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Management, Nagpur.
Department of Mechanical Engineering
(2020-21)
OPTICAL MICROSCOPY AND COORDINATE
MEASURING MACHINE
(Micro-CMM)
● Classification ● Applications
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Principle of Optical Microscope :
(Compound Microscope)
● (ob). Next, arrange the eyepiece (oc) so that primary image A'B' is located closer to the
eyepiece than the anterior focal point, then more enlarged erect virtual image A"B" is created.
● Put your naked eye in the eye (pupil) position on the eyepiece barrel to observe the enlarged
image. In short, the last image to be observed is an inverted virtual image.
● As described above, this type of microscope which creates a magnified image by combining
an objective lens making an inverted real image and an eyepiece making an erect virtual image
is called a compound microscope.
● The observation optical system in an optical microscope is commonly standardized on this
compound microscope. Meanwhile, such type of microscope that directly observes an inverted
real image magnified with an objective lens is called a single microscope.
● A microscopic observation on a TV monitor, recently popularized increasingly, uses the way of
directly capturing this inverted real image with a CCD camera, thereby being comprised of a
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simple microscope optical system.
Principle :
Capabilities
● Reflection mode
● Transmission mode
● Raman spectroscopy
Resolution
µ : wavelength of light
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Classification of Optical Microscopy :
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Industrial Microscopes Digital Microscopes :
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Figure of Optical Microscopy:
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Optical Microscope Components :
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Optical Microscope Components :
● Eyepiece:
The lens at the top that you look through. It contains 2 or more lenses that focus the
image. Usually has a 10x magnification.
● Turret:
This holds 2 or more objective lenses and can be rotated easily to change magnification
power. Normally when viewing a slide for example, it is best to start the magnification
at the lowest and then work your way upwards.
● Objective:
1 or more objective lens that collect light. The lenses are usually in a cylindrical shaped
tube. The shortest lens has the lowest power i.e the lowest level of magnification, the
longest one is the lens that has the greatest magnification power. The objective lenses
usually have the magnification power 4x, 10x and 40x.
● Focus wheel:
These are wheels that move the stage in the vertical plane. There are also wheels for
adjusting coarse and focus. Some microscopes however, do allow focus at the eyepiece
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as well.
Optical Microscope Components :
● Frame:
The frame consists of the arm, the base and is in essence the bodywork of the
microscope. It allows attachment of the focus wheels and the stage to the microscope.
● Light source:
A light source used in place of a mirror. Most microscopes do allow manual light
adjustment via a wheel located near the base.
● Condenser:
The function of the condenser lens is to focus the light onto the specimen. To increase
the quality the condenser lens may also have filters or a diaphragm.
● Stage:
A platform underneath the objective that provides a platform for the slide to be
viewed. In the center of the stage is a hole which allows light to pass through. The
stage also normally has arms to hold the slide in place.
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Optical Microscopy :
● Significant errors of optical techniques typically stem from
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Optical Microscopy :
● The resolution (r) is given by the equation proposed by Lord Rayleigh:
where, l is wavelength of light, m is the refractive index of the medium between the
object (specimen) and the objective lens, and a is the semi-angle subtended.
The term msina is also known as the numerical aperture. Using equation, the best
resolution that can theoretically be obtained is in the range 150 to 200 nm.
The depth of field is in the light microscope is of the order of 1 mm. Thus, the depth of
field is very small and therefore, for getting sharp images care has to be taken in sample
preparation. The specimen surface has to be very flat and horizontal.
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Resolving Power :
The resolving power of an optical microscope a is given by
the Abbe equation
Where
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● One of the most important advantages found is the ability of the microscope to
measure steep slopes, up to almost 90 degrees on a part with minimal surface
roughness.
● This measurement requires a high-resolution, high-numerical aperture objective,
which has a limited lateral measuring field unsuitable for measuring the entire
object.
● Because of mentioned limitation a stitching procedure is needed to combine
scans taken with several objectives.
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Confocal Laser Scanning Microscopy :
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Schematic Diagram of CLSM :
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Summary Video for Optical Microscopy :
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Introduction to Micro-CMM :
➢ A coordinate measuring machine is a device that measures the geometry of physical
objects by sensing discrete points on the surface of the object with a probe. Various types
of probes are used in CMMs, including mechanical, optical, laser, and white light.
➢ Depending on the machine, the probe position may be manually controlled by an operator
or it may be computer controlled.
➢ CMMs typically specify a probe's position in terms of its displacement from a reference
position in a three-dimensional Cartesian coordinate system (i.e., with XYZ axes).
