4

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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Table of Contents

SUZHOU-D

g
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CPU
:AMD Caspin
Chip Set :AMD RX881+SB710
Remarks : Tigris Platform
Model Name : Suzhou-D
PBA Name
: MAIN
PCB Code
: GCE :
NAN :
HAN :

Dev. Step
Revision
T.R. Date
Design
XIE BIN

: PV
: 1.0
: 2009.11.10
CHECK
GUO LEI

COVER
OPERATION BLOCK DIAGRAM
BOARD INFORMATION
D
POWER DIAGRAM
POWE RAILS ANALYSIS
TIMING DIAGRAM,POWER ON
CLOCK DISTRIBUTION
THERMAL SENSOR&FAN CONTROL
CLOCK GEN.
S1g3 CPU
RX881M
SODIMM DDR2
SB710
SPI_BIOS_ROM
PARK-S3
gDDR3
LVDS (LCD CONNECTOR)
C
CRT CONNECTOR
HDMI CONNECTOR
MICOM
KBD CONN & TOUCHPAD
LED LOGIC
AUDIO
LOM(Marvell 88E8040)
WLAN
MEMORY CARD (AU6336)
EXPRESS CARD
HDD & ODD
MDC CONN. & BLUETOOTH
USB CONNECTOR
SUB BOARD_POWER SWITCH
B
CHARGER
P3.3V_AUX & P5.0V_AUX & P12V_ALW
DDR2 POWER & P0.9V_AUX
CPU VRM
CHIPSET POWER(P1.1V & P1.2V)
GFX POWER
gDDR3 POWER & P1.0V
SWITCHED POWER
(P5.0V & P3.3V &P 2.5V & P1.8V & P1.2V_AUX)
POWER DISCHARGER
MOUNT HOLE
TEST POINT

Page. 1
Page. 2
Page. 3
Page. 4
Page. 5
Page. 6
Page. 7
Page. 8
Page. 9
Page. 10~12
Page. 13~15
Page. 16~17
Page. 18~22
Page. 23
Page. 24~27
Page. 28~29
Page. 30
Page. 31
Page. 32
Page. 33
Page. 34
Page. 35
Page. 36~37
Page. 38
Page. 39
Page. 40
Page. 41
Page. 42
Page. 43
Page. 44
Page. 45
Page. 46
Page. 47
Page. 48
Page. 49
Page. 50~51
Page. 52
Page. 53
Page. 54

APPROVAL

Page. 55
Page. 56
Page. 57

BC LEE

A
DRAW

DATE

XIE BIN

08/18/2009

GUO LEI
APPROVAL

Signature :

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

Owner : SEC Mobile R & D

TITLE

0.1

ELECTRONICS

MAIN
PART NO.

COVER

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

FAN
D

P5V_AUX
P3.3V_AUX

P1.1V / P1.2V

PG 47

Mobile Processor

PG 8

Clocking

AMD Caspian CPU

(s1g3 socket)

PG 9

PG 50~51

CPU

PG 10~12

PG 30

LCD

PG 30

CRT
PG 31

PG 48

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North Bridge
RX881

PEG x16

PARK-S3
PG 18~21

DDR II Power

PG 17
DDR II
SODIMM 1

DDR II 667/800

PG 53

HyperTansport Gen3

Ext. PEG

LCD

P1.8V_AUX
P0.9V_AUX

PG 16
DDR II
SODIMM 0

L2 Cache : 2M/1M/512K

GFX CORE

HDMI

PG 46

DDR II 667/800

Channel A (Reverse)

Channel B (Reverse)

PG 52

PG 49

Smart
Battery
Module

Dual channel

PG 8

HDMI

Charging
Circuit

636pin

Thermistor

PG 32

CPU
VRM

PCIE x1

Lane 2

PCIE x1

Lane 0

8040

RJ45

PG 38

PG 38

52P

ANT

Mini Card 1 (WLAN)

External Graphics

PG 39

528 FCBGA
PG 13~15

CRT

PCIE x1

Lane 1

Express Card
PG 41

PCIEXPRESS
X4

eSATA

High Definition Audio

HDAUDIO

Camera

Audio
ALC269
PG 36

SATA4

SB710

USB 8

528 BGA

USB 4

PG 24 - 28

HD Primary

USB 0,1,6

USB 0,1,6

PG 44,45

Bluetooth

ANT PG 43

12P

USB 5

HD Secondary

MDC
Modem

RJ11

PG 43

INT MIC
HP
MIC-IN

PG 37

2P 2P

PG 42

SATA HDD

PG 42

SATA ODD

PG 36

SPKR

3 IN 1

USB 4

SPI

SPI ROM

AU6336
PG 40

LPC

PG 29

SATA 0

SATA 1

3.3V LPC, 33MHz

PG 33

MICOM

Touch
PAD

MEC1308-NU
TMKBC (TBD)

KBD

PG 34

A
SPKR

L
DRAW

80 Port

LED

DATE

XIE BIN

PG 35
CHECK

08/18/2009

APPROVAL

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

PG 29

TITLE

0.1

ELECTRONICS

MAIN
BLOCK DIAGRAM

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

BOARD INFORMATION
D

SCHEMATIC ANNOTATIONS AND BOARD INFORMATION

VDC
CPU_CORE0
CPU_CORE1
EGFX_CORE
P1.1V
P1.2V
P3.3V_MICOM
P1.5V
P1.8V
P1.8V_AUX
P0.9V_AUX
P3.3V
P3.3V_AUX
P5.0V
P5.0V_AUX
P5.0V_STB
P12.0V_ALW

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Crystal / Oscillator

Voltage Rails
Primary DC system power supply (7 to 21V)
Core Voltage for CPU
Core Voltage for CPU
Core Voltage for GPU
VTT for M92,RX881
Core Voltage for SB710
3.3V always power rail (for Micom)
1.5V switched power rail (off in S3-S5)
1.8V switched power rail (off in S3-S5)
1.8V power rail for DDR (off in S4-S5)
0.9V power rail for DDR (off in S3-S5)
3.3V switched power rail (off in S3-S5)
3.3V switched on power rail (off in S4-S5)
5.0V switched power rail (off in S3-S5)
5.0V switched on power rail (off in S4-S5)
5.0V always power rail
12.0V always power rail

TYPE

FREQUENCY

DEVICE

USAGE

Crystal
Crystal
Crystal
Crystal
Crystal

32.768KHz
10MHz
14.318MHz
25MHz
25MHz

SB710
MICOM
CLOCK-Generator
LAN
SATA

Real Time Clock

MEC1308-NU
CK-505
88E8040
SB710

I C / SMB Address

USB PORT Assign

PORT #
0
1
2
3
4
5
6
7
8
9
10

Devices

Address

Hex

Bus

SB710
CPU Thermal Sensor
SODIMM0
SODIMM1
Thermal Sensor on SODIMM0
Thermal Sensor on SODIMM1
CK-505M (Clock Generator)

Master
0111 101x
1010 000x
1010 010x
0011 000x
0011 010x
1101 0010

7Ah
A0h
A4h
30h
34h
D2h

SMBUS Master
Thermal Sensor
Clock, Unused Clock Output Disable

PCI Express Assign

ASSIGNED TO
SYSTEM PORT 0
SYSTEM PORT 1
NC
NC
3 IN 1
Bluetooth
SYSTEM PORT 2
NC
Camera
NC
EXPRESS CARD

PORT #
0
1
2
3
4
5

ASSIGNED TO

Mini Card (WLAN)

EXPRESS CARD
LOM
NC
NC
NC

REVISION HISTORY

LCD Pannel Detect

A

Devices

(TBD)
Resolution

PANNEL_DETECT_0(strap0)

See rev notes for more information.

DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

MAIN
BOARD INFORMATION

BA41-xxxxxxA

LAST EDIT

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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER DIAGRAM

Rev 0.1

KBC3_PWRON

KBC3_SUSPWR
(CHP3_S4_STATE*)

KBC3_VRON

(CHP3_SLPS3*)

AC Adapter

VDC

Battery DC

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P5V_AUX

P3.3V_MICOM
MICOM LED

P0.9V_AUX

THERMAL CRT
SB710
MICOM
ODD
HDD
TOUCH PAD

P5.0V

USB connector

DDR II-Termination

EGFX_CORE

PARK

P1.0V

PARK

CPU_CORE0,1

HDMI
AUDIO
CAMERA

S1G3

P1.2V

S1G3
RX881
SB710

P1.1V

RX881
PARK

SB710

P1.2V_AUX

P5.0V_STB

SB710

SB710
EXPRESS CARD
WLAN
LAN
MDC
THERMAL
LVDS
LED

P3.3V_AUX

USB N Charger

RX881
PARK
gDDR-3 for PARK
eSATA Reapter
AU6336

P1.8V

AMD S1G3
SODIMM (DDR II)

P1.8V_AUX

P1.5V

CK505
WLAN
EXPRESS CARD

P1.2V_LAN

LAN

P12.0V_ALW
Power On/Off Table by S-state
Rail
S0

S3

S4

S5

+V*A(LWS)
+V*LAN

ON

ON

ON

ON

+1.8V_AUX
+0.9V_AUX

ON

ON

+V*AUX

ON

ON

State

S5-S4

P2.5V

S1G3

P3.3V

CK505
DDR2
LVDS
SPI
LAN
HDD

THERMAL
PARK
HDMI
WLAN
AUDIO
BT

S0

S3

A
DRAW

ON

CHECK

08/18/2009

ON

APPROVAL

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

+V* (CORE)

TITLE

DATE

XIE BIN

+V

RX881
CRT
SB710
LEDS
EXPRESS CARD
AU6336

0.1

ELECTRONICS

MAIN
POWER DIAGRAM

BA41-xxxxxxA

LAST EDIT

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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER RAILS ANALYSIS

Rev. 0.6 (060920)

220V

1.2V_AUX ( TBD A )

3.3V_AUX ( TBD A )

Adapter

Battery

MICOM 3V ( TBD A )
1.8V ( TBD A )

1.8V
3.3V

S1G3
( 35 W )

3.3V

7.7 A (TBD)
4.48 A (TBD)

3.79 A (TBD)
0.33 A (TBD)

RX881
MCH
(8 - 8.5 W )

3.3V

3.3V

1.2V
3.3V

3.3V_AUX
5V
1.2V_AUX
RTC_Battery

0.9-1.2V (EGFX CORE)

1.1V
1.8V
3.3V

1.8V_AUX

41 A (TBD)
4.5 A (TBD)
0.13 A (TBD)

MICOM 3V
3.3V

Thermal
Sensor

0.75 A (TBD)

0.08 A (TBD)
0.08 A (TBD)

MICOM 3V

1.2V
1.1V

VDC INV ( TBD A )

VGA CORE (TBD A)
RTC_Battery

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CPU CORE
1.8V_AUX

CPU CORE ( TBD A )

1.8V_AUX ( TBD A )
1.5V ( TBD A )
1.1V ( TBD A )
3.3V ( TBD A )
5.0V ( TBD A )
1.2V ( TBD A )
0.9V_AUX( TBD A )

0.9V_AUX

1.13 A (TBD)
0.374 A (TBD)

0.209 A (TBD)
0.001 A (TBD)
0.001 A (TBD)
0.006 A (TBD)

17.75 A (TBD)
4.48 A (TBD)
6.53 A (TBD)
0.67 A (TBD)

3.1 A (TBD)
1 A (TBD)

SB710

( ~ 2.0 W )

3.3V

3.3V

3.3V
5V

1.8V
3.3V

CLOCK

0.25 A (TBD)

0.2 A (TBD)

0.01 A (TBD)

KeyBoard

3.3V_AUX

KBD LED

3.3V_AUX

SPI

0.015 A (TBD)

3.3V

HD Audio

0.06 A (TBD)
0.07 A (TBD)

DDR-2

5V

(Dual slots)

1.5 A (TBD)

SATA ODD

0.22 A (TBD)

SATA HDD

PWR LED

0.1 A (TBD)

SD Card

0.6 A (TBD)

LAN

0.5 A (TBD)

MDC

Bluetooth

1.5 A (TBD)

Mini Card X 2

1.5V

5V

0.1 A (TBD)

0.5 A (TBD)

3.3V

PEG

KBC

0.75A (TBD)

( ~ 5.0 W )

1.8V

3.1 A (TBD)

gDDR3

5V

FAN

0.16 A (TBD)

3.3V (LCD 3V)

19V (VDC INV)

P3.3V_AUX
P1.2V_LAN
P1.8V_LAN

0.08 A (TBD)
0.29 A (TBD)
0.15 A (TBD)

0.67 A (TBD)
0.5 A (TBD)

LCD

5V

5V

LAN (88E8040)

5V

Audio AMP

1.5 A (TBD)

USB (x 3)

2 A (TBD)

Touch Pad

0.2 A (TBD)

Value by Datasheet/Application notes (Value by measurement)

DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

MAIN
POWER RAILS ANALYSIS

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

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OF

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Timing Diagram, Power ON

Rev..1.0 2009-08-27

VDC
P12.0V_ALW

g
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P5.0V_STB

P3.3V_MICOM
KBC3_RST#

KBC3_CHKPWRSW#

120ms

KBC3_SUSPWRON

740us

P5.0V_AUX

937.7us

P3.3V_AUX

9.4ms

P1.8V_AUX

19.05ms

KBC3_RSMRST#

126ms

CHP3_SLPS5#

126ms

CHP3_SLPS3#

103.5ms

KBC3_PWRON
P5.0V
P3.3V

538.9us

1.704ms

EGFX_CORE
P1.8V
P1.1V

621.3us

2.212ms

1.243ms
170us

KBC3_VRON

508.8us

CPU_CORE

631.4us

VRM3_CPU_PWRGD

492.7us

VDD_CPU_NB

P1.2V

791.6US

118.6ms

KBC3_PWRGD

99.16ms

CPU1_CPUPWRGD

102.1ms

A_RST#

600.5ns

KBC3_CPURST#

104.1ms

CPU1_LDTRST*

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

MAIN
TIMING DIAGRAM

BA41-xxxxxxA

LAST EDIT

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CLOCK DISTRIBUTION

THIS DOCUMENT CONTAINS CONFIDENTIAL

PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

P3.3V

D
CLK0_HCLK0/0#

200 MHz

667/800 MHz

CLK1_MCLK2/2#

667/800 MHz

CLK1_MCLK3/3#

SODIMM #0

SODIMM #1

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CLK3_NBGFX/GFX#

RX881
MCH

100 MHz (SRC0)

CLK1_SBLINK/SBLINK#

MIN3_CLKREQ#

PLL3
SSC

100 MHz

CLK1_PEG/PEG#

27MHz

CLK3_GFX_27M

AMD PARK-S3

PCIEXPRESS X4

LOM3_CLKREQ#

100 MHz (SRC 1)

100 MHz (SRC 4)

CLK1_SBSRC/SBSRC#

PCIEPLL

48 MHz

CLK3_USB48

PCIE LAN
(Marvell)

25 MHz

SB710

EXP3_CLKREQ*#

USBPLL

CLK1_EXPCARD/CARD#

EXPRESS CARD

SATAPLL

14.318 MHz
33 MHz

33 MHz
Buffer

32.768 KHz
OSC

CLK3_PCLKICH

HDA3_AUD_BCLK

HDA3_MDC_BCLK

RTC Clock
32.768 KHz

SPI

14 MHz
OSC

CLK3_ICH14

HD 24 MHz

CLK1_PCIELOM/LOM#

100 MHz (SRC 3)

MUX

MINI PCIE
CARD 1

DPLLB

PEG
X16

100 MHz (SRC 1,2,3)

SLG8SP628VTR

CLK1_MINIPCIE/PCIE#

100 MHz (SRC 2)

DPLLA

CLK3_GFX_27M_SS

48MHz PLL

HPLL
MPLL

CLK0_HTT/HTT#

100 MHz

MUX

CLK1_MCLK1/1#

HT Gen3
100 MHz

Main PLL
SSC

CLK1_MCLK0/0#

667/800MHz

CPU

1
MUX

PD*

667/800 MHz

PORT 80

17.86 MHz SPI3_CLK

33 MHz

CLK3_DBGLPC

HDA3_HDMI_BCLK

33 MHz

CLK3_PCLKMICOM

HD Audio
MDC

HDMI
KBC

DRAW

DATE

XIE BIN
CHECK

APPROVAL

08/18/2009
ADV
REV

BC LEE
MODULE CODE

TITLE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

14.318 MHz

32.768 KHz

0.1

ELECTRONICS

MAIN
CLOCK DISTRIBUTION

BA41-xxxxxxA

LAST EDIT

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PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

THERMAL SENSOR & FAN CONTROL

P3.3V_AUX

P3.3V

49.9
1%

g
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S fid
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C

10000nF-X5R
6.3V

100nF
10V

C92

100nF
10V

U5
EMC2112-BP-TR

1
16
19
9

17
18
20

FAN5_VDD
P3.3V_AUX

FAN3_FDBACK#

10

SMT3

TH_SHDN_SEL_R_MN

0-1005

6
7

14
15

SMDATA
SMCLK

VDD_3V
VDD_5V_1
VDD_5V_2
RESET#

2
3

DN1
DP1

2.2nF

R65

50V

C1513

CPU2_THERMDA

TH_DN3_DP2_S_MN

C72

2.2nF

11

CLK

TH_TRIP_SET_R_MN

50V

2.2nF
50V

40V

MMBT3904
Q522

40V

GFX3_THERMDN

R64

13
21

GND
THERMAL_PAD

C71

Q3
MMBT3904

GFX3_THERMDP

R63

Place between CPU & GPU

R66

25V
4700nF-X5R

C1512

CPU2_THERMDC

C91

ADDR_SEL

1209-001887

25V
4700nF-X5R

THM3_ALERT#
THM3_STP#

4 TH_DP3_DN2_S_MN
5

DP3_DN2
DN3_DP2

SHDN_SEL
TRIP_SET

KBC3_THERM_SMDATA
KBC3_THERM_SMCLK

12
8

ALERT#
SYS_SHDN#

FAN_1
FAN_2
TACH

R67

C88

C94

R78
R77
R68

10000nF-X5R
6.3V

TH_VDD_3V_R_MN

C86

10K 1%
10K 1%
10K 1%

R76
nostuff

P3.3V_AUX

10K 1%

P5.0V

1.5K
1%

5.5V

SMBUS Address 7Ah

95 degree C

P3.3V

P1.8V

R72

J2
HDR-4P-1R-SMD

10K
1%

FAN5_VDD
FAN3_FDBACK#

C85

10000nF-X5R
6.3V

5
6

R43
2K
1%

1
2
3
4
MNT1
MNT2

CHP3_THRMTRIP#

Q4
MMBT3904

3711-000456

40V

CPU1_THRMTRIP#

Line Width = 20 mil

SHDN_SEL MODE
CH1(CPU MODE)

0
HIGH Z

CH3(DIODE MODE)

N/A (SHDN# NOT USED)

A
DRAW

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

0.1

PART NO.

EMC2112

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

THERMAL SENSOR

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OF

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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CK_CLOCK_AMD
P3.3V

P1.5V

B523
BLM18PG181SN1

B529
BLM18PG181SN1
AMD used : 600ohm,500mA

100nF 10V

100nF 10V

100nF 10V

22000nF-X5R

C890

C891

C896

1%
1%
1%

100nF 10V

C888

nostuff
nostuff

R780
R779
R777

100nF 10V

C923

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
U509
SLG8SP628VTR

100nF 10V

100nF 10V

100nF 10V

100nF 10V

100nF 10V

100nF 10V

C921

C887

C889

C925

C922

C894

For PI

8.2K
8.2K 5%

63
26
48
4
55
40
35
16

R754
R758

nostuff

SMB3_CLK
SMB3_DATA

2
3

CK_XTAL_IN_C_MN
CK_XTAL_OUT_C_MN

R762

CK_PD#_R_MN

nostuff

1M
1%

C950

Y501
14.31818MHz

0.033nF
50V

C951
0.033nF
50V

61
62

51
23
45
44
39
38

LOM3_CLKREQ#
MIN3_CLKREQ#
EXP3_CLKREQ#

2801-004518

17
11
47
25
34

1
24
46
7
52
43
33
18
10

B
Place 14.318MHz within
500mils of CK-505

VDD_SRC_IO_1
VDD_SRC_IO_0
VDD_CPU_IO
VDD_ATIG_IO
VDD_SB_SRC_IO
VDD_48
VDD_ATIG
VDD_CPU
VDD_DOT
VDD_HTT
VDD_SATA
VDD_SB_SRC
VDD_SRC
SCL
SDA

XTAL_IN
XTAL_OUT

CPU_K8_0
CPU_K8_0#

ATIGCLK_1
ATIGCLK_1#

ATIGCLK_0
ATIGCLK_0#
SB_SRC_1
SB_SRC_1#
SB_SRC_0
SB_SRC_0#

SRC_7_27M_SS
SRC_7#_27M
SRC_6_SATA
SRC_6#_SATA#
SRC_4
SRC_4#
SRC_3
SRC_3#

PD#

CLKREQ_0#
CLKREQ_1#
CLKREQ_2#
CLKREQ_3#
CLKREQ_4#

SRC_2
SRC_2#
SRC_1
SRC_1#
SRC_0
SRC_0#

VSS_48M
VSS_ATIG
VSS_CPU
VSS_DOT
VSS_HTT
VSS_SATA
VSS_SB_SRC
VSS_SRC_1
VSS_SRC_0

HTT_0#_66M_1
HTT_0_66M_0

48MHZ_0

REF_0_SEL_HTT66
REF_1_SEL_SATA
REF_2_SEL_27
THERMAL

50
49

CLK0_HCLK0
CLK0_HCLK0#

28
27

CLK1_PEG
CLK1_PEG#

30
29

32 CK_SB_SRC_1_R_MN
31 CK_SB_SRC_1#_R_MN

R725
R726

10K
10K

1%
1%

37 CK_SB_SRC_0_R_MN
36 CK_SB_SRC_0#_R_MN

R757
R724

10K
10K

1%
1%

6 CK_SRC_7_27M_SS_R_MN R763
5 CK_SRC_7#_27M_R_MN
R764

22.6
22.6

1%
1%

42 CK_SRC_6_SATA_R_MN R755
41 CK_SRC_6#_SATA#_R_MN R756

10K
10K

1%
1%

CLK3_GFX_27M_SS
CLK3_GFX_27M

9
8

27MHz

CLK1_EXPCARD
CLK1_EXPCARD#

15
14

CLK1_MINIPCIE
CLK1_MINIPCIE#

20
19

CLK1_PCIELOM
CLK1_PCIELOM#

22
21

CLK1_SBLINK
CLK1_SBLINK#

53
54

64 CK_48MHZ_0_R_MN

R766
R765

59 CK_REF_0_SEL_HTT66_R_MN
58 CK_REF_1_SEL_SATA_R_MN
R778
57 CK_REF_2_SEL_27_R_MN
65

This part is 64pin QFN package.

33
33

1%
1%

33

1%

C928

CLK0_HTT#
CLK0_HTT
CLK3_MMC48
CLK3_USB48
CLK3_SB14

0.01nF
0.5pF
50V

SB710 : 1.1V (OSC_14MHz)

nostuff

0.022nF
50V

SEL_HTT66

(Pin 59)

SEL_SATA

(Pin 58)

(Pin 57)

SEL_27M

DEVICE

C949

nostuff

CLK REQ

CLK1_SBSRC
CLK1_SBSRC#

13
12

1205-003515
3.465V

100MHz

CLK1_NBGFX
CLK1_NBGFX#

10K 1%
10K 1%
10K 1%

100nF 10V

C927

CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN
CK_VDD_SB_SRC_IO_B_MN

VDD_REF
VSS_REF

R761
R760
R759

100nF 10V

C924

C895

2200nF-X5R
10V

C893

VDD_REF

60

22000nF-X5R 20% 6.3V

2200nF-X5R
10V

CK_VDD_REF_B_MN 56

C892

VDD_48

P3.3V

6.3V 20%

100nF 10V

B522
BLM18PG181SN1
AMD used : 600ohm,500mA

C926

P3.3V

C929

nostuff

10K
10K
10K

1
0*

66MHz 3.3V single HTT clock

100MHz differential clock

SRC6 diff. clock

100MHz spreading diff. clock

0*
1*
0

27MHz/27MHz_SS graphics clock

SRC7 diff. clock

SRC PORT

CLK REQ 0

CLK REQ 1

LOM3_CLKREQ#

LOM

SB Link

CLK REQ 2

MIN3_CLKREQ#

MINI CARD

CLK REQ 3

EXP3_CLKREQ#

EXP CARD

CLK REQ 4

SB_SRC

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

CK for AMD CPU

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

Main_Clock_Circuit

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CPU_Caspian
P2.5V

P1.2V

P1.2V

CPU1_HTIN(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

C
CPU1_HTIN#(15:0)

CPU1_CLKIN_0
CPU1_CLKIN_1
CPU1_CLKIN_0#
CPU1_CLKIN_1#

CPU1_CTLIN_0
CPU1_CTLIN_1
CPU1_CTLIN_0#
CPU1_CTLIN_1#

E3
E1
G3
G1
J1
L3
L1
N3
E5
F3
G5
H3
K3
L5
M3
N5
E2
F1
G2
H1
K1
L2
M1
N2
F5
F4
H5
H4
K4
M5
M4
P5
J3
J5
J2
K5
N1
P3
P1
P4

C129

C132

C131

4700nF-X5R
25V

220nF
10V

3.3nF
50V

C130
100nF
10V

1/5
HT LINK

L0_CADIN_H0
L0_CADIN_H1
L0_CADIN_H2
L0_CADIN_H3
L0_CADIN_H4
L0_CADIN_H5
L0_CADIN_H6
L0_CADIN_H7
L0_CADIN_H8
L0_CADIN_H9
L0_CADIN_H10
L0_CADIN_H11
L0_CADIN_H12
L0_CADIN_H13
L0_CADIN_H14
L0_CADIN_H15
L0_CADIN_L0
L0_CADIN_L1
L0_CADIN_L2
L0_CADIN_L3
L0_CADIN_L4
L0_CADIN_L5
L0_CADIN_L6
L0_CADIN_L7
L0_CADIN_L8
L0_CADIN_L9
L0_CADIN_L10
L0_CADIN_L11
L0_CADIN_L12
L0_CADIN_L13
L0_CADIN_L14
L0_CADIN_L15

VLDT_B0
VLDT_B1
VLDT_B2
VLDT_B3
L0_CADOUT_H0
L0_CADOUT_H1
L0_CADOUT_H2
L0_CADOUT_H3
L0_CADOUT_H4
L0_CADOUT_H5
L0_CADOUT_H6
L0_CADOUT_H7
L0_CADOUT_H8
L0_CADOUT_H9
L0_CADOUT_H10
L0_CADOUT_H11
L0_CADOUT_H12
L0_CADOUT_H13
L0_CADOUT_H14
L0_CADOUT_H15
L0_CADOUT_L0
L0_CADOUT_L1
L0_CADOUT_L2
L0_CADOUT_L3
L0_CADOUT_L4
L0_CADOUT_L5
L0_CADOUT_L6
L0_CADOUT_L7
L0_CADOUT_L8
L0_CADOUT_L9
L0_CADOUT_L10
L0_CADOUT_L11
L0_CADOUT_L12
L0_CADOUT_L13
L0_CADOUT_L14
L0_CADOUT_L15

L0_CLKIN_H0
L0_CLKIN_H1
L0_CLKIN_L0
L0_CLKIN_L1

L0_CLKOUT_H0
L0_CLKOUT_H1
L0_CLKOUT_L0
L0_CLKOUT_L1

L0_CTLIN_H0
L0_CTLIN_H1
L0_CTLIN_L0
L0_CTLIN_L1

L0_CTLOUT_H0
L0_CTLOUT_H1
L0_CTLOUT_L0
L0_CTLOUT_L1

3704-001228

U7-4
47296-6111

AE2
AE3
AE4
AE5

CLK0_HCLK0

C769

CPU_VDDA1_B_MN F8

2012
3.9nF 50V

F9

R692CPU_CLKIN_H_C_MN

4/5

VDDA1
VDDA2

KEY1
KEY2

M11
W18

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

AD1
AC2
AB1
AA2
W2
V1
U2
T1
AD4
AD5
AB4
AB5
Y5
V4
V5
T4
AC1
AC3
AA1
AA3
W3
U1
U3
R1
AD3
AC5
AB3
AA5
W5
V3
U5
T3
Y1
Y4
W1
Y3
R2
T5
R3
R5

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

CPU1_HTOUT(15:0)

CLK0_HCLK0#

C770

A9
169
1% CPU_CLKIN_L_C_MN A8

2012
3.9nF 50V

B7
A7
F10
C6

CPU1_LDTRST#
CPU1_PWRGDCPU
CPU1_LDTSTP#

AF4
AF5
AE6

CPU1_SIC
CPU1_SID
CPU1_ALERT#

P1.2V

R630
R629

44.2 1% CPU_HT_REF0_R_MN R6
44.2 1% CPU_HT_REF1_R_MN P6
F6
E6

CPU1_VDD_FB
CPU1_VDD_FB#

CPU1_HTOUT#(15:0)

Y6
AB6

G10
AA9
AC9
AD9
AF9

nostuff
nostuff

P1.8V_AUX

CPU1_CLKOUT_0
CPU1_CLKOUT_1
CPU1_CLKOUT_0#
CPU1_CLKOUT_1#

R50

301 1%

CPU_TEST23_R_MN

AD7

R672
R673

301 1%
301 1%

CPU_TEST18_R_MN

H10
G9

R671
R670

499 1%
499 1%

CPU_TEST25_H_R_MN

R46
R51
R49
R53
R52
R54

301 1%
301 1%
301 1%
301 1%
301 1%
301 1%

CPU_TEST21_R_MN

P1.8V_AUX

CPU1_CTLOUT_0
CPU1_CTLOUT_1
CPU1_CTLOUT_0#
CPU1_CTLOUT_1#

nostuff
nostuff
nostuff

CPU_TEST19_R_MN

CPU_TEST25_L_R_MN

CPU_TEST20_R_MN
CPU_TEST24_R_MN
CPU_TEST22_R_MN
CPU_TEST12_R_MN
CPU_TEST27_R_MN
CPU_TEST9_R_MN

SHORT501

E9
E8

AB8
AF7
AE7
AE8
AC8
AF8
C2
AA6

A3
A5
B3
B5
C1

CPU Socket : 0185482000 (3704-001228)

SVC
SVD

CLKIN_H
CLKIN_L

RESET_L
PWROK
LDTSTOP_L
LDTREQ_L

THERMTRIP_L
PROCHOT_L
MEMHOT_L

SIC
SID
ALERT_L

THERMDC
THERMDA

HT_REF0
HT_REF1

VDDIO_FB_H
VDDIO_FB_L

VDD0_FB_H
VDD0_FB_L

VDDNB_FB_H
VDDNB_FB_L

VDD1_FB_H
VDD1_FB_L
DBRDY
TMS
TCK
TRST_L
TDI

DBREQ_L
TDO

TEST23

TEST28_H
TEST28_L

TEST18
TEST19

TEST17
TEST16
TEST15
TEST14

TEST25_H
TEST25_L
TEST21
TEST20
TEST24
TEST22
TEST12
TEST27

TEST7
TEST10
TEST8

TEST9
TEST6

TEST29_H
TEST29_L

RSVD1
RSVD2
RSVD3
RSVD4
RSVD5

RSVD10
RSVD9
RSVD8
RSVD7
RSVD6

R45
R628
R62

VLDT_A0
VLDT_A1
VLDT_A2
VLDT_A3

P1.8V_AUX

1608

U7-1
47296-6111
D1
D2
D3
D4

B12
BLM18PG181SN1

301 1%
301 1%
301 1%

A6
A4

CPU1_SVC
CPU1_SVD

AF6
AC7
AA8

CPU1_THRMTRIP#
CPU1_PROCHOT#

CPU_MEMHOT_L_R_MN

W7
W8

CPU2_THERMDC
CPU2_THERMDA

W9
Y9

CPU1_VDDIO_FB
CPU1_VDDIO_FB#

H6
G6

CPU1_VDDNB_FB
CPU1_VDDNB_FB#
P1.8V

R675

E10

301
1%

CPU_DBREQ_L_R_MN

AE9

J7
H8

D7
E7
F7
C7

CPU_TEST15_R_MN
CPU_TEST14_R_MN

C3
K8

CPU_TEST10_R_MN

nostuff
nostuff
R669 301 1%
R690 301 1%

R667

P1.2V

301 1%

C4

C9
C8

H18
H19
AA7
D5
C5

3704-001228

P1.2V

R687
R691
R689

1K 1%
301 1%
301 1%

CPU1_LDTSTP#

R674

301 1%

1608

C127

C65

C66

C68

C133

C589

C590

4700nF-X5R
25V

4700nF-X5R
25V

4700nF-X5R
25V

220nF
10V

220nF
10V

100nF
10V

100nF
10V

C67
0.18nF
50V

P1.8V

CPU1_LDTREQ#
CPU1_LDTRST#
CPU1_PWRGDCPU

C128
0.18nF
50V

R47
R48
R44

CPU1_SIC
CPU1_SID
CPU1_ALERT#

P1.8V_AUX
390
390
1K

nostuff

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

Caspian CPU
PART NO.

