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2..material Properties & 2
2..material Properties & 2
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Orientation effects in Si
<111>directions are the least expensive from the manufacturing point of view. etching is slowest along the <111> directions. Chemical etching of Si will preferentially expose {111} planes.This will facilitate cutting of V grooves in a {100} surface. Silicon tends to cleave on {111} planes. {100} surface is suitable for defining scribe lines for rectangular chips. Scribe lines are described along <110> directions and all <110>directions are mutually at right angles on a (100) surface. Defining scribe lines on a (111) surface is difficult.
(111) surface
(100) surface
Orientation effects in Si
Growth of Si is difficult in {110} planes. Four of the {111} planes meet (110) Si at 90o on the surface. Used for etching vertical grooves. Diffusion, oxidation etc are also orientation dependent. MOS circuits are fabricated on {100}surface only.
Flats
Flats
Vertical Groove
V-groove