➢ In addition to moving the probe along the X, Y, and Z axes, many machines also allow the
probe angle to be controlled to allow measurement of surfaces that would otherwise be
unreachable.
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CMM :
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New Probing Systems :
➢ There are newer models that have probes that drag
along the surface of the part taking points at specified
intervals, known as scanning probes.
➢ This method of CMM inspection is often more
accurate than the conventional touch-probe method
and most times faster as well.
➢ The next generation of scanning, known as non-
contact scanning, which includes high speed laser
single point triangulation,laser line scanning and
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Focus Probe :
● A light from a laser diode is primarily polarised by a grating plate.
Having passed through a beam splitter and a quarter wave plate
(mounted on the beam splitter), it is focused by an objective lens
onto the object surface as a spot approximately 1 Pm in diameter,
about 2 mm from the sensor.
● The reflected beam signal is imaged onto a four-quadrant
photodetector within the sensor by means of the quarter wave
plate.
● The photodiode outputs are combined to give a focus error signal Fig. Optical system of the focus
(FES) that is used to respond to the surface variation. At the focal probe
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FES on Various Materials :
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Contact Probe :
● A touch probe is composed of the probe stylus, the probe
mechanism, and the sensor.
● The probe tip must be spherical with diameters ranging from 500
m to 100 m, or less.
● It is normally made by gluing a microball on a micro tungsten
wire. The concentricity of the wire to the ball is a problem in
assembly that will cause measuring error because the probe
radius has to be compensated.
● A technique of fabricating monolithic probe stylus with melting
Fig:
and solidification processes of a thin glass fibre to form a micro-
sphere tip has been developed.
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A. Structure and motion of a touch probe B. Mechanism of contact probe
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Structure of a Micro-CMM :
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Bridge Structures :
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Comparison of Bridge Centre Deflection :
The semi-circular bridge has higher stiffness than the conventionally rectangular type
to almost twice amount.
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Structure of Micro-CMM :
2 Co-planar XY Stage :
► The top table is moved in the X-direction along the precision ground rods
mounted onto the frame, and the frame is moved in the Y-direction along the
precision ground rods of the base.
► The sliding surface of the moving part is mounted with a Teflon pad to reduce the
friction. Four guiding rods are located in the same plane, which means they share
the same vertical height.
► This is the essence of the co-planar stage that the Abbé error in vertical direction
can be significantly reduced.
► In addition, there are no transmission components and the geometry is
symmetrical, which ensures less random error and better static deformation under
the same working conditions.
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Coplanar System :
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Process Capabilities of Micro CMM :
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Advantages :
● The optical CMM offers high geometric accuracy of several optical 3D measurements
in relation to each other, enabling the measurement of small surface details on large
components and precisely determining the position of these individual measurements in
relation to each other.
● The spectrum of measurable surfaces includes all common industrial materials and
composites such as plastics, PCD, CFRP, ceramics, chrome, silicon.
● Simple operation is implemented by single-button solutions, automation and ergonomic
control elements such as a specially designed controller.
● Air-bearing axes with linear drive enable wear-free use and highly accurate, fast
measurements.
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Applications :
The optical high-resolution measurements enable manufactures to verify accuracy
of machining centers and achieve higher reproducibility of processes and products.
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Summary video for CMM :
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Research Papers :
Title- New developments in coordinate measuring machines (CMM) for manufacturing industries.
Authors- S. Hammad Mian and A. Al-Ahmari Advanced Manufacturing Institute, College of
Engineering,, King Saud University, Riyadh, Saudi Arabia.: 24 April 2014 published
● In this paper, comprehensive review concerning CMMs with capabilities to measure micro/nano
features has been presented.
● This work has also discussed different methods to estimate measurement uncertainty, as well as
performance evaluation of CMMs.
● Moreover, novel concepts such as intelligent CMM, multi-sensor CMM, virtual CMM have been
presented.
● The intelligent CMM would be able to perform all functions automatically such as extraction of
geometric and measuring information of part from its CAD file, selection of probe type,
determination of measuring features, generation of number and coordinates of measuring points, etc.
● Intelligent planning environment for generating automated CMM inspection should be able to
interpret and extract necessary design information available in CAD model, generate data structure
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Procedure to be Followed :
● The benchmark part is measured on Coordinate measuring machine Zeiss Contura G2.The
measurement plan in CMM software is made by CAD programming, using imported 3D model.
● After importing the model, it is necessary to define coordinate system, domain of measurement
probe movement and measure three referent planes on the model.
● After the workpiece alignment, measurement of all defined features is performed by CMM
scanning in one measurement cycle in CNC mode.
