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Transistors

2SB0956
Silicon PNP epitaxial planar type
Unit: mm

For low-frequency output amplification


Complementary to 2SD1280

4.50.1
1.60.2

1
0.40.08
1.50.1

Parameter

Symbol

Rating

Unit

VCBO

20

Collector-emitter voltage (Base open)

VCEO

20

Emitter-base voltage (Collector open)

VEBO

IC

ICP

Collector power dissipation

0.4 max.

2.60.1

45

3.00.15

Collector-base voltage (Emitter open)

Peak collector current

0.40.04

Absolute Maximum Ratings Ta = 25C

Collector current

3
2
0.50.08

1.0+0.1
0.2

Large collector power dissipation PC


Low collector-emitter saturation voltage VCE(sat)
Mini Power type package, allowing downsizing of the equipment
and automatic insertion through the tape packing and the magazine packing.

Features

2.50.1

4.0+0.25
0.20

1.50.1

PC

Junction temperature

Tj

150

Storage temperature

Tstg

55 to +150

1: Base
2: Collector
3: Emitter
MiniP3-F1 Package

Marking Symbol: H

cm2

Note) *: Print circuit board: Copper foil area of 1


or more, and the board
thickness of 1.7 mm for the collector portion

Electrical Characteristics Ta = 25C 3C


Parameter

Symbol

Collector-emitter voltage (Base open)

VCEO

IC = 1 mA, IB = 0

20

Emiter-base voltage (Collector open)

VEBO

IE = 10 A, IC = 0

ICBO

VCB = 10 V, IE = 0

Collector-base cutoff current (Emitter open)

Conditions

VCE = 2 V, IC = 500 mA

130

hFE2

VCE = 2 V, IC = 1.5 A

50

VCE(sat)

IC = 1 A, IB = 50 mA

Forward current transfer ratio *1

hFE1 *2

Collector-emitter saturation voltage *1

VBE(sat)

IC = 500 mA, IB = 50 mA

Base-emitter saturation voltage

*1

Transition frequency

fT

Collector output capacitance


(Common base, input open circuited)

Min

Cob

Typ

Max

Unit

280

0.5

1.2

VCB = 6 V, IE = 50 mA, f = 200 MHz

200

MHz

VCB = 6 V, IE = 0, f = 1 MHz

40

pF

Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Pulse measurement
*2: Rank classification
Rank

hFE1

130 to 210

180 to 280

Publication date: December 2002

SJC00062CED

2SB0956
IC VCE
Ta = 25C

1.0

IB = 5.0 mA
4.5 mA

Collector current IC (A)

1.0

4.0 mA

0.8

0.8

3.5 mA
3.0 mA

0.6

0.6
0.4
0.2

2.0 mA

0.4

1.5 mA

0.2

0.5 mA

1.0 mA

20

40

60

2.5 mA

80 100 120 140 160

VBE(sat) IC

Forward current transfer ratio hFE

Base-emitter saturation voltage VBE(sat) (V)

25C
1 Ta = 25C
75C

0.1

0.01

0.1

400
Ta = 75C

300

25C
200

25C

100

0
0.01

10

0.1

10

IE = 0
f = 1 MHz
Ta = 25C

60

40

Single pulse
Ta = 25C
ICP
t = 10 ms

IC

t=1s

0.1

0.01

20

10

100

Collector-base voltage VCB (V)

0.001
0.1

10

100

Collector-emitter voltage VCE (V)

SJC00062CED

0.1

10

Collector current IC (A)

500

VCB = 6 V
Ta = 25C

400

300

200

100

0
10

100

Emitter current IE (mA)

Safe operation area


10

Collector current IC (A)

Collector output capacitance


C (pF)
(Common base, input open circuited) ob

Collector current IC (A)

80

0
1

0.001
0.01

fT I E

500

Cob VCB

100

Ta = 75C

0.01

VCE = 2 V

Collector current IC (A)

120

25C

25C

hFE IC
600

IC / IB = 10

0.001
0.01

IC / IB = 20

Collector-emitter voltage VCE (V)

Ambient temperature Ta (C)

10

10

0.1

Transition frequency fT (MHz)

Collector power dissipation PC (W)

Copper plate at the collector


is more than 1 cm2 in area,
1.7 mm in thickness

1.2

VCE(sat) IC

1.2

Collector-emitter saturation voltage VCE(sat) (V)

PC Ta
1.4

1 000

Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
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Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
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2002 JUL

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