TRAINING REPORT

Bharat Electronics Limited

Plot no. 405, Industrial Area, Phase III, Panchkula
FROM 18/06/12 TO 28/07/12

BACHELOR OF TECHNOLOGY In ELECTRONICS AND COMMUNICATION ENGG.

SUBMITTED TO: Mr. Anish chauhan S.A.E H R Dept. SUBMITTED BY: Name : TANU UPT No.:5245/12

CONTENTS
PREFACE ACKNOWLEDGEMENT BHARAT ELECTRONICS LIMITED AT A GLANCE MISSION & OBJECTIVES OF BEL HISTORY MANUFACTURING UNITS OF BEL

CUSTOMERS OF COMPANY PRODUCTS OF BEL PROJECTS UNDERTAKEN CURRENTLY BEL PANCHKULA A VITAL LINK IN CHAIN ORGANISATION OF BEL PANCHKULA LECTURES DEPARTMENT ALLOTED PROJECT WORKED ON CONCLUSION

PREFACE
With the ongoing revolution in electronic and communication where innovations are taking at the blink of eye, it is impossible to keep the pace with the emerging trends. Excellence is an attitude that that whole of human race is born with. It is the environment that makes sure that whether the result of this attitude is visible or otherwise. A Well planned, properly executed and evaluated industrial training helps a lot in inculcating a professional attitude. It provides a linkage between the student and industry to develop an awareness of industrial approach to problem solving, based on a broad understanding of process and mode of operation of organization. During this period, the student gets the real experience for working in the actual Industry environment. Most of the theoretical knowledge that has been gained during the course of their studies is put to test here. Apart from this the student gets an opportunity to learn the latest technology, which is immensely helps in them in building their career. I had the opportunity to have a real experience on many ventures, which increased my sphere of knowledge to great extent. I got a chance to learn many new technologies and was also interfaced to many instruments. And all this credit goes to organization Bharat Electronics Ltd.

ACKNOWLEDGEMENT
I am highly indebted to BEL Panchkula , one of the leading organizations of our nation, for letting me undertake six weeks training course with them. It was really a very nice experience as we came to know how actually the company strives hard to keep up the national security at par with the rest of the world. I would like to express my gratitude towards Mr. Dinesh Kumar Dhiman (Manager HRD) who allowed us to join BEL as a trainee, & helped us in every possible way so that we could complete our training successfully. I also thank Mr. Anish Chauhan (Senior Engineer Assistance, S.E.A.), who was there to support us whenever we needed help at every point of our training. Last but not least I would like to thank all the staff members of BEL who made this training a rich experience & a success.

UPT No. - 5245/12 TANU

BHARAT ELECTRONICS LIMITED AT A GLANCE

Bharat Electronics Limited (BEL) is a Government of India undertaking set up under the Ministry of Defence. BEL was established in 1954 in Bangalore, primarily to meet strategic defence electronics needs of the country. Since its inception, BEL has been noted for its pioneering achievements in the manufacture of professional Electronic Equipment & Systems, & Electronic Components. Evolving out of a work culture with continuous emphasis on Quality, the Companys growth into a multitechnology, multi-unit enterprise amply demonstrates its leadership & expertise. With nine manufacturing units located in Bangalore, Ghaziabad, Panchkula, Kotdwara, Pune, Navi Mumbai, Hyderabad, Chennai & Machilipatnam, Bharat Electronics commands a strong presence in practically every vital area of professional electronics in the country. Bharat Electronics has been awarded the coveted ISO 9000 certification, the benchmark of international quality. BELs philosophy is epitomized on its motto Quality, Technology, Innovation. With in-house R&D and sate-of-art manufacturing facilities, BEL manufactures a wide range encompasses Semiconductor Devices, Professional Vacuum Tubes, Crystal Devices, Solar Cells & Systems. Almost all components manufactured by Bharat Electronics conform to international specifications. The component part numbers are equivalent to and application compatible with international part numbers.

MISSION & OBJECTIVES OF BEL

MISSION
To be the market leader in Defence Electronics & in other chosen fields & products.

OBJECTIVES
To become a customer-driven company supplying quality products at competitive prices at the expected time & providing excellent support. To achieve growth in the operations commensurate with the growth of professional electronics industry in the country. To generate internal resources for financing the investments required for modernization, expansion & growth for ensuring a fair return to the investor. In order to meet the Nations strategic needs, to strive for self reliance by indigenization of materials & components. To retain the technological leadership of the company in defense & other chosen fields of electronics through in-house Research & Development as well as through collaboration/co-operation with Defence/National Research Laboratories, International companies, Universities & Academic institutions. To progressively increase overseas sales of its products & services. To create an organizational culture this encourages members of the organization to realize their full potential through continuous learning on the job & through other HRD initiatives.

HISTORY
Bharat Electronics Limited (BEL) was set up at Bangalore, India, by the Government of India under the Ministry of Defence in 1954 to meet the specialised electronic needs of the Indian defence services. Over the years, it has grown into a multi-product, multi-technology, multi-unit company serving the needs of customers in diverse fields in India and abroad . BEL is among an elite group of public sector undertakings which have been conferred the Navratna status by the Government of India. The growth and diversification of BEL over the years mirrors the advances in the electronics technology, with which BEL has kept pace. Starting with the manufacture of a few communication equipment in 1956, BEL went on to produce Receiving Valves in 1961, Germanium Semiconductors in 1962 and Radio Transmitters for AIR in 1964. In 1966, BEL set up a Radar manufacturing facility for the Army and inhouse R&D, which has been nurtured over the years. Manufacture of Transmitting Tubes, Silicon Devices and Integrated Circuits started in 1967. The PCB manufacturing facility was established in 1968. In 1970, manufacture of Black & White TV Picture Tube, X-ray Tube and Microwave Tubes started. The following year, facilities for manufacture of Integrated Circuits and Hybrid Micro Circuits were set up. 1972 saw BEL manufacturing TV Transmitters for Doordarshan. The following year, manufacture of Frigate Radars for the Navy began. Under the government's policy of decentralization and due to strategic reasons, BEL ventured to set up new Units at various places. The second Unit of BEL was set up at Ghaziabad in 1974 to manufacture Radars and Tropo communication equipment for the Indian Air Force. The third Unit was established at Pune in 1979 to manufacture Image Converter and Image Intensifier Tubes. In 1980, BEL's first overseas office was set up at New York for procurement of components and materials. In 1981, a manufacturing facility for Magnesium Manganese Dioxide batteries was set up at the Pune Unit. The Space Electronic Division was set up at Bangalore to support the satellite programme in 1982. The same year saw BEL achieve a turnover of Rs.100 crores. In 1983, an ailing Andhra Scientific Company (ASCO) was taken over by BEL as the fourth manufacturing Unit at Machilipatnam. In 1985, the fifth Unit was set up in Chennai for supply of Tank Electronics, with proximity to HVF, Avadi. The sixth Unit was set up at Panchkula the same year to manufacture Military Communication equipment. 1985 also saw BEL

manufacturing on a large scale Low Power TV Transmitters and TVROs for the expansion of Doordarshan's coverage. 1986 witnessed the setting up of the seventh Unit at Kotdwara to manufacture Switching Equipment, the eighth Unit to manufacture TV Glass Shell at Taloja (Navi Mumbai) and the ninth Unit at Hyderabad to manufacture Electronic Warfare Equipment. In 1987, a separate Naval Equipment Division was set up at Bangalore to give greater focus to Naval projects. The first Central Research Laboratory was established at Bangalore in 1988 to focus on futuristic R&D. 1989 saw the manufacture of Telecom Switching and Transmission Systems as also the setting up of the Mass Manufacturing Facility in Bangalore and the manufacture of the first batch of 75,000 Electronic Voting Machines. The agreement for setting up BEL's first Joint Venture Company, BE DELFT, with M/s Delft of Holland was signed in 1990. Recently this became a subsidiary of BEL with the exit of the foreign partner and has been renamed BEL Optronic Devices Limited. The second Central Research Laboratory was established at Ghaziabad in 1992. The first disinvestment (20%) and listing of the Company's shares in Bangalore and Mumbai Stock Exchanges took place the same year. BEL Units obtained ISO 9000 certification in 1993-94. The second disinvestment (4.14%) took place in 1994. In 1996, BEL achieved Rs.1,000 crores turnover. In 1997, GE BEL, the Joint Venture Company with M/s GE, USA, was formed. In 1998, BEL set up its second overseas office at Singapore to source components from South East Asia. The year 2000 saw the Bangalore Unit, which had grown very large, being reorganized into Strategic Business Units (SBUs). There are seven SBUs in Bangalore Unit. The same year, BEL shares were listed in the National Stock Exchange. In 2002, BEL became the first defence PSU to get operational Mini Ratna Category I status. In June 2007, BEL was conferred the prestigious Navratna status based on its consistent performance. During 2008-09, BEL recorded a turnover of Rs.4624 crores.

MANUFACTURING UNITS OF BEL

In 1954 with a factory of Jallahali, Bharat Electronics grew into nine units, spread all over India. The locations & products of the units are given below:-

1. BANGALORE:
This is also called BG Complex. Jallahali unit which is the mother unit is now a part of the BG Complex. This is the biggest unit with approx. 10,000 employees working here. Among the products here, the important ones are: Communication equipment Air & Doordarshan equipment like mobile van for live telecast etc. Radar-mobile, one dimensional, 3-dimensional & multi dimensional Radars are manufactured here. Different range of semi-conductor devices like ICs,resistors & black & white color TV picture tube glasses. ISROs requirements are met at space electronics department at Bangalore. Satellite launch vehicle was also manufactured here.

2. GHAZIABAD:
This is the second unit which was set up in 1974, & approx. 2500 employees working here. Radars & some communication equipment are The products manufactured here are: Radars Some communication equipments like antennas SATCOM (defence) Microwave components

3. PUNE:
To diversify further one more branch was added 1979 & this was in Pune. In this branch around 700-800 employees are working. The product profile includes: Image convertor, image intensifier, X-ray tubes Batteries Electro-optics

4. MACHLIPATNAM:
There was one Andhra scientific company, which was a sick unit. This was taken over by BEL & is called ASCO unit in 1983. The products include: Optical & opto-electronic equipment like binoculars, microscopes Medical Electronics

5. NAVI MUMBAI:
This is an industrial place near Mumbai. This unit makes: Glass shells for black & white TV picture tubes Shelters for Electronic Equipment Train Actuated Warning System Electronic Equipment Assembly

6. PANCHKULA:
Panchkula & Kotdwara were proposed simultaneously by the Government in 1985. It was proposed to set up one unit each in Haryana & Uttar-Pradesh. But the place in U.P. for setting up a BEL unit could not be decided while that at Haryana was decided & hence this unit started earlier. This unit manufactures only tactical communication equipment like VHF, UHF transceivers etc.

7. KOTDWARA:
This is a unit in Garhwal district of Uttar-Pradesh. This unit manufactures radio relay, multiplex equipments & exchanges etc.

8. CHENNAI:
The eight unit of BEL was established in Chennai. This unit manufactures: Tank related electronic equipments Optical fire control systems

9. HYDERABAD:
This is another unit of BEL which manufactures electronics warfare equipments.

CUSTOMERS OF COMPANY
OVERSEAS MARKET: Exports play a key role in BEL's strategic perspective. The ranges of products and services exported have been increasing over the years. A number of international companies are using the facilities at BEL for contract manufacturing. The broad list of products and services being exported is given below: -

Products and Services Defence Communication Civilian Communication

Countries Algeria, Botswana, Brazil, France, Germany, Malaysia, Mauritius, Russia, Sweden, Switzerland, UK. Brazil, Iran, Italy, Kenya, Malaysia, Nepal, Singapore, Sweden, Switzerland, UK, Vietnam. Austria, Australia, China, Finland, France, Hong Kong, Malaysia, Netherlands, Philippines, Germany, South Korea, Singapore, Spain, Taiwan, Turkey, UAE, UK, USA. Algeria, Armenia, Bangladesh, Brazil, Egypt, France, Greece, Hong Kong, Italy, Nepal, UK, USA, Zambia. Australia, Egypt, France, Germany, Israel, Malaysia, Netherlands, New Zealand, Saudi Arabia, Singapore, UAE, UK, USA. Vietnam, Brazil, Middle East. Switzerland, Ukraine. USA, Australia, Japan, Brazil, Canada. Australia, Bahrain, Kuwait, Mauritius, Malawi, Nepal, Oman, Philippines, Saudi Arabia, UAE, USA Nepal, Kenya

Semiconductor Devices Electron Tubes, Magnetron, Transmitting Tubes, TV Picture Tubes and parts. Opto Electronic Products and parts Sound & Vision Broadcast Equipments Radar and Sub-systems Contract Manufacturing Batteries, Energy Saver and other products Turnkey Systems

List of world class companies with whom BEL has technologies collaborations for different state of the art products are as given below.

Company Oerikon Contraves, Switzerland Norcontro, Norway Northrop Grumman, USA ELTA, Israel INROS, Russia Matra Defence Equipments& Systems, France Sextant, France FLBIT,Israel Ericssion, Sweden Elopotro, South Africa Signal, The Netherlands Thompson Tube Electronic, France

Products Naval FC Systems Radar Scan Converter Airport Radars BFSR (Battle Field Surveillance Radar) Sonobuys Electric Drive System For Tanks LCD Display Unit Stand alone communication unit Radio Relay System Laser Range Finder Fire Control Radar TWT

involved in providing state-of-the-art communication equipment to the Indian Army, be it hand held mobile radios and terminals, ground based systems, airborne and even ship borne equipments and systems. The communication equipments developed here cover HF, VHF, UHF, and V/UHF frequency bands. The most important project of BEL under the communication equipments is STARS-V which provides secure mode of data transfer. In STARS-V, the data to be transferred is first encrypted using a microprocessor which could be read only by a similar device with same coding. Now the latest technology of frequency hopping is being implemented which is a very useful tool in making a secure data transfer system.

PRODUCTS OF BEL
The products of BEL mainly focused on defense purposes but later on BEL also started manufacturing some commercially useful items also. The major products include communication devices which provide secure mode of communication. Also the major products include RADARS, X-RAY TUBES, and TRANSRECIEVERS etc. BEL has been EL manufactures a lot of product which is very difficult to list but some of the major products were as follows: Integrated circuits and micro circuits X-ray tubes and magnetrons B/W picture tubes HF & broadcast equipment Radars STARS-V SECTEL CNR HUD ACME MK II SPACE GUIDING EQUIPMENTS AIRBORNE GPS RECEIVER (UA-429) PRIME LUP SRAX TIDEX SECURE FAX SECURE TELEPHONE SPURT MESSAGE ALPHANUMERIC RADIO TERMINAL (AS-7306)

PROJECTS UNDERTAKEN CURRENTLY 1. STARS-V 5W/25W (FH)

1.

FEATURES
1 : Frequency range 30 MHz 88 MHz 2 : 25 KHz channel spacing 3 : 8 Preset + 1 Manual frequencies / 9 Hop settings 4 : Built in Crypto 5 : Secure Selective call facility 6 : RF Power 25 W 7 : Preset Scan facility 8 : Built in Data Modem in FF and FH 9 : Synchronous / Asynchronous data interface (up to 19.2 kbps ). 10 : Frequency hopping capability at 250 hops/second 11 : Synchronisation based on Time Of the Day ( TOD ) 12 : Robust sync system with orthogonal hopping 13 : Automatic time maintenance (RTC ) 14 : Late Net Entry 15 : Full band and Partial band hopping with banning of selected 16 : Flexible frequency and key management feature 17 : Built in Global Positioning System 18 : Automatic Rebroadcast feature for data and voice in FF and FH

frequency bands

2. LUP 291

WHAT THE EQUIPMENT IS ?

The Radio Set LUP 291 is lightweight and portable transceiver. The radio is useful for ground communication at the platoon level. The simplex radio operates in the UHF frequency band of 403 to 470 MHz. The radio provides clear and secure voice communication. The radio is microprocessor controlled and user friendly. The controls of the radio set are housed on the top, left and front panel. A 7.5-Volt DC source powers the radio set from the bottom panel. A belt clip is provided to clip radio on soldiers belt.

FACILITIES
a. Clear and Secure modes of operation. b. 150 Hz tone or carrier squelch operation. c. Built-in high grade Digital Secrecy. d. Secure key selection(32 Keys). e. Manual Key entry(Key 33). f. Selective call facility. g. 32 Preset Channels(4 banks of 8 Channels each). h. 1 Manual Channel. i. Preset and Manual Channel programming facility. j. Time Out Timer. k. Preset and Priority Channel Scan. l. Battery Status Indication, Received Signal Strength Indication. (RSSI) m.Quick emergency erasure and Remote Erasure Facility. n. Group calling facility based on CTCSS tones. o. Clear Voice Override facility.

p. Inbuilt Powerful Diagnosis feature (BITE). q. Sulk(Tx Inhibit) mode of operation. r. Whisper mode of operation. s. Auto Power save facility. t. Keypad backlighting facility. u. Power on password enabling or disabling facility. v. Cloning facility w.Automatic Test Equipment (ATE) interface facility x. RF Power Control HP(5watts)/LP(1 watt)

3. ACME MK II :-

ACME stands for Analog Code Multiplex Encryption system. It is defined as analog add on encryption / decryption device designed to work with HF Radio to provide secure speech communication capabilities over HF links. In this set there is very low background noise so there is no disturbance between the two communicators. The radio signal strength is very high that, say from Gandhinagar to Shillong communication is very smooth and fine, the message can be encrypted very easily.

4. HUD (Head UP Display )

This project is one of the very advanced projects in the field of electronics, in India. For a longtime Indian Air forces had looking for a multifunctional, lightweight and less complex aircraft For training the fresher three fresher in their Air Forces. The demand has been fulfilled with the development of Light Combat Aircraft (LCA). This has been indigenously by India. It has been already tested once. HUD is actually a transparent screen. It is fitted just below the windshield of the LCA. Whatever critical information is needed comes directly on the screen i.e. HUD. The material of this assembly is such that it allows all the lights to pass through it except the green light .As a result of this; display of the information is done in green colour. The brightness of green light is made more than that of sun for the pilot to see the green letters.There is a FLIR Camera (Forward Looping IR Camera) attached to the back part of the screen. This camera is an infrared camera that captures the image in the night and Displays it on the screen. Even though the camera is fitted on the backside of the screen, but in no way does it obstructs the view of pilot. In the daytime there is only one display i.e. CURSIVE DISPLAY while in the night there are two displays alternatively namely CURSIVE DISPLAY & RASTER DISPLAY. In CURSIVE DISPLAY text information is displayed on the scree. RASTER DISPLAY shows the image on the screen. Raster makes