● Sixty different part measurement characteristics are defined in CMM measurement plan for
controlling printing accuracy on the benchmark part.
● The characteristics in CMM software are used for definition of controlled work piece geometrical
dimensions and tolerances and are possible output of a CNC measurement program. Part features
are used for definition,and features measurement results for calculation of characteristics
measurement results.
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● The characteristics are grouped in six groups, and those are: flatness,perpendicularity, angularity,
parallelism,cylindricity and diameter cylinder.
Results :
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Title-Surface and Material Characterization Techniques
Book- Surface Treatment of Materials for Adhesive Bonding
© 2014 Elsevier Inc. All rights reserved.
chapter n.o-4
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Differential Scanning Calorimeter (DSC) :
● Differential scanning calorimetry (DSC) is one of best known techniques in the
group known as the thermal analysis methods.
● Other techniques include differential thermal analysis methods, dynamic
mechanical analysis methods,and thermogravimetric analysis methods
● DSC is a thermal analysis technique used to measure the heat flows related to
transitions in materials as a function of time and temperature.
● These measurements provide qualitative and quantitative information about
physical and chemical changes that involve endothermic or exothermic processes
or changes in heat capacity.
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Conclusion :
● In summary, Tools exist that have exceedingly high resolution, but are limited in range
(i.e. only a few square micrometers can be measured), tools exist that have sufficient
range, but are limited in their ability to measure drastic slope changes on the surface of
the part, a characteristic typical of high aspect ratio micromachined parts.
● The current solution to quantifying micro-scale MEMS parts is to use a combination of
tools. The combination of these techniques, at best, provides geometric information
about localized regions of a specific part, but a technique which provides geometric
information for an entire micromachined part has yet to be realized.
● After doing this research and study about CMM we are able to understand different
terms which are related to micro coordinates measuring machines and we were able to
demonstrate all the required process which are taking place inside the instrument and
capabilities of CMM.
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References :
RESEARCH PAPERS :
● Liang, S., 2004, “Machining and metrology at micro/nano scale,” Keynote speech, In Proceedings of the 1st
International Conference on Positioning Technology,Hamamatsu, Japan, pp. 23–28.
● Sasaki, T., Ishida, K., Teramoto, Kawai, T., and Takeuchi, Y., 2007, “Ultraprecision micromilling of a small 3-D
parts with complicated shape,” In Proceedings of the 7th International Conference of EUSPEN, Bremen, Germany,
pp. 388–391.
● Weckenmann, A., Peggs, G. and Hoffmann, J., 2005, “Probing systems for dimensional micro and nano
metrology,” In Proceedings of International Symposium on Measurement Technology and Intelligent Instruments,
Huddersfield, UK, pp.199–206.
● Claverley, J.D.; Leach, R.K. A review of the existing performance verification infrastructure for micro-
CMMs.Precis. Eng. 2015, 39, 1–15
● Bauza, M.B.; Hocken, R.J.; Smith, S.T.; Woody, S.C. Development of a virtual probe tip with an application to
high aspect ratio microscale features. Rev. Sci. Instrum. 2015, 76, 095112.
● Michihata, M.; Hayashi, T.; Adachi, A.; Takaya, Y. Measurement of Probe-stylus Sphere Diameter for Micro-CMM
Based on Spectral Fingerprint of Whispering Gallery Modes. CIRP Ann. Manuf. Technol.2014, 63, 469–472.
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● https://www.academia.edu/38168355/3D_printing_additive_procedure_model_creation_and_dimensional_check_
using_CMM
References :
WEBSITES:
● http://home.iitk.ac.in/~sangals/virtualLab/microscopyExperiments/microscopyLaboratoryExp
eriment-1.html
● https://centers.njit.edu/york/analysis/special-microsope.php
● https://www.routledge.com/New-Techniques-of-Optical-Microscopy-and-Microspectroscopy/
herry/p/book/9780849371172
● https://www.olympus-ims.com/en/microscope/dsx/?gclid=Cj0KCQjw18WKBhCUARIsAFiW
7JxFHZn5hucisLyvcHun6exUIS0aRwb75gWbEvoNP3ABEWJGUza44kYaAgi_EALw_wcB
#!cms[focus]=cmsContent14526
● https://www.olympus-ims.com/en/microscope/terms/feature10/
● https://www.intertek.com/analysis/microscopy/optical/
● https://www.slideshare.net/badebhau/measurement-techniques-in-micro-machining-pdf-by-ba58
debhau4gmailcom
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THANK YOU !
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