KGCOMPO(M) Management Review Meeting 2013 WW038 Weekly Production LDR Major Defects C/M OEM

Defect August Solder short =38% CN1 U2 C37 D3/C8 Model TCJ3400 Root cause Solder short during Solder Dipping process C/M Add glue at CN1 U2 C37 D3/C8 PIC Watie / CB Ooi When 11.9.13 Effectiveness Test run Result =0/1000 pcs

Countermeasure
Top Defects Breakdown
CN1 solder short, 150, 10% U2 solder short, 142, 10% D3/C8 solder short, 133, 9%

Add glue in between always solder short location

C37 U2
U2

Others, 545, 38%

D3/C8

CN1

C37 solder short, 106, 7%

U4 solder short, 377, 26%

KGCOMPO(M) Management Review Meeting 2013 WW035 Weekly Production LDR Major Defects C/M OEM
Defect U4 Solder short Model TCJ3400 Root cause U4 Solder shot due to spray fluxes coverage No good C/M Reset spray fluxes To activate 1 cycle before PCB input & increase the Cycle frequency for better flux coverage PIC Razak / Denish When 29.8.13 Effectiveness OK

Before
Poor flux coverage

After
Good flux coverage

Problem
U4 Solder shot due to spray fluxes coverage No good Spray Fluxes activate once PCB input Spray Fluxes activate before PCB input