26C

 VOC-Free
 No. 32

All Water-Soluble fluxes classified as:

IPC ANSI J-STD 004 Type ORM1
 ROSIN FLUXES
 Type R: No. 97
 Type RMA: No. 99
 Type RA: No.100
 Hi-Temp RA: No. 100HT

Solids content variations are available

for all fluxes.
 ADDITIONAL PCB ASSEMBLY
PROCESS PRODUCTS
TM TM
 SyberGel and SyberLiquid
 Hand solder, repair and rework gel or liquid that
act as flux and cleaner.
 Superior SyberKleen 2000 Saponifier
 Rosin residue removal in aqueous cleaning systems.
 Superior Descaler
 A descaling solution for removing residual build-up
that is standard for in-line and batch aqueous
cleaners.
 Superior Dross Reducer
 Powder for dross and oxidation removal from solder
bath to extend solder life.
 COMPONENT TINNING
PRECLEANERS & FLUXES
 Lead tinning for semiconductor, component,
and fuse leads.
 Fluxes formulated for Tin/Lead, Lead-
Free, and fusible alloys.
 Base Metals:
 Copper
 Nickel
 Alloy 42
 Alloy 51
 Kovar
 Other specialty alloys
 SEMICONDUCTOR AND
COMPONENT LEAD
PRE-CLEANERS
 Copper Pre-Cleaner
VOC-Free, non-hazardous, OA
formulation.
Light, pink color that changes if pH
exceeds a 3.5 reading.
 Nickel Pre-Cleaner
A high activity nickel cleaner that
contains no sulfuric acid.
 DIFFERENT FLUXES FOR
DIFFERENT APPLICATIONS
 VOC-FREE, HALIDE
 No. 30, No. 30DS, No. 40MM4, No. 43
 ALCOHOL-BASED HALIDE
 No. 45, No. 48, No. 48S
 VOC-FREE, NON-HALIDE
 430 Series
 ALCOHOL-BASED, NON-HALIDE
 No. 435, No. 435 3:1, No. 91
 WIRE TINNING FLUXES
 No-Clean: Small gage (14-22) automatic or
manual cut/strip/tin operations.
 VOC-Free: No. 425
 Alcohol-based: No. 325, No. 334.
 Water-soluble: Large gage (2-12) wires;
Copper and brass crimped terminal wires.
 VOC-Free: No. 30
 Alcohol-based: No. 45

Applications:
Automotive, Industrial, and Appliances.