S1G3 CPU (1/3)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

10

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CPU_Caspian
MEM1_ADQS(7:0)
P0.9V_AUX

0 1 2 3 4 5 6 7

MEM1_ADM(7:0)
0 1 2 3 4 5 6 7

G13
G16
C22
G22
AD23
AB19
Y15
W12
H13
G15
C21
G21
AC23
AB20
W15
W13
MA_DQS_H0
MA_DQS_H1
MA_DQS_H2
MA_DQS_H3
MA_DQS_H4
MA_DQS_H5
MA_DQS_H6
MA_DQS_H7
MA_DQS_L0
MA_DQS_L1
MA_DQS_L2
MA_DQS_L3
MA_DQS_L4
MA_DQS_L5
MA_DQS_L6
MA_DQS_L7

U7-3
47296-6111
3/5

3704-001228

A12
B16
A22
E25
AB26
AE22
AC16
AD12

MA_DATA0
MA_DATA1
MA_DATA2
MA_DATA3
MA_DATA4
MA_DATA5
MA_DATA6
MA_DATA7
MA_DATA8
MA_DATA9
MA_DATA10
MA_DATA11
MA_DATA12
MA_DATA13
MA_DATA14
MA_DATA15
MA_DATA16
MA_DATA17
MA_DATA18
MA_DATA19
MA_DATA20
MA_DATA21
MA_DATA22
MA_DATA23
MA_DATA24
MA_DATA25
MA_DATA26
MA_DATA27
MA_DATA28
MA_DATA29
MA_DATA30
MA_DATA31
MA_DATA32
MA_DATA33
MA_DATA34
MA_DATA35
MA_DATA36
MA_DATA37
MA_DATA38
MA_DATA39
MA_DATA40
MA_DATA41
MA_DATA42
MA_DATA43
MA_DATA44
MA_DATA45
MA_DATA46
MA_DATA47
MA_DATA48
MA_DATA49
MA_DATA50
MA_DATA51
MA_DATA52
MA_DATA53
MA_DATA54
MA_DATA55
MA_DATA56
MA_DATA57
MA_DATA58
MA_DATA59
MA_DATA60
MA_DATA61
MA_DATA62
MA_DATA63

0 1 2 3 4 5 6 7

R579
R578

MB_DATA0
MB_DATA1
MB_DATA2
MB_DATA3
MB_DATA4
MB_DATA5
MB_DATA6
MB_DATA7
MB_DATA8
MB_DATA9
MB_DATA10
MB_DATA11
MB_DATA12
MB_DATA13
MB_DATA14
MB_DATA15
MB_DATA16
MB_DATA17
MB_DATA18
MB_DATA19
MB_DATA20
MB_DATA21
MB_DATA22
MB_DATA23
MB_DATA24
MB_DATA25
MB_DATA26
MB_DATA27
MB_DATA28
MB_DATA29
MB_DATA30
MB_DATA31
MB_DATA32
MB_DATA33
MB_DATA34
MB_DATA35
MB_DATA36
MB_DATA37
MB_DATA38
MB_DATA39
MB_DATA40
MB_DATA41
MB_DATA42
MB_DATA43
MB_DATA44
MB_DATA45
MB_DATA46
MB_DATA47
MB_DATA48
MB_DATA49
MB_DATA50
MB_DATA51
MB_DATA52
MB_DATA53
MB_DATA54
MB_DATA55
MB_DATA56
MB_DATA57
MB_DATA58
MB_DATA59
MB_DATA60
MB_DATA61
MB_DATA62
MB_DATA63

C11
A11
A14
B14
G11
E11
D12
A13
A15
A16
A19
A20
C14
D14
C18
D18
D20
A21
D24
C25
B20
C20
B24
C24
E23
E24
G25
G26
C26
D26
G23
G24
AA24
AA23
AD24
AE24
AA26
AA25
AD26
AE25
AC22
AD22
AE20
AF20
AF24
AF23
AC20
AD20
AD18
AE18
AC14
AD14
AF19
AC18
AF16
AF15
AF13
AC12
AB11
Y11
AE14
AF14
AF11
AD11

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

39.2 1%
39.2 1%

VTT1
VTT2
VTT3
VTT4

AF10
AE10

T19
V22
U21
V19

MEM1_ODT0
MEM1_ODT1

T20
U19
U20
V20

MEM1_CS0#
MEM1_CS1#

MEM:CMD/CTRL/CLK

MEMZP
MEMZN

H16

MEM1_BDQ(63:0)

2/5

VTT_SENSE
MEMVREF

MA0_ODT0
MA0_ODT1
MA1_ODT0
MA1_ODT1

RSVD_M2
MB0_ODT0
MB0_ODT1
MB1_ODT0

MA0_CS_L0
MA0_CS_L1
MA1_CS_L0
MA1_CS_L1

J22
J20

MEM1_CKE0
MEM1_CKE1

CLK1_MCLK0
CLK1_MCLK1

CLK1_MCLK0#
CLK1_MCLK1#

MEM1_AMA(15:0)

P1.8V_AUX

R587
1K
1%

MEM1_ABS(2:0)

MEM1_VREF0

R588
1K
1%

MEM1_ARAS#
MEM1_ACAS#
MEM1_AWE#

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

N21
M20
N22
M19
M22
L20
M24
L21
L19
K22
R21
L22
K20
V24
K24
K19

0
1
2

R20
R23
J21

MB0_CS_L0
MB0_CS_L1
MB1_CS_L0
MB_CKE0
MB_CKE1

MA_CKE0
MA_CKE1

N19
E16
Y16
P19
N20
F16
AA16
P20

R19
T22
T24

VTT5
VTT6
VTT7
VTT8
VTT9

RSVD_M1

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

MB_DQS_H0
MB_DQS_H1
MB_DQS_H2
MB_DQS_H3
MB_DQS_H4
MB_DQS_H5
MB_DQS_H6
MB_DQS_H7
MB_DQS_L0
MB_DQS_L1
MB_DQS_L2
MB_DQS_L3
MB_DQS_L4
MB_DQS_L5
MB_DQS_L6
MB_DQS_L7

G12
F12
H14
G14
H11
H12
C13
E13
H15
E15
E17
H17
E14
F14
C17
G17
G18
C19
D22
E20
E18
F18
B22
C23
F20
F22
H24
J19
E21
E22
H20
H22
Y24
AB24
AB22
AA21
W22
W21
Y22
AA22
Y20
AA20
AA18
AB18
AB21
AD21
AD19
Y18
AD17
W16
W14
Y14
Y17
AB17
AB15
AD15
AB13
AD13
Y12
W11
AB14
AA14
AB12
AA12

D10
C10
B10
AD10

MA_CLK_H5
MA_CLK_H1
MA_CLK_H7
MA_CLK_H4
MA_CLK_L5
MA_CLK_L1
MA_CLK_L7
MA_CLK_L4

MB_CLK_H5
MB_CLK_H1
MB_CLK_H7
MB_CLK_H4
MB_CLK_L5
MB_CLK_L1
MB_CLK_L7
MB_CLK_L4

MA_ADD0
MA_ADD1
MA_ADD2
MA_ADD3
MA_ADD4
MA_ADD5
MA_ADD6
MA_ADD7
MA_ADD8
MA_ADD9
MA_ADD10
MA_ADD11
MA_ADD12
MA_ADD13
MA_ADD14
MA_ADD15

MB_ADD0
MB_ADD1
MB_ADD2
MB_ADD3
MB_ADD4
MB_ADD5
MB_ADD6
MB_ADD7
MB_ADD8
MB_ADD9
MB_ADD10
MB_ADD11
MB_ADD12
MB_ADD13
MB_ADD14
MB_ADD15

MA_BANK0
MA_BANK1
MA_BANK2

MB_BANK0
MB_BANK1
MB_BANK2

MA_RAS_L
MA_CAS_L
MA_WE_L

MB_RAS_L
MB_CAS_L
MB_WE_L

W10
AC10
AB10
AA10
A10

Y10

CPU1_VTTSENSE

W17

MEM1_VREF0

B18
W26
W23
Y26

MEM1_ODT2
MEM1_ODT3

V26
W25
U22

MEM1_CS2#
MEM1_CS3#

J25
H26

MEM1_CKE2
MEM1_CKE3

P22
A17
AF18
R26
R22
A18
AF17
R25
P24
N24
P26
N23
N26
L23
N25
L24
M26
K26
T26
L26
L25
W24
J23
J24

CLK1_MCLK2
CLK1_MCLK3
CLK1_MCLK2#
CLK1_MCLK3#

C
MEM1_BMA(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

MEM1_BBS(2:0)

R24 0
U26 1
J26 2
U25
U24
U23

MEM1_BRAS#
MEM1_BCAS#
MEM1_BWE#

3704-001228

Place close to MEMORY

P0.9V_AUX

C139, C253 replaced with 22000nf (from 4700nF) : PI_ADV1

PLACE EACH CAP NEAR W17 pin

C573

MEM1_VREF0

C593

C595

100nF

1nF

10V

50V

C778

22000nF-X5R 4700nF-X5R
20%
25V
6.3V

C12
D16
A24
F26
AC25
AF21
AE16
AF12
B12
C16
A23
E26
AC26
AF22
AD16
AE12

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

MB_DM0
MB_DM1
MB_DM2
MB_DM3
MB_DM4
MB_DM5
MB_DM6
MB_DM7

MEM1_ADQ(63:0)

MA_DM0
MA_DM1
MA_DM2
MA_DM3
MA_DM4
MA_DM5
MA_DM6
MA_DM7

E12
C15
E19
F24
AC24
Y19
AB16
Y13

P0.9V_AUX
U7-2
47296-6111

P1.8V_AUX

MEM1_ADQS#(7:0)

C574

C775

4700nF-X5R
25V

22000nF-X5R
220nF
20%
6.3V
10V

C43

C42

C776

C41

220nF
10V

220nF
10V

220nF
10V

C44

C774 C777 C771 C572

C575

C772

C773

1nF
50V

1nF
50V

0.18nF
50V

0.18nF
50V

0.18nF
50V

1nF
50V

1nF
50V

0.18nF
50V

0 1 2 3 4 5 6 7

0 1 2 3 4 5 6 7

MEM1_BDQS#(7:0)

MEM1_BDM(7:0)
0 1 2 3 4 5 6 7

MEM1_BDQS(7:0)

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

Caspian CPU
PART NO.

S1G3 CPU (2/3)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

11

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

50V

25V
10%

10%

10nF

10V

20%

C720

C651

25V
10nF

0.18nF 50V

22000nF-X5R

220nF

C719

C655

5%

6.3V

20%

20%

C654

10V

100

220nF

R668

C653

C647

20%

22000nF-X5R

CPU1_VDD_FB

0.18nF

6.3V

1%

22000nF-X5R

100

22000nF-X5R

CORE0_RUN

6.3V

R666

CPU_Caspian

6.3V

CPU_CORE

1608

1%

CPU1_VDD_FB#

C646

C656

C591

C650

22000nF-X5R
20% 6.3V

50V
0.18nF

C669

50V
0.18nF

C660

10V

10%

10%

220nF

C664

10V

20%

22000nF-X5R

220nF

C724

C668

20%

6.3V

6.3V
22000nF-X5R

C725

6.3V

6.3V

20%

22000nF-X5R

20%

C658

22000nF-X5R

P1.8V_AUX

C657

6.3V

20%

22000nF-X5R

22000nF-X5R
20% 6.3V

VDD_CPU_NB

C659

C652

C648

22000nF-X5R
20% 6.3V

C649

J6
J8
J10
J12
J14
J16
J18
K2
K7
K9
K11
K13
K15
K17
L6
L8
L10
L12
L14
L16
L18
M7
M9
AC6
M17
N4
N8
N10
N16
N18
P2
P7
P9
P11
P17
R8
R10
R16
R18
T7
T9
T11
T13
T15
T17
U4
U6
U8
U10
U12
U14
U16
U18
V2
V7
V9
V11
V13
V15
V17
W6
Y21
Y23
N6

Bottom side decoupling

Decoupling between processor and Memory

Place close to processor as possible

50V
0.18nF

C726

25V

25V
10nF

C722

10V

10nF

10%

220nF

C663

C661

10%

10V

10V

220nF

C662

10%

220nF

C665

10%

10V

10%

220nF

C723

C666

4700nF-X5R
25V

P1.8V_AUX

10%

3704-001228

VSS66
VSS67
VSS68
VSS69
VSS70
VSS71
VSS72
VSS73
VSS74
VSS75
VSS76
VSS77
VSS78
VSS79
VSS80
VSS81
VSS82
VSS83
VSS84
VSS85
VSS86
VSS87
VSS88
VSS89
VSS90
VSS91
VSS92
VSS93
VSS94
VSS95
VSS96
VSS97
VSS98
VSS99
VSS100
VSS101
VSS102
VSS103
VSS104
VSS105
VSS106
VSS107
VSS108
VSS109
VSS110
VSS111
VSS112
VSS113
VSS114
VSS115
VSS116
VSS117
VSS118
VSS119
VSS120
VSS121
VSS122
VSS123
VSS124
VSS125
VSS126
VSS127
VSS128
VSS129

10%

Y25
V25
V23
V21
V18
U17
T25
T23
T21
T18
R17
P25
P23
P21
P18

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57
VSS58
VSS59
VSS60
VSS61
VSS62
VSS63
VSS64
VSS65

4700nF-X5R
25V

VDDIO1
VDDIO2
VDDIO3
VDDIO4
VDDIO5
VDDIO6
VDDIO7
VDDIO8
VDDIO9
VDDIO10
VDDIO11
VDDIO12

VDDIO27
VDDIO26
VDDIO25
VDDIO24
VDDIO23
VDDIO22
VDDIO21
VDDIO20
VDDIO19
VDDIO18
VDDIO17
VDDIO16
VDDIO15
VDDIO14
VDDIO13

P1.8V_AUX

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AA4
AA11
AA13
AA15
AA17
AA19
AB2
AB7
AB9
AB23
AB25
AC11
AC13
AC15
AC17
AC19
AC21
AD6
AD8
AD25
AE11
AE13
AE15
AE17
AE19
AE21
AE23
B4
B6
B8
B9
B11
B13
B15
B17
B19
B21
B23
B25
D6
D8
D9
D11
D13
D15
D17
D19
D21
D23
D25
E4
F2
F11
F13
F15
F17
F19
F21
F23
F25
H7
H9
H21
H23
J4

C671

H25
J17
K18
K21
K23
K25
L17
M18
M21
M23
M25
N17

VDDNB_1
VDDNB_2
VDDNB_3
VDDNB_4
VDDNB_5

P8
P10
R4
R7
R9
R11
T2
T6
T8
T10
T12
T14
U7
U9
U11
U13
U15
V6
V8
V10
V12
V14
W4
Y2
AC4
AD2

10%

K16
M16
P16
T16
V16

VDD1_1
VDD1_2
VDD1_3
VDD1_4
VDD1_5
VDD1_6
VDD1_7
VDD1_8
VDD1_9
VDD1_10
VDD1_11
VDD1_12
VDD1_13
VDD1_14
VDD1_15
VDD1_16
VDD1_17
VDD1_18
VDD1_19
VDD1_20
VDD1_21
VDD1_22
VDD1_23
VDD1_24
VDD1_25
VDD1_26

4700nF-X5R
25V

VDD_CPU_NB

VDD0_1
VDD0_2
VDD0_3
VDD0_4
VDD0_5
VDD0_6
VDD0_7
VDD0_8
VDD0_9
VDD0_10
VDD0_11
VDD0_12
VDD0_13
VDD0_14
VDD0_15
VDD0_16
VDD0_17
VDD0_18
VDD0_19
VDD0_20
VDD0_21
VDD0_22
VDD0_23

CPU_CORE

C667

G4
H2
J9
J11
J13
J15
K6
K10
K12
K14
L4
L7
L9
L11
L13
L15
M2
M6
M8
M10
N7
N9
N11

5/5

4700nF-X5R
25V

U7-5
47296-6111

22000nF-X5R
20% 6.3V

CPU_CORE

C670

CPU_CORE

A
DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

0.1

ELECTRONICS

Caspian CPU
PART NO.

S1G3 CPU (3/3)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

12

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

NB_ RX881_AMD

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
PEG1_RXP(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

Y24
V23
V24
U25
T24
P23
P24
N25
AC25
AB24
AA25
Y23
W20
V20
U21
U18
T22
AB23
M22
R21

CPU1_CLKOUT_0
CPU1_CLKOUT_1
CPU1_CTLOUT_0
CPU1_CTLOUT_1

T23
AA22
M23
R20

CPU1_CLKOUT_0#
CPU1_CLKOUT_1#
CPU1_CTLOUT_0#
CPU1_CTLOUT_1#

R685

C23
A24

NB_HT_RXCALP_R_MN

NB_HT_RXCALN_R_MN

301 1%

HT_RXCAD0P
HT_RXCAD1P
HT_RXCAD2P
HT_RXCAD3P
HT_RXCAD4P
HT_RXCAD5P
HT_RXCAD6P
HT_RXCAD7P
HT_RXCAD8P
HT_RXCAD9P
HT_RXCAD10P
HT_RXCAD11P
HT_RXCAD12P
HT_RXCAD13P
HT_RXCAD14P
HT_RXCAD15P
HT_RXCAD0N
HT_RXCAD1N
HT_RXCAD2N
HT_RXCAD3N
HT_RXCAD4N
HT_RXCAD5N
HT_RXCAD6N
HT_RXCAD7N
HT_RXCAD8N
HT_RXCAD9N
HT_RXCAD10N
HT_RXCAD11N
HT_RXCAD12N
HT_RXCAD13N
HT_RXCAD14N
HT_RXCAD15N

1/5
HT_TXCAD0P
HT_TXCAD1P
HT_TXCAD2P
HT_TXCAD3P
HT_TXCAD4P
HT_TXCAD5P
HT_TXCAD6P
HT_TXCAD7P
HT_TXCAD8P
HT_TXCAD9P
HT_TXCAD10P
HT_TXCAD11P
HT_TXCAD12P
HT_TXCAD13P
HT_TXCAD14P
HT_TXCAD15P
HT_TXCAD0N
HT_TXCAD1N
HT_TXCAD2N
HT_TXCAD3N
HT_TXCAD4N
HT_TXCAD5N
HT_TXCAD6N
HT_TXCAD7N
HT_TXCAD8N
HT_TXCAD9N
HT_TXCAD10N
HT_TXCAD11N
HT_TXCAD12N
HT_TXCAD13N
HT_TXCAD14N
HT_TXCAD15N

HT_RXCLK0P
HT_RXCLK1P
HT_RXCTL0P
HT_RXCTL1P

HT_TXCLK0P
HT_TXCLK1P
HT_TXCTL0P
HT_TXCTL1P

HT_RXCLK0N
HT_RXCLK1N
HT_RXCTL0N
HT_RXCTL1N

HT_TXCLK0N
HT_TXCLK1N
HT_TXCTL0N
HT_TXCTL1N

HT_RXCALP
HT_RXCALN

HT_TXCALP
HT_TXCALN

0904-002536

* Hyper Transport Calibration resistors

RS780M / RX781 : 301 ohm

D24
E24
F24
F23
H23
J25
K24
K23
F21
G20
J20
J18
L19
M19
M21
P18

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

D25
E25
F25
F22
H22
J24
K25
K22
G21
H21
J21
K17
J19
L18
P21
M18

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

CPU1_HTIN(15:0)

PEG1_RXN(15:0)

CPU1_HTIN#(15:0)

H24
L21
M24
P19

CPU1_CLKIN_0
CPU1_CLKIN_1
CPU1_CTLIN_0
CPU1_CTLIN_1

H25
L20
M25
R18

B24 NB_HT_TXCALP_R_MN
B25 NB_HT_TXCALN_R_MN

AE3
AD4
AE2
AD3
AD1
AD2
V5
W6
U5
U6
U8
U7

PEX1_MINI_RXP0
PEX1_MINI_RXN0
PEX1_EXPCARD_RXP1
PEX1_EXPCARD_RXN1
PEX1_LAN_RXP2
PEX1_LAN_RXN2

CPU1_CLKIN_0#
CPU1_CLKIN_1#

PEX1_SB_TXP(3:0)

CPU1_CTLIN_0#
CPU1_CTLIN_1#

R686

301

PEX1_SB_TXN(3:0)

1%

0
1
2
3

AA8
AA7
AA5
W5

0
1
2
3

Y8
Y7
AA6
Y5

GPP_RX0P
GPP_RX0N
GPP_RX1P
GPP_RX1N
GPP_RX2P
GPP_RX2N
GPP_RX3P
GPP_RX3N
GPP_RX4P
GPP_RX4N
GPP_RX5P
GPP_RX5N

PCIE I/F GPP

SB_RX0P
SB_RX1P
SB_RX2P
SB_RX3P

PCIE I/F SB

SB_RX0N
SB_RX1N
SB_RX2N
SB_RX3N

GPP_TX0P
GPP_TX0N
GPP_TX1P
GPP_TX1N
GPP_TX2P
GPP_TX2N
GPP_TX3P
GPP_TX3N
GPP_TX4P
GPP_TX4N
GPP_TX5P
GPP_TX5N
SB_TX0P
SB_TX1P
SB_TX2P
SB_TX3P

SB_TX0N
SB_TX1N
SB_TX2N
SB_TX3N

PCE_CALRN_PCE_BCALRN
PCE_CALRP_PCE_BCALRP

A5 NB_GFX_TX0P_C_MN
A4 NB_GFX_TX1P_C_MN
C3 NB_GFX_TX2P_C_MN
D1 NB_GFX_TX3P_C_MN
E2 NB_GFX_TX4P_C_MN
F4 NB_GFX_TX5P_C_MN
F1 NB_GFX_TX6P_C_MN
H4 NB_GFX_TX7P_C_MN
H1 NB_GFX_TX8P_C_MN
J2 NB_GFX_TX9P_C_MN
K4 NB_GFX_TX10P_C_MN
K1 NB_GFX_TX11P_C_MN
M4 NB_GFX_TX12P_C_MN
M1 NB_GFX_TX13P_C_MN
N2 NB_GFX_TX14P_C_MN
P1 NB_GFX_TX15P_C_MN
B5 NB_GFX_TX0N_C_MN
B4 NB_GFX_TX1N_C_MN
B2 NB_GFX_TX2N_C_MN
D2 NB_GFX_TX3N_C_MN
E1 NB_GFX_TX4N_C_MN
F3 NB_GFX_TX5N_C_MN
F2 NB_GFX_TX6N_C_MN
H3 NB_GFX_TX7N_C_MN
H2 NB_GFX_TX8N_C_MN
J1 NB_GFX_TX9N_C_MN
K3 NB_GFX_TX10N_C_MN
K2 NB_GFX_TX11N_C_MN
M3 NB_GFX_TX12N_C_MN
M2 NB_GFX_TX13N_C_MN
N1 NB_GFX_TX14N_C_MN
P2 NB_GFX_TX15N_C_MN

C107
C99
C106
C101
C109
C96
C108
C98
C112
C100
C114
C105
C81
C75
C77
C78
C120
C104
C113
C102
C116
C103
C115
C97
C111
C95
C110
C73
C82
C74
C79
C80

100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF

6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V

AC1NB_GPP_TX0P_C_MN
AC2NB_GPP_TX0N_C_MN
AB4 NB_GPP_TX1P_C_MN
AB3 NB_GPP_TX1N_C_MN
AA2 NB_GPP_TX2P_C_MN
AA1 NB_GPP_TX2N_C_MN
Y1
Y2
Y4
Y3
V1
V2

C54
C53
C583
C582
C52
C76

100nF
100nF
100nF
100nF
100nF
100nF

10V
10V
10V
10V
10V
10V

C60
C57
C585
C56

100nF
100nF
100nF
100nF

10V
10V
10V
10V

0
1
2
3

AE7 NB_SB_TX0N_C_MN
AD6 NB_SB_TX1N_C_MN
AC6 NB_SB_TX2N_C_MN
AE5 NB_SB_TX3N_C_MN

C59
C58
C584
C55

100nF
100nF
100nF
100nF

10V
10V
10V
10V

0
1
2
3

AB8 NB_PCE_CALRN_R_MN
AC8 NB_PCE_CALRP_R_MN

PEG1_TXP(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

PEG1_TXN(15:0)

PEX1_MINI_TXP0
PEX1_MINI_TXN0
PEX1_EXPCARD_TXP1
PEX1_EXPCARD_TXN1
PEX1_LAN_TXP2
PEX1_LAN_TXN2

AD7 NB_SB_TX0P_C_MN
AE6 NB_SB_TX1P_C_MN
AB6 NB_SB_TX2P_C_MN
AD5 NB_SB_TX3P_C_MN

0904-002536

RX780 / RD780 : 1.21K ohm (for S3 issue in D/T chipset)

EMI

CPU1_HTOUT#(15:0)

Y25
V22
V25
U24
T25
P22
P25
N24
AC24
AB25
AA24
Y22
W21
V21
U20
U19

2/5

GFX_TX0P
GFX_RX0P
GFX_TX1P
GFX_RX1P
GFX_TX2P
GFX_RX2P
GFX_TX3P
GFX_RX3P
GFX_TX4P
GFX_RX4P
GFX_TX5P
GFX_RX5P
GFX_TX6P
GFX_RX6P
GFX_TX7P
GFX_RX7P
GFX_TX8P
GFX_RX8P
GFX_TX9P
GFX_RX9P
GFX_TX10P
GFX_RX10P
GFX_TX11P
GFX_RX11P
GFX_TX12P
GFX_RX12P
GFX_TX13P
GFX_RX13P
GFX_TX14P
GFX_RX14P
GFX_TX15P
GFX_RX15P
PCIE
I/F
GFX
GFX_TX0N
GFX_RX0N
GFX_TX1N
GFX_RX1N
GFX_TX2N
GFX_RX2N
GFX_TX3N
GFX_RX3N
GFX_TX4N
GFX_RX4N
GFX_TX5N
GFX_RX5N
GFX_TX6N
GFX_RX6N
GFX_TX7N
GFX_RX7N
GFX_TX8N
GFX_RX8N
GFX_TX9N
GFX_RX9N
GFX_TX10N
GFX_RX10N
GFX_TX11N
GFX_RX11N
GFX_TX12N
GFX_RX12N
GFX_TX13N
GFX_RX13N
GFX_TX14N
GFX_RX14N
GFX_TX15N
GFX_RX15N

R627
R584

2K
1.24K

PEX1_SB_RXP(3:0)

PEX1_SB_RXN(3:0)

P1.1V

1%
1%

AMD recommended
1608, 1.27k ohm
(2007-007669)

EMI1

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

HYPER TRANSPORT CPU I/F

CPU1_HTOUT(15:0)

260118-1

U6-1
RX881

U6-2
RX881

D4
A3
C2
E5
G5
H5
J6
J7
L5
M8
P7
P5
R8
R6
P4
T4
C4
B3
C1
F5
G6
H6
J5
J8
L6
L8
M7
M5
P8
R5
P3
T3

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

MCH
PART NO.

RX881 (1/3)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

13

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

NB_ RX881_AMD
D

U6-3
RX881

6.3V

1K
0-1005
1K
nostuff

A12
D14
B12

H17

NB_VDDA18HTPLL_B_MN

D7
E7

NB_VDDA18PCIEPLL_B_MN

NB_SYSRESET#_R_MN

NB_POWERGOOD_R_MN

CPU1_LDTSTP#
CPU1_LDTREQ#
CPU1_ALL_LDTSTP
CLK0_HTT
CLK0_HTT#

NB_ALLOW_LDTSTOP_R_MN

1K
0-1005

R663
SMT503

D8
A10
C10
C12
C25
C24
E11

P1.1V

NB_REFCLK_N_PWM_GPIO3_R_MN F11

CLK1_NBGFX
CLK1_NBGFX#

R656

T2
T1

U1
U2

4.7K
5%

CLK1_SBLINK
CLK1_SBLINK#

R657
4.7K
5%

2200nF-X5R

10V

C705

20%

nostuff
R654
SMT502
R659

B505
B504
2200nF-X5R

C712

1
S

CPU1_LDTRST#
PLT3_RST#
CHP3_NB_PWRGD

715 1%

P1.8V

10V

C709
22000nF-X5R

NB_NC_9_R_MN G14

R661

60V

V4
V3
B9
A9
A8
B8
B7
A7

B10

G11

NB_NC_16_R_MN C8

R655

P3.3V

P3.3V

R664

R660

1K
1%

1K
1%

R684

R658 nostuff

DBG3_HSYNC

AB12
AE16
V11
AE15
AA12
AB16
AB14
AD14
AD13
AD15
AC16
AE13
AC14
Y14

4/5

NC_39
NC_40
NC_41
NC_42
NC_43
NC_44
NC_45
NC_46
NC_47
NC_48
NC_49
NC_50
NC_51
NC_52

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
A11
B11
F8
E8

DBG3_HSYNC
DBG3_VSYNC

U6-4
RX881

B18
A18
A17
B17
D20
D21
D18
D19

NC_4
VSS35
NC_5
VSS36
NC_6
VSS37

NC_33
NC_34
NC_35
NC_36

DAC_HSYNC_PWM_GPIO4
DAC_VSYNC_PWM_GPIO6
NC_7
NC_8
NC_9

PLLVDD_NC
PLLVDD18_NC
PLLVSS_NC

VDDA18HTPLL

VDDA18PCIEPLL1
VDDA18PCIEPLL2

SYSRESET#
POWERGOOD
LDTSTOP#
ALLOW_LDTSTOP

VDDLTP18_NC
VSSLTP18_NC

VDDLT18_1_NC
VDDLT18_2_NC
VDDLT33_1_NC
VDDLT33_2_NC
VSSLT1_VSS
VSSLT2_VSS
VSSLT3_VSS
VSSLT4_VSS
VSSLT5_VSS
VSSLT6_VSS
VSSLT7_VSS

B16
A16
D16
D17

A13
B13

AD16
AE17
AD17

A15
B15
A14
B14

W12
Y12
AD18
AB13
AB18
V14

C14
D15
C16
C18
C20
E20
C22

nostuff

R585

HT_REFCLKP
HT_REFCLKN

REFCLK_P_OSCIN_OSCIN
REFCLK_N_PWM_GPIO3
GFX_REFCLKP
GFX_REFCLKN

GPIO3
GPIO2
GPIO4

E9
F7
G12

V15
W14

40.2
AE12
1% NB_NC_64_R_MNAD12

P1.8V

R586

40.2
1%

NC_66
NC_67
NC_68
NC_69
NC_70
NC_71
NC_72
NC_73
NC_74
NC_75
NC_76
NC_77
NC_78
NC_79
NC_80
NC_81

SBD_MEM / DVO_I/F

A22
B22
A21
B21
B20
A20
A19
B19

NB_NC_65_R_MN

RHU002N06
Q523
60V

NC_25
NC_26
NC_27
NC_28
NC_29
NC_30
NC_31
NC_32

LVTM

G18
G17
E18
F18
E19
F19

NC_1
NC_2
NC_3

PLL PWR

KBC3_PWRGD

1K NB_NC_1_R_MN E17
F17
1%
F15

1K 1%

NB_KBC3_PWRGD_Q_MN

RHU002N06
Q524

R665

R682

10K
1%

PM

R683

NC_17
NC_18
NC_19
NC_20
NC_21
NC_22
NC_23
NC_24

AVDD1_NC
AVDD2_NC
AVDDDI_NC
AVSSDI_NC
AVDDQ_NC
AVSSQ_NC

CRT / TVOUT

P1.8V

3/5

CLOCKs

P3.3V

F12
E12
F14
G15
H15
H14

NC_53
NC_54
NC_55

NC_82
NC_83
NC_84
NC_85

NC_56
NC_57
NC_58
NC_59
NC_60
NC_61

NC_86
NC_87

IOPLLVDD18_NC
IOPLLVDD_NC

NC_62
NC_63

IOPLLVSS_NC

NC_64
NC_65

MEM_VREF_NC

AA18
AA20
AA19
Y19
V17
AA17
AA15
Y15
AC20
AD19
AE22
AC18
AB20
AD22
AC22
AD21
Y17
W18
AD20
AE21

C
P1.1V

P1.8V

W17
AE19
AE23 NB_IOPLLVDD18_NC_B_MN
AE24
AD23

C63
2200nF-X5R

AE18

10V

nostuff

0904-002536

GPP_REFCLKP
GPP_REFCLKN

GPPSB_REFCLKP_SB_REFCLKP
GPPSB_REFCLKN_SB_REFCLKN

NC_10
NC_11
NC_12
NC_13
NC_14
NC_15

MIS.

