Professional Documents
Culture Documents
NPN Silicon
Features
http://onsemi.com
COLLECTOR 1 2 BASE 3 EMITTER
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Symbol RqJA RqJC Max 200 83.3 Unit C/W C/W
12
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
MARKING DIAGRAM
A = Assembly Location Y = Year WW = Work Week G = PbFree Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device P2N2222AG P2N2222ARL1G Package TO92 (PbFree) TO92 (PbFree) Shipping 5000 Units/Bulk 2000/Tape & Ammo
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2013
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: P2N2222A/D