FIMPRRRRRRRRRR RR ne SSS Total No. of Questions :12] [Total No. of Pages : 5 864 [3264]-455 B.E.(E & TC) ELECTRONIC PRODUCT DESIGN (2003 Course) Time Hours] (Max. Marks : 100 Instructions to the candidates: 1) Answers to the two sections should be written in separate books. 2) Neat diagrams must he drawn wherever necessary. 3) Figures to the right indicate full marks. 4 Use of logarithmic tables slide rule, Mollier charts, electronic pocket citlculator and steam tables is allowed. 5) Assume suitable data, if necessary. 6) All questions are compulsory. SECTION -1 QI) a) Explain the Bathtub curve for reliability indicating all its regions. Also explain how failures in- e [8] i) Early failure region and ii) Wear out region are reduced prior to shipment of electronic product. b) Draw the circuit diagram of DC regulated power supply (with power ON indication) using three terminal regulator and bridge rectifier. Calculate MTTF for the circuit. Failure rates of components used are given below. (6) ‘Component Failure rate for 10° hours Power Transformer Fuse Rectifier diodes Electrolytic capacitors | 0.6 Ceramic capacitors | 04 Regulator IC 0.003 Resistor 0.04 LED 0.04°) Q2) a) d) °) Q3) a) b) 04) 2) b) °) 13264]-455 Compare MTTF for a switching regulator with linear regiilator with same power output (4) OR Compare Consumer products, Industrial produets and Military products for- 8 i) Cost/performance ratio ii) Reliability iit) Competition iv) Temperature rating of components used Explain how i) Component ii) Sub-assembly/PCB and iii) Housing level shielding from EMI is achieved. (6) For a far field case, it is desirable to achieve a 40 dB shielding effectiveness using conductive coating on enclosure, What should be the coating impedance in Q/square? (41 i i eel lll ‘A microcontroller circuit 1s implemented on PCB using FR4 laminate (¢,=4:1).Ifat certain location on POB, the length of two tracks carrying asignal is 10 cm, what should be the maximum clock rise time for which amped cirenit analysis would be valid? (6 For a thermocouple based temperature measurement system using” 12-bit ADC and 10-bit DAC, discuss stages where special PCB design considerations are necessary. Explain the necessary precautions to be taken to ensure proper working of the system. [10] oR Explain in details recommended PCB design practices for - i) Power gupply and ground routing ii) Decoupling, 18] Explain different termination schemes for avoiding reflections in high- speed PCB designs. {4 Compare on-board and off-board regulation schemes for placement of DC power supply regulator. 4|Q5) Explain with jfstification and schematic arrangement, the type of instrument ! that you will use to find faults in following- [16] a) AWien Bridge Oscillator. b) A microcontroller circuit with a hairline short on two adjacent lines of data bus. c) Acombinational logie that is producing glitches or hazards. d) A memory interface that is suspected to comply with set up and hold time requirements. . OR Q6) 2) Explain advantages and limitations of i) Analog Real Time Oscilloscope ii) Digital Storage Oscilloscope. Also explain how Mixed Signal Oscilloscope addresses fault finding related to signal integrity. [8] b) Draw the circuit diagram of two-stage BJT RC coupled amplifier and explain how you can make use of - i) DC or operating point analysis ii) ACanalysis : to determine component values. * [8] SECTION - 11 Q7) A Microcontroller based oxygen measurement system uses Zirconium sensor to measure oxygen concentration. The system uses a keyboard with 4 keys and allows user to fix a set point from keyboard. Oxygen concentration is displayed on 4-digit multiplexed LED display. Oxygen concentration data is communicated to nearby PC using RS 232 interface. The mV output from sensor is given by relation- mV = Klog R/R, where K is a constant, R, is measured concentration and R, is reference concentration. For this system- . a) Draw detailed flow chart for development of software. b) i) _ Identify software modules that are functionally independent of each other. ii) Modules that should be coded in assembly language. Justify your choice iil) Modules that should be coded in C language. Justify your choice {18} [3264]-455 3Q8) Write short notes on- {i a) Modular programming b) Standard methods of debugging software c) In-circuitemulator 4) Steps from coding to the generation of executable code when using combination ef Assembly language and C language programs @Q9) a) Explain different vibration tests that should to be carried out on 3 industrial product. Indicate different parameters/settings associated wi this test. 7 t b) Specify with justification the choice of environmental tests to be carrit out on following products- t i) Washing Machine ii) PLC iii) UPS OR Q70)a) Why it is necessary to conduct following tests on electronic produd { i) Radiated Emission ii) Conducted Emission iii) Radiated Susceptibility iv) Conducted Susceptibility b) Which of the above tests will be essential for following products- [ i) FM radio receiver ii) PC used in Office environment iii) Industrial PC * iv) Mobile phone Justify your choice of test(s). Q11)For the circuit shown below, all OPAMPs (type OPO7) are powered w, + 12V DC regulated voltage. All resistors are having +2% tolerance. For'tl signal conditioning circuit - a i) Write Product Test Specifications ii) Prepare complete Bill of Materials [3264)-485 4iii) Suggest suitable location of test points iv) Compute acceptable range of variati in voltages at each test point. 9 ” 0 3] —12V OR Q12)Fot an industrial process control instrument, what should be the contents of i) User manual and ii) Service manual. Explain how each section of these manuals is to be used by concemed persons. [16] w 6] +e [3264)-455 5 fa.