NC_37
NC_38

SUS_STAT#_PWM_GPIO5

THERMALDIODE_P
THERMALDIODE_N

STRP_DATA

TESTMODE

D9
D10

D12

CHP3_SUSSTAT#

AE8
AD8

P1.8V

D13 NB_TESTMODE_R_MN

RSVD

NC_16

0904-002536

150
1%

R662

R688

1.91K
1%

1K 1%

CPU1_ALL_LDTSTP

1.8k ohm

DBG3_VSYNC
1K
1%

1K
1%

A
DRAW

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

0.1

ELECTRONICS

MCH
PART NO.

RX881 (2/3)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

14

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

NB_ RX881_AMD
P1.1V

P1.1V

C714

C640

4700nF-X5R
25V

100nF
10V

100nF
10V

100nF
10V

C
C716

C717

10000nF-X5R 100nF
6.3V
10V

C715

C718

100nF
10V

100nF
10V

P1.2V

C64

C642

C645

C588

C644

4700nF-X5R
25V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

P1.8V

B6
BLM18PG181SN1
NB_VDDA18PCIE_B_MN

C62

4700nF-X5R
25V

C61
4700nF-X5R
25V

C631

C632

C586

100nF
10V

100nF
10V

100nF
10V

P1.8V

C708
1000nF-X5R
6.3V

J17
K16
L16
M16
P16
R16
T16

C704

C121

1000nF-X5R
6.3V

1000nF-X5R
6.3V

4700nF-X5R
25V

C638

C633

C587

C637

C641

C639

100nF
10V

10000nF-X5R
6.3V

10000nF-X5R
6.3V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

H18
G19
F20
E21
D22
B23
A23
AE25
AD24
AC23
AB22
AA21
Y20
W19
V18
U17
T17
R17
P17
M17
J10
P10
K10
M10
L10
W9
H9
T10
R10
Y9
AA9
AB9
AD9
AE9
U10
F9
G9
AE11
AD11

5/5

VDDHT_1
VDDHT_2
VDDHT_3
VDDHT_4
VDDHT_5
VDDHT_6
VDDHT_7

VDDPCIE_1
VDDPCIE_2
VDDPCIE_3
VDDPCIE_4
VDDPCIE_5
VDDPCIE_6
VDDPCIE_7
VDDPCIE_8
VDDPCIE_9
VDDPCIE_10
VDDPCIE_11
VDDPCIE_12
VDDPCIE_13
VDDPCIE_14
VDDPCIE_15
VDDPCIE_16
VDDPCIE_17

VDDHTRX_1
VDDHTRX_2
VDDHTRX_3
VDDHTRX_4
VDDHTRX_5
VDDHTRX_6
VDDHTRX_7

VDDHTTX_1
VDDHTTX_2
VDDHTTX_3
VDDHTTX_4
VDDHTTX_5
VDDHTTX_6
VDDHTTX_7
VDDHTTX_8
VDDHTTX_9
VDDHTTX_10
VDDHTTX_11
VDDHTTX_12
VDDHTTX_13

POWER

C643

C630

100nF
10V

C634

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
U6-5
RX881

C713

C707

100nF
10V

C635
100nF
10V

VDDA18PCIE_1
VDDA18PCIE_2
VDDA18PCIE_3
VDDA18PCIE_4
VDDA18PCIE_5
VDDA18PCIE_6
VDDA18PCIE_7
VDDA18PCIE_8
VDDA18PCIE_9
VDDA18PCIE_10
VDDA18PCIE_11
VDDA18PCIE_12
VDDA18PCIE_13
VDDA18PCIE_14
VDDA18PCIE_15

VDD18_1
VDD18_2
VDD18_MEM1_NC
VDD18_MEM2_NC

VDDC_1
VDDC_2
VDDC_3
VDDC_4
VDDC_5
VDDC_6
VDDC_7
VDDC_8
VDDC_9
VDDC_10
VDDC_11
VDDC_12
VDDC_13
VDDC_14
VDDC_15
VDDC_16
VDDC_17
VDDC_18
VDDC_19
VDDC_20
VDDC_21
VDDC_22

VDD_MEM1_NC
VDD_MEM2_NC
VDD_MEM3_NC
VDD_MEM4_NC
VDD_MEM5_NC
VDD_MEM6_NC

VDD33_1_NC
VDD33_2_NC

A6
B6
C6
D6
E6
F6
G7
H8
J9
K9
M9
L9
P9
R9
T9
V9
U9

A25
D23
E22
G22
G24
G25
H19
J22
L17
L22
L24
L25
M20
N22
P20
R19
R22
R24
R25
H20
U22
V19
W22
W24
W25
Y21
AD25

K12
J14
U16
J11
K15
M12
L14
L11
M13
M15
N12
N14
P11
P13
P14
R12
R15
T11
T15
U12
T14
J16

L12
M14
N13
P12
P15
R11
R14
T12
U14
U11
U15
V12
W11
W15
AC12
AA14
Y18
AB11
AB15
AB17
AB19
AE20
AB21
K11

AE10
AA11
Y11
AD10
AB10
AC10
H11
H12

0904-002536

P3.3V

C711

C710

100nF
10V

100nF
10V

VSSAHT1
VSSAHT2
VSSAHT3
VSSAHT4
VSSAHT5
VSSAHT6
VSSAHT7
VSSAHT8
VSSAHT9
VSSAHT10
VSSAHT11
VSSAHT12
VSSAHT13
VSSAHT14
VSSAHT15
VSSAHT16
VSSAHT17
VSSAHT18
VSSAHT19
VSSAHT20
VSSAHT21
VSSAHT22
VSSAHT23
VSSAHT24
VSSAHT25
VSSAHT26
VSSAHT27

VSSAPCIE1
VSSAPCIE2
VSSAPCIE3
VSSAPCIE4
VSSAPCIE5
VSSAPCIE6
VSSAPCIE7
VSSAPCIE8
VSSAPCIE9
VSSAPCIE10
VSSAPCIE11
VSSAPCIE12
VSSAPCIE13
VSSAPCIE14
VSSAPCIE15
VSSAPCIE16
VSSAPCIE17
VSSAPCIE18
VSSAPCIE19
VSSAPCIE20
VSSAPCIE21
VSSAPCIE22
VSSAPCIE23
VSSAPCIE24
VSSAPCIE25
VSSAPCIE26
VSSAPCIE27
VSSAPCIE28
VSSAPCIE29
VSSAPCIE30
VSSAPCIE31
VSSAPCIE32
VSSAPCIE33
VSSAPCIE34
VSSAPCIE35
VSSAPCIE36
VSSAPCIE37
VSSAPCIE38
VSSAPCIE39
VSSAPCIE40

GROUND

P1.1V

C706

C636
100nF
10V

VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10

A2
B1
D3
D5
E4
G1
G2
G4
H7
J4
R7
L1
L2
L4
L7
M6
N4
P6
R1
R2
R4
V7
U4
V8
V6
W1
W2
W4
W7
W8
Y6
AA4
AB5
AB1
AB7
AC3
AC4
AE1
AE4
AB2

AE14
D11
G8
E14
E15
J15
J12
K14
M11
L15

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

MCH
PART NO.

RX881 (3/3)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

15

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DDR SO-DIMM #0

D
Array resistors & Single resistors used to improve layout & routing.

ME POWER RAIL UNDER ME ENABLE

MEM1_ADQ(63:0)

P1.8V_AUX

P0.9V_AUX

DDR1-2
DDR2-SODIMM-200P-RVS

MEM1_AMA(15:0)

2/2
DDR1-1
DDR2-SODIMM-200P-RVS
MEM1_AMA(15:0)

1/2
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

MEM1_ABS(2)

107
106

MEM1_ABS(0)
MEM1_ABS(1)

110
115

MEM1_CS0#
MEM1_CS1#
CLK1_MCLK0

30
32
164
166
79
80

0.0015nF

CLK1_MCLK0#
CLK1_MCLK1

50V
C721
C592
0.0015nF 50V

CLK1_MCLK1#

MEM1_CKE0
MEM1_CKE1

113
108
109

MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#

R567
R566

10K 1%
10K 1%

MEM0_SA0_R_MN198
MEM0_SA1_R_MN200

197
195

SMB3_CLK
SMB3_DATA

MEM1_ODT0
MEM1_ODT1
MEM1_ADM(7:0)

MEM1_ADQS(7:0)

MEM1_ADQS#(7:0)

102
101
100
99
98
97
94
92
93
91
105
90
89
116
86
84
85

114
119
0
1
2
3
4
5
6
7

10
26
52
67
130
147
170
185

0
1
2
3
4
5
6
7

13
31
51
70
131
148
169
188

0
1
2
3
4
5
6
7

11
29
49
68
129
146
167
186

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15
A16_BA2
BA0
BA1
S0*
S1*
CK0
CK0*
CK1
CK1*
CKE0
CKE1
CAS*
RAS*
WE*
SA0
SA1
SCL
SDA
ODT0
ODT1
DM0
DM1
DM2
DM3
DM4
DM5
DM6
DM7
DQS0
DQS1
DQS2
DQS3
DQS4
DQS5
DQS6
DQS7
DQS*0
DQS*1
DQS*2
DQS*3
DQS*4
DQS*5
DQS*6
DQS*7

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63

5
7
17
19
4
6
14
16
23
25
35
37
20
22
36
38
43
45
55
57
44
46
56
58
61
63
73
75
62
64
74
76
123
125
135
137
124
126
134
136
141
143
151
153
140
142
152
154
157
159
173
175
158
160
174
176
179
181
189
191
180
182
192
194

112
111
117
96
95
118
81
82
87
103
88
104

P1.8V_AUX

VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12

VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57

18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162

0
1
2
3

R601
R596
R599
R589

47
47
47
47

4
5
6
7

R603
R631
R639
R604

47
47
47
47

8
9
10
11

R595
R635
R597
R640

47
47
47
47

12
13
14
15

R632
R598
R637
R636

47
47
47
47

R605
R591

47
47

R634
R638

47
47

R606
R593

47
47

R592
R602
R633

47
47
47

R590
R600
R594

47
47
47

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

P3.3V

199

C553

C554

100nF
10V

83

2200nF-X5R 120
10V
50

69
163

MCH3_EXTTS0#
MEM1_VREF1

C831

C830

100nF
10V

201
202

1nF
50V

47
133
183
77
12
48
184
78
71
72
121
122
196
193
8

P1.8V_AUX

R694
1K
1%

MEM1_VREF1

VDDSPD
NC1
NC2
NC3
NC4
NCTEST
VREF

GND0
GND1

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15

R693
1K
1%

MEM1_CS0#
MEM1_CS1#

MEM1_CKE0
MEM1_CKE1

MEM1_ODT0
MEM1_ODT1

MEM1_ABS(0)
MEM1_ABS(1)
MEM1_ABS(2)

3709-001341

MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#

100nF
C616
10V

C615
100nF
10V
100nF
C688
10V

C686
100nF
10V
100nF
C683
10V

P1.8V_AUX

C613

100nF
10V
100nF
C611
10V

P1.8V_AUX

C689
100nF
10V

P1.8V_AUX
100nF
C681
10V

C684
100nF
10V

P1.8V_AUX
100nF
C609
10V

C608
100nF
10V
100nF
C614
10V

P1.8V_AUX

C612
100nF
10V
100nF
C617
10V

P1.8V_AUX

C610
100nF
10V

Place close to MEMORY

ME POWER RAIL UNDER ME ENABLE

P1.8V_AUX

Place one cap close to every 2 pull-up resistors terminated to P0.9V_AUX

Place near SO-DIMM0

P0.9V_AUX

XC500
330uF C606
2.5V
OXI

C672

C596

C607

C598

C679

2200nF-X5R2200nF-X5R2200nF-X5R2200nF-X5R2200nF-X5R100nF
10V
10V
10V
10V
10V
10V

C599

C605

C597

100nF
10V

100nF
10V

100nF
10V

nostuff

C697

C698

C687

C691

C690

C695

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

nostuff

P3.3V

A
R676

3709-001341

R677

1%
10K
1%
10K

MCH3_EXTTS0#

DRAW

XIE BIN

MCH3_EXTTS1#

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

GUO LEI

0.1

ELECTRONICS

SODIMM_DDR2
SODIMM_DDR2 (1/2)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

P1.8V_AUX

PAGE

16

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DDR SO-DIMM #1

D
Array resistors & Single resistors used to improve layout & routing.

MEM1_BDQ(63:0)

P1.8V_AUX

P0.9V_AUX

DDR2-2
DDR2-SODIMM-200P-RVS

MEM1_BMA(15:0)

2/2
DDR2-1
DDR2-SODIMM-200P-RVS

1/2

MEM1_BMA(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

MEM1_BBS(2)

107
106

MEM1_BBS(0)
MEM1_BBS(1)

110
115

MEM1_CS2#
MEM1_CS3#
CLK1_MCLK2

C779
C594

CLK1_MCLK3#

30
32
164
166
79
80

50V

0.0015nF

CLK1_MCLK2#
CLK1_MCLK3

0.0015nF

50V

MEM1_CKE2
MEM1_CKE3

113
108
109

MEM1_BCAS#
MEM1_BRAS#
MEM1_BWE#

P3.3V
R35
R36

10K
10K

1%
1%

MEM1_SA0_R_MN198
MEM1_SA1_R_MN200

197
195

SMB3_CLK
SMB3_DATA

MEM1_ODT2
MEM1_ODT3
MEM1_BDM(7:0)

MEM1_BDQS(7:0)

MEM1_BDQS#(7:0)

102
101
100
99
98
97
94
92
93
91
105
90
89
116
86
84
85

114
119
0
1
2
3
4
5
6
7

10
26
52
67
130
147
170
185

0
1
2
3
4
5
6
7

13
31
51
70
131
148
169
188

0
1
2
3
4
5
6
7

11
29
49
68
129
146
167
186

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15
A16_BA2
BA0
BA1
S0*
S1*
CK0
CK0*
CK1
CK1*
CKE0
CKE1
CAS*
RAS*
WE*
SA0
SA1
SCL
SDA
ODT0
ODT1
DM0
DM1
DM2
DM3
DM4
DM5
DM6
DM7
DQS0
DQS1
DQS2
DQS3
DQS4
DQS5
DQS6
DQS7
DQS*0
DQS*1
DQS*2
DQS*3
DQS*4
DQS*5
DQS*6
DQS*7

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63

5
7
17
19
4
6
14
16
23
25
35
37
20
22
36
38
43
45
55
57
44
46
56
58
61
63
73
75
62
64
74
76
123
125
135
137
124
126
134
136
141
143
151
153
140
142
152
154
157
159
173
175
158
160
174
176
179
181
189
191
180
182
192
194

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

112
111
117
96
95
118
81
82
87
103
88
104

VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12

VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57

10V
100nFC604

18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162

0
1
2
3

R622
R615
R621
R610

47
47
47
47

4
5
6
7

R616
R611
R648
R617

47
47
47
47

8
9
10
11

R643
R641
R608
R650

47
47
47
47

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V

199

C551

100nF
10V

C552

VDDSPD

83

NC1
NC2
NC3
NC4
NCTEST

2200nF-X5R 120
10V
50

69
163

MCH3_EXTTS1#
MEM1_VREF1

C781

100nF
10V

C780
1nF
50V

VREF

201
202

GND0
GND1

47
133
183
77
12
48
184
78
71
72
121
122
196
193
8

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15

12
13
14
15

MEM1_CS2#
MEM1_CS3#

MEM1_CKE2
MEM1_CKE3

MEM1_ODT2
MEM1_ODT3

MEM1_BBS(0)
MEM1_BBS(1)
MEM1_BBS(2)

3709-001390

MEM1_BCAS#
MEM1_BRAS#
MEM1_BWE#

R642
R618
R649
R647

47
47
47
47

R619
R612

47
47

R645
R646

47
47

R620
R607

47
47

R613
R624
R644

47
47
47

R609
R623
R614

47
47
47

C623
100nF
10V

10V
100nFC622

P1.8V_AUX

C678
100nF
10V

10V
100nFC600

P1.8V_AUX

C693
100nF
10V

C
10V
100nFC677

P1.8V_AUX

C696
100nF
10V
10V
100nFC694

P1.8V_AUX

C602
100nF
10V

10V
100nFC626

P1.8V_AUX

C601
100nF
10V
10V
100nFC625

P1.8V_AUX

C624
100nF
10V

10V
100nFC603

P1.8V_AUX

C674
100nF
10V

Place one cap close to every 2 pull-up resistors terminated to P0.9V_AUX

P1.8V_AUX

Place near SO-DIMM1

P0.9V_AUX

XC501
330uF C619
2.5V
OXI

nostuff

C699

C692

C629

C620

C618 C621 C627 C628

2200nF-X5R2200nF-X5R2200nF-X5R2200nF-X5R2200nF-X5R100nF
10V
10V
10V
10V
10V
10V

100nF
10V

100nF
10V

100nF
10V

C680

C673

C675

C685

100nF
10V

100nF
10V

100nF
10V

100nF
10V

C682

C676

100nF
10V

100nF
10V

nostuff

nostuff

A
DRAW

3709-001390

DATE

XIE BIN
CHECK

APPROVAL

08/18/2009
ADV
REV

BC LEE
MODULE CODE

TITLE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

0.1

ELECTRONICS

SODIMM_DDR2
SODIMM_DDR2 (2/2)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

P1.8V_AUX

PAGE

17

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SB_710_AMD
U516-1
SB710

1000nF-X5R
6.3V

SB_PCIE_CALRN_R_MN

P24

PCIE_PVDD

P25

PCIE_PVSS

N25
N24

CLK1_SBSRC
CLK1_SBSRC#

PCIE_RCLKP_NB_LNK_CLKP
PCIE_RCLKN_NB_LNK_CLKN

K23
K22

NB_DISP_CLKP
NB_DISP_CLKN

M24
M25

NB_HT_CLKP
NB_HT_CLKN

P17
M18

CPU_HT_CLKP
CPU_HT_CLKN

M23
M22

SLT_GFX_CLKP
SLT_GFX_CLKN

J19
J18

GPP_CLK0P
GPP_CLK0N

L20
L19

GPP_CLK1P
GPP_CLK1N

M19
M20

GPP_CLK2P
GPP_CLK2N

N22
P22

GPP_CLK3P
GPP_CLK3N

L18

CLK3_SB14

14M_X1

J20

C1026
0.01nF

0.01nF

X1

B3

X2

2801-003856

Y504
0.032768MHz

CPU1_ALL_LDTSTP
CPU1_PROCHOT#
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_LDTRST#

F23
F24
F22
G25
G24

ALLOW_LDTSTP
PROCHOT#
LDT_PG
LDT_STP#
LDT_RST#

RTC

A3

20M
3

C1013

SB_X2_C_MN

R844

14M_X2

CPU

SB_X1_C_MN

INTE#_GPIO33
INTF#_GPIO34
INTG#_GPIO35
INTH#_GPIO36

25M_48M_66M_OSC

J21

N1
U2
P7
V4
T1
V3
U1
V1
V2
T2
W1
T9
R6
R7
R5
U8
U5
Y7
W8
V9
Y8
AA8
Y4
Y3
Y2
AA2
AB4
AA1
AB3
AB2
AC1
AC2
AD1
W2
U7
AA7
Y1
AA6
W5
AA5
Y5
U6
W6
W4
V7
AC3
AD4
AB7
AE6
AB6
AD2
AE4
AD5
AC6
AE5
AD6
V5

LPCCLK0
LPCCLK1
LAD0
LAD1
LAD2
LAD3
LFRAME#
LDRQ0#
LDRQ1#_GNT5#_GPIO68
BMREQ#_REQ5#_GPIO65
SERIRQ
RTCCLK
INTRUDER_ALERT#
VBAT

KBC3_RCIN#
KBC3_A20G

PCI3_AD23
PCI3_AD24
PCI3_AD25
PCI3_AD26
PCI3_AD27
PCI3_AD28

C3
C2
B2

R176

10K

R174

10K 1%

1%

nostuff

RTC BATTERY

P3.3V

R877

For BIOS Upgrade Select:

PU For Suzhou-D
PD For Bremen-D

R298

CHP3_INTRUDER#

P3.3V_MICOM

PRTC_BAT

nostuff
nostuff

10K
1%

1M

C347

CHP3_RTCRST#_R_MN

1000nF-X5R

CHP3_RTCRST#_RD_MN

R878

10K
1%

R296

CHP3_RTCRST#

C166

1000nF-X5R

PCI3_CLKRUN#

R240
R247
LPC3_LAD(3:0)

SB_LPCCLK0_R_MN
SB_LPCCLK1_R_MN

0
1
2
3

R300

510

C346

C345

100nF
10V

1000nF-X5R
25V

22
22

3711-000541

For RTC Reset

Place under Memory Door

LPC3_CLK0
LPC3_CLK1

LPC3_LFRAME#

CHP3_SERIRQ
DRAW

CHP3_RTCCLK
CHP3_INTRUDER#
CHP3_RTCRST#

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

GUO LEI

0.1

ELECTRONICS

ICH
PART NO.

SB710 (1/5)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

1%
1
2
MNT1
MNT2

nostuff

0904-002534

J519
HDR-2P-SMD

1K
3
4

1%

1608

AD3
AC4
AE2
AE3

G22
E22
H24
H23
J25
J24
H25
H22
AB8
AD7
V15

P3.3V

50V

C235

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

PCIE_CALRP
PCIE_CALRN

SB_PCIE_PVDD_B_MN

C996
2200nF-X5R
10V

C249

T25
T24

CLK3_PCLKMICOM
CLK3_DBGLPC
PCI3_CLK2
PCI3_CLK3
PCI3_CLK4
PCI3_CLK5

BAT54C
D11

2.2K
R834
B532
BLM18PG181SN1
2.05k ohm

SB_PCIE_CALRP_R_MN

1%
1%
1%
1%
1%
1%

1608

562
1%

22.6
22.6
22.6
22.6
22.6
22.6

30V

R833

AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31
CBE0#
CBE1#
CBE2#
CBE3#
FRAME#
DEVSEL#
IRDY#
TRDY#
PAR
STOP#
PERR#
SERR#
REQ0#
REQ1#
REQ2#
REQ3#_GPIO70
REQ4#_GPIO71
GNT0#
GNT1#
GNT2#
GNT3#_GPIO72
GNT4#_GPIO73
CLKRUN#
LOCK#

R161
R162
R200
R198
R186
R187

SB_PCICLK0_R_MN
SB_PCICLK1_R_MN
SB_PCICLK2_R_MN
SB_PCICLK3_R_MN
SB_PCICLK4_R_MN
SB_PCICLK5_R_MN

P1.2V

PCIE_RX0P
PCIE_RX0N
PCIE_RX1P
PCIE_RX1N
PCIE_RX2P
PCIE_RX2N
PCIE_RX3P
PCIE_RX3N

PCIRST#

P4
P3
P1
P2
T4
T3

0.022nF
5%
0.022nF
5%

PCIE_TX0P
PCIE_TX0N
PCIE_TX1P
PCIE_TX1N
PCIE_TX2P
PCIE_TX2N
PCIE_TX3P
PCIE_TX3N

U22
U21
U19
V19
R20
R21
R18
R17

PEX1_SB_RXP(0)
PEX1_SB_RXN(0)
PEX1_SB_RXP(1)
PEX1_SB_RXN(1)
PEX1_SB_RXP(2)
PEX1_SB_RXN(2)
PEX1_SB_RXP(3)
PEX1_SB_RXN(3)

V23
V22
V24
V25
U25
U24
T23
T22

PCICLK0
PCICLK1
PCICLK2
PCICLK3
PCICLK4
PCICLK5_GPIO41

50V

SB_PCIE_TX0P_C_MN
SB_PCIE_TX0N_C_MN
SB_PCIE_TX1P_C_MN
SB_PCIE_TX1N_C_MN
SB_PCIE_TX2P_C_MN
SB_PCIE_TX2N_C_MN
SB_PCIE_TX3P_C_MN
SB_PCIE_TX3N_C_MN

PCI CLKS

10V
10V
10V
10V
10V
10V
10V
10V

PCI INTERFACE

PEX1_SB_TXP(0)
PEX1_SB_TXN(0)
PEX1_SB_TXP(1)
PEX1_SB_TXN(1)
PEX1_SB_TXP(2)
PEX1_SB_TXN(2)
PEX1_SB_TXP(3)
PEX1_SB_TXN(3)

100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF

CLOCK GENERATOR

C254
C253
C219
C246
C248
C247
C251
C252

1/5

A_RST#

33 1%

LPC

R194

P1.2V

N2

SB_A_RST#_R_MN

PLT3_RST#

C234

100K
1%

PCI EXPRESS INTERFACE

0.1nF
50V

RTC XTAL

C952

R204

PAGE

18

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SB_710_AMD
Rout to connector side closely

U516-2
SB710

SATA1_ODD_TXP1
SATA1_ODD_TXN1

25V
25V

C975
C974

10nF
10nF

25V
25V

C218
C217

10nF
10nF

25V
25V

C214
C213

10nF
10nF

25V
25V

SB_SATA_RX0P_C_MN AC10
SB_SATA_RX0N_C_MN AB10
SB_SATA_TX1P_C_MN AE10
SB_SATA_TX1N_C_MN AD10
SB_SATA_RX1P_C_MN AE11
SB_SATA_RX1N_C_MN AD11

SATA_TX1P
SATA_TX1N
SATA_RX1P
SATA_RX1N

AD13
AE13
AC14
AB14
AE14
AD14
AE15
AD15
AB16
AC16
AD16
AE16

SATA_TX2P
SATA_TX2N

SATA_RX2P
SATA_RX2N
SATA_TX3P
SATA_TX3N

SATA_RX3P
SATA_RX3N
SATA_TX4P
SATA_TX4N

SATA_RX4P
SATA_RX4N
SATA_TX5P
SATA_TX5N

SPI ROM

AD12
AE12

C228

SATA_RX5P
SATA_RX5N

R177

2801-004517

Y5031
25MHz

R155
10M

1K
1%

SB_SATA_CAL_R_MN

V12

SB_SATA_X1_C_MN

Y12

SB_SATA_X2_C_MN AA12

C227

P3.3V

0.01nF

W11

FANOUT0_GPIO3
FANOUT1_GPIO48
FANOUT2_GPIO49

SATA_X1
SATA_X2

FANIN0_GPIO50
FANIN1_GPIO51
FANIN2_GPIO52

SATA_ACT#_GPIO67

C972

2200nF-X5R
10V

B20
BLM18PG181SN1

SB_PLLVDD_SATA_B_MN AA11

C229
100nF
10V

W12

PLLVDD_SATA

XTLVDD_SATA

SB_XTLVDD_SATA_B_MN

H/W MONITOR

CHP3_SATALED#
B19
BLM18PG181SN1

SATA PWR

10K
1%

P3.3V

SPI_DI_GPIO12
SPI_DO_GPIO11
SPI_CLK_GPIO47
SPI_HOLD#_GPIO31
SPI_CS#_GPIO32

SATA_CAL

R156

P1.2V

IDE_D0_GPIO15
IDE_D1_GPIO16
IDE_D2_GPIO17
IDE_D3_GPIO18
IDE_D4_GPIO19
IDE_D5_GPIO20
IDE_D6_GPIO21
IDE_D7_GPIO22
IDE_D8_GPIO23
IDE_D9_GPIO24
IDE_D10_GPIO25
IDE_D11_GPIO26
IDE_D12_GPIO27
IDE_D13_GPIO28
IDE_D14_GPIO29
IDE_D15_GPIO30

LAN_RST#_GPIO13
ROM_RST#_GPIO14

0.01nF

IDE_IORDY
IDE_IRQ
IDE_A0
IDE_A1
IDE_A2
IDE_DACK#
IDE_DRQ
IDE_IOR#
IDE_IOW#
IDE_CS1#
IDE_CS3#

TEMP_COMM
TEMPIN0_GPIO61
TEMPIN1_GPIO62
TEMPIN2_GPIO63
TEMPIN3_TALERT#_GPIO64

VIN0_GPIO53
VIN1_GPIO54
VIN2_GPIO55
VIN3_GPIO56
VIN4_GPIO57
VIN5_GPIO58
VIN6_GPIO59
VIN7_GPIO60
AVDD

C260
1000nF-X5R
6.3V

nostuff
nostuff

AA24
AA25
Y22
AB23
Y23
AB24
AD25
AC25
AC24
Y25
Y24

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AB12
AC12

SATA_TX0P
SATA_TX0N
SATA_RX0P
SATA_RX0N

SERIAL ATA

SATA1_ODD_RXP1
SATA1_ODD_RXN1

10nF
10nF

2/5

C261
100nF
10V

AVSS

AD24
AD23
AE22
AC22
AD21
AE20
AB20
AD19
AE19
AC20
AD20
AE21
AB22
AD22
AE23
AC23

G6
D2 SB_SPI_DO_R_MN
D1 SB_CLK_R_MN
F4 SB_HOLD#_R_MN
F3 SB_CS#_R_MN

R262
R263

12.1 1%
12.1 1%

R847

12.1 1%

C
P3.3V
10K
1%

C957
C973

AD9
AE9

ATA 66/100/133

SATA1_HDD_TXP0
SATA1_HDD_TXN0
SATA1_HDD_RXP0
SATA1_HDD_RXN0

SB_SATA_TX0P_C_MN
SB_SATA_TX0N_C_MN

SPI3_MISO
SPI3_MOSI
SPI3_CLK

R258

SPI3_CS0#

U15
J1
M8
M5
M7
P5
P8
R8

C6
B6
A6
A5
B5

A4
B4
C4
D4
D5
D6
A7
B7

THM3_ALERT#

P3.3V_AUX

F6

C306

G7

100nF
10V

0904-002534

P3.3V

R175

10K

1%

R157

10K

1%

A
CHP3_SERIRQ
DRAW

PCI3_CLKRUN#

XIE BIN
CHECK

08/18/2009

APPROVAL

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

LPC option ; These are used with LPC

TITLE

DATE

0.1

ELECTRONICS

ICH
PART NO.

SB710 (2/5)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

19

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SB_710_AMD

USB1, 6 : Right Port

USB0 : Left Port
USB5 : Bluetooth
USB8 : Camera
USB4 : 3-in-1
USB2 : eSATA

P3.3V

nostuff

KBC3_PWRGD
CHP3_SUSSTAT#
CHP3_SB_TEST2
P3.3V_AUX CHP3_SB_TEST1
CHP3_SB_TEST0
KBC3_A20G
KBC3_RCIN#
R195 KBC3_RUNSCI#
R260
10K
KBC3_EXTSMI#
10K
1%
R196

BIOS CRISIS RECOVER STRAP

10K
1%

P1.8V

PLACE NEAR KEYBOARD

MMBT3906LT1
-40V

70V

P3.3V_AUX

3
2

R255

10K 1%

R172

10K 1%

nostuff

70V

R251

D513
BAV99LT1

47nF

EXP3_CPPE#

R857

AE18
AD18
AA19
W17
V17
W20
W21
R173
AUD3_SPKR
AA18
10K
SMB3_CLK
W18
1%
SMB3_DATA
K1
K2
SB_DDC1_SCL_R_MN AA20
For Touchpad LED Select
SB_DDC1_SDA_R_MN Y18
For MICOM Select
C1
CHP3_RFOFF#
Y19
0
R848
G5

CHP3_BIOSWP#

SMB3_ALERT#

10K
1%

C305

B9
B8
A8
A9
E5
F8
E4

KBC3_WAKESCI#

C263

HDA3_AUD_SYNC
HDA3_MDC_SYNC
HDA3_AUD_RST#
HDA3_MDC_RST#

P3.3V_AUX
10K

SMB3_ALERT#

1K 1%

PEX3_WAKE#
R189

R184

4.7K

R151

10K

1%

R243

10K

1%

R171

2.2K

1%

nostuff

47
22.6
47
22.6

5%
1%
5%
1%

R183
R188
R192
R193

47
22.6
47
22.6

5%
1%
5%
1%

0.01nF
0.5pF
50V

USB3_OC#

SB_AZ_BITCLK_R_MN M1
SB_AZ_SDOUT_R_MN M2

HDA3_AUD_SDI0
HDA3_MDC_SDI1

J7
J8
SB_AZ_SDIN3_R_MN L8
M3
SB_AZ_SYNV_R_MN L6
SB_AZ_RST#_R_MN M4
L5
H19
H20
H21
F25

nostuff
nostuff
nostuff

D22
E24
E25
D23

SATA_IS0#_GPIO10
CLK_REQ3#_SATA_IS1#_GPIO6
SMARTVOLT_SATA_IS2#_GPIO4
CLK_REQ0#_SATA_IS3#_GPIO0
CLK_REQ1#_SATA_IS4#_FANOUT3_GPIO39
CLK_REQ2#_SATA_IS5#_FANIN3_GPIO40
SPKR_GPIO2
SCL0_GPOC0#
SDA0_GPOC1#
SCL1_GPOC2#
SDA1_GPOC3#
DDC1_SCL_GPIO9
DDC1_SDA_GPIO8
LLB#_GPIO66
SHUTDOWN#_GPIO5
DDR3_RST#_GEVENT7#

USB_OC6#_IR_TX1_GEVENT6#
USB_OC5#_IR_TX0_GPM5#
USB_OC4#_IR_RX0_GPM4#
USB_OC3#_IR_RX1_GPM3#
USB_OC2#_GPM2#
USB_OC1#_GPM1#
USB_OC0#_GPM0#
AZ_BITCLK
AZ_SDOUT
AZ_SDIN0_GPIO42
AZ_SDIN1_GPIO43
AZ_SDIN2_GPIO44
AZ_SDIN3_GPIO46
AZ_SYNC
AZ_RST#
AZ_DOCK_RST#_GPM8#

IMC_GPIO0
IMC_GPIO1
SPI_CS2#_IMC_GPIO2
IDE_RST#_F_RST#_IMC_GPO3
IMC_GPIO4
IMC_GPIO5
IMC_GPIO6
IMC_GPIO7

USB 2.0

IMC_GPIO8
IMC_GPIO9
IMC_PWM0_IMC_GPIO10
SCL2_IMC_GPIO11
SDA2_IMC_GPIO12
SCL3_LV_IMC_GPIO13
SDA3_LV_IMC_GPIO14
IMC_PWM1_IMC_GPIO15
IMC_PWM2_IMC_GPO16
IMC_PWM3_IMC_GPO17
IMC_GPIO18
IMC_GPIO19
IMC_GPIO20
IMC_GPIO21
IMC_GPIO22
IMC_GPIO23
IMC_GPIO24
IMC_GPIO25
IMC_GPIO26
IMC_GPIO27
IMC_GPIO28
IMC_GPIO29
IMC_GPIO30
IMC_GPIO31
IMC_GPIO32
IMC_GPIO33
IMC_GPIO34
IMC_GPIO35
IMC_GPIO36
IMC_GPIO37
IMC_GPIO38
IMC_GPIO39
IMC_GPIO40
IMC_GPIO41

CLK3_USB48

SB_USB_RCOMP_R_MN

1%

R249
11.8K

E6
E7
F7
E8
H11
J10
E11
F11
A11
B11
C10
D10
G11
H12
E12
E14
C12
D12
B12
A12
G12
G14
H14
H15
A13
B13
B14
A14

USB3_EXPCARD+
USB3_EXPCARDUSB3_CAMERA+
USB3_CAMERAUSB3_P6+
USB3_P6USB3_BT+
USB3_BTUSB3_MMC+
USB3_MMCUSB3_MINI1+
USB3_MINI1-

For USB port

C
USB3_P1+
USB3_P1USB3_P0+
USB3_P0-

A18
B18
F21
D21
F19
E20
E21
E19
D19
E18
G20
G21
D25
D24
C25
C24
B25
C23
B24
B23
A23
C22
A22
B22
B21
A21
D20
C20
A20
B20
B19
A19
D18
C18

For USB port

CHP3_GPIO16
CHP3_GPIO17

CHP3_BIOS_CRI#

0904-002534

P5.0V_AUX_C

2.2K

P3.3V

R202
R264
R203
R201

10K 1%
10K 1%
10K 1%

HDA3_AUD_BCLK
HDA3_MDC_BCLK
HDA3_AUD_SDO
HDA3_MDC_SDO

R180
R179
R178

2.2K

R835

R153

P3.3V_MICOM

4.7K

50V

R254

P3.3V

R152
10K
1%

D512
BAV99LT1

10K
1%

nostuff

KBC3_RSMRST#_QD_MN

KBC3_RSMRST#_QDD_MN

SB_RSMRST#_Q_MN

R259

nostuff

KBC3_RSMRST#_Q_MN

nostuff

CHP3_THRMTRIP#

CHP3_NB_PWRGD

KBC3_RSMRST#

nostuff

Q536

SB_SYS_RESET#_GPM7#_R_MN
SB_WAKE#_GEVENT8#_S_MN

INTEGRATED uC

1%

R846

PEX3_WAKE#

GPIO

301
1%

1%

USB OC

100

USB_FSD13P
USB_FSD13N
USB_FSD12P
USB_FSD12N
USB_HSD11P
USB_HSD11N
USB_HSD10P
USB_HSD10N
USB_HSD9P
USB_HSD9N
USB_HSD8P
USB_HSD8N
USB_HSD7P
USB_HSD7N
USB_HSD6P
USB_HSD6N
USB_HSD5P
USB_HSD5N
USB_HSD4P
USB_HSD4N
USB_HSD3P
USB_HSD3N
USB_HSD2P
USB_HSD2N
USB_HSD1P
USB_HSD1N
USB_HSD0P
USB_HSD0N

C8
G8

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R809

R256

HD AUDIO

( Put it a debugger connector)

USB 1.1

CHP3_SLPS3#
CHP3_SLPS5#
KBC3_PWRBTN#

nostuff

4/5
USBCLK_14M_25M_48M_OSC
USB_RCOMP

ACPI / WAKE UP EVENTS

CHP3_BIOS_CRI#
R237

PCI_PME#_GEVENT4#
RI#_EXTEVNT0#
SLP_S2_GPM9#
SLP_S3#
SLP_S5#
PWR_BTN#
PWR_GOOD
SUS_STAT#
TEST2
TEST1
TEST0
GA20IN_GEVENT0#
KBRST#_GEVENT1#
LPC_PME#_GEVENT3#
LPC_SMI#_EXTEVNT1#
S3_STATE_GEVENT5#
SYS_RESET#_GPM7#
WAKE#_GEVENT8#
BLINK_GPM6#
SMBALERT#_THRMTRIP#_GEVENT2#
NB_PWRGD
RSMRST#

USB MISC

U516-4
SB710
E1
E2
H7
F5
G1
H2
H1
K3
H5
H4
H3
Y15
W15
K4
K24
F1
J2
H6
F2
J6
W14
D3

INTEGRATED Uc

R236
10K

CHP3_SUSSTAT#

R30
27K

CHP3_BIOSWP#

nostuff

nostuff

USB3_OC#

AUD3_SPKR

R31
51.1K
1%

SMB3_DATA

A
DATE

DRAW

R154

2.2K

XIE BIN

SMB3_CLK

08/18/2009

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

PU : No Reboot Mode

TITLE

0.1

ELECTRONICS

ICH
PART NO.

SB710 (3/5)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

20

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SB_710_AMD

U516-5
SB710

P1.2V

B531
BLM18PG181SN1
C995

SB_PCIE_VDDR_B_MN

C997

C255

C250

C256

C257

22000nF-X5R 1000nF-X5R 1000nF-X5R 1000nF-X5R1000nF-X5R 100nF

20%
6.3V
6.3V
6.3V
6.3V
10V
6.3V

C245
100nF
10V

nostuff
P1.2V

B530
BLM18PG181SN1

SB_PCIE_AVDD_SATA_B_MN

C971

C223

C224

22000nF-X5R
20%
6.3V

1000nF-X5R
6.3V

1000nF-X5R 100nF
6.3V
10V

C226

C225
100nF
10V

B
P3.3V_AUX
B541
BLM18PG181SN1
C1023

SB_AVDDTX_B_MN

C1024

10000nF-X5R 10000nF-X5R
6.3V
6.3V

C296

C295

C297

1000nF-X5R 1000nF-X5R100nF
6.3V
6.3V
10V

C298

C299

100nF
10V

100nF
10V

P18
P19
P20
P21
R22
R24
R25
AA14
AA15
AA17
AB18
AC18
AD17
AE17
A16
B16
C16
D16
D17
E17
F15
F17
F18
G15
G17
G18

VDD33_18_1
VDD33_18_2
VDD33_18_3
VDD33_18_4

PCIE_VDDR_1
PCIE_VDDR_2
PCIE_VDDR_3
PCIE_VDDR_4
PCIE_VDDR_5
PCIE_VDDR_6
PCIE_VDDR_7

AVDD_SATA_1
AVDD_SATA_2
AVDD_SATA_3
AVDD_SATA_4
AVDD_SATA_5
AVDD_SATA_6
AVDD_SATA_7

AVDDTX_0
AVDDTX_1
AVDDTX_2
AVDDTX_3
AVDDTX_4
AVDDTX_5
AVDDRX_0
AVDDRX_1
AVDDRX_2
AVDDRX_3
AVDDRX_4
AVDDRX_5

C262

C1008

100nF
10V

100nF
10V

1000nF-X5R 1000nF-X5R 10000nF-X5R 10000nF-X5R

6.3V
6.3V
25V
25V

C1007

C1006

C994

C1009

22000nF-X5R
20%
6.3V

P1.2V

POWER

CKVDD_1.2V_1
CKVDD_1.2V_2
CKVDD_1.2V_3
CKVDD_1.2V_4
S5_3.3V_1
S5_3.3V_2
S5_3.3V_3
S5_3.3V_4
S5_3.3V_5
S5_3.3V_6
S5_3.3V_7

L21
L22
L24
L25

A17
A24
B17
J4
J5
L1
L2

USB_PHY_1.2V_1
USB_PHY_1.2V_2

G2
G4

C304

C294

100nF
10V

100nF
10V

C998

22000nF-X5R
20%
6.3V

P1.2V_AUX

C303

S5_1.2V_1
S5_1.2V_2

V5_VREF
AVDDCK_3.3V
AVDDCK_1.2V
AVDDC

A15
B15
C14
D8
D9
D11
D13
D14
D15
E15
F12
F14
G9
H9
H17
J9
J11
J12
J14
J15
K10
K12
K14
K15

P3.3V_AUX

C307

1000nF-X5R 1000nF-X5R
6.3V
6.3V

P1.2V_AUX

A10
B10

P3.3V

C302

C301

C1025

100nF
10V

100nF
10V

22000nF-X5R
20%
6.3V

P5.0V

AE7 SB_V5_VREF_R_MN
J16 SB_AVDDCK_3.3V_B_MN
K17 SB_AVDDCK_1.2V_B_MN
E9 SB_AVDDC_B_MN

R158

1K
1%

H18
J17
J22
K25
M16
M17
M21
P16

C233

1000nF-X5R
6.3V

P3.3V

P1.2V

B534
BLM18PG181SN1

F9

0904-002534

C1011

C1010

2200nF-X5R

2200nF-X5R

10V

10V

AVSS_USB_1
AVSS_USB_2
AVSS_USB_3
AVSS_USB_4
AVSS_USB_5
AVSS_USB_6
AVSS_USB_7
AVSS_USB_8
AVSS_USB_9
AVSS_USB_10
AVSS_USB_11
AVSS_USB_12
AVSS_USB_13
AVSS_USB_14
AVSS_USB_15
AVSS_USB_16
AVSS_USB_17
AVSS_USB_18
AVSS_USB_19
AVSS_USB_20
AVSS_USB_21
AVSS_USB_22
AVSS_USB_23
AVSS_USB_24
PCIE_CK_VSS_1
PCIE_CK_VSS_2
PCIE_CK_VSS_3
PCIE_CK_VSS_4
PCIE_CK_VSS_5
PCIE_CK_VSS_6
PCIE_CK_VSS_7
PCIE_CK_VSS_8
AVSSC

B535
BLM18PG181SN1

P3.3V_AUX

B540
BLM18PG181SN1

C300
100nF
10V

C1012
2200nF-X5R
10V

GROUND

Y20
AA21
AA22
AE25

C259

P3.3V

L15
M12
M14
N13
P12
P14
R11
R15
T16

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9

100nF
10V

CORE S0

C220

3.3V_S5 I/O CLKGEN I/O

C231
100nF
10V

CORE S5

C258

PLL

C236

PCI/GPIO I/O

C232

IDE/FLASH

C230

A-LINK I/O

C221

SATA I/O

C222

22000nF-X5R 1000nF-X5R 1000nF-X5R1000nF-X5R 1000nF-X5R 1000nF-X5R100nF

20%
6.3V
6.3V
6.3V
6.3V
6.3V
10V
6.3V

P1.2V

3/5

VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
VDDQ_10
VDDQ_11
VDDQ_12

USB I/O

C970

5/5

AVSS_SATA_1
AVSS_SATA_2
AVSS_SATA_3
AVSS_SATA_4
AVSS_SATA_5
AVSS_SATA_6
AVSS_SATA_7
AVSS_SATA_8
AVSS_SATA_9
AVSS_SATA_10
AVSS_SATA_11
AVSS_SATA_12
AVSS_SATA_13
AVSS_SATA_14
AVSS_SATA_15
AVSS_SATA_16
AVSS_SATA_17
AVSS_SATA_18
AVSS_SATA_19
AVSS_SATA_20

g
n
l
u
a
s
i
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m
n
a
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S fid
n
o
C

U516-3
SB710
L9
M9
T15
U9
U16
U17
V8
W7
Y6
AA4
AB5
AB21

30V
BAT54A
D511

P3.3V

T10
U10
U11
U12
V11
V14
W9
Y9
Y11
Y14
Y17
AA9
AB9
AB11
AB13
AB15
AB17
AC8
AD8
AE8

A2
A25
B1
D7
F20
G19
H8
K9
K11
K16
L4
L7
L10
L11
L12
L14
L16
M6
M10
M11
M13
M15
N4
N12
N14
P6
P9
P10
P11
P13
P15
R1
R2
R4
R9
R10
R12
R14
T11
T12
T14
U4
U14
V6
Y21
AB1
AB19
AB25
AE1
AE24

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47
VSS_48
VSS_49
VSS_50

P23
R16
R19
T17
U18
U20
V18
V20
V21
W19
W22
W24
W25

PCIE_CK_VSS_9
PCIE_CK_VSS_10
PCIE_CK_VSS_11
PCIE_CK_VSS_12
PCIE_CK_VSS_13
PCIE_CK_VSS_14
PCIE_CK_VSS_15
PCIE_CK_VSS_16
PCIE_CK_VSS_17
PCIE_CK_VSS_18
PCIE_CK_VSS_19
PCIE_CK_VSS_20
PCIE_CK_VSS_21

L17

AVSSCK

0904-002534

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

ICH
PART NO.

SB710 (4/5)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

21

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Strap
P3.3V_AUX

P3.3V_AUX
P3.3V
P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V_AUX

P3.3V_AUX

P3.3V
nostuff

D
R818

R819

R817

R816

R820

R821

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

nostuff

nostuff

nostuff

nostuff

R164

R163

R160

R181

R239

R246

R845

R190

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

PCI3_CLK2
PCI3_AD28
PCI3_CLK3
PCI3_AD27
PCI3_CLK4
PCI3_AD26
PCI3_CLK5
PCI3_AD25

g
n
l
u
a
s
i
t
m
n
a
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S fid
n
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C
LPC3_CLK0

PCI3_AD24

LPC3_CLK1

PCI3_AD23

CHP3_RTCCLK

R813

R814

R812

R810

R811

R815

2.2K

2.2K

2.2K

2.2K

2.2K

2.2K

HDA3_AUD_RST#

nostuff

R199

R197

R159

R182

R238

R245

R849

R191

10K
1%

10K
1%

2.2K

10K
1%

10K
1%

10K
1%

2.2K

10K
1%

nostuff

nostuff

DEBUG STRAPS

STRAP
HIGH

STRAP
LOW

PCI3_AD(28)

PCI3_AD(27)

PCI3_AD(26)

PCI3_AD(25)

USE
LONG
RESET

USE PCI
PLL

USE ACPI
BCLK

USE IDE PLL

USE
SHORT
RESET

BYPASS
PCI PLL

BYPASS
ACPI
BCLK

BYPASS IDE
PLL

P3.3V_AUX

PCI3_AD(24)

PCI3_AD(23)

USE DEFAULT
PCIE STRAPS

BOOTFAILTIMER
DISABLED

USE EEPROM
PCIE STRAPS

BOOTFAILTIMER
ENABLED

STRAP
HIGH

STRAP
LOW

R252

R261

2.2K

2.2K

2.2K

nostuff

PCI3_CLK3

RTC_CLK

AUD_RST#

BOOTFAIL
TIMER
ENABLED

USER
DEBUG
STRAPS

RESERVED

RESERVED

EC
ENABLED

CLKGEN
ENABLED

INTERNAL RTC

ENABLE PCI
MEM BOOT

BOOTFAIL
TIMER
DISABLED

IGNORE
DEBUG
STRAPS

RESERVED

RESERVED

EC
DISABLED

CLKGEN
DISABLED

EXRERNAL RTC
(PD on X1,
Apply 32KHz to
RTC_CLK)

DISABLE PCI
MEM BOOT

2.2K
5%

2.2K
5% nostuff

R248
R185

R253

R257

10K

10K

10K

2.2K
5%

nostuff

LPC3_CLK0

LPC3_CLK1

GPIO16

NC, L = SPI ROM

L, NC = LPC ROM

CHP3_GPIO16
CHP3_GPIO17

CHP3_SB_TEST0

PCI3_CLK5

ROM TYPE
NC, NC = RSVD

nostuff

CHP3_SB_TEST1

PCI3_CLK4

GPIO17

R242

R241

CHP3_SB_TEST2

nostuff

PCI3_CLK2

P3.3V_AUX

R250

L, L = FWH ROM

R244
2.2K
5%

nostuff

A
DRAW

DATE

XIE BIN

Remove SB_TEST pins for mass production. (For ASIC debug only - AMD)

CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

ICH
SB710 Strap(5/5)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

22

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

02
03
04
06
08
09
0A
0B
0C
OE
0F
10
11
13

SPI_BIOS_ROM
R783

12.1 1%

BIOS_Q_R_MN 2

WITH INITIAL POST VALUE

INIT. KEYBOARD CONTROLLER
CHECK CHECKSUM
8254 TIMER INIT.
8237 DMA CONTROLLER INIT.
RESET INTERRUP CONTROLLER
TEST DRAM REFRESH
TEST 8742 KEYBOARD CONTROLLER
SET ES SEGMENT REG. TO 4GB
ENABLE A20
AUTO SIZING DRAM
COMPUTE THE CPU SPEED
TESET CMOS RAM
SHADOW SYSTEM BIOS ROM
AUTO SIZING CACHE
CONFIGURE ADVANCED CHIPSET REG.
LOAD ALTER REG. WITH CMOS VALUE
INIT. INTERRUPT VECTOR
INIT. BIOS INTERRUPT
CHECK ROM COPYRIGHT NOTICE
INIT. I20 SUPPORT IF INSTALLED
CHECK VIDEO CONFIGURE AGAINST CMOS
INIT. PCI BUS AND DEVICE
INIT. ALL VIDEO BIOS ROM
SHADOW VIDEO BIOS ROM
DISPLAY CPU TYPE AND SPEED
TEST KEYBOARD
SET KEYCLICK IF ENABLED
ENABLE KEYBOARD
TEST FOR UNEXPECTED INTERRUPTS
DISPLAY " PRESS ...... SETUP"
TEST RAM GETWEEN 512K AND 640K
TEST EXTENDED MEMORY
TEST EXTENDED MEMORY ADDRESS LINE
JUMP TO USER PATCH 1

66
6A
6C
6E
70
72
74
76
7C
7E
80
82
84
86
88
8A
8C
9A
9C
9E
A0
A4
A8
AA
AC
AE
B0
B2
B4
B6
B7
BA
BE
C0
D0
D2
D4
D6
D8
DA
DC
89
90
91
92
94
96
98

CONFIGURE ADVANCE CACHE REG.

DISPLAY EXTERNAL CACHE SIZE
DISPLAY SHADOW MESSAGE
DISPLAY NON-DISPOSABLE SEGMENT
DISPLAY ERROR MESSAGE
CHECK FOR CONFIGURATION ERROR
TEST REAL-TIME CLOCK
CHECK FOR KEYBOARD EERROR
SETUP HARDWARE INTERRUPT VECTOR
TEST COPROCESSER IF PRESENT
DISABLE ON-BOARD I/O PORT
DETECT AND INSTALL EXT.RS232C
DETECT AND INSTALL EXT.PARALLEL
RE-INIT. ON-BOARD I/O PORT
INIT. BIOS DATA ROM
INIT.EXTENDED BIOS DATA AREA
INIT. FDD CONTROLLER
SHADOW OPTION ROMS
SETUP POWER MANAGEMENT
ENABLE H/W INTERRUPT
SET TIME OF DAY
INIT. TYPEMATIC RATE
ERASE F2 PROMPT
SCAN FOR F2 KEY STROKE
ENTER SETUP
CLEAR IN POST FLAG
CHECK FOR ERRORS
POST DONE-PREPARE TO BOOT O/S
ONE BEEP
CHECK PASSWORD (OPTION)
ACPI INIT
DMI INIT
CLEAR SCREEN
TRY BOOT WITH INT19
INTERRUPT HANDLER ERROR
UNKNOWN INTERRUPT ERROR
PENDING INTERRUPT ERROR
SHUTDOWN 5
SHUTDOWN ERROR
EXTENDED BLOCK MOVE
SHUTDOWN 10
ENABLE NMI
INIT. HDD CONTROLLER
INIT. LOCAL BUS HDD CONTROLLER
JUMP TO USER PATCH 2
DISABLE A20 ADDRESS LINE
CLEAR HUGE ES SEGMENT REG.
SEARCH FOR OPTION ROMS

g
n
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u
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m
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a
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S fid
n
o
C
P3.3V_MICOM

U510
MX25L8005M2C-15G
KBC3_SPI_DI

14
16
18
1A
1C
20
22
24
26
28
32
34
38
3A
3C
3D
42
44
46
47
48
49
4A
4C
50
52
54
56
58
5A
5C
60
62
64

VERIFY REAL MODE

DISABLE NMI
GET CPU TYPE
INIT. SYSTEM H/W
INIT. CHIPSET REG.
SET IN POST FLAG
INIT CPU.REG
CPU CACHE ON
INIT.CACHE TO POST
INIT. I/O VALUE
ENABLE THE L-BUS IDE
INIT. POWER MANAGER
LOAD ALTERNATE REG.
PCI BUS MASTER RESET

D
C
S*
HOLD*
W*
VSS VCC

5
6
1
7 BIOS_HOLD#_R_MN
3
8

R785

10K

1%

CHP3_BIOSWP#

1107-001646

R767
100K
1%

1MB(8MBit)

KBC3_SPI_DO
KBC3_SPI_CLK
KBC3_SPI_CS0#

C953
100nF
10V

80H DECODER CONNECTOR

ICT FREE

P5.0V

EGFX_CORE
P0.9V_AUX
P1.1V

P3.3V

PLT3_RST#
CLK3_DBGLPC
LPC3_LFRAME#
LPC3_LAD(3)
LPC3_LAD(2)
LPC3_LAD(1)
LPC3_LAD(0)

1
2
3
4
5
6
7
8
9
10

VDC

P1.5V

J3
HDR-10P-1R-SMD

P1.8V

1
2
3
4
5
6
7
8
9
10

KBC3_PWRSW#

P3.3V

P5.0V

TP24115
1
2
3
4
5
6
7
8
9
10

11
MNT1
12
MNT2

3711-000386

A
DRAW

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI
APPROVAL

ADV

SPI_BIOS_ROM

0.1

SPI_BIOS_ROM

REV

BC LEE
MODULE CODE

TITLE

DATE

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS
PART NO.

PAGE

23

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

AE19
R712

P1.8V

BLM18PG181SN1

715

1%

AL27

PLT3_RST#

B515
C840
100nF
10V

C837

C843

1000nF-X5R
6.3V

10000nF-X5R
6.3V

P1.8V

150

BLM18PG181SN1

C834
100nF
10V

C835

C836

1000nF-X5R
6.3V

10000nF-X5R
6.3V

1%

10000nF-X5R
6.3V

1000nF-X5R
6.3V

P3.3V
AD10
GENERICE_HPD4

AK5
AM3
AK6
AM5
AJ7
AH6
AK8
AL7
TXCBP_DPB3P
TXCBM_DPB3N
TX3P_DPB2P
TX3M_DPB2N
TX4P_DPB1P
TX4M_DPB1N
TX5P_DPB0P
TX5M_DPB0N

R3
R1
SDA
SCL

Y
C
COMP

GENERICA
GENERICB
GENERICC
GENERICD

DPLUS
DMINUS
TS_FDO

GFX_DPA_PVDD_B_MN

B526
BLM18PG181SN1

C842
100nF
10V

PEG3_HPD_HDMI
GFX_DPC_VDD10_B_MN

C906

C907

C905

100nF
10V

1000nF-X5R
6.3V

10000nF-X5R
6.3V

DPC_PVDD
GFX_DPLL_VDDC_B_MN

C838
100nF
10V

C841
1000nF-X5R
6.3V

1%

XTALOUT
XTALIN
DDCCLK_AUX5P
DDCDATA_AUX5N

10K

AF2
AF4
AG3
AG5
AH3
AH1
AK3
AK1

R98

T4
T2
R5

AK28
AM28 GFX_XTALIN_R_MN
AE16
AD16

C205

10000nF-X5R

1000nF-X5R

100nF

6.3V

6.3V

10V

C902

C903

10000nF-X5R

1000nF-X5R

100nF

6.3V

6.3V

10V

R91

P1.8V

100

CLK3_GFX_27M

1%

R96
150
1%

TITLE

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

ADV
REV

BC LEE

B525
BLM18PG181SN1

C904

0.1

ELECTRONICS

GFX
PARK-S3-XT (1/4)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

C204

CRT3_DDCDATA
CRT3_DDCCLK
LCD3_EDID_DATA
LCD3_EDID_CLK
PEG3_HDMI_DATA
PEG3_HDMI_CLK

XIE BIN

MODULE CODE

C203

GFX3_THERMDP
GFX3_THERMDN

DATE

APPROVAL

P1.8V

B18
BLM18PG181SN1

DPC_VDD18

AB13
W8
W9
W7

GUO LEI

6.3V

DPC_PVDD

AM10
AH12
AJ9

1%

CHECK

CRT3_HSYNC
CRT3_VSYNC

R92
R94
R93

AM12
AL11
AK10
AK12
AJ11
AL9

CRT3_RED
CRT3_GREEN
CRT3_BLUE

150 1%
150 1%
150 1%

AH26
AJ27
AL13
AJ13

C147
C146
C148

AM26
AL25
AH24
AK26
AJ25
AG25

R696 10K
DRAW

DPC_VDD18

C844 B517
10000nF-X5R
BLM18PG181SN1

PEG3_TXCP_HDMI_MN
PEG3_TXCN_HDMI_MN
PEG3_TX0P_HDMI_MN
PEG3_TX0N_HDMI_MN
PEG3_TX1P_HDMI_MN
PEG3_TX1N_HDMI_MN
PEG3_TX2P_HDMI_MN
PEG3_TX2N_HDMI_MN

0.012nF

R2
G2
B2
R2B
G2B
B2B

LCD1_ACLK
LCD1_ACLK#
LCD1_ADATA0
LCD1_ADATA0#
LCD1_ADATA1
LCD1_ADATA1#
LCD1_ADATA2
LCD1_ADATA2#

0.012nF
0.012nF

HSYNC
VSYNC
H2SYNC
V2SYNC

GFX_DPLL_PVDD_B_MN

C845

L3
L5
K4
L1
L6

R
G
B
RB
GB
BB

VREFG

P1.8V BLM18PG181SN1
B516
C839

JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_TRST#

U6
U10
T10
U8
U7
T9
T8
T7
N6
N5
N3
Y9
N1
M4
R6
W10
M2
P8
P7
N7
P2
P4
P10
N8

0904-002541

GFX_DPAB_CALR_R_MN

B514

PERSTB

GFX_DPB_PVDD_B_MN

R714

1/4

PCIE_TX0
PCIE_TX1
PCIE_TX2
PCIE_TX3
PCIE_TX4
PCIE_TX5
PCIE_TX6
PCIE_TX7
PCIE_TX8
PCIE_TX9
PCIE_TX10
PCIE_TX11
PCIE_TX12
PCIE_TX13
PCIE_TX14
PCIE_TX15
PCIE_TX0#
PCIE_TX1#
PCIE_TX2#
PCIE_TX3#
PCIE_TX4#
PCIE_TX5#
PCIE_TX6#
PCIE_TX7#
PCIE_TX8#
PCIE_TX9#
PCIE_TX10#
PCIE_TX11#
PCIE_TX12#
PCIE_TX13#
PCIE_TX14#
PCIE_TX15#
RSET
AVSSQ
R2SET
A2VSSQ

PEG3_LCDVDDON
LCD3_BRIT

TESTEN_1
HPD1
DDC1CLK
DDC1DATA
DDC2CLK
DDC2DATA
DDC6CLK
DDC6DATA

AD22
AE22

GFX_R2SET_R_MNAG13

TXCAP_DPA3P
TXCAM_DPA3N
TX0P_DPA2P
TX0M_DPA2N
TX1P_DPA1P
TX1M_DPA1N
TX2P_DPA0P
TX2M_DPA0N

10K 1%

AL15
AK14
AH16
AJ15
AL17
AK16
AH18
AJ17
AL19
AK18

AF24
AC14
AE6
AE5
AC11
AC13
AC1
AC3

GFX_RSET_R_MN

60V

AB12
AB11

GFX_TESTEN_R_MN

499 1%

U11-1
PARK-S3_XT

AUX1N
AUX1P
AUX2N
AUX2P

R695

AH20
AJ19
AL21
AK20
AH22
AJ21
AL23
AK22
AK24R716
AJ23

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
TXCLK_LP_DPE3P
TXCLK_LN_DPE3N
TXOUT_L0P_DPE2P
TXOUT_L0N_DPE2N
TXOUT_L1P_DPE1P
TXOUT_L1N_DPE1N
TXOUT_L2P_DPE0P
TXOUT_L2N_DPE0N
TXOUT_L3P
TXOUT_L3N

AD4
AD2
AD11
AD13

PLACE VREFG DIVIDER AND CAP CLOSE TO ASIC

Q525
RHU002N06
S

TXCLK_UP_DPF3P
TXCLK_UN_DPF3N
TXOUT_U0P_DPF2P
TXOUT_U0N_DPF2N
TXOUT_U1P_DPF1P
TXOUT_U1N_DPF1N
TXOUT_U2P_DPF0P
TXOUT_U2N_DPF0N
TXOUT_U3P
TXOUT_U3N

GFX3_GPIO5

ADT3_SEL#

P3.3V

VREFG = 1.80V / 3

DPC_PVSS
DPC_PVDD
DPC_VDD18_1
DPC_VDD18_2

100nF
10V

R746

10K
1%

1%

DIGON
VARY_BL

P1.0V

249
1%

C851

1%

10K

V6

VREFG
R717

10K

1
P3.3V

AC5

R137

GFX_DPC_PVDD_B_MN W6

499
1%

AH30
AG29
AF27
AD27
AC25
Y23
AB27
Y27
W24
V27
U24
T26
T24
P27
P24
M27
AG31
AF28
AF26
AD26
AB25
Y24
AB26
Y26
W23
U26
U23
T27
T23
P26
P23
N26

100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF

R132

1%

GFX_DPC_VDD18_B_MN AC6

R715

6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V
6.3V

10K

DVDATA_0
DVDATA_1
DVDATA_2
DVDATA_3
DVDATA_4
DVDATA_5
DVDATA_6
DVDATA_7
DVDATA_8
DVDATA_9
DVDATA_10
DVDATA_11
DVDATA_12

PEG1_RXN(15:0)

C93
C728
C732
C734
C733
C737
C738
C740
C744
C747
C746
C758
C753
C757
C755
C760
C119
C729
C730
C731
C736
C739
C735
C742
C741
C749
C743
C756
C750
C759
C752
C761

R136

Y7
Y8
AB2
AB4
AB7
AB8
AB9
AC7
AC8
AD7
AC10
AD9
AE8

P1.8V

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

PCIE_RX0
PCIE_RX1
PCIE_RX2
PCIE_RX3
PCIE_RX4
PCIE_RX5
PCIE_RX6
PCIE_RX7
PCIE_RX8
PCIE_RX9
PCIE_RX10
PCIE_RX11
PCIE_RX12
PCIE_RX13
PCIE_RX14
PCIE_RX15
PCIE_RX0#
PCIE_RX1#
PCIE_RX2#
PCIE_RX3#
PCIE_RX4#
PCIE_RX5#
PCIE_RX6#
PCIE_RX7#
PCIE_RX8#
PCIE_RX9#
PCIE_RX10#
PCIE_RX11#
PCIE_RX12#
PCIE_RX13#
PCIE_RX14#
PCIE_RX15#

TX0M_DPC2N
TX1M_DPC1N
TX2M_DPC0N
TX0P_DPC2P
TX1P_DPC1P
TX2P_DPC0P
TXCCM_DPC3N
TXCCP_DPC3P
DPC_VDD10_1
DPC_VDD10_2

PCIE_REFCLKN
PCIE_REFCLKP

P1.0V

PEG1_TXN(15:0)

PEG1_RXP(15:0)

AF30
AE29
AD30
AC29
AB30
AA29
Y30
W29
V30
U29
T30
R29
P30
N29
M30
L29
AE31
AD28
AC31
AB28
AA31
Y28
W31
V28
U31
T28
R31
P28
N31
M28
L31
K30

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

V2
W5
Y2
W3
Y4
AA3
U5
V4
AA5
AA6

AK32
AK30

CLK1_PEG#
CLK1_PEG
PEG1_TXP(15:0)

DPC_VSSR_1
DPC_VSSR_2
DPC_VSSR_3
DPC_VSSR_4
DPC_VSSR_5

R697 1.24K 1%

PCIE_CALRN
PCIE_CALRP

AA1
U1
U3
W1
Y6

GFX_PCIE_CALRP_R_MN Y22

2
GFX3_GPIO12
GFX3_GPIO13
GFX3_VOLTID0
CLK3_GFX_27M_SS
GFX3_VOLTID1

0
0

GPIO_0
GPIO_1
GPIO_2
GPIO_3_SMBDATA
GPIO_4_SMBCLK
GPIO_5_AC_BATT
GPIO_6
GPIO_7_BLON
GPIO_11
GPIO_12
GPIO_13
GPIO_14_HPD2
GPIO_15_PWRCNTL_0
GPIO_16_SSIN
GPIO_17_THERMAL_INT
GPIO_18_HPD3
GPIO_19_CTF
GPIO_20_PWRCNTL_1
GPIO_21_BB_EN
GPIO_23_CLKREQ#
GPIO_10_ROMSCK
GPIO_9_ROMSI
GPIO_8_ROMSO
GPIO_22_ROMCS#

1%
GFX_PCIE_CALRN_R_MNAA22

R130
R131

AG10
AG11
AE10
AE9
L9
N9
AC16
AG8
AG7
AF14
AE14
AD14

R698 2K

GFX3_GPIO11
PEG3_BKLTEN
GFX3_GPIO5
KBC3_THERM_SMCLK
KBC3_THERM_SMDATA
GFX3_GPIO2
GFX3_GPIO1
GFX3_GPIO0

DPB_PVDD
DPB_PVSS
DPAB_CALR
DVCNTL_0
DVCNTL_1
DVCNTL_2
VREFG
DPA_PVDD
DPA_PVSS
DPLL_PVDD
DPLL_PVSS
DPLL_VDDC

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
P1.0V

PAGE

24

OF

58

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D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

U11-2
PARK-S3_XT

PEG1_DQA(63:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

P1.5V

B
R700

R701

40.2
1%

40.2
1%

GFX_MVREFDA_R_MN K26
GFX_MVREFSA_R_MN J26

P1.5V
R699
100
1%

C812
100nF
10V

R702
100
1%

R703

C818
100nF
10V

2/4

MAA_0
MAA_1
MAA_2
MAA_3
MAA_4
MAA_5
MAA_6
MAA_7
MAA_8
MAA_9
MAA_10
MAA_11
MAA_12
DQMA_0
DQMA_1
DQMA_2
DQMA_3
DQMA_4
DQMA_5
DQMA_6
DQMA_7
MAA_BA0
MAA_BA1
MAA_BA2

K17
J20
H23
G23
G24
H24
J19
K19
J14
K14
J11
J13
H11

0
1
2
3
4
5
6
7
8
9
10
11
12

E32
E30
A21
C21
E13
D12
E3
F4
J16
L15
G11

0
1
2
3
4
5
6
7
0
1
2

H28
C27
A23
E19
E15
D10
D6
G5

0
1
2
3
4
5
6
7

H27
A27
C23
C19
C15
E9
C5
H4

0
1
2
3
4
5
6
7

PEG1_MAA(12:0)

PEG1_DQMA(7:0)

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R748
R721

R704

243

1%

10K 1%
150 1%
243

GFX_MEM_CALRN0_R_MN J25
GFX_TESTEN_2_R_MN K7

GFX_DPC_CALR_R_MN J8
GFX_MEM_CALRP0_R_MN K25

1%

GFX_CLKTESTA_C_MN
GFX_CLKTESTB_C_MN

C870

C865

100nF
10V

100nF
10V

R747

R719

51.1
1%

51.1
1%

K8
L7

L10

GFX_DRAM_RST_R_MN

P1.5V

DQA_0
DQA_1
DQA_2
DQA_3
DQA_4
DQA_5
DQA_6
DQA_7
DQA_8
DQA_9
DQA_10
DQA_11
DQA_12
DQA_13
DQA_14
DQA_15
DQA_16
DQA_17
DQA_18
DQA_19
DQA_20
DQA_21
DQA_22
DQA_23
DQA_24
DQA_25
DQA_26
DQA_27
DQA_28
DQA_29
DQA_30
DQA_31
DQA_32
DQA_33
DQA_34
DQA_35
DQA_36
DQA_37
DQA_38
DQA_39
DQA_40
DQA_41
DQA_42
DQA_43
DQA_44
DQA_45
DQA_46
DQA_47
DQA_48
DQA_49
DQA_50
DQA_51
DQA_52
DQA_53
DQA_54
DQA_55
DQA_56
DQA_57
DQA_58
DQA_59
DQA_60
DQA_61
DQA_62
DQA_63

MEMORY INTERFACE

K27
J29
H30
H32
G29
F28
F32
F30
C30
F27
A28
C28
E27
G26
D26
F25
A25
C25
E25
D24
E23
F23
D22
F21
E21
D20
F19
A19
D18
F17
A17
C17
E17
D16
F15
A15
D14
F13
A13
C13
E11
A11
C11
F11
A9
C9
F9
D8
E7
A7
C7
F7
A5
E5
C3
E1
G7
G6
G1
G3
J6
J1
J3
J5

RDQSA_0
RDQSA_1
RDQSA_2
RDQSA_3
RDQSA_4
RDQSA_5
RDQSA_6
RDQSA_7

WDQSA_0
WDQSA_1
WDQSA_2
WDQSA_3
WDQSA_4
WDQSA_5
WDQSA_6
WDQSA_7
ODTA0
ODTA1

CLKA0
CLKA0B

CLKA1
CLKA1B

RASA0B
RASA1B

CASA0B
CASA1B

CSA0B_0
CSA0B_1
CSA1B_0
CSA1B_1

MVREFDA
MVREFSA

CKEA0
CKEA1

MEM_CALRN0
TESTEN_2

WEA0B
WEA1B

DPC_CALR
MEM_CALRP0

PX_EN
XO_IN2
XO_IN

CLKTESTA
CLKTESTB

RSVD
MAA_13

L18
K16

PEG1_MBA(2:0)

PEG1_DQSA(7:0)

PEG1_DQSA#(7:0)

PEG1_ODTA0
PEG1_ODTA1

H26
H25

PEG1_CLKA0
PEG1_CLKA0#

G9
H9

PEG1_CLKA1
PEG1_CLKA1#

G22
G17

PEG1_RASA0#
PEG1_RASA1#

G19
G16

PEG1_CASA0#
PEG1_CASA1#

H22
J22

PEG1_CSA00#

G13
K13

PEG1_CSA10#

K20
J17

PEG1_CKEA0
PEG1_CKEA1

G25
H10

AB16 GFX_PX_EN_R_MN
AB22
AC22
G14
G20

PEG1_WEA0#
PEG1_WEA1#
150 1%
R718

PEG1_MAA(13)

DRAM_RST

0904-002541

P1.5V

R117
2.2K

MEM1_RST#
R118
R102
10K
1%

680
DRAW

C152

DATE

XIE BIN

0.068nF
50V

CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

GFX
PARK-S3-XT (2/4)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

25

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY

P1.0V

C876

C873

1000nF-X5R
6.3V

C816

1000nF-X5R
6.3V

1000nF-X5R
6.3V

C871

1000nF-X5R
6.3V

C880

C879

C819

C878

C872

C875

C815

C874

10000nF-X5R
6.3V

10000nF-X5R
6.3V

10000nF-X5R
6.3V

10000nF-X5R
6.3V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

B509
BLM18PG181SN1

P1.8V

U11-3
PARK-S3_XT

P1.5V

THIS DOCUMENT CONTAINS CONFIDENTIAL

PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

GFX_DPE_VDD10_B_MN

C789

C791

10000nF-X5R
6.3V

1000nF-X5R
6.3V

C792

AG20
AG21
AG15
AG16

AF16
AG17

B508
BLM18PG181SN1

AF22
AG22

C788

C849

C850

10000nF-X5R
6.3V

100nF
10V

1000nF-X5R
6.3V

VDDR1_1
VDDR1_2
VDDR1_3
VDDR1_4
VDDR1_5
VDDR1_6
VDDR1_7
VDDR1_8
VDDR1_9
VDDR1_10
VDDR1_11
VDDR1_12
VDDR1_13
VDDR1_14
VDDR1_15
VDDR1_16
VDDR1_17

MEM I/O

PCIE

3/4

PCIE_VDDR_1
PCIE_VDDR_2
PCIE_VDDR_3
PCIE_VDDR_4
PCIE_VDDR_5
PCIE_VDDR_6
PCIE_VDDR_7
PCIE_VDDR_8
PCIE_VDDC_1
PCIE_VDDC_2
PCIE_VDDC_3
PCIE_VDDC_4
PCIE_VDDC_5
PCIE_VDDC_6
PCIE_VDDC_7
PCIE_VDDC_8
PCIE_VDDC_9
PCIE_VDDC_10
PCIE_VDDC_11
PCIE_VDDC_12

DPE_VDD10_1
DPE_VDD10_2

DPA_VDD10_1
DPA_VDD10_2

DPE_VDD18_1
DPE_VDD18_2
DPF_VDD18_1
DPF_VDD18_2

DPA_VSSR_1
DPA_VSSR_2
DPA_VSSR_3
DPA_VSSR_4
DPA_VSSR_5

DPF_VDD10_1
DPF_VDD10_2

DPB_VDD10_1
DPB_VDD10_2

GFX_VDD_CT_B_MN

C787
BLM18PG181SN1
10000nF-X5R
B507
6.3V

C783

C784

1000nF-X5R
6.3V

1000nF-X5R
6.3V

C786

P1.8V

C802

C805

10000nF-X5R
6.3V

1000nF-X5R
6.3V

C785

1000nF-X5R
6.3V

P3.3V

100nF
10V

AA20
AA21
AB20
AB21

AA17
AA18
AB17
AB18

C854

1000nF-X5R
6.3V

LEVEL
TRANSLATION

VDD_CT_1
VDD_CT_2
VDD_CT_3
VDD_CT_4

I/O

VDDR3_1
VDDR3_2
VDDR3_3
VDDR3_4

C853

C855

10000nF-X5R
6.3V

1000nF-X5R
6.3V

Y11
GFX_VDDR_B_MN U12
V12
Y12

C856
100nF
10V

P1.8V

DPB_VDD18_1
DPB_VDD18_2
DPA_VDD18_1
DPA_VDD18_2

DAC

B519
C852
BLM18PG181SN1

10000nF-X5R
6.3V

B
P1.8V

C860
100nF
10V

AA11
AA12
U11
V11

L17
L16

U21

C90

C89

C868

10000nF-X5R
6.3V

P1.8V

C859

1000nF-X5R
6.3V

EGFX_CORE

BLM18PG181SN1
B9

1000nF-X5R
6.3V

BLM18PG181SN1
B528

R21

100nF
10V

P1.8V

GFX_MPV18_B_MN
C912

1000nF-X5R

100nF

6.3V

10V

C910

L8

H7
H8

C911

1000nF-X5R
6.3V

NC_VDDRHA
NC_VSSRHA
BIF_VDDC_1

100nF
10V

J7

B521
BLM18PG181SN1
C881

C877

C914

1000nF-X5R
6.3V

100nF
10V

10000nF-X5R
6.3V

M11

C795

C798

1000nF-X5R
6.3V

100nF
10V

R713

150

M12

VDD2DI

L23
L24
L25
L26
M22
N22
N23
N24
R22
T22
U22
V22
AF6
AF7

GFX_PCIE_VDDR_L_MN

C804

C797

C801

100nF
10V

100nF
10V

100nF
10V

C803

C800

C799

C796

1000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

10000nF-X5R
6.3V

P1.0V

D
C751

C813

100nF
10V

100nF
10V

C748

C814

C808

C754

C745

1000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

10000nF-X5R
6.3V

C794
100nF
10V

PCIE_PVDD
MPV18

SPV18
SPV10

SPVSS

BACK BIAS
NC_BBP_1
NC_BBP_2

AF17
1% DPEF_CALR

C899

C900

100nF
10V

1000nF-X5R
6.3V

C140

C138

AG24

GFX_DPA_VDD18_B_MN

C176

AVDD

C174

1000nF-X5R
6.3V

A2VDD

100nF
10V

VDD1DI

AD19

VDD2DI

THEM

TSVDD

CORE

VDDC_1
VDDC_2
VDDC_3
VDDC_4
VDDC_5
VDDC_6

VDDC_7
VDDC_8
VDDC_9
VDDC_10
VDDC_11
VDDC_12
VDDC_13
VDDC_14
VDDC_15
VDDC_16
VDDC_17
VDDC_18
VDDC_19
VDDC_20
VDDC_21

DDCCLK_AUX3P
DDCDATA_AUX3N
PWRGOOD

P1.8V
B14
CIC21J601NE

C170

C169

100nF

1000nF-X5R

10000nF-X5R

10V

6.3V

6.3V

AA15
N15
N17
R13
R16
R18

C173

C142

C141

C143

100nF

1000nF-X5R

10000nF-X5R

10V

6.3V

6.3V

VDD2DI

B11
CIC21J601NE

C144

C145

100nF

C172

C179

1000nF-X5R
6.3V

10000nF-X5R
6.3V

EGFX_CORE

C861

C810

C862

C869

C908

C809

C807

C864

C848

1000nF-X5R

1000nF-X5R

1000nF-X5R

1000nF-X5R

1000nF-X5R

1000nF-X5R

1000nF-X5R

1000nF-X5R

1000nF-X5R

6.3V

6.3V

6.3V

6.3V

6.3V

6.3V

6.3V

6.3V

6.3V

6.3V

1000nF-X5R

C847

C806

1000nF-X5R

1000nF-X5R

6.3V

6.3V

C202

C898

10000nF-X5R

6.3V

C857

1000nF-X5R

6.3V

C201

C846

C858

1000nF-X5R

1000nF-X5R

6.3V

6.3V

C200

10000nF-X5R

10000nF-X5R

6.3V

6.3V

10000nF-X5R

6.3V

EGFX_CORE

B520
BLM18PG181SN1

C867
100nF
10V

C817

C811

1000nF-X5R
6.3V

1000nF-X5R
6.3V

C866
10000nF-X5R
6.3V

0.9V-1.1V @2A (gDDR3)

GFX_VDDCI_B_MN
DRAW

DATE

XIE BIN

R720
10K
1%

CHECK

APPROVAL

08/18/2009
ADV
REV

BC LEE
MODULE CODE

TITLE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

0904-002541

0.1

ELECTRONICS

GFX
PARK-S3-XT (3/4)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

10000nF-X5R
6.3V

C909

AD20
AC20
N10 GFX_PWRGOOD_R_MN

M16
M17
M18
M20
M21
N20

P1.8V

C149

1000nF-X5R
6.3V

10V

1000nF-X5R

6.3V

V15
V17
V20
V21
Y13
Y16
Y18
Y21

P1.8V

BLM18PG181SN1 P1.8V
B15

C863

T12
T15
T17
T20
U13
U16
U18

C171

B13
CIC21J601NE

AD17 GFX_TSVDD_B_MN

ISOLATED VDDCI_1 M13

CORE I/O VDDCI_2 M15
VDDCI_3
VDDCI_4
VDDCI_5
VDDCI_6
VDDCI_7
VDDCI_8

10000nF-X5R
6.3V

C175

AE17
AE23

C832

1000nF-X5R
6.3V

1000nF-X5R
6.3V

A2VDDQ

AE20

C833

100nF

VDD1DI

P1.8V

B16
BLM18PG181SN1

C782

A2VDDQ

100nF
10V

1000nF-X5R
6.3V

AE13
AF13
AE11
AF11

P3.3V

B513
CIC21J601NE

10V

B10
BLM18PG181SN1

GFX_DPE_PVDD_B_MN

C139

10000nF-X5R
6.3V

A2VDD

10000nF-X5R
6.3V

AF8
AF9

100nF
10V

C790

C901

P1.8V

AG19
AF20

C793
1000nF-X5R
6.3V

P1.0V

B524
BLM18PG181SN1

GFX_DPA_VDD110_B_MN

AE1
AE3
AG1
AG6
AH5

AG18
AF19

P1.8V

AVDD
CIC21J601NE
B510

100nF
10V

BIF_VDDC_2

EGFX_CORE
SPV10

A2VDDQ

MEM CLK

SPV10

GFX_SPV18_B_MN

BLM18PG181SN1
B527

NC_1
NC_2
NC_3
NC_4

PLL

GFX_PCIE_PVDD_B_MN AM30

C913

A2VDD

DVCLK
VDDR4_1
VDDR4_2
VDDR4_3

VDD1DI

GFX_NC_B_MN

DPF_PVDD
DPF_PVSS

AVDD

BLM18PG181SN1
B518

P1.0V

DPE_PVDD
DPE_PVSS

POWER

P1.8V

AB23
AC23
AD24
AE24
AE25
AE26
AF25
AG26

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
GFX_DPE_VDD18_B_MN

100nF
10V

H13
H16
H19
J10
J23
J24
J9
K10
K23
K24
K9
L11
L12
L13
L20
L21
L22

1
P1.8V
B506
BLM18PG181SN1

PAGE

26

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

PARK Straps

A3
A30
AA13
AA16
AB10
AB15
AB6
AC9
AD6
AD8
AE7
AG12
AH10
AH28
B10
B12
B14
B16
B18
B20
B22
B24
B26
B6
B8
C1
C32
E28
F10
F12
F14
F16
F18
F2
F20
F22
F24
F26
F6
F8
G10
G27
G31
G8
H14
H17
H2
H20
H6
J27
J31
K11
K2
K22
K6
M6
N11
N12
N13
N16
N18
N21
P6
P9
R11

AUD[1:0]

TX_PWRS_ENB

00 : No Audio Function
01 : Audio for DP & HDMI if adapter is detected
10 : Audio for DP Only
11 : Audio for Both DP & HDMI

PCIE FULL TX OUTPUT SWING

TSVSS

0 : 50% TX OUTPUT SWING

=> LOW LOSS INTERCONNECT
1 : FULL TX OUTPUT SWING

P3.3V

P3.3V

nostuff

R128

GFX3_GPIO0

TX_DEEMPH_EN
PCIE TRANSMITTER DE-EMPHASIS ENABLED
0 : TX DE-EMPHASIS Disabled (eg. on-board)
1 : TX DE-EMPHASIS Enabled (eg. MXM)

3.3K

CRT3_HSYNC

R95

10K 1%

CRT3_VSYNC

R97

10K 1%

If BIOS_ROM_EN=1, ROMCFGID[2:0]
If BIOS_ROM_EN=0, Memory Aperture Size
GFX3_GPIO(13 : 11)

P3.3V

nostuff

R127

GFX3_GPIO1

3.3K

000 : 128MB
001 : 256MB
010 : 64MB
011 : RESERVED
1XX : RESERVED

P3.3V
nostuff
R133

GFX3_GPIO13

BIF_GEN2_EN_A

0 : 2.5GT/s CAPABLE FOR PCIe DEVICE

1 : 5.0GT/s CAPABLE FOR PCIe DEVICE
=> 5.0GT/s CAPABILITY WILL BE
CONTROLLED BY SOFTWARE

R129

GFX3_GPIO2

R126

10K 1%

P3.3V

GFX3_GPIO12

nostuff

R135

10K 1%

R134

10K 1%

10K 1%

10K 1%

GFX3_GPIO11

AC17

VSS_MECH_1
VSS_MECH_2
VSS_MECH_3

VSS1DI
VSS2DI

GND_66
GND_67
GND_68
GND_69
GND_70
GND_71
GND_72
GND_73
GND_74
GND_75
GND_76
GND_77
GND_78
GND_79
GND_80
GND_81
GND_82
GND_83
GND_84
GND_85
GND_86

GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_8
GND_9
GND_10
GND_11
GND_12
GND_13
GND_14
GND_15
GND_16
GND_17
GND_18
GND_19
GND_20
GND_21
GND_22
GND_23
GND_24
GND_25
GND_26
GND_27
GND_28
GND_29
GND_30
GND_31
GND_32
GND_33
GND_34
GND_35
GND_36
GND_37
GND_38
GND_39
GND_40
GND_41
GND_42
GND_43
GND_44
GND_45
GND_46
GND_47
GND_48
GND_49
GND_50
GND_51
GND_52
GND_53
GND_54
GND_55
GND_56
GND_57
GND_58
GND_59
GND_60
GND_61
GND_62
GND_63
GND_64
GND_65

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
A32
AM1
AM32

DPB_VSSR_1
DPB_VSSR_2
DPB_VSSR_3
DPB_VSSR_4
DPB_VSSR_5

AG14
AH14
AM14
AM16
AM18

0904-002541

AD23
AC19

R12
R15
R17
R20
T11
T13
T16
T18
T21
T6
U15
U17
U20
U9
V13
V16
V18
Y10
Y15
Y17
Y20

GND

DPF_VSSR_1
DPF_VSSR_2
DPF_VSSR_3
DPF_VSSR_4
DPF_VSSR_5

AF10
AG9
AH8
AM6
AM8

U11-4
PARK-S3_XT
4/4

AF23
AG23
AM20
AM22
AM24

PCIE_VSS_1
PCIE_VSS_2
PCIE_VSS_3
PCIE_VSS_4
PCIE_VSS_5
PCIE_VSS_6
PCIE_VSS_7
PCIE_VSS_8
PCIE_VSS_9
PCIE_VSS_10
PCIE_VSS_11
PCIE_VSS_12
PCIE_VSS_13
PCIE_VSS_14
PCIE_VSS_15
PCIE_VSS_16
PCIE_VSS_17
PCIE_VSS_18
PCIE_VSS_19
PCIE_VSS_20
PCIE_VSS_21
PCIE_VSS_22
PCIE_VSS_23
PCIE_VSS_24
PCIE_VSS_25
PCIE_VSS_26
PCIE_VSS_27
PCIE_VSS_28
PCIE_VSS_29
PCIE_VSS_30
PCIE_VSS_31

DPE_VSSR_1
DPE_VSSR_2
DPE_VSSR_3
DPE_VSSR_4
DPE_VSSR_5

AA27
AB24
AB32
AC24
AC26
AC27
AD25
AD32
AE27
AF32
AG27
AH32
K28
K32
L27
M32
N25
N27
P25
P32
R27
T25
T32
U25
U27
V32
W25
W26
W27
Y25
Y32

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

GFX
PARK-S3-XT (4/4)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

27

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

A-channel Lower Data

K9

PEG1_CKEA0
PEG1_MBA(2:0)

M2
N8
M3

0
1
2

T2

MEM1_RST#

L2
L1
J3
K3
L3

PEG1_CSA00#
PEG1_RASA0#
PEG1_CASA0#
PEG1_WEA0#

D3
E7

PEG1_DQMA(0)
PEG1_DQMA(2)

K1
J1

PEG1_ODTA0
P1.5V
R706

GML_VREFDQ0_R_MNH1
GML_VREFCA0_R_MNM8

4.99K
1%

C820
100nF GML_ZQ_ZQ00_R_MNL8
10V
L9

CKE_CKE0
BA0
BA1
BA2

D7
C3
C8
C2
A7
A2
B8
A3

6
7
1
5
3
2
0
4

E3
F7
F2
F8
H3
H8
G2
H7

18
16
20
17
23
22
21
19

PEG1_DQA(7:0)

N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
T7
M7

0
1
2
3
4
5
6
7
8
9
10
11
12
13

DQSU#
DQSL#

C7
F3

PEG1_DQA(23:16)

PEG1_CKEA0
PEG1_MBA(2:0)

PEG1_DQSA(0)
PEG1_DQSA(2)

B7
G3

J7
K7

PEG1_CLKA0
PEG1_CLKA0#

K9

M2
N8
M3

0
1
2

T2

MEM1_RST#

PEG1_DQSA#(0)
PEG1_DQSA#(2)

L2
L1
J3
K3
L3

PEG1_CSA00#

CS#_CS0#
NC_CS1#
RAS#
CAS#
WE#

NC_CE1

DMU
DML
ODT_ODT0
NC_ODT1
VREFDQ
VREFCA

P1.5V

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15_BA3

A1
A8
C1
C9
D2
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5

B2
D9
G7
K2
K8
N1
N9
R1
R9
DQSU
DQSL

RESET#

PEG1_MAA(13:0)

E9
F1
H2
H9

VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9

E9
F1
H2
H9
D7
C3
C8
C2
A7
A2
B8
A3

13
8
12
14
9
10
15
11

E3
F7
F2
F8
H3
H8
G2
H7

27
26
30
24
31
25
29
28

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7

CK
CK#

ZQ_ZQ0
NC_ZQ1

VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9

A1
A8
C1
C9
D2

1105-002019
E-DIE

A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9

R705
4.99K
1%

U507
K4W1G1646E-HC12

P1.5V

VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9

PEG1_RASA0#
PEG1_CASA0#
PEG1_WEA0#

J9

D3
E7

PEG1_DQMA(1)
PEG1_DQMA(3)

B1
B9
D1
D8
E2
E8
F9
G1
G9

K1
J1

PEG1_ODTA0

P1.5V

R103

GML_VREFDQ1_R_MN H1

4.99K
1%

M8

R104
4.99K
1%

C155
100nF
10V

GML_VREFCA1_R_MN

GML_ZQ_ZQ01_R_MN

L8
L9

DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7

U9
K4W1G1646E-HC12
1105-002019
E-DIE

DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7

CK
CK#

CKE_CKE0
BA0
BA1
BA2

DQSU
DQSL

DQSU#
DQSL#

RESET#

CS#_CS0#
NC_CS1#
RAS#
CAS#
WE#

NC_CE1

DMU
DML

VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9

ODT_ODT0
NC_ODT1

VREFDQ
VREFCA
ZQ_ZQ0
NC_ZQ1

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12

J7
K7

PEG1_CLKA0
PEG1_CLKA0#

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15_BA3

P1.5V

PEG1_DQA(15:8)

PEG1_DQA(31:24)

C7
F3

PEG1_DQSA(1)
PEG1_DQSA(3)

B7
G3

PEG1_DQSA#(1)
PEG1_DQSA#(3)

J9

B1
B9
D1
D8
E2
E8
F9
G1
G9

A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9

N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
T7
M7

0
1
2
3
4
5
6
7
8
9
10
11
12
13

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12

PEG1_MAA(13:0)

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9

B2
D9
G7
K2
K8
N1
N9
R1
R9

P1.5V

VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5

P1.5V

P1.5V

R711

R100

4.99K
1%
C822
100nF
10V

R709
4.99K
1%

4.99K
1%

R99

R710
243

4.99K
1%

1%

P1.5V

R101

C150

243
1%

100nF
10V

P1.5V

C762

C768

C765

C766

10000nF-X5R
6.3V

10000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

C764

C821

C767

C763

C154

C122

C153

C126

C124

C123

C125

C151

100nF
10V

100nF
10V

100nF
10V

10nF
25V

10000nF-X5R
6.3V

10000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

100nF
10V

100nF
10V

100nF
10V

10nF
25V

A
DRAW

PEG1_CLKA0
PEG1_CLKA0#

R708

56 1%

R707

56 1%

XIE BIN

C823

10nF
25V
PEG1_CLKA0_R_MN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

0.1

PART NO.

gDDR3 (1/2)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

GRAPHICS_MEMORY

PAGE

28

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

A-channel Upper Data

A1
A8
C1
C9
D2
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5

A1
A8
C1
C9
D2

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9

VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9

E9
F1
H2
H9

C183

C209

C182

C207

C208

C184

C886

C915

C885

C918

C884

C919

C917

C916

1000nF-X5R
6.3V

1000nF-X5R
6.3V

100nF
10V

100nF
10V

100nF
10V

10nF
25V

10000nF-X5R
6.3V

10000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

100nF
10V

100nF
10V

100nF
10V

10nF
25V

K1
J1

PEG1_ODTA1
P1.5V

GMU_VREFDQ0_R_MN H1
GMU_VREFCA0_R_MN M8

C206

L8
100nF
L9
GMU_ZQ_ZQ00_R_MN

DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7

CK
CK#
CKE_CKE0
BA0
BA1
BA2

DQSU
DQSL

RESET#

DQSU#
DQSL#

E3
F7
F2
F8
H3
H8
G2
H7

36
33
37
35
39
32
38
34

C7
F3

PEG1_DQA(47:40)

PEG1_DQA(39:32)

J7
K7

PEG1_CLKA1
PEG1_CLKA1#

K9

PEG1_CKEA1
PEG1_MBA(2:0)

B7
G3

PEG1_DQSA#(5)
PEG1_DQSA#(4)

M2
N8
M3

0
1
2

PEG1_DQSA(5)
PEG1_DQSA(4)

T2

MEM1_RST#

L2
L1
J3
K3
L3

PEG1_CSA10#

CS#_CS0#
NC_CS1#
RAS#
CAS#
WE#

NC_CE1

DMU
DML
ODT_ODT0
NC_ODT1
VREFDQ
VREFCA
ZQ_ZQ0
NC_ZQ1

42
41
40
43
46
44
45
47

VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9

PEG1_RASA1#
PEG1_CASA1#
PEG1_WEA1#

J9

D3
E7

PEG1_DQMA(7)
PEG1_DQMA(6)

B1
B9
D1
D8
E2
E8
F9
G1
G9

K1
J1

PEG1_ODTA1

P1.5V

R752

GMU_VREFDQ1_R_MN H1
GMU_VREFCA1_R_MN M8

4.99K
1%

R753
4.99K
1%

C920

GMU_ZQ_ZQ01_R_MN L8

L9

100nF
10V

B
P1.5V

DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7

U508
K4W1G1646E-HC12
1105-002019
E-DIE

DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7

CK
CK#

CKE_CKE0
BA0
BA1
BA2

DQSU
DQSL

RESET#

DQSU#
DQSL#

CS#_CS0#
NC_CS1#
RAS#
CAS#
WE#

NC_CE1

DMU
DML

ODT_ODT0
NC_ODT1
VREFDQ
VREFCA
ZQ_ZQ0
NC_ZQ1

A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9

10V

1105-002019
E-DIE

D7
C3
C8
C2
A7
A2
B8
A3

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12

D3
E7

PEG1_DQMA(5)
PEG1_DQMA(4)

U12
K4W1G1646E-HC12

DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7

VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9

D7
C3
C8
C2
A7
A2
B8
A3

61
56
58
57
62
60
59
63

E3
F7
F2
F8
H3
H8
G2
H7

54
52
53
48
49
51
55
50

C7
F3

PEG1_DQA(63:56)

PEG1_DQA(55:48)

PEG1_DQSA(7)
PEG1_DQSA(6)

B7
G3

PEG1_DQSA#(7)
PEG1_DQSA#(6)

J9

B1
B9
D1
D8
E2
E8
F9
G1
G9

A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9

L2
L1
J3
K3
L3

PEG1_RASA1#
PEG1_CASA1#
PEG1_WEA1#

4.99K
1%

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15_BA3

10000nF-X5R
6.3V

T2

PEG1_CSA10#

R116

N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
T7
M7

0
1
2
3
4
5
6
7
8
9
10
11
12
13

C180

M2
N8
M3

0
1
2

4.99K
1%

PEG1_MAA(13:0)

E9
F1
H2
H9

10000nF-X5R
6.3V

K9

MEM1_RST#

R138

VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9

C181

J7
K7

PEG1_CKEA1
PEG1_MBA(2:0)

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15_BA3

P1.5V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

PEG1_CLKA1
PEG1_CLKA1#

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9

N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
T7
M7

0
1
2
3
4
5
6
7
8
9
10
11
12
13

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12

PEG1_MAA(13:0)

P1.5V

B2
D9
G7
K2
K8
N1
N9
R1
R9

P1.5V

B2
D9
G7
K2
K8
N1
N9
R1
R9

P1.5V

VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5

P1.5V

R120

R722

4.99K
1%

R119
4.99K
1%

R139

C185
100nF
10V

4.99K
1%

R723

243
1%

4.99K
1%

P1.5V

R749

C882

243
1%

100nF
10V

P1.5V

A
DRAW

XIE BIN

PEG1_CLKA1
PEG1_CLKA1#

R751

56 1%

CHECK

C883

R750

56 1%

10nF
25V
PEG1_CLKA1_R_MN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

0.1

PART NO.

gDDR3 (2/2)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

GRAPHICS_MEMORY

PAGE

29

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LVDS

LCD Power

Backlight On

EBL Purpose

P3.3V_AUX

P5.0V_STB

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

+
4

PEG3_BKLTEN
14-C4,48-B2

R510

R507

100K
1%

100K
1%

R504

R509

1K 1%

30.1K

PEG3_LCDVDDON_Q_MN

LCD3_BKLTON

C503

330nF
10V

1%

LCD3_BKLTON_R_MN

C507

KBC3_BKLTON

R505

200K
1%

P3.3V

LCD_VDD3V

Q500
SI2315BDS-T1

100nF

PEG3_LCDVDDON_QR_MN

U501
7SZ08

10K

change to AO3415L

PEG3_LCDVDDON_R_MN

R520

PEG3_LCDVDDON

Q501
RHU002N06

1%G
1

R503

100K
1%

Camera + LCD Connector

Converter Power

LCD_VDD3V

Q503
AO3409L

150K
1%

R511

C511
100nF
25V

P3.3V_VDD_INV_EN_QR_MN

51.1K
1%

P3.3V_VDD_INV_EN_Q_MN
D

Q502
RHU002N06

LCD_VDD3V

R506

10K

1%

R876

10K

1%

P3.3V

P5.0V

10V

C509

C512

4700nF-X5R
25V

100nF
10V

LCD3_BRIT
USB3_CAMERAUSB3_CAMERA+

C510
100nF

14-C4,48-C4
14-B4
14-B4

25V

LCD1_ACLK
LCD1_ACLK#
LCD1_ADATA1
LCD1_ADATA1#

1
2
3
4
5
6
7
8
10
9
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
MNT1
MNT2

B502
EXC24CE900U

USB3_CAMERA-_S_MN
USB3_CAMERA+_S_MN

14-B4
14-B4
14-B4
14-C4

2.2K

C505
100nF

10V

2.2K

C504
100nF

JLCD500

R525

P3.3V_VDD_INV_EN_MN
10K 1%
R508
G

VDD_LED

C508

C506

100nF
10V

100nF
10V

B
R502

P3.3V

P3.3V

VDD_LED

R501

VDC

26-C3,48-B2

14-B4
14-C4
14-B4
14-C4
14-C4,49-D4
14-C4,49-C3

LCD3_BKLTON

LCD1_ADATA2
LCD1_ADATA2#
LCD1_ADATA0
LCD1_ADATA0#
LCD3_EDID_CLK
LCD3_EDID_DATA

31
32

3710-002498
SOCK-30P-2R-SMD-MNT

A
A
LCD3_BKLTON

DRAW

CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ELECTRONICS

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

XIE BIN

0.1

GRAPHICS_IF (1/2)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

30

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CRT

VCC_CRT

P5.0V

P5.0V

D504
MMBD4148
1

D505
MMBD4148

10V

40.2

1%
27-B3,48-C3

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
50V

nostuff
nostuff
nostuff

Place close to CONN.

SMT500

R575
2.2K
27-B3

14-D4,48-C2

VCC_CRT
Q517
RHU002N06

CRT5_DDCDATA

0-1005

0.27nF 50V

CRT3_P5.0V_D_MN

100nF
10V

J504
DSUB-15-VGA
1
6
11
2
7
12
3
8
13
4
9
14
5
10
15

C581

16
17

3701-001515

D503
BAV99LT1 3
1

CRT5_DDCDATA_CLK_D_MN

nostuff
nostuff

CRT5_DDCCLK

Check "CRT3_DDCCLK/DATA" Voltage Level

2N06 Can be replaced with SM6K2

DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

ELECTRONICS

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DEV. STEP

GUO LEI

0.1

GRAPHICS_IF (2/2)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

D502
BAV99LT1

0-1005

R576
2.2K

CRT3_DDCCLK

27-B3

P3.3V

P3.3V

2.2K

SMT501

nostuff
nostuff

R580

0.27nF 50V

Q518
RHU002N06

C562

CRT3_DDCDATA

14-D4,48-D2

R582
2.2K

VCC_CRT

27-B3
27-B3
27-C3,48-C3
27-C3,48-C3

C578

P3.3V

P3.3V
nostuff
nostuff

CRT5_DDCDATA
CRT5_DDCCLK
CRT5_HSYNC
CRT5_VSYNC

C50
0.022nF

50V

PGB1010603NR
D4

C49
0.022nF

50V

C70
0.022nF

CRT5_VSYNC

PGB1010603NR
D2

CRT3_BLUE_L_MN

82nH

PGB1010603NR
D3

27-B3,48-C3

L7

0.033nF 50V

40.2 1%

14-D4,48-C4

C46

10V

5
+
R581
4
3 CRT5_VSYNC_R_MN

CRT3_GREEN_L_MN

0.033nF 50V

OE*

82nH

C577

2
14-D4,48-C3

L8

C580

CRT3_VSYNC

CRT3_BLUE

C563
100nF

U505
SN74AHCT1G125DCKR

14-D4,48-C3

150 1%

CRT3_GREEN

R57

VCC_CRT

CRT3_RED_L_MN

150 1%

CRT3_RED

82nH

R59

L6

150 1%

CRT CONNECTOR

14-D4,48-D4

BLM18PG181SN1
B503

CRT5_HSYNC

R58

5
+
R583
4
3 CRT5_HSYNC_R_MN

0.022nF 50V

OE*

0.022nF 50V

2
14-D4,48-C3

C48

CRT3_HSYNC

0.022nF 50V

U506
SN74AHCT1G125DCKR

C47

C579
100nF

PAGE

31

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

HDMI
D
P5.0V

HDMI port for External Graphics

P5.0V_HDMI_TH_MN

P3.3V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
D5

20V

P3.3V

miniSMDC110-2
TH3

P5.0V_HDMI_TH_D_MN

CRS06

HDMI

C87

R75

PEG3_TX2P_HDMI_MN

PEG3_TX1N_HDMI_MN
PEG3_TX0P_HDMI_MN

PEG3_TX0N_HDMI_MN
PEG3_TXCP_HDMI_MN

PEG3_TXCN_HDMI_MN

100nF 10V PEG3_TX1N_HDMI_C_MN

100nF 10V PEG3_TX0P_HDMI_C_MN

C178
C192

100nF 10V PEG3_TX0N_HDMI_C_MN

100nF 10V PEG3_TXCP_HDMI_C_MN

C193

100nF 10V PEG3_TXCN_HDMI_C_MN

VGA5_HDMI_HPD

PEG5_HDMI_CLK

PEG3_HDMI_CLK

Q7
60V
RHU002N06
SMT5

nostuff

R80
R83

499
499

1%
1%

R82
R81

499
499

1%
1%

P3.3V

R90

1%
1%

100K
1%

1%
1%

499
499

VGA5_HDMI_HPD

PEG3_TXCP_HDMI_C_MN
PEG3_TXCN_HDMI_C_MN

499
499

R86
R87

100K
1%

PEG3_TX0P_HDMI_C_MN
PEG3_TX0N_HDMI_C_MN

R85
R84

ESD

nostuff

VGA5_HDMI_HPD_R_MN

3
1
R70
Q521
MMBT3904

3701-001597

PEG3_TX2P_HDMI_C_MN
PEG3_TX2N_HDMI_C_MN
PEG3_TX1P_HDMI_C_MN
PEG3_TX1N_HDMI_C_MN

20
21
22
23

70V

P3.3V

40V

MNT1
MNT2
MNT3
MNT4

BAV99LT1
3
D506

nostuff

100nF
10V

70V

BAV99LT1
D507

C84

TMDS_DATA2
TMDS_DATA2_SHIELD
TMDS_DATA2#
TMDS_DATA1
TMDS_DATA1_SHIELD
TMDS_DATA1#
TMDS_DATA0
TMDS_DATA0_SHIELD
TMDS_DATA0#
TMDS_CLOCK
TMDS_CLOCK_SHIELD
TMDS_CLOCK#
CEC
RESERVED
SCL
SDA
DDC_GROUND
5V_POWER
HOT_PLUG_DETECT

nostuff

0-1005

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19

PEG5_HDMI_CLK_B_MN
PEG5_HDMI_DATA_B_MN

EMI

C703

10K
1%

R71

50V

BLM18PG181SN1
BLM18PG181SN1

0.5pF

PEG5_HDMI_CLK
PEG5_HDMI_DATA

P3.3V

C194
C177

50V

P3.3V

B8
B7

100nF 10V PEG3_TX2N_HDMI_C_MN

100nF 10V PEG3_TX1P_HDMI_C_MN

C702

0-1005

100nF 10V PEG3_TX2P_HDMI_C_MN

C196
C197

0.5pF
0.01nF

R73
R74

SMT4

PEG3_TX2N_HDMI_MN
PEG3_TX1P_HDMI_MN

J506
HDMI-19P-FEMALE

C195

0.01nF

PEG5_HDMI_DATA

60V
Q8
RHU002N06

2.2K
2.2K

PEG3_HDMI_DATA

100nF
10V

10K
1%

60V

PEG3_HPD_HDMI

PEG3_TX_HDMI_PD_Q_MN
R69

RHU002N06
Q11

47K

A
DRAW

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

0.1

ELECTRONICS

GRAPHICS_IF
PART NO.

HDMI

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

32

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MICOM_MEC1308-NU
P3.3V_MICOM

C958

C934

C930

100nF

100nF

C956
100nF

100nF

C897

C954

100nF

100nF

P3.3V

C955

100nF

KBC3_KCLK_R_MN
KBC3_KDAT_R_MN
KBC3_EMCLK_R_MN
KBC3_EMDAT_R_MN

LPC3_LAD(0:3)

0
1
2
3

LPC3_LFRAME#
PLT3_RST#
CLK3_PCLKMICOM
PCI3_CLKRUN#
CHP3_SERIRQ

KBC3_SPI_CLK
KBC3_SPI_DI
KBC3_SPI_DO
KBC3_SPI_CS0#

41
42
43
44
38

VRM3_CPU_PWRGD
CHP3_SLPS5#

R789
R768

0
1M

KBC_XTAL1_C_MN 70
KBC_XTAL2_C_MN 71

5%

C935
0.022nF

2801-003856

AVCC

VCC2

40

49

14
39
58
84
106
119

KSI0
KSI1
KSI2
KSI3
KSI4
KSI5
KSI6
KSI7
IMCLK
IMDAT
KCLK
KDAT
EMCLK
EMDAT

GPIO20_PS2CLK
GPIO21_PS2DAT
32KHZ_OUT_GPIO22_WK_SE01
GPIO25
GPIO27_WK_SE05
GPIO28
GPIO29_BC_CLK
GPIO30_BC_DAT
GPIO31_BC_INT#
GPIO32
GPIO33
GPIO34
GPIO35
GPIO36
GPIO37_CIR_LED
GPIO38_CIR_IN
GPIO39

LAD0
LAD1
LAD2
LAD3
LFRAME#
LRESET#
PCI_CLK
CLKRUN#
SER_IRQ
NC_TEST_CLK

HSTCLK_GPIO41
HSTDATAIN_GPIO43 (MISO)
HSTDATAOUT_GPIO45 (MOSI)
HSTCS0#_GPIO44
HSTCS1#_GPIO42
FLCLK
FLDATAIN
FLDATAOUT
FLCS0#
FLCS1#

10K 1%

R742
R737
R738

10K 1%
10K 1%
10K 1%

KBC3_LED_ACIN#
KBC3_LED_CHARGE#

R736
R739

10K 1%
10K 1%

KBC3_SMDATA#
KBC3_SMCLK#

R741
R740

4.7K 1%
4.7K 1%

107
79
80
60
85
86
87

KBC3_CHGEN
KBC3_PRECHG
KBC3_CHG4.2V P3.3V_MICOM

R769

P3.3V_MICOM

10K
1%

88
89
90
91
92
101
102

103
105
75
73
74
93
98
99
100
126
65
64
63
1
34
33
30

KBC3_PWRSW#

KBC3_LED_POWER#

R772

ADT3_SEL#

300K
1%

PEX3_WAKE#
CHP3_SLPS3#

KBC3_BATDET#

C933

KBC3_VRON
KBC3_A20G

10nF
25V

KBC3_CAPSLED#

MICOM RESET

KBC3_PWRON

KBC3_RST#

KBC3_USBPWRON#

Q5
RHU002N06

R268

AB1A_DATA
AB1A_CLK
AB1B_DATA
AB1B_CLK

60V

TEST_PIN
PWRGD
VCC1_RST#
GPIO10
NBAT_LED
NPWR_LED_8051TX
NFDD_LED_8051RX

69
78
77
116
113
115
114

R60

4.7K

BSS84
Q6

KBC3_RST#_Q_MN

THM3_STP_Q_MN

C51

111
112
109
110

P3.3V_AUX

KBC3_BKLTON
KBC3_RSMRST#
KBC3_PWRBTN#
KBC3_SPKMUTE#
KBC3_RFOFF#
LID3_SWITCH#
PLT3_RST#

G1

R61
100K
1%

KBC3_SMDATA#
KBC3_SMCLK#
KBC3_THERM_SMDATA
KBC3_THERM_SMCLK
P3.3V

KBC_PWRGD_R_MN

R771

10K 1%

SMT2

KBC3_PWRSW#
KBC3_LED_CHARGE#
KBC3_NUMLED#
KBC3_SCLED#

SHORT502

ADC3_GPIO23
ADC2_GPIO40
ADC1_GPIO46
ADC0_GPIO47
GPIO19

XTAL2

R735

KBC3_CAPSLED#
KBC3_NUMLED#
KBC3_SCLED#

10nF
25V

NEC_SCI

XTAL1

GPIO01
GPIO02
GPIO03
NRESET_OUT_GPIO06
GPIO07_PWM3
GPIO08_RXD
GPIO09_TXD
GPIO11_AB2A_DATA
GPIO12_AB2A_CLK
GPIO13_AB2B_DATA
GPIO14_AB2B_CLK
GPIO15_FAN_TACH1
GPIO16_FAN_TACH2
GPIO17_A20M

SHORT503

45
72

Y502
0.032768MHz

46
48
50
51
52
53
54
55
57
59

2
94
127
96
31
3
95
128
97
32

SPI3_CLK
SPI3_MISO
SPI3_MOSI
SPI3_CS0#

nostuff

35
36
61
62
66
67

76

KBC3_RUNSCI#

CHP3_SUSSTAT#
KBC3_WLON_LED#

29
28
27
26
25
24
23
22

KBC3_LED_ACIN#
KBC3_LED_CTRL
KBC3_EXTSMI#
KBC3_RCIN#
KBC3_WAKESCI#

0
0

THM3_STP#

0-1005

10kohm pull-up to P3.3V_AUX

should be at the thermal sensor side.

KBC3_TX
KBC3_RX

KBC3_TX
KBC3_RX

CAP

KBC5_TCLK
KBC5_TDATA

0
1
2
3
4
5
6
7

124
125
123
122
121
120
118

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

MEC1308-NU

15

R792
R793
R794
R791
R787
R788

10K 1%
10K 1%
10K 1%
10K 1%
10K 1%
10K 1%

P5.0V

P3.3V_MICOM
OUT0_SCI
OUT1
OUT7_NSMI
OUT8_KBRST
OUT9_PWM2
OUT10_PWM0
PWM1_OUT11

U511

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7

KSO0
KSO1
KSO2
KSO3
KSO4
KSO5
KSO6
KSO7
KSO8
KSO9
KSO10
KSO11
KSO12_GPIO00_KBRST
KSO13_GPIO18
GPIO04_KSO14
GPIO05_KSO15
GPIO24_KSO16
BA09-00021A
GPIO26_KSO17

11
37
47
56
82
104
117

KBC3_SUSPWR
KBC3_PWRGD
KBC5_KSI(0:7)

21
20
19
18
17
16
13
12
10
9
8
7
6
5
81
83
4
108

VCC0

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

AVSS
AGND

KBC5_KSO(0:15)

VCC1_1
VCC1_2
VCC1_3
VCC1_4
VCC1_5
VCC1_6

68

nostuff

TP23656
1
2
3
4

MODE0
TX
RX
GND

For Production

KBC_CAP_C_MN

C931
C932

4700nF-X5R
10V

0.022nF

DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV

MICOM_MEC1308

0.1

MICOM_MEC1308

REV

BC LEE
MODULE CODE

TITLE

DATE

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS
PART NO.

PAGE

33

OF

58

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www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Micom Glue Logic

KEYBOARD

TOUCHPAD BUTTON

TOUCHPAD

P3.3V_MICOM

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

26
27

3708-002166

35-B3,49-B3
34-B1,48-C4
35-B3,49-C3

C826

C825

C827

C828

0.01nF

0.01nF

0.01nF

0.01nF

50V

50V

50V

50V

TPD5_R_BUTTON#

P5.0V

CONN-6P-FPC
J509

SW502
SW-TACT-4P
4

3
2

BAV99LT1
D515
nostuff

Confrim that there are PU on Touch PAD moduel side or micom.

TOUCHPAD LED POWER

KBC3_LED_CTRL

1000nF-X5R
6.3V

1
3

SUPPLY
OUTPUT
GND

R165

10K

1%

48-B2
34-B3,35-A1

1%

C215
100nF

-12V

KBC3_LED_CRTL_QR_MN

Q25
RHU002N06
60V

R145

20K
1%

Q24
SI2315BDS-T1

330nF
10V

R500

C216

R148

30.1K

C1509

200K
1%

KBC3_LED_CRTL_RQR_MN

U500
A3212ELH/HED55XXU12

R147

P3.3V

P3.3V_LED

LID SWITCH

P3.3V_AUX

P5.0V_STB

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
MNT1
MNT2

34-B1,48-B3

MNT2
MNT1
6
5
4
3
2
1

R734
R733
R732
R731
R730
R729
R728
R727

J508
FPC-KBD-25P

nostuff

3708-002402

8
7

KBC5_KSO(0:15)

BAV99LT1
D514

100nF
10V

KBC5_TDATA
TPD5_R_BUTTON#
TPD5_L_BUTTON#
KBC5_TCLK

3
2

10K
10K
10K
10K
10K
10K
10K
10K

1%
1%
1%
1%
1%
1%
1%
1%

P5.0V

C829

KBC5_KSI(0:7)

P5.0V

SW501
SW-TACT-4P

TPD5_L_BUTTON#

100K
1%

LID3_SWITCH#

1009-001010

A
DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ELECTRONICS

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

0.1

PART NO.

MICOM_GLUE

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

34

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LEDs

FUNCTION KEY LED

P3.3V_LED

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V

475

1%

R786

475

1%

R790

475

1%

R795

475

1%

R808

475

1%

R822

475

1%

R841

475

1%

R850

475

1%

R856

475

1%

R858

475

1%

1
1

475

1%

R862

475

1%

R863

475

1%

475

1%

1
1

G
R

1
2

KBC3_LED_ACIN#_R_MN

R306

475

1%

R305

475

1%

R864

KBC3_LED_ACIN#
KBC3_LED_CHARGE#

R872

475

1%

KBC3_LED_CHARGE#_R_MN

R873

475

1%

P3.3V_AUX

KBC3_LED_POWER#

R307

LTST-C193TBKT-AC

475

R861

P3.3V_MICOM

LED519
LTST-C195KGJRKT

LED506

1%

1%

475

475

R860

R859

ADAPTERIN/CHARGING LED

475 1%

R304

475 1%

LED507

LTST-C193TBKT-AC

LED508

LTST-C193TBKT-AC

LED509

LTST-C193TBKT-AC

LED510

LTST-C193TBKT-AC

LED511

LTST-C193TBKT-AC

LED512

LTST-C193TBKT-AC

R302

32-C1,48-B4

LTST-C193TBKT-AC

LED513

LTST-C193TBKT-AC

LED514

LTST-C193TBKT-AC

LED516

LTST-C193TBKT-AC

LED520

LTST-C193TBKT-AC

LED522

LTST-C193TBKT-AC

LED523

LTST-C193TBKT-AC

LED524

LTST-C193TBKT-AC

LED525

LTST-C193TBKT-AC

WLON_LED#

LED505

R303

WLON_LED#_LED_MN
32-C1,48-B4

KBC3_WLON_LED#

LTST-C193TBKT-AC

475 1%

LED518
LTST-C193TBKT-AC

LTST-C193TBKT-AC

LED504

CHP3_SATALED#_LED_MN
20-B3,49-B4

LED503

LED517
LTST-C193TBKT-AC
CHP3_SATALED#

R301

LTST-C193TBKT-AC

KBC3_CAPSLED#_LED_MN
34-C3,49-D4

KBC3_CAPSLED#

LTST-C193TBKT-AC

LED502

LED515
LTST-C193TBKT-AC

LED501

R784

1%

1%

475

475

R781

R782

1%

KBC3_LED_POWER#_R_MN

LED521
LTST-C193TBKT-AC

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV

LED_SWITCH

0.1

LED_SWITCH

REV

BC LEE
MODULE CODE

TITLE

ELECTRONICS
PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

35

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

AUdio Codec (ALC269)

D
Codec Pin9 Setting
S/B without Low Voltage IO

S/B with Low Voltage IO

Pin9 : 3.3V

Pin9 : 1.5V
Do not make a testpoint in these nets
C283

1000nF-X5R

D8
MMBD4148

P3.3V

6.3V
1

22-B3,48-C4

75V

10000nF-X5R
10V

15K
1%

10K
1%

nostuff

4.7K
1%

4.7nF
25V

HDA3_AUD_SDO
HDA3_AUD_BCLK
HDA3_AUD_SDI0
HDA3_AUD_SYNC
HDA3_AUD_RST#

G_AUD
20-B3,49-A4

D7
BAT54A
30V

R208

20-B3,49-A4
20-B3,49-A4

22 HDA3_AUD_SDI0_R_MN

20-B3,49-A4

AUD3_SPKR_C_MN 12

1000nF-X5R 6.3V

AUD5_JDREF_R_MN

29-C3

AUD5_SENS_MIC#
AUD5_SENS_HP#

29-D2,49-C4

1%

19

1%
20K
39.2K 1%

13
18

JDREF

SENSE_A
SENSE_B

AUD5_SENS_A_MN 39

3
1

R210 2.2K
C280

10000nF-X5R
10V

C278

C277

100nF
10V

100nF
10V

AUD5_PVDD_B_MN

42
43
7

CPVEE

MIC1_R_B
MIC1_L_B

EAPD_SPDIF02
SPDIF01

46

29-C4,34-B3 49-D4

CBN
CBP

PD#

47
48

20K

HPOUT_L_I
HPOUT_R_I

GPIO0_DMIC_DATA
GPIO1_DMIC_CLK

R277
R279

SPK_OUT_LSPK_OUT_L+

BEEP

2
3

R276

SPK_OUT_RSPK_OUT_R+

SDATA_OUT
BCLK
SDATA_IN
SYNC
RESET#

20-B3,49-A4

AUD5_PD#_D_MN

29-C4,34-B3 49-D4

DVDD
DVDD_IO

5
6
8
10
11

Do not make a testpoint in these nets

P5.0V_AUD
B533
BLM18PG181SN1
KBC3_SPKMUTE#

100nF
10V

20-B3,48-C2

C328

R209
100K
1%

KBC3_SPKMUTE#

C329

100nF
10V

1
9

C330

P3.3V

C279

U13
ALC269Q-GR

AUD3_SPKR_Q_MN

R278

HDA3_AUD_RST#

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
C281

R280
R212

G_AUD

AUD3_SPKR

Do not make a testpoint in these nets

MIC1_VREFO_R
MIC1_VREFO_L

MIC2_R_F
MIC2_L_F

MIC2_VREFO

PVDD1
PVDD2

LINE1_R_C
LINE1_L_C

PVSS1
PVSS2

LINE2_R_E
LINE2_L_E

C999

C1015

4700nF-X5R
10V

4700nF-X5R 100nF
10V
10V

C323

25
38

C276
100nF
10V

AVDD1
AVDD2

VREF

CPVREF

26
37

B537
B536

41 SPK5_L_M_MN
40 SPK5_L_P_MN
32
33

29-D3,49-B4
29-D3,49-B3

35 AUD5_CBN_MN
36 AUD5_CBP_MN
34 C273

C275

2200nF-X5R 10V

AVSS1
AVSS2

THERMAL

RGND-SHORT

SHORT510

RGND-SHORT

1
2
3
4
MNT1
MNT2

5
6

C1020

C1019

C1018

C1017

1nF
50V

1nF
50V

1nF
50V

1nF
50V

3711-000456

2200nF-X5R10V

Do not make a testpoint in these nets

AUD5_CPVEE_MN

C324
C325

22 AUD5_MIC1_RIGHT_C_MN
21 AUD5_MIC1_LEFT_C_MN

1000nF-X5R
1000nF-X5R

R274
R275

6.3V
6.3V

R205
R273

30 AUD5_MIC1_VREFO_R_MN
28 AUD5_MIC1_VREFO_L_MN

C326
C327

17 AUD5_MIC2_RIGHT_C_MN
16 AUD5_MIC2_LEFT_C_MN

1000nF-X5R
1000nF-X5R

24
23

1K 1%
1K 1%

4.7K
4.7K

6.3V
6.3V

Do not make a testpoint in these nets

29

29-B3
29-B3

AUD5_MIC1_RIGHT
AUD5_MIC1_LEFT

1%
1%
29-B4

29-B3

AUD5_MIC2_INT
AUD5_MIC2_VREF

C1014

ALC269Q_VB_GR

10000nF-X5R
6.3V

15
14

G_AUD

R837

20

Do not make a testpoint in these nets

27 AUD5_VREF_MN

31 AUD5_CPVREF_S_MN

SMT505

49

0-1005

C321

4700nF-X5R
25V

1205-003769
3.9V

SHORT509

J518
HDR-4P-1R-SMD

SPK5_R_M_B_MN
SPK5_R_P_B_MN
SPK5_L_M_B_MN
SPK5_L_P_B_MN

BLM18PG181SN1
BLM18PG181SN1

AUD5_HP_O_LEFT
AUD5_HP_O_RIGHT

G_AUD

DVSS

MONO_OUT

P4.75V_AUD

Do not make a testpoint in these nets

B539
BLM18PG181SN1
B538
BLM18PG181SN1

44 SPK5_R_M_MN
45 SPK5_R_P_MN

SMD_A : 3711-000922
SMD_S : 3711-000456
Do not make a testpoint in these nets

C322
100nF
10V

G_AUD

G_AUD

B23
BLM18PG181SN1

P5.0V_AUD

P4.75V_AUD

U17
MIC5252-4.75BM5

C334

C335

10000nF-X5R
10V

100nF
10V

1
2
3

SHORT511

R1608-SHORT

IN
OUT
GND
EN BYPASS

4 AUD5_LDO_BYPASS_MN

1203-003344

2nd Vendor : 1203-005579

(G916-475T1UF)

SHORT512

C331

100nF
10V

10000nF-X5R
10V

R1608-SHORT
R1608-SHORT

G_AUD

A
C332
1000nF-X5R

R1608-SHORT

C333

SHORT7

SHORT508

6.3V

DRAW

nostuff
nostuff

DATE

XIE BIN
CHECK

08/18/2009

G_AUD

APPROVAL

G_AUD

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

G_AUD

TITLE

0.1

ELECTRONICS

HDA_CODEC
AUDIO CODEC ALC269_GR (1/2)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

36

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

HEADPHONE

J517
JACK-PHONE-6P-BLACK

28-C2,49-B3

R207

56

AUD5_HP_RIGHT_R_MN

B25

BLM18PG181SN1

AUD5_HP_RIGHT_B_MN

28-C2,49-B4

R206

56

AUD5_HP_LEFT_R_MN

B24

BLM18PG181SN1

AUD5_HP_LEFT_B_MN

50V

50V

50V

0.1nF

0.1nF

0.1nF

C320

C343

AUD5_HP_O_LEFT

C342

AUD5_HP_O_RIGHT

5
4
3

28-C3,49-C4

AUD5_SENS_HP#

2
1

G1
G2

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

3722-002588|phone-jack-6p-4_ng

nostuff

G_AUD

Connect to Mount-hole.

AUD5_MIC2_INT

R852

1K 1%

C1016
47nF
50V

BLM18PG181SN1

AUD5_MIC1_LEFT_J_MN

50V

B21

50V

AUD5_MIC1_LEFT

0.1nF

28-C1

0.1nF

AUD5_MIC1_RIGHT_J_MN

MIC500
SOM4013SL-G443-C1033

AUD5_MIC2_INT_J_MN

AUD5_MIC2_INT_B_MN

MIC JACK
J515
JACK-PHONE-6P-BLACK
5
4
3
6
2
1

R
L
G1
G2
3722-002588|phone-jack-6p-4_ng

Mono Mic Assy : Place inside Audio Analog Plane

R851

28-C1

BLM18PG181SN1

AUD5_MIC2_VREF

4.7K
1%

B22

C272

28-C1

AUD5_MIC1_RIGHT

C318

AUD5_MIC1_LEFT

28-C1

50V

AUD5_MIC1_RIGHT

28-C3

0.1nF

AUD5_SENS_MIC#

C319

B17
BLM18PG181SN1

1
2

MIC_SIG
GND

J511
HDR-2P-SMD

C199

3003-001158

0.1nF
50V

G_AUD

3
4

C191

nostuff

10nF

25V

B
G_AUD

Connect to Mount-hole.

1
2
MNT1
MNT2

3711-000541

G_AUD

G_AUD

For SMD mic noise risk, dual design for second solution

C271

10nF

25V

C344

10nF

25V

C274

10nF

25V

G_AUD

A
DRAW

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

0.1

ELECTRONICS

HDA_CODEC
AUDIO CODEC ALC269_GR (2/2)

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

37

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LAN Controller (Marvell 88E8040)

P3.3V_AUX

PD_12_25

28
31

P3.3V_AUX

C571

C568

100nF
10V

100nF
10V

7
30
46

C557

C564

C570

C556

100nF
10V

100nF
10V

100nF
10V

4700nF-X5R
10V

2
6
23
34
29

P3.3V

VAUX_AVLBL

VDDO_TTL1
VDDO_TTL2
VDDO_TTL3

VMAIN_AVLBL

XTALI

VDD1
VDD2
VDD3
VDD4
VDD5

XTALO

TESTMODE

Place nearby PIN 29

P2.5V_LAN

15

C569
100nF
10V

C567
4700nF-X5R
10V

P3.3V_AUX

10 LAN1_TXP_MN
11 LAN1_TXCT_MN
9 LAN1_TXN_MN

1%
1%
1%
1%

9
10

2603-000099

TD+
TDRD+
TERM1
TERM2
RDTERM3
TERM4

MNT1
MNT2
3722-002843

Second Vendor:
2603-000115

C555
1nF

36

R570
8 LAN3_DISABLE#_R_MN

3KV

10K 1%

11 LAN3_XTALI_C_MN

10 LAN3_XTALO_C_MN

Y500
25MHz

35

Place crystal within 0.75inches from LAN chip.

2801-004517

RSET

VPD_CLK
VPD_DATA

LOM_DISABLE#

P1.2V_LAN

48

TD+
TX+
TDCT TXCT
TDTX-

16 LAN1_RXP_MN
14 LAN1_RXCT_MN
15 LAN1_RXN_MN

1K
1K
1K
1K

LED_LINK#

7
6
8

44
45

RD+
RX+
RDCT RXCT
RDRX-

J502
JACK-LAN-8P

1
2
3
LAN1_CABLE_TERMINATION2_MN 4
5
6
LAN1_CABLE_TERMINATION1_MN 7
8

R555
R554
R552
R553

LED_ACT#
LED_SPEED#

1
3
2

LAN3_MDI1P
LAN3_MDI1N
LAN3_MDI0P
LAN3_MDI0N

10V

nostuff

CLKREQ#
PU_VDDO_TTL

13
14
16
17

100nF

PEX3_LAN_PU_VDDO_TTL_R_MN 33

RXP
RXN
TXP
TXN

C543

32

R568

LT500
LFE8423

10V

LOM3_CLKREQ#

Place AC coupling capacitors

close to LAN chip.
21-A4
21-A4
12-B1,48-B2

PERST#
WAKE#
REFCLKP
REFCLKN
PCIE_TXP
PCIE_TXN
PCIE_RXP
PCIE_RXN

100nF

4
5
42
43
PEX3_LAN_RXP2_C_MN 37
PEX3_LAN_RXN2_C_MN 38
41
40

14-B1,21-C1 25-A4,32-C3 34-B3

22-C4,32-C4 34-C3,48-A3
12-B1
12-B1
21-B4
C565 100nF 10V
21-B4
C566 100nF 10V

C544

4.7K
1%

10K 1%

U504
88E8040-A0-NNB2C000

R577

R569
PLT3_RST#
PEX3_WAKE#
CLK1_PCIELOM
CLK1_PCIELOM#
PEX1_LAN_RXP2
PEX1_LAN_RXN2
PEX1_LAN_TXP2
PEX1_LAN_TXN2

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P2.5V_LAN

nostuff

P3.3V

1
39

RESERVED1
RESERVED2
RESERVED3
RESERVED4
RESERVED5
THERMAL
RESERVED6
RESERVED7
RESERVED8
RESERVED9
RESERVED10

AVDDL

AVDD2.5_OUT
AVDDL25

Place nearby PIN 1

12 LAN3_RSET_R_MN
18
19
20
21
22
49
24
25
26
27
47

R571

2K 1%

C559

C558

0.01nF
0.5pF
50V

0.01nF
0.5pF
50V

1205-003904

A
DRAW

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

0.1

ELECTRONICS

LAN
LAN_Marvell 88E8040

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

38

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Wireless LAN

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
WLAN, 4mm

P3.3V

P3.3V

P3.3V

C317

R836

100nF
10V

10K
1%

P3.3V

C1029
100nF
10V

J5
MINICARD-52P

MIN3_CLKREQ#
CLK1_MINIPCIE#
CLK1_MINIPCIE

22-C4,30-B3
34-C3,48-A3

12-B1,49-C4

12-B1
12-B1

R874

R875

100
1%

100
1%

PEX1_MINI_RXN0
PEX1_MINI_RXP0
PEX1_MINI_TXN0
PEX1_MINI_TXP0

21-B4
21-B4

21-B4
21-B4

For Half Minicard

BA61-01103A

17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

WAKE*
RSVD_1
RSVD_2
CLKREQ*
GND_2
REFCLKREFCLK+
GND_3

SIM_RSVD_C8
SIM_RSVD_C4
GND_5
PERN0
PERP0
GND_7
GND_8
PETN0
PETP0
GND_10
RSVD_11
RSVD_12
RSVD_13
RSVD_14
RSVD_15
RSVD_16
RSVD_17
RSVD_18

P3.3V_1
GND_1
P1.5V_1
SIM_VCC_C1
SIM_DATAIO_C7
SIM_CLK_C3
SIM_RESET_C2
SIM_VPP_C6

GND_4
W_DISABLE*
PERST*
P3.3V_AUX
GND_6
P1.5V_2
SMB_CLK
SMB_DATA
GND_9
USB_DUSB_D+
GND_11
LED_WWAN*
LED_WLAN*
LED_WPAN*
P1.5V_3
GND_12
P3.3V_2
MNT1
MNT2

2
4
6
8
10
12
14
16

18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52

R271

KBC3_RFOFF#

32-C1,34-B3

36-B4,48-B4

CHP3_RFOFF#
PLT3_RST#

34-B3
25-A4,30-B3
14-B1,21-C1

R270

R272 100 1%

CHP3_RFOFF#

32-C3,34-B3

KBC3_RFOFF#

R269

WLON_LED#

Q32
RHU002N06

USB3_MINI1USB3_MINI1+

Mini PCI Express Card

30.00 mm

53
54

3709-001506

Top

Pin 1

48.05 mm

M503
HEAD
DIA
LENGTH

1
3
5
7
9
11
13
15

50.95 mm

PEX3_WAKE#

P3.3V

Odd Pins : Top side

Even Pins : Bottom Side

C269

10000nF-X5R
6.3V

C341

C270

100nF

100nF

A
DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

DATE

0.1

PART NO.

Wiress LAN

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

MINI_PCIE_CONN

PAGE

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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Card Reader (AU6336)

P1.8V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

P3.3V_MCD

P3.3V_MCD

R265

P3.3V

R290

C311
1000nF-X5R
6.3V

C316

C315

100nF
10V

100nF
10V

C314

150K
1%

U16
AU6336C52-MWF

1000nF-X5R
6.3V

2
9
14
28
8

3
4

USB3_MMC+
USB3_MMC-

20
MCD3_RSTN_C_MN 27

25

CLK3_MMC48
C310
470nF
16V

6
7

VD33P
VDDHM
VDD33C
VDD
VDDU
DP
DM

SD_V33

SDDATA0
SDDATA1
SDDATA2
SDDATA3
SDDATA4
SDDATA5
SDDATA6
SDDATA7

CLED

RSTN
EXTCLK
NC1
NC2

TRIST
SDCDN
SDWP
SDCMD
SDCLK

100nF
10V

R287
100K
1%

24
17
19
21
22
23
12
11

MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDDATA3

MCD3_SDDATA3
MCD3_SDCMD

R291

49.9

6.3V

2
3
4
5
6
MCD3_SDDATA0_R_MN 7
MCD3_SDDATA1_R_MN 8
MCD3_SDDATA2_R_MN 9
10
11

MCD3_SDCLK

10
13
18
16
26

MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDCD#
MCD3_SDWP

MCD3_SDCD#

MCD3_SDWP
MCD3_SDCMD
MCD3_SDCLK

330

1
5 MCD3_PEXT_R_MN
29

R266

R289
R288
R292

49.9
49.9
49.9

1%
1%
1%

22

C313

C312

0.01nF
0.5pF
50V

0.01nF
0.5pF
50V

MCD3_SD_SPD

PU / PD : No Stuff
PU : Stuff, PD : No Stuff

MCD3_CLK_IN

J6
EDGE-SD-9P

MCD3_SDDATA3_R_MN 1

1%

0904-002453

C339
1000nF-X5R

15

R267

REXT
VS33P
GND

C340

40mil pattern

12
13

CD_DAT3
CMD
VSS1
VDD
CLK
VSS2
DAT0
DAT1
DAT2
CARD_DETECT
WRITE_PROTECT
MNT1
MNT2
3709-001492

3-in-1 Socket
Support : SD/MMC/SDHC

SD v1.0 Clock Option

24 MHz (default)
15 MHz

827S Clock Source option

PU : X, PD : X
PU : No Stuff, PD : Stuff

12MHz, fixed S/N

12MHz, no S/N

PU : Stuff, PD : No Stuff

48MHz

A
DRAW

DATE

XIE BIN
CHECK

APPROVAL

08/18/2009

Suzhou-D

ADV

MULTICARD

0.1

3 IN 1 CARD

REV

BC LEE
MODULE CODE

TITLE

SAMSUNG

DEV. STEP

GUO LEI

ELECTRONICS
PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

40

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Express Card Connector

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V_AUX P1.5V

P3.3V

P3.3V

J514
SOCK-30P-2R-SMD-MNT

PEX1_EXPCARD_RXN1
PEX1_EXPCARD_RXP1
EXP3_CLKREQ#

USB3_EXPCARD+
USB3_EXPCARD-

2
1
3
4
5
6
7
8
10
9
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
MNT1
MNT2

SMB3_CLK
SMB3_DATA
PEX3_WAKE#

CHP3_SLPS3#
PLT3_RST#

PEX1_EXPCARD_TXN1
PEX1_EXPCARD_TXP1
EXP3_CPPE#
CLK1_EXPCARD#
CLK1_EXPCARD

31
32

3710-002498

A
DRAW

DATE

XIE BIN
GUO LEI
APPROVAL

SAMSUNG

Suzhou-D

ELECTRONICS

ADV
REV

BC LEE
MODULE CODE

TITLE

08/18/2009
DEV. STEP

CHECK

0.1

EXPRESS CARD

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

41

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SATA I/F CONN

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

SATA HDD CONN

ODD CONN

JHDD1
HDD-22P-SMD
S1
S2
S3
S4
S5
S6
S7

20-B3
20-B3

SATA1_HDD_TXP0
SATA1_HDD_TXN0

20-B3
20-B3

SATA1_HDD_RXN0
SATA1_HDD_RXP0

P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15

P3.3V

C266

C265

C237

10000nF-X5R
6.3V

100nF
10V

100nF
10V

nostuff

P5.0V

C268

C309

C267

C308

C264

100nF
10V

10000nF-X5R
6.3V

10000nF-X5R

100nF
10V

100nF
10V

6.3V

M1
M2

GND1
TX+
TXGND2
RXRX+
GND3

S1
S2
S3
S4
S5
S6
S7

SATA1_ODD_TXP1
SATA1_ODD_TXN1

V3.3_1
V3.3_2
V3.3_3
GND4
GND5
GND6
V5_1
V5_2
V5_3
GND7
RESERVE
GND8
V12_1
V12_2
V12_3

SATA1_ODD_RXN1
SATA1_ODD_RXP1

P5.0V

C212

C186

C210

C187

C211

100nF
10V

10000nF-X5R
6.3V

10000nF-X5R
6.3V

100nF
10V

100nF
10V

P1
P2
P3
P4
P5
P6
14
15

J4
CDROM-SATA-13P
GND_1
TX+
TXGND_2
RXRX+
GND_3
DP
P5V_1
P5V_2
MD
GND_4
GND_5
MNT1
MNT2
3710-002796

3710-002798
nostuff

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

HDD & ODD SUB BONNECTOR

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

SATA_DEVICES

PAGE

42

OF

58

1
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MDC Connector

BLUETOOTH

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V_AUX

J520
SOCK-12P-2R-SMD
HDA3_MDC_SDO

C
HDA3_MDC_SYNC
HDA3_MDC_SDI1
HDA3_MDC_RST#

R866

33

R868

1%

HDA3_MDC_SDI1_R_MN

13
14
15
16
17
18

R867

10K

10K

1
2
3
4
5
6
7
8
9
10
11 12
MNT1
MNT2
MNT3
MNT4
MNT5
MNT6

C1031
100nF
10V

C1032

10000nF-X5R
6.3V

P3.3V

R865
10K

nostuff

3710-002133

nostuff

HDA3_MDC_BCLK

C1028

C1027

100nF
10V

100nF
10V

J516
HDR-6P-SMD

USB3_BTUSB3_BT+

22-B1
22-B1

7
8

1
2
3
4
5
6
MNT1
MNT2

3711-003057

J510
HDR-2P-SMD

1
2
MNT1
MNT2

B511
B512
3
4

3711-000541

CIC21J601NE
CIC21J601NE

C136

C137

1nF
3KV

1nF
3KV

J507
JACK-MODEM-2P

1
2
3
4

RING
TIP

MNT1
MNT2

3722-002246

To MDC card.
SUB_GND_A

SUB_GND_A

EMI

EMI500

CONTACT-PLATE-EMI

To RJ11 cable. (Connect with BA39-00593A)

M504
HEAD
DIA
LENGTH

BA61-00963A

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

MODEM & BLUETOOTH

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

HDA_MODEM & BLUETOOTH

PAGE

43

OF

58

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www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LEFT USB PORT

P5.0V_AUX

C959
100nF
10V

U513
TPS2062

KBC3_USBPWRON#

Need 2A Routing

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
2
8
5
3
4

IN

OUT1
OC1*
OC2* OUT2
EN1*
EN2* GND

C189

EC15
100uF

C190

C188

100nF

100nF

10V

16V

10V

0.033nF
50V

nostuff
nostuff

1205-002596

J512
JACK-USB-4P
PWR
DD+
GND

MNT1
MNT2
MNT3
MNT4

USB3_P1USB3_P1+

5
6
7
8

3722-002767

J513
JACK-USB-4P
PWR
DD+
GND

MNT1
MNT2
MNT3
MNT4

USB3_P6USB3_P6+

5
6
7
8

3722-002767

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

0.1

USB_CONNECTOR (1/2)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

USB_CONNECTOR

PAGE

44

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

USB PORT & POWER S/W SUB BD

TOP RIGHT USB PORT

MAIN TO SUB USB CONN

P5.0V_AUX

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P5.0V_USB_SUB

J505
JACK-USB-4P

C38

2
8
5
3
4

KBC3_USBPWRON#

5
6
7
8

IN

OUT1
OC1*
OC2* OUT2
EN1*
EN2* GND

7
6
1

C29

C26

C27

C28

100nF
6.3V

100nF
25V

1000nF-X5R
10V
25V

100nF

EC4
100uF

C30

C31

100nF

16V

10V

0.033nF
50V

1205-002596

PWR
DD+
GND

USB3_P0-_SUB
USB3_P0+_SUB

P5.0V_AUX_C

Need 2A Routing

U2
TPS2062

10V
100nF

Need 2A Routing

nostuff
nostuff

P3.3V

MNT1
MNT2
MNT3
MNT4

3722-002767

J503
HDR-10P-SMD

C542
100nF
10V

1
2
3
4
5
6
7
8
9
10

G_SUB

USB3_P0USB3_P0+

KBC3_PWRSW#

Power Button

P3.3V_MICOM

11
MNT1
12

MNT2

3711-002050

70V

BAV99LT1
D501

SW500
SW-TACT-4P

SUB TO MAIN USB CONN

Type : angle

KBC3_PWRSW#_SUB

P3.3V_SUB

P5.0V_USB_SUB

G_SUB

C83

100nF
10V

Power ON LED

G_SUB

USB3_P0-_SUB
USB3_P0+_SUB

KBC3_PWRSW#_SUB

P3.3V_SUB

LED500
LTST-C193TBKT-AC
1

1
2
3
4
5
6
7
8
9
10

11
MNT1
12 MNT2
3711-000386

R653

J1
HDR-10P-1R-SMD

475

1%

SYS3_LED_POWER_MN

G_SUB

Put this LED located near PWRSW from ME recommedation

DRAW

Power LED, Blue color

DATE

XIE BIN

TITLE

08/18/2009

G_SUB
CHECK

APPROVAL

ADV
REV

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

0.1

USB_CONNECTOR (2/2)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

USB_CONNECTOR

PAGE

45

OF

58

1
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www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CHARGER & POWER MANAGEMENT

VDC_ADPT

C519
4
5
6
7

MNT1
MNT2
MNT3
MNT4

100nF
25V

C501 C500

C502

R523 R522 R524

100nF
25V

10nF

20

20

20

25V

1%

1%

1%

100nF
25V

B500
HU-1M2012-121JT

C522
4700nF-X5R
25V

C521
4700nF-X5R
25V

100nF 25V

nostuff

GND_1

PNS_CHGVR_DCJACK_QB_MN

C1510 1000nF-X5R
25V

FOR EMI

PNS_CHGVR_DCJACK_MN

1
3

POWER J500
GND_2

1
2
3
4

C520

B501
HU-1M2012-121JT

JACK-DC-POWER-3P-MNT

R521 100K 1%

S1
S2
S3
G

D1
D2
D3
D4

VDC
VDC_CHG

Q504
AP4435GM

Q508
AP4435GM

8
7
6
5

8
7
6
5

-30V

0.02
1
2
3
4

D1 S1
D2 S2
D3 S3
D4 G
-30V

1W
1%

R573

R516

R517

300K
1%

2.2

22

EC3
68uF

C13
4700nF-X5R
25V

25V
AL

EC5
68uF

C14

25V
AL

100nF
25V

S1
S2
S3
G

8
7
6
5

D1
D2
D3
D4

FOR EMI

C19

C20

100nF
25V

100nF
25V

C541
10nF
25V

C517
BGATE

100nF
25V

100K
1%

1
2
3
4

nostuff

nostuff

R519

3722-002997

U1
AP4435GM

R572

CHGVR_BATDRV#_MN

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AP4232BGM -> New

D1 7

Q509
RHU002N06

D2

G_CHG

1000nF-X5R

R23

25V

5.1
1%

13
26

CHGVR_VDDP_MN

CHGVR_VDD_MN

7
9
8
5

CHGVR_CHLIM_MN
CHGVR_VADJ_MN

CHGVR_ACLIM_MN

R541

CHGVR_ICM_MN

10K
1%
3

R537

10K 1%G

60V

1
S

R538

12.594V@1.188V

470K

nostuff
G_CHG

G_CHG

R547

R544

24.3K
1%

10K
1%

R546

R545

R542

R543

30K
1%

300K
1%

200K
1%

30K
1%

CHGVR_VADJ_RQ_MN

3
G_CHG

CHGVR_KBC3_CHG4.2V_RQ_MN

KBC3_CHG4.2V

R548

10K 1%

60V
S

R549
470K

Q507
RHU002N06

R536
100
1%

4.32A@1.74V
3.03A@0.506V

C536

C537

6.8nF
50V

10nF
25V

C538
100nF
25V

G_CHG
G_CHG

High : VCELL to 4.200V

Low : VCELL to 4.350V

3
4

CHGVR_VCOMP_MN

13.05V@2.058V

SGATE
DCIN
ACSET
DCSET

BGATE

G_CHG

R535
10K
1%

23
24

BOOT
UGATE
PHASE
LGATE
PGND

VDDP
VDD

CHLIM
VADJ
ACLIM
ICM

CSOP
CSON

ICOMP
VCOMP

CELLS
GND

ACPRN
DCPRN

THERM

R15

14
15
16
12
11

PNS_CHGVR_BST_MN
PNS_CHGVR_TG_MN

BAT3_DETECT#
C23
0.1nF
50V

nostuff

B4
BLM18PG181SN1
BAT3_SMDATA#

PNS_CHGVR_BST_RC_MN

0.1nF

C21
0.1nF

nostuff

50V

1K
1%

VDD

GND

C535

Float

1nF
50V

KBC3_CHGEN

G_CHG

G_CHG

G_CHG

G_CHG

P3.3V_MICOM

R13
20K
1%

nostuff
G_CHG

BAT3_SMDATA#

R744

100

1%

BAT3_SMCLK#

R743

100

1%

R770

100

1%

BAT3_DETECT#
ADT3_SEL#
(ACTIVE LOW)

SHORT2

Adapter configuration

DRAW

90W / 4.32A / 91.2%

SEC Code
Value

Rtop

200K

2007-007334

10K

2007-007142

Rbot

27.4K

2007-007274

30K

2007-008275

08/18/2009
ADV

GUO LEI
REV

BC LEE

0.1

ELECTRONICS

CHARGER
CHARGER (EQ24751BR)

PART NO.

BA41-xxxxxxA

G_CHG
MODULE CODE

SAMSUNG

Suzhou-D

LAST EDIT

July 15, 2009 19:25:13 PM

www.manuals.clan.su

KBC3_SMCLK#
KBC3_BATDET#

DEV. STEP

CHECK

APPROVAL

COM-22C-015(1996.6.5) REV. 3

KBC3_SMDATA#

TITLE

DATE

XIE BIN

INSTPAR

60W / 3.03A / 96%

Value
SEC Code

P3.3V_MICOM

R533

Cells N/B

B3
BLM18PG181SN1
BAT3_SMCLK#

CHGVR_EN_MN

CELLS

nostuff

50V

P2.39V_VREF

2
10

3711-007023

B5
BLM18PG181SN1

100nF
25V

C22

BATT-CONN-7P
J501

C4

ANS_CHGVR_BG_MN

29

B1
HU-1M2012-121JT

CHGVR_BAT3_DETECT#_CBJ_MN

C17

C16

47nF
50V

21 CHGVR_CSOP_MN
22 CHGVR_CSON_MN
6
1

C15

C3

PNS_CHGVR_PHASE_MN

1203-005849
R1425V

G_CHG

17

1nF
50V

1%

C518
1nF
50V

3.3

VREF
EN

CHGVR_ICOMP_MN

Q506
RHU002N06

G_CHG

KBC3_PRECHG

CSIN

R12

22

C540

CHGVR_KBC3_PRECHG_RQ_MN

P2.39V_VREF
P2.39V_VREF

CHGVR_DCPRN_MN

CHGVR_CHLIM_RQ_MN

CHGVR_VCOMP_RC_MN

150K
1%

CHGVR_ICM_RC_MN

R540

CSIP

R11
4700nF-X5R
25V 22

CHGVR_ACSET_MN

CHGVR_DCSET_MN

2.5A@1.024V
0.268A@0.107V

7
6
5
4
3
2

(1.26V)

C533

10
1%

PNS_CHGVR_PHASE_RC_MN

70V

18
25
27
28

CHGVR_DCIN_MN

P2.39V_VREF

10
1%

C34

nostuff

20 CHGVR_CSIN_MN

CHGVR_SGATE_MN

G_CHG

R550

CHGVR_BAT3_SMDATA#_CBJ_MN

U503
ISL6255AHRZ-T

19

G_CHG

R551

CHGVR_BAT3_SMCLK#_CBJ_MN

C539

1000nF-X5R
25V

200K
1%

ANS_CHGVR_VDC_CHG_BJ_MN

SIQ1048-R100

S
ANS_CHGVR_BG_MN

Q1-2
AP4232BGM-HF

27.4K
1%

R539

D2

G_CHG

R21

10nF
25V

30K
1%

B2
HU-1M2012-121JT

R24
0.02
L1
1W
10uH CHGVR_PHASE_RL_MN
1%

70V

300K
1%

15.15V@1.264V

C12

R22

R18

300K
1%

300K
1%

D1 5

D500
BAT54A

CHGVR_CSIP_MN

30V

R19

nostuff
R20

PNS_CHGVR_PHASE_MN

100nF
25V

VDC

VDC_ADPT

C534

BGATE

Q1-1
AP4232BGM-HF

G
PNS_CHGVR_TG_MN

ADT3_SEL#

R518

470K

100nF
25V
4700nF-X5R
25V
4700nF-X5R
25V
4700nF-X5R
25V

nostuff

D509
BAV99LT1

-50V

CHGVR_P3.3V_MICOM_RQ_MN

R25

C18

10K
1%

R557

60V

Q505
BSS84

D510
BAV99LT1

EMI

43.2K
1%

70V

VCHG=12.597V@2600Cell
VCHG=13.05V@2950Cell
IPRECHG=0.27A
ICHG=2.56A FOR 5200mAh & 4000mAh

R556 P3.3V_MICOM

D508
BAV99LT1

25V

100nF

25V

C2

100nF

C1

CHGVR_SGATE_RRQ_MN

CHGVR_SGATE_R_MN

PAGE

46

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

P3.3V_AUX & P5.0V_AUX

VDC
VDC

R294
300K
1%

R299
R293
100K
1%

C348
4700nF-X5R
25V

100nF
25V

100nF
25V

Q31-1
D1 7
8 AP4232BGM-HF

P5.0V_AUX
L14
3.3uH

Nichicon New($0.09)

6.3V
2409-001175
15mohm
CAN 6T

C945

C1022

R803

R804

10

10

D1

16
21

20

R855

100nF
25V

D2

VIN

EN

13

3.3

PNS_SYSVR_BST1_MN

22

UGATE1

UGATE2

PHASE1

PHASE2

BOOT1

BOOT2

LGATE1

LGATE2

10

C966

nostuff
nostuff
nostuff

ANS_SYSVR_BG1_MN

4
C990
1nF
50V

Q31-2
AP4232BGM-HF
7.6V

1nF
50V

470K
1%

C293
0.22nF
50V

Set : 5.064V
PSV -> 5.129
FCCM -> 5.100

24

11

PNS_SYSVR_PHASE2_MN

R853
3.3

VOUT1

VOUT2

470K
1%

10K
1%

FB1

FB2

REF

C338

KBC3_SUSPWR_RQ_MN

1
S

KBC3_SUSPWR

SMT506

0-1005
S

C337
4.7nF
25V

Q34

TONSEL

10nF
25V

1
S

P5.0V_STB

Q535

G_P3.3V

P3.3V_MICOM

C1030

C336

22000nF-X5R
20%
6.3V

10000nF-X5R
6.3V

SMT8

P2.0V_REF P3.3V_MICOM
nostuff

SMT7

R283

0-1005

SKIPSEL

14

SYSVR_SKIPSEL_MN

330KHz/375KHz@RT8205
245KHz/305KHz@TPS51125

P12V_ALW

400KHz/500KHz@RT8205
365KHz/460KHz@TPS51125

VDC

R115
30K
1%

(PWM)

G_P3.3V

G_P3.3V

C167
1nF
50V

4700nF-X5R
25V

Q534
RHU002N06

DRAW

CHECK

G_P3.3V

475K
1%

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

XIE BIN

R839

C168

INSTPAR
D

KBC3_SUSPWR

Q13
MMBT3904
2

SHORT513

KBC3_SUSPWR_QR_MN

3
1

R840
100K

P12.0V_ALW

(Auto Skip)

nostuff

R297

G_P3.3V

nostuff
nostuff
nostuff

0-1005

PGND

1203-005735

2 RHU002N06 G_P3.3V

Set : 3.333V

ENTRIP1

100K
1%

nostuff

0.22nF
50V

P3.3V_MICOM

15

C292

SYSVR_TONSEL_MN

G_P3.3V

SYSVR_ENTRIP1_MN

R854

C291

G_P3.3V

VREG3

PGOOD

2 RHU002N06

G_P3.3V

6.3V
2409-001175
Can 4.5T
18mohm

17

ENTRIP2

PAD

10K
1%

R282

25

R232

VREG5

23

80.6K
1%

Q33
RHU002N06

1nF
50V

nostuff
nostuff
nostuff

15K
1%

P5.0V_STB

100K
1%

C965

G_P3.3V

100K
1%

100nF
10V

PNS_SYSVR_PHASE2_RC_MN

Q30-2
AP4232BGM-HF

220nF
16V

R284

SYSVR_ENTRIP2_MN

Nichicon New($0.09)
EC13
330uF

C944

P3.3V_MICOM

AUX3_PWRGD

10
1%

SYSVR_FB2_MN

R233

NC

R801

SYSVR_VOUT2_MN

P2.0V_REF

18

10K
1%

R802

10
1%

MS-RH7040S-L72
2703-000339

R234

R285

PNS_SYSVR_BST2_RC_MN

ANS_SYSVR_BG2_MN

15K
1%

R286

L13
3.3uH

D2

G_P3.3V

R281

P3.3V_AUX
Misan , Maglayer -> New

Q30-1
AP4232BGM-HF

D1 5

12

R235

SYSVR_FB1_MN

P5.0V_STB

8
D2

C989
1nF
50V

SYSVR_VOUT1_MN

nostuff

D1 7

PNS_SYSVR_BST2_MN

19

G
PNS_SYSVR_PHASE1_RC_MN

R295
PNS_SYSVR_TG2_MN

G_P3.3V

PNS_SYSVR_BST1_RC_MN

100nF
10V

25V
AL

AP4232BGM -> NEW

nostuff

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
PNS_SYSVR_TG1_MN

PNS_SYSVR_PHASE1_MN

MS-RH7040S-L72
2703-000339

EC14
330uF

EC20
68uF

100nF
25V

G_P3.3V

U519
RT8205AGQW TPS51125 2nd

7.6V

D2

Misan , Maglayer -> New

C1000

C1001

100nF
25V

25V
AL

C1002

SYSVR_VIN_MN

EC21
68uF

FOR EMI

FOR EMI

VDC

KBC3_RST#

3.3

BZX84C12L
ZD1

VDC

C1021

0.1

P3.3V_AUX & P5.0V_AUX

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_MV_3V_5V

PAGE

47

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DDR2 Power

VDC
FOR EMI

P5.0V_STB

P5.0V_STB

U3
APW7141QAITRG
10

PVCC

C37

UGATE
TON

13
2

PNS_DDR2VR_BST_MN

14

100nF
25V

3 4 9
D1 D2 D3 D4

Misan,Maglayer NEW

R26
200K
1%

PNS_DDR2VR_BST_RC_MN

VCC

C24

PHASE

12

350KHz

Q2
AON6912L

G1

L5
1.5uH

30V

S1_D2

PNS_DDR3VR_PHASE_MN

10

1000nF-X5R
6.3V

P3.3V_AUX

G2

G_DDR

LGATE

R42

ANS_DDR2VR_BG_MN

5 6 7

DDR2VR_PGOOD_MN

KBC3_SUSPWR

R38

1K
1%

DDR3VR_EN_PSV_MN

DDR2VR_TRIP_MN

AUX3_PWRGD

R37

1K 1%

R39

68.1K
1%

C35
100nF
10V

DDR2VR_KBC3_SUSPWR_RRD_MN

11

R41

10K
1%

15

EN

VOUT

G_DDR

G_DDR

100nF
10V

2.5V
2409-001176
15mohm
CAN 6T

1nF
50V

R625

1%
100

C
CPU1_VDDIO_FB#
CPU1_VDDIO_FB

GND

R626

1%
100

0.1nF
50V

17.4K
1%

DDR2VR_VFB_MN

SET : 1.80V

R29

12.4K
1%

OCP : 10.3A@11mohm

G_DDR

EC7
330uF

C69

C25

R28

FB

10
1%

nostuff

OCSET

THERMAL

10
1%

Nichicon New($0.09)

MS-RH7040-1R5
2703-000178

C45

50V

1203-006049
5V

G_DDR

R55

PNS_DDR2VR_PHASE_RC_MN

C576
RdsOn : 11mohmMAX
1nF

POK

PGND

D1
MMBD4148
75V

R56

S1 S2 S3

100K
1%

25V
AL

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
4

DDR2VR_VCC_MN

nostuff

4700nF-X5R
25V

P1.8V_AUX
2

C36

2.2
BOOT

C39

100nF
25V

DDR2VR_TON_MN

R40

2.2

C40

PNS_DDR2VR_TG_MN

4700nF-X5R
25V

R27

D
EC6
68uF

SHORT3
INSTPAR

G_DDR

G_DDR

DDR2 VTT(P0.9V_AUX)

P5.0V_AUX

P1.8V_AUX

U8
APL5336KAITRG

C701

10000nF-X5R
6.3V

VIN

R680
100K
1%

P5.0V_AUX

DDR2VR_VREF_P0.9V_MN

R651

Q519
RHU002N06
60V

DDR2VR_P5.0V_ALW_VREF_RQ_MN

DDR2VR_KBC3_PWRON_P0.9V_RCQ_MN

AUX3_PWRGD

R652

1K
1%
10nF
25V

100nF
10V

100K
1%

nostuff

1
S

VREF

VOUT

P0.9V_AUX

GND

PAD

C117

6
7
5
8

1000nF-X5R
6.3V

DDR2VR_VOUT_0.9V_MN

C727

R681

C118

10000nF-X5R
6.3V

1203-006083
7V

CPU1_VTTSENSE

Q520
RHU002N06

C700

100K
1%

VCNTL
NC_2
NC_1
NC_3

R79

60V

1%
100

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

PART NO.

DDR2 POWER

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_MEMORY

PAGE

48

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CPU VRM [INTERSIL]

P5.0V

VDC

P5.0V

VDC
R10

R515

2.2

2.2

D
100nF

C33

U502
ISL6265HRTZ-T

25V
CPUVR_VIN_MN

48

G_CPU

G_CPU

G_CPU

30

CPUVR_PVCC_MN
CPUVR_VCC_MN

47

1K
1%

COUVR_FBO_RC_MN

220
1%

R512

120K
1%

220nF
25V

PVCC

BOOT_0
PHASE_0

35
33

R34

30V

3.3

Q514
SIR164DP-T1-GE3

VIDIFF_0

ANS_CPUVR_LGATE0_MN

31

LGATE_0

50V

10

Q515 5D
SIR164DP-T1-GE3
nostuff

C514

FB_0

30V

1 2 3

S1 S2 S3

1nF
50V

1 2 3

6.19K
1%

1nF

C527

50V

20K
1%

MPO104-R39

C546

12.7K
1%

25V

PGND_0

COMP_0

CPUVR_VWO_MN

1nF

12

ISP_0
ISN_0

VW0

13
14

R2

97.6K
CPUVR_RBIAS_MN
1%
7
8

CPUVR_ISP0_RTC_MN
4.99K 1%

R6

1nF
50V

RBIAS
OCSET

UGATE_1

COMP_1

BOOT_1
PHASE_1

26

220nF
25V

CPU1_PWRGDCPU

R527
R528

P1.8V_AUX

P3.3V

COUVR_ENABLE_MN

SMT1
R9
R8

15
16
18
17

CPUVR_VSEN1_MN

CPUVR_RTN1_MN

0-1005
nostuff
0
nostuff
0

ANS_CPUVR_LGATE1_MN

Q510 D
SIR164DP-T1-GE3

PGND_1

30V

30V

S1 S2 S3

1 2 3

3.3V

VFIXEN
OFS
Disable Enable

GND

Enable

Disable

5V

Disable

Disable

SVC
0
0
1
1

SVD
0
1
0
1

VOUT
1.4V
1.2V
1.0V
0.8V

G_CPU

C7
C9

1nF 50V
0.007nF

45

ISP_1
ISN_1

VSEN0
RTN0
VSEN1
RTN1

PGOOD

UGATE_NB

SVC
0
0
1
1

SVD
0
1
0
1

VOUT
1.1V
1.0V
0.9V
0.8V

150K
1%

C525

1nF
50V

1nF
50V

EC501
330uF
2V
AL

25V

1nF

4.99K
1%

10K 1%

Q516-1

37

AO4822AL
220nF
PNS_CPUVR_UGATE_NB_MN
25V
G

36
38

Q516-2

D1 7

LGATE_NB

39

ANS_CPUVR_LGATE_NB_MN

PGND_NB

40

1nF
50V

FB_NB

OCSET_NB
VSEN_NB
RTN_NB

EP

41
43
42

C550

4700nF-X5R
25V

L4
3.3uH

1 30V

D1 5

C560

100nF
25V

R565 R574

10

MS-RH7040S-L72

U4
330uF
2V
AL

R530

C549

3 30V

VDD_CPU_NB

nostuff
10

AO4822AL G

COMP_NB

Place 4700nF like Zigzag

C561

D2

D2

0.33nF

49

100nF

VDC

nostuff

CPUVR_FB_NB_MN
C11

C545

12.7K
1%

4.99K 1%

C526

FSET_NB

50V

R17

MPO104-R39

R561

OFS_VFIXEN

CPUVR_COMP_NB_MN

46

Pre-PWROK Metal VID

CPU_CORE

L2
0.39uH

CPUVR_ISP1_MN

23
24

CPUVR_FSET_NB_MN

44

25V
AL

R560

C528

20K 1%

EC1
68uF

C547

PNS_CPUVR_PHASE_NB_MN

R16

4700nF-X5R
25V

28

PNS_CPUVR_BOOT_NB_MN

VFIXEN VID CODES

C529

4700nF-X5R
25V

R559CPUVR_ISP1_RTC_MN
R871

BOOT_NB
PHASE_NB

OFS/VFIXEN(1Pin)

C10

100nF
25V

50V

SVD
SVC
ENABLE
PWROK

G_CPU

VRM3_CPU_PWRGD

S1 S2 S3

1 2 3
5

P5.0V

G_CPU

2K
1%

29

30V

S1 S2 S3

0
10K 1%

P3.3V

VW1

C6

3.3

Q511
SIR164DP-T1-GE3
nostuff

LGATE_1

CPUVR_OFS_VFIXEN_MN

R7

R33

1 2 3

SHORT1
CPU1_VDD_FB
CPU1_VDD_FB#

25
27

10 1%

FB_1

Q512
SIR474DP-T1-GE3

C32

PNS_CPUVR_UGAGE1_MN

10 1%

G_CPU

VIDFF_1

nostuff
nostuff

4
5
6
3

VDC

1nF
50V

R529

1K
1%

R3

1K
1%

22

10K 1%

C523 C524

R563

19

4.99K
1%

R870

CPUVR_ISP0_MN

PNS_CPUVR_PHASE1_MN

CPU1_SVD
CPU1_SVC
KBC3_VRON

2V
AL
2402-001306

R558

PNS_CPUVR_BOOT1_MN
PNS_CPUVR_BOOT1_RC_MN

R5
0

EC500
330uF

2V
AL

C548

32

R562

21

R4
0

EC502
330uF

100nF

50V

11

20

G_CPU

4700nF-X5R
25V

25V
AL

CPU_CORE

R32

CPUVR_OCSET_MN

P1.8V_AUX

C530

EC2
68uF

S1 S2 S3

0.18nF 50V

R526

R1

30V

VPUVR_COMP0_MN

C513

COUVR_COMP0_RC_MN

G_CPU

4700nF-X5R
25V

L3
0.39uH

S1 S2 S3

1 2 3
5

PNS_CPUVR_PHASE0_MN

VCC

C532

100nF
25V

PNS_CPUVR_BOOT0_MN
PNS_CPUVR_BOOT0_RC_MN

3.3nF

C515

CPUVR_FB0_MN

PNS_CPUVR_UGATE0_MN

C531

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

R513

VDD_NB Freq = 1 / ( ( 1.5*10^-6) * Rfsetnb ) Hz

: 303KHz@22Kohm

34

CPUVR_VIDIFF0_MN

R514

VDD Freq = ( R_VW & COMP / 2.33 + 0.29 ) uS

: 342.6KHz@6.8Kohm

UGATE_0

VIN

10 1%

10V

Q513
SIR474DP-T1-GE3

10 1%

1000nF-X5R
25V

100nF

C516

R564

C5

R534

C8

12.7K
1%

1nF
50V

2402-001306

R532
100
1%

nostuff

CPUVR_OCSET_NB_MN

R531
100
1%

CPU1_VDDNB_FB
CPU1_VDDNB_FB#

1203-005313
5V

G_CPU

SHORT500

DRAW

INSTPAR

XIE BIN

08/18/2009

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

G_CPU

TITLE

DATE

0.1

CPU VRM (IMVP6+)

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_CPU_MV_ISL6265HRT

PAGE

49

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CHIPSET POWER(P1.1V)
VDC

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
FOR EMI

P5.0V_AUX

U15
APW7141QAITRG

10

P5.0V_AUX

PVCC

C243

UGATE
TON

13
2

2.2

BOOT

CHSETVR_P1.1V_VCC_MN

14

C244

100nF
25V
PNS_CHSETVR_P1.1V_BST_MN
PNS_CHSETVR_BST_P1.1V_RC_MN

VCC

C289

PHASE

12

R230

350KHz

CHSETVR_P1.1V_PGOOD_MN

75V

R231 30K

C290

1%

10nF
25V

G_P1.1V

CHSETVR_P1.1V_TRIP_MN

11

13K
1%

15

L12
1.5uH

R800

10
Q529-2
AP4232BGM-HF 1%

4G

ANS_CHSETVR_P1.1V_BG_MN

POK

R799

Nichicon New($0.09)

MS-RH7040-1R5
2703-000178

10
1%

3 7.6V

C942
100nF
10V

EN

VOUT

2.5V
2409-001176
15mohm
CAN 46T

1nF
50V

CHSETVR_P1.1V_VOUT_MN

R228
4.7K
1%

GND

FB

EC12
330uF

nostuff

OCSET

THERMAL

C943

1nF
RdsOn(Typ 8.5mohm / 11mohm)
50V

CHSETVR_P1.1V_VFB_MN

C288
0.1nF
50V

Set : 1.059V

R227

1203-006049
5V

G_P1.1V G_P1.1V G_P1.1V

D1

C941

CHSETVR_P1.1V_EN_PSV_MN

R169

1 7.6V

PNS_CHSETVR_P1.1V_PHASE_RC_MN

PGND

D10
MMBD4148
KBC3_VRON

D2

P1.1V

PNS_CHSETVR_P1.1V_PHASE_MN

100K
1%

nostuff

LGATE

25V
AL

Misan,Maglayer NEW

Q529-1
AP4232BGM-HF

200K
1%

P3.3V_AUX

R226

EC19
68uF

D1

D2

1000nF-X5R
6.3V

G_P1.1V

4700nF-X5R
25V

PNS_CHSETVR_P1.1V_TG_MN

2.2

R229

C963

100nF
25V

CHSETVR_P1.1V_TON_MN

R170

4700nF-X5R
25V

C964

OCP : 10.0A@11mohm

10K
1%

G_P1.1V

SHORT6
INSTPAR

G_P1.1V

A
DATE

DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

PART NO.

P1.1V

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_MV_RX881

PAGE

50

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CHIPSET POWER(P1.2V)
VDC

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
FOR EMI

P5.0V_AUX

U10
APW7141QAITRG

10

P5.0V_AUX

PVCC

C161

UGATE
TON

BOOT

C164

C162

100nF
PNS_CHSETVR_P1.2V_BOOT_MN
25V
2.2

2.2

PHASE

14

12

R109

LGATE

R111

75V

CHSETVR_P1.2V_EN_MN

POK

PGND

CHSETVR_P1.2V_OCSET_MN 11

R108 30K
1%

C163
10nF
25V

G_P1.2V

R106
10K
1%

ANS_CHSETVR_P1.2V_LGATE_MN

R88

3 7.6V

15

VOUT

EN

Nichicon New($0.09)

MS-RH7040S-L71
2703-001004

10

C156

PNS_CHSETVR_P1.2V_PHASE_RC_MN

100nF
10V

EC8
220uF
2.5V
2409-001187
35mohm
3216

nostuff
nostuff
nostuff

CHSETVR_P1.2V_VOUT_MN

R113

6.19K
1%

GND

FB

1nF
50V

R105

nostuff

OCSET

THERMAL

C157

1nF
RdsOn(Typ 8.5mohm / 11mohm)
50V

L9
2.2uH

10
Q12-2
AP4232BGM-HF

4G

CHSETVR_P1.2V_FB_MN

C165
0.1nF
50V

Set : 1.059V

R112

1203-006049
5V

G_P1.2V G_P1.2V G_P1.2V

D1

C824

CHSETVR_P1.2V_POK_MN

D6
MMBD4148

1 7.6V

D2

100K
1%

KBC3_VRON

PNS_CHSETVR_P1.2V_BOOT_RC_MN

P3.3V_AUX

nostuff

Misan,Maglayer NEW

Q12-1
AP4232BGM-HF

200K
1%

P1.2V

D1

PNS_CHSETVR_P1.2V_PHASE_MN

1000nF-X5R
6.3V

G_P1.2V

4700nF-X5R
25V

D2

350KHz

VCC

CHSETVR_P1.2V_VCC_MN

C160

4700nF-X5R
25V

13
2 CHESETVR_P1.2V_TON_MN

R107

R110

C159

100nF
25V

PNS_CHSETVR_P1.2V_UGATE_MN

4700nF-X5R
25V

C158

OCP : 10.0A@11mohm

10K
1%

G_P1.2V

SHORT4
INSTPAR

G_P1.2V

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

PART NO.

P1.2V

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_MV_RX881

PAGE

51

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

VDC

Graphic Core Power

FOR EMI

D
P5.0V

17

UGATE

PNS_EGFXVR_TG_MN

Q29
SIR474DP-T1-GE3

14

PCMC104T-1R0MN
2703-003259

1 2 3
5

PNS_EGFXVR_PHASE_MN

PNS_EGFXVR_BST_MN

LGATE

16R825
19

3.3
C981

220nF

25V

PNS_EGFXVR_BST_RC_MN
ANS_EGFXVR_BG_MN

12

R167

R166

10
1%

10
1%

100nF
10V

30V

PGOOD

nostuff

50V

EC9
330uF

EC10
330uF

2.5V

2.5V

2409-001176

PNS_EGFXVR_PHASE_RC_MN

C241

2409-001176
15mohm
Can Polymer 6T

1nF
50V

R824

C980

OCP : 14.2A@DCR Max 3.3mohm

GFX3_VOLTID1
2.2K

C198

6.19K
1%

100nF
10V

R211

Nichicon New($0.09)

Q28
S1 S2 S3
C977
SIR164DP-T1-GE3
1nF1 2 3

C985

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
PHASE
BOOT

20K
1%

25V
AL

L10
1uH

30V

S1 S2 S3

G_EGFX

nostuff

15

VCC

2200nF-X5R
10V

R827

EC17
68uF

C979

nostuff

4700nF-X5R
25V

2200nF-X5R
10V
EGFXVR_VCC_MN

P3.3V

C282

4700nF-X5R
25V

EGFX_CORE

PVCC

C978
2.2

C983

100nF
25V

U517
ISL95870B
18

R823

C982

P3.3V

R213
2.2K

OCSET
VO

GFX3_VOLTID0

47nF

50V

VID1

FB

SMT6

SMT507

0-1005

0-1005

R796

EGFXVR_OSCET_MN

10

EGFXVR_VO_MN

EGFXVR_FB_MN

6.19K
1%

R168

VID0

2K

1%

2K

1%

R218
2.49K
1%

R826

KBC3_PWRON

68.1K 1%

C984
22nF
25V

EGFXVR_EN_MN

13

RTN

EN

G_EGFX

EGFXVR_RTN_MN

C1511
0.068nF
50V

R838
0

nostuff

G_EGFX

(SW0)

SREF

nostuff

G_EGFX

EGFXVR_SREF_MN

C284

R214

300KHz

15K
1%

11

FSEL

(SW1)

SET0

EGFXVR_SET0_MN

EGFXVR_SET1_MN

EGFXVR_SET2_MN

RSET1

R216 RSET2
15K

(SW2)

20

13K
1%

0.90V (0.903V)

21

0.95V (0.953V)

1.00V (1.004V)

1.05V (1.054V)

R215

EP

1203-006144
7V

G_EGFX

SET2

267K
1%

SHORT507

G_EGFX

R217

INSTPAR

G0

SET1

PGND

(SW3)

G1

33nF
16V

1%

G_EGFX

GFX3_VOLTID

R869

RSET3

RSET4

G_EGFX

G_EGFX
DATE

DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

PWR_GFX
PART NO.

GFX POWER

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

4
COM-22C-015(1996.6.5) REV. 3

www.manuals.clan.su

PAGE

52

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58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

gDDR3 POWER(P1.5V)
VDC

FOR EMI
EC18
68uF

C986
P5.0V_AUX
10

P5.0V_AUX

100nF
25V

U14
APW7141QAITRG
PVCC

UGATE
TON

C987

2.2

gDDR3VR_TON_MN

C242
100nF 25V
12 PNS_gDDR3VR_PHASE_MN
2.2

LGATE

R219

75V

KBC3_PWRON

POK

PGND

gDDR3VR_POK_MN

D9
MMBD4148
3

gDDR3VR_EN_MN

C287

1%

R828

10nF
25V

13K
1%

VOUT

EN

gDDR3VR_OCSET_MN11

R224 100K

1 7.6V

D1

4G

9 ANS_gDDR3VR_LGATE_MN

R798

Q27-2
AP4232BGM-HF

10
1%

10
1%

3 7.6V

MS-RH7040S-L71
2703-001004

EC11
330uF

C940
100nF
10V

PNS_gDDR3VR_PHASE_RC_MN

2.5V

2409-001176
15mohm
6T

C961

1nF
50V

nostuff

C286
0.1nF
50V

10K
1%

gDDR3VR_FB_MN

SHORT5
INSTPAR

Set : 1.059V

R220

1203-006049
5V

OCP : 10.0A@11mohm

G_P1.5V G_P1.5V G_P1.5V

R797

R222

FB

D2

1nF
50V
RdsOn(Typ 8.5mohm / 11mohm)

GND

THERMAL

L11
2.2uH

Nichicon New($0.09)

OCSET

15

G_P1.5V

C962

nostuff

Q27-1
AP4232BGM-HF

200K
1%

350KHz

100K
1%

P1.5V
Misan,Maglayer NEW

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
VCC

P3.3V_AUX

G_P1.5V

4700nF-X5R
25V

D1

D2

R223

14 PNS_gDDR3VR_BOOT_MN
R225

PHASE

1000nF-X5R
6.3V

PNS_gDDR3VR_BOOT_RC_MN

BOOT

gDDR3VR_VCC_MN

C285

C988

13 PNS_gDDR3VR_UGATE_MN
2

4700nF-X5R
25V

R221

25V
AL

10K
1%

G_P1.5V

G_P1.5V

P1.0V

P5.0V

P1.5V

U512
APL5336KAITRG

C939

10000nF-X5R
6.3V

100K
1%

P5.0V_AUX

EGFXVR_P1.0V_VREF_MN

R745

100K
1%
D
EGFXVR_P1.0V_KBC3_PWRON_R_MN

KBC3_PWRON

R774

100K 1%

C937
10nF
25V

100nF
10V

200K

60V

VREF

VCNTL
NC_2
NC_1
NC_3
VOUT

6
7
5
8

P1.0V

1000nF-X5R
6.3V

EGFXVR_P1.OV_VOUT_MN

GND

1203-006083
7V

C960

C938

R775

Q527
1%
RHU002N06

EGFXVR_P1.0V_P5.0V_AUX_MN

VIN

R776

PAD

C936

10000nF-X5R
6.3V

Q526
RHU002N06

60V

1
S

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV
REV

BC LEE
MODULE CODE

TITLE

0.1

gDDR3 POWER

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_GFX MEMORY

PAGE

53

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Switched Power

Switched Power On (P3.3V)

P5.0V_STB

P12.0V_ALW

P3.3V_AUX

P3.3V

P2.5V

P3.3V

Q530
AO6402AL
1
2
5
6

R807
R829

470K
1%

100K
1%

D1
D2
D3
D4

1203-005591
5.5V

3.9nF

4700nF-X5R
10V

P2.5V_ADJ_MN

KBC3_PWRON_R_MN

R830

1K 1%
50V

P12.0V_ALW

P1.8V_AUX

SHORT504

SHORT505

SHORT506

R805
C946

10K
1%

R806

47nF
50V

13K
1%

S1
S2
S3
G
-30V

D1
D2
D3
D4

8
7
6
5

KBC3_PWRON_INV#

C948

100nF
10V

4700nF-X5R
10V

KBC3_PWRON

Q531
RHU002N06

60V

1
S

30V

C1004

60V

4700nF-X5R
25V

C135

Q9
RHU002N06 C134

C947

KBC3_PWRON_QR_MN

P1.2V_AUX
U518
RT9179GB

10000nF-X5R
6.3V

22nF
25V

C1003

100nF
10V

P1.2V_AUX

P3.3V_AUX

KBC3_PWRON_INV#_QR_MN

1
2
3
4

1 2 3

200K
1%

S1 S2 S3

R89

Q528
AP4435GM

10K
1%

P5.0V_AUD

P5.0V

5 6 7 8

P5.0V_AUX

R832

P1.8V

Q10
AO4476L

10000nF-X5R
6.3V

11.8K
1%

Switched Power On (P1.8V)

Switched Power On (P5.0V)

C991

R831

1nF

C968

KBC3_PWRON

60V

C967

C993

KBC3_PWRON

4700nF-X5R
25V

50V

Q533
RHU002N06

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
C992

D1 D2 D3 D4

1
5
IN
OUT
3
EN
2
4
GND ADJ

FB Ref =1.175V

60V

1
D

0-1005

Q532
RHU002N06

KBC3_PWRON_INV#

U515
RT9179GB

SMT504

(2.5138V)

30V

KBC3_PWRON_INV#_RQ_MN
D

P2.5V

1
5
IN
OUT
3
EN
2
4
GND ADJ

R842 C1005
2K
1%

1203-005591
5.5V
P1.2V_AUX_ADJ_MN

10000nF-X5R
6.3V

R843
39.2K
1%

C969

10000nF-X5R
10V

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

PWR_SWITCH
SWITCH POWER

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PART NO.

PAGE

54

OF

58

1
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER DISCHARGER

P5.0V_STB

R143

10K
1%

R146

R114

R142

100K
1%

1K
1%

10

49.9
1%

Q20
RHU002N06

Q22
RHU002N06

60V

P3.3V

Q14
RHU002N06

60V

P1.8V

P1.5V

P1.1V

P1.2V

P1.0V

R123

R141

R121

R124

R140

R125

10

10

10
1%

10
1%

10

10

10

60V

60V

nostuff

R122

Q18
RHU002N06

Q26
RHU002N06

60V

P5.0V

KBC3_PWRON_INV#

P1.8V_AUX

R144

P3.3V_AUX

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
D

KBC3_SUSPWR

P5.0V_AUX

Q19
RHU002N06

60V

60V

Q23
RHU002N06

Q17
RHU002N06

60V

60V

Q16
RHU002N06

Q21
RHU002N06

60V

nostuff

Q15
RHU002N06

60V

1
S

A
DRAW

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

DATE

0.1

DISCHARGER LOGIC

PART NO.

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

ELECTRONICS

PWR_CPU_MV_IDISCHARGER

PAGE

55

OF

58

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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

System boss PAD

MT500
RMNT-30-80-1P

MT501
RMNT-30-80-1P

MT507
RMNT-30-80-1P

MT504
RMNT-30-80-1P

MT512
RMNT-30-80-1P

MT509
RMNT-30-80-1P

MT510
RMNT-30-80-1P

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

MT503
RMNT-38-70-1P

MT511
RMNT-30-80-1P

CPU breaket PAD

MT502
RMNT-38-70-1P

MT505
RMNT-38-70-1P

MT506
RMNT-38-70-1P

THERMAL NUT

MT19
RMNT-25-70-1P

PCB + bottom
B

MT20
RMNT-25-70-1P

M500
HEAD
DIA
LENGTH

M501
HEAD
DIA
LENGTH

M502
HEAD
DIA
LENGTH

BA61-00932A

BA61-00932A

BA61-00932A

MT4
RMNT-25-50-1P

USB boss PAD

G_SUB

MODEM boss PAD

MT508
RMNT-42-60-1P

MT22
RMNT-30-50-1P

SUB_GND_A

SUB_GND_A

A
DRAW

DATE

XIE BIN

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

CHECK

GUO LEI

ADV
REV

APPROVAL

BC LEE
MODULE CODE

TITLE

0.1

ELECTRONICS

MAIN
PART NO.

MOUNT HOLE

BA41-xxxxxxA

LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

56

OF

58

1
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www.manuals.clan.su

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

VREFG
CPU1_SIC
CPU1_SID
CPU1_SVC
CPU1_SVD
CRT3_RED
SMB3_CLK
SPI3_CLK
ADT3_SEL#
CRT3_BLUE
KBC3_A20G
KBC3_VRON
KBC5_TCLK
LCD1_ACLK
LCD3_BRIT
LPC3_CLK0
LPC3_CLK1
MCD3_SDWP
SMB3_DATA
SPI3_CS0#
SPI3_MISO
SPI3_MOSI
THM3_STP#
WLON_LED#
CRT3_GREEN
CRT3_HSYNC
CRT3_VSYNC
CRT5_HSYNC
CRT5_VSYNC
DBG3_HSYNC
DBG3_VSYNC
GFX3_GPIO0
GFX3_GPIO1
GFX3_GPIO2
KBC3_CHGEN
KBC3_PWRGD
KBC3_PWRON
KBC3_RCIN#
KBC5_TDATA
MCD3_SDCD#
MCD3_SDCLK
MCD3_SDCMD
MEM1_VREF0
MEM1_VREF1
PEX3_WAKE#
SB_X1_C_MN
SB_X2_C_MN

KBC5_KSI(7)
KBC5_KSO(0)
KBC5_KSO(1)
KBC5_KSO(2)
KBC5_KSO(3)
KBC5_KSO(4)
KBC5_KSO(5)
KBC5_KSO(6)
KBC5_KSO(7)
KBC5_KSO(8)
KBC5_KSO(9)
LCD3_BKLTON
LPC3_LAD(0)
LPC3_LAD(1)
LPC3_LAD(2)
LPC3_LAD(3)
SMB3_ALERT#
BAT3_DETECT#
CHGVR_ICM_MN
CHGVR_VDD_MN
CPU1_LDTREQ#
CPU1_LDTRST#
CPU1_LDTSTP#
CRT3_DDCDATA
EGFXVR_FB_MN
EGFXVR_VO_MN
EXP3_CLKREQ#
KBC3_BATDET#
KBC3_CHG4.2V
KBC3_EXTSMI#
KBC3_NUMLED#
KBC3_PWRBTN#
KBC3_RSMRST#
KBC3_RUNSCI#
KBC3_SMDATA#
KBC3_SPI_CLK
KBC5_KSO(10)
KBC5_KSO(11)
KBC5_KSO(12)
KBC5_KSO(13)
KBC5_KSO(14)
KBC5_KSO(15)
KBC_CAP_C_MN
LID3_SWITCH#
LPC3_LFRAME#
MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDDATA3
MCH3_EXTTS0#
MCH3_EXTTS1#
MIN3_CLKREQ#
PCI3_CLKRUN#
SYSVR_FB2_MN
CHGVR_CSIN_MN
CHGVR_CSIP_MN
CHGVR_CSON_MN
CHGVR_CSOP_MN
CHGVR_DCIN_MN
CHGVR_VADJ_MN
CHGVR_VDDP_MN
CHP3_NB_PWRGD
CHP3_SATALED#
CHP3_SB_TEST0
CHP3_SB_TEST2
CHP3_SUSSTAT#
CPU1_VDDIO_FB
CPU1_VDDNB_FB
CPU1_VTTSENSE
CRT3_RED_L_MN
DDR2VR_TON_MN
DDR2VR_VCC_MN
DDR2VR_VFB_MN
EGFXVR_RTN_MN
EGFXVR_VCC_MN

CHGVR_EN_MN
CHP3_GPIO16
CHP3_GPIO17
CHP3_RTCCLK
CHP3_SERIRQ
CHP3_SLPS3#
CHP3_SLPS5#
CK_PD#_R_MN
CPU1_ALERT#
CRT3_DDCCLK
GFX_NC_B_MN
KBC3_BKLTON
KBC3_PRECHG
KBC3_PWRSW#
KBC3_RFOFF#
KBC3_SCLED#
KBC3_SMCLK#
KBC3_SPI_DI
KBC3_SPI_DO
KBC5_KSI(0)
KBC5_KSI(1)
KBC5_KSI(2)
KBC5_KSI(3)
KBC5_KSI(4)
KBC5_KSI(5)
KBC5_KSI(6)

GDDR3VR_EN_MN
GDDR3VR_FB_MN
GFX_RSET_R_MN
KBC3_CAPSLED#
KBC3_LED_CTRL
KBC3_SPI_CS0#
KBC3_SPKMUTE#
KBC3_WAKESCI#
LCD3_EDID_CLK
PEG3_HPD_HDMI
PEG5_HDMI_CLK
VGA5_HDMI_HPD
CHGVR_ACLIM_MN
CHGVR_ACSET_MN
CHGVR_CHLIM_MN
CHGVR_DCPRN_MN
CHGVR_DCSET_MN
CHGVR_ICOMP_MN
CHGVR_SGATE_MN
CHGVR_VCOMP_MN
CHP3_BIOS_CRI#
CHP3_INTRUDER#
CHP3_THRMTRIP#
CPU1_THRMTRIP#
CPU1_VDDIO_FB#
CPU1_VDDNB_FB#
CPUVR_VSEN1_MN
DDR2VR_TRIP_MN
EGFXVR_SET0_MN
EGFXVR_SET1_MN
EGFXVR_SET2_MN
EGFXVR_SREF_MN
GDDR3VR_POK_MN
GDDR3VR_TON_MN
GDDR3VR_VCC_MN
GFX_MPV18_B_MN
GFX_PX_EN_R_MN
GFX_R2SET_R_MN
KBC3_KCLK_R_MN
KBC3_KDAT_R_MN
KBC3_LED_ACIN#
KBC3_USBPWRON#
KBC3_WLON_LED#
LAN3_RSET_R_MN
LCD3_EDID_DATA
PEG3_HDMI_DATA
PEG5_HDMI_DATA
TPD5_L_BUTTON#
TPD5_R_BUTTON#
VRM3_CPU_PWRGD
CHGVR_ICM_RC_MN
COUVR_ENABLE_MN
CPU1_ALL_LDTSTP
CRT3_GREEN_L_MN
CRT3_P5.0V_D_MN
DDR2VR_PGOOD_MN
EGFXVR_OSCET_MN
GFX_TESTEN_R_MN
GFX_XTALIN_R_MN
KBC3_EMCLK_R_MN
KBC3_EMDAT_R_MN
KBC3_LED_POWER#
KBC3_PWRSW#_SUB
ANS_DDR2VR_BG_MN
ANS_SYSVR_BG1_MN
ANS_SYSVR_BG2_MN
CHGVR_SGATE_R_MN
CHGVR_VADJ_RQ_MN
DDR3VR_EN_PSV_MN
GDDR3VR_OCSET_MN
GFX_MVREFSA_R_MN
GFX_PWRGOOD_R_MN
GML_VREFCA0_R_MN
GML_VREFCA1_R_MN
GML_VREFDQ0_R_MN

GML_VREFDQ1_R_MN
GML_ZQ_ZQ00_R_MN
GML_ZQ_ZQ01_R_MN
GMU_VREFCA0_R_MN
GMU_VREFCA1_R_MN
GMU_VREFDQ0_R_MN
GMU_VREFDQ1_R_MN
GMU_ZQ_ZQ00_R_MN
GMU_ZQ_ZQ01_R_MN
KBC3_LED_CHARGE#
KBC3_THERM_SMCLK
PNS_CHGVR_BST_MN
PNS_DDR2VR_TG_MN
PNS_SYSVR_TG1_MN
PNS_SYSVR_TG2_MN
SB_DDC1_SCL_R_MN
SB_DDC1_SDA_R_MN
TH_SHDN_SEL_R_MN
WLON_LED#_LED_MN
CHGVR_CHLIM_RQ_MN
CHGVR_VCOMP_RC_MN
CPU_TEST25_H_R_MN
CPU_TEST25_L_R_MN
GFX_CLKTESTA_C_MN
GFX_DPC_CALR_R_MN
GFX_TESTEN_2_R_MN
KBC3_THERM_SMDATA
PNS_DDR2VR_BST_MN
PNS_EGFXVR_BST_MN
CHGVR_SGATE_RRQ_MN
GFX_DPAB_CALR_R_MN
GFX_DPA_VDD18_B_MN
GFX_DPC_VDD10_B_MN
GFX_DPLL_VDDC_B_MN
LAN3_DISABLE#_R_MN
PEG5_HDMI_CLK_B_MN
VGA5_HDMI_HPD_R_MN
CHSETVR_P1.2V_EN_MN
CHSETVR_P1.2V_FB_MN
DDR2VR_VOUT_0.9V_MN
GFX_MEM_CALRN0_R_MN
GFX_MEM_CALRP0_R_MN
GFX_PCIE_CALRN_R_MN
GFX_PCIE_CALRP_R_MN
PEG3_LCDVDDON_QR_MN
PNS_CHGVR_BST_RC_MN
PNS_DDR3VR_PHASE_MN
PNS_GDDR3VR_BOOT_MN
ANS_GDDR3VR_LGATE_MN
CHP3_SATALED#_LED_MN
CHSETVR_P1.1V_TON_MN
CHSETVR_P1.1V_VCC_MN
CHSETVR_P1.1V_VFB_MN
CHSETVR_P1.2V_POK_MN
CHSETVR_P1.2V_VCC_MN
DDR2VR_VREF_P0.9V_MN
EGFXVR_P1.0V_VREF_MN
EGFXVR_P1.OV_VOUT_MN
KBC3_CAPSLED#_LED_MN
PNS_DDR2VR_BST_RC_MN
PNS_EGFXVR_BST_RC_MN
PNS_GDDR3VR_PHASE_MN
PNS_GDDR3VR_UGATE_MN
CHESETVR_P1.2V_TON_MN
CHSETVR_P1.1V_TRIP_MN
KBC3_LED_CHARGE#_R_MN
NB_ALLOW_LDTSTOP_R_MN
P3.3V_VDD_INV_EN_Q_MN
PNS_CHGVR_PHASE_RC_MN
CHSETVR_P1.1V_PGOOD_MN
CHSETVR_P1.2V_OCSET_MN
P3.3V_VDD_INV_EN_QR_MN
PNS_DDR2VR_PHASE_RC_MN
PNS_GDDR3VR_BOOT_RC_MN
PNS_SYSVR_PHASE2_RC_MN

ANS_CHSETVR_P1.1V_BG_MN
CHGVR_KBC3_PRECHG_RQ_MN
CHGVR_P3.3V_MICOM_RQ_MN
CHSETVR_P1.1V_EN_PSV_MN
CK_REF_0_SEL_HTT66_R_MN
PNS_CHSETVR_P1.1V_TG_MN
PNS_GDDR3VR_PHASE_RC_MN
CHGVR_KBC3_CHG4.2V_RQ_MN
PNS_CHSETVR_P1.1V_BST_MN
DDR2VR_KBC3_SUSPWR_RRD_MN
EGFXVR_P1.0V_P5.0V_AUX_MN
PNS_CHSETVR_P1.2V_BOOT_MN
ANS_CHSETVR_P1.2V_LGATE_MN
NB_REFCLK_N_PWM_GPIO3_R_MN
PNS_CHSETVR_P1.1V_PHASE_MN
PNS_CHSETVR_P1.2V_PHASE_MN
PNS_CHSETVR_P1.2V_UGATE_MN
DDR2VR_P5.0V_ALW_VREF_RQ_MN
PNS_CHSETVR_BST_P1.1V_RC_MN
EGFXVR_P1.0V_KBC3_PWRON_R_MN
PNS_CHSETVR_P1.2V_BOOT_RC_MN
PNS_CHSETVR_P1.1V_PHASE_RC_MN
PNS_CHSETVR_P1.2V_PHASE_RC_MN
DDR2VR_KBC3_PWRON_P0.9V_RCQ_MN
AVDD
A2VDD
A2VDDQ
CPU_CORE
CPU_CORE
DPC_PVDD
DPC_VDD18
G_CHG
G_CPU
G_DDR
G_SUB
G_EGFX
G_P1.1V
G_P1.2V
G_P1.5V
G_P3.3V
LCD_VDD3V
P1.0V
P2.5V
P0.9V_AUX
P1.2V_AUX
P1.2V_LAN
P1.8V_AUX
P2.0V_REF
P2.5V_LAN
P3.3V_LED
P3.3V_LED
VDD_LED
P3.3V_MCD
P3.3V_MCD
P3.3V_SUB
P5.0V_AUX
P5.0V_AUX
P5.0V_STB
P5.0V_STB
P12.0V_ALW
P12.0V_ALW

VCC_CRT
VDD_LED

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

P4.75V_AUD
P2.39V_VREF
P2.39V_VREF
P5.0V_AUX_C
P5.0V_USB_SUB
P5.0V_USB_SUB
SPV10
SUB_GND_A
VDC
VDC
VDD1DI
VDD2DI
VCC_CRT

A
DRAW

DATE

XIE BIN
CHECK

08/18/2009

SAMSUNG

Suzhou-D

DEV. STEP

GUO LEI
APPROVAL

ADV

ELECTRONICS

Test Point
PART NO.

REV

BC LEE
MODULE CODE

TITLE

BA41-xxxxxxA

0.1
LAST EDIT

July 15, 2009 19:25:13 PM

PAGE

57

OF

58

1
D:/Users/mentor/Suzhou-D/Suzhou-D_adv1_0826

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