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Copper Electroplating
Copper Electroplating
OPJIT
Copper plating
Copper plating is a process of copper deposition over a part immersed into
an electrolyte solution and used as a cathode, when the copper anode is being dissolved into the electrolyte in form of the copper ions traveling through the solution and depositing on the cathode surface.
Phosphorized copper (0.04-0.08% P)is recommended for the anodes in Copper plating [Acid copper sulfate bath] and Acid copper fluoborate bath.
High purity oxygen-free copper is used for the anodes in Cyanide copper
bath and Copper pyrophosphate bath. Less pure anodes form sludges on their surfaces.
The
sludge particles may increase the deposit roughness. Anode-to-cathode area ratio is kept within the range between 1 and 2.
oil-free air or by the oscillating cathodes.
The copper electrolyte solutions are normally agtated by the solution flow, The solutions are continuously filtered through a 1-5 m filters at a flow 1-3
Discuss:
Properties of copper deposites
Cyanide copper bath Copper pyrophosphate bath
electroplated copper is copper plating of Printed Circuit Boards (PCB). Copper substrate is easy to plate therefore copper deposit is widely used as an undercoat for over-deposits. High thermal conductivity. Copper deposits are used as thermal conductors. Copper deposit over steel surface may serve as a diffusion barrier. Copper coatings are used as stop-off preventing diffusion of carbon or/and Nitrogen during selective Case hardening. There are numerous elctrolyte solutions and electro-deposition techniques for copper plating. Copper deposits possess excellent decorative appearance. Copper is relatively inexpensive metal.
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
oz/gal
g/l
2.0 3.5
15 26
3.7 4.6
28 35
2.0 4
15 30 to PH=12.3 6 45
1.4 2.5
10.5 19
1.5 0.8
11 6
High speed
60
12.5
94
15
5.6
42
5.6
42
1.0
7.5
Operation conditions of cyanide copper baths Cathode current Anode current density density (max.) A/ft2 Cathode efficiency Max.deposit thickness mil 0.1 m 2.5 Solution flow Continuous
Agitation
Filtration
120145
10-30 1-3
Rochelle salt
130160
54-71
20-40 2-4
30
50
0.2
5.0
Solution flow
Continuous
High speed
170180
77-82
30-60 3-6
50
100
0.3-2.0 7.5-50
Problem: Poor adhesion (blistering or peeling) Possible causes: 1.Poor cleaning treatment (Surface preparation) 2.Contaminated rinsing water Problem: Low current efficiency due to the anode polarization (black or green deposit on anodes) Possible causes: 1. Low free cyanide 2.Insufficient agitation 3.High anode current density 4.High operation temperature 5.Organic contamination Problems: Roughness Possible causes: 1.Suspended solid particles in the solution 2.Rough substrate surface 3.High current density 4.Organic contamination
Possible causes:
1.Low free cyanide 2.Insoluble particles in the solution Problem: Dull deposit
Possible causes:
1.Low brightner 2.Organic contamination Problem: Dark deposit with yellow tarnish
Possible causes:
1.Low copper 2.High free cyanide
Possible causes:
1.Low free cyanide 2.Low Rochelle salt
oz/gal 3.5
g/l 26
oz/gal 25
g/l 188
oz/gal 1.5
g/l 11
oz/gal 0.13
g/l 1 7-8.5
Voltage
V
PH
Filtration
Agitation
1-7
95-100
2-5
8-8.5
Vigorous air
Continuous 1 turnover/hr
Possible causes:
Possible causes:
1.High copper metal; 2.Insufficient agitation; 3.Low copper/pyrophosphate ratio; 4.High operation temperature; 5.Organic contamination
Problems: Roughness
Possible causes:
1.Suspended solid particles in the solution; 2.Rough substrate surface; 3.High current density; 4.Metallic contamination
Problem: Brittle deposit Possible causes: 1.High brightner content; 2.Organic contamination; 3.Excessive ammonia
Problem: Dull deposit Possible causes:
Problem: Burnt copper deposit Possible causes: 1.Low copper; 2.Insufficient agitation;
Problem: Buildup of orthophosphate in solution. Possible causes: 1.High operation temperature; 2.Low copper/pyrophosphate ratio
Agitation
Filtration
F
70-100
C
21-38
A/ft2
40
A/dm2
4
A/ft2
40
A/dm2
4 1 Vigorous air Continuous 3 turnover/hr
70-90
64-113
21-32
18-45
15-50
50-200
1.5-5
5-20
7-25
20-100
0.7-2.5
2-10
2
2
High speed
Possible causes:
Possible causes:
Possible causes:
1.Suspended solid particles in the solution; 2.Rough substrate surface; 3.High chloride; 4.Low brightner content; 5.High rectifier ripple
Possible causes:
1.High chloride; 2.Insufficient anode area; 3.Organic contamination 4.Low temperature; 5.High acid; 6.Low copper
Problem: Burnt deposit
Possible causes:
1.Low copper; 2.High acid; 3.Low chloride; 4.Insufficient agitation; 5.Organic contamination
Copper metal
oz/gal 8 g/l 60
60
450
16
120
30
30
Temperature Bath Low concentration High concentration F 80-170 80-170 C 27-77 27-77
Possible causes:
Possible causes:
1.High copper metal; 2.Low acid; 3.Low operation temperature; 4.High current density
Problems: Roughness
Possible causes:
1.Suspended solid particles in the solution; 2.Rough substrate surface; 3.Low brightner content; 4.High rectifier ripple
Possible causes:
Possible causes:
Possible causes: