MIRTEC Co.

, Ltd
Advanced Total Inspection System

June, 2012

02

Technical Report . 04

New

Statistical Process Control

SPC 5.0

WHY need Statistical Process Control?

SPC ?

Solder Printing

Component Placement

Reflow Soldering

SPC PCB DB , . ,

SMT Processing Step

SPC
Process Improvement

.
SPC SMT Process , , 3 , .

Defect Analysis

. , , .

SMT Process ?

Defect Analysis
: SMT Process .

Screen Print

Placement

Soldering

SMT Process ?
:
COMPONENTS PWB Solder Paste Chip IC BGA CSP LGA SOC / SIP / MCP SOP QFP Connector Condenser Coil Tantal Diode TR Array Pad Etc.. DEFECT Missing Mel Component Shift No Solder Insufficient Solder Excessive Solder Bridge Misalignment Skew Component Polarity Tombstone Manhattan Turn Over Wrong Component Scratch Solder Ball Height Tilt Etc..

 ?
: .
Material - PWB Defect - Chip Crack - Spec out component - Man - Solder Paste - - - Method - Wrong Teaching Programming - PWB - - Reflow Profile setting Machine - Machine Calibration - Reflow - Stencil - Mounter -

Material

Man

4M Analysis
Method Machine

SPC Process Improvement

: .

1. Monitoring
DEFECT TYPE
Missing Mel Component Shift No Solder Insufficient Solder Excessive Solder Bridge Misalignment Skew Component Polarity Tombstone Manhattan Turn Over Wrong Component Scratch Solder Ball Height Tilt Etc..

2. Analysis

3. Improvement
(Material / Method Factor)

Manager

Material Material

Man Man

Report

4M Analysis

(Machine Factor)

Engineer

Method Method

Machine Machine

(Human Factor)

Operator

4. Feed back

Quality Improvement
: .

Yield
Analysis
Process Improvement Feed Back

Time

1. Monitoring : Yield Control

1. Monitoring : Model Review

1. Monitoring : Defect Part View

2. Analysis: Top 10 Defect

2. Analysis: Scatter Chart

2. Analysis: Control Chart

2. Analysis: Multi Yield Control

3. Report: Daily Report

3. Report: Data Export

Remote SPC / Built-in SPC

= , =

Function
Welcome Home Connections Settings PCB Model View Language / Unit (: , )

Built-in

Remote

PCB Defect View

View Yield Defect List Control Chart Analysis Multi-Scatter

, , ,
, , , //,, AOI: (P, U ), SPI: (X-bar, S, Cp, Cpk ) AOI: Offset Scatter, SPI: Multi-Histogram

Worst Top 10
Multi-SPC Multi-Yield Defect Type of Part Daily Report DPM Report (window) Report PPM Report (part)

, , ,
/

Data Export
Save Search Condition Tools Restore Search Condition Save Layout Restore Layout Window Classic MDI / Tabbed MDI

CSV, TXT , AOI:

UI UI /

SPC 5.0 Movie

(Webpage Link)

If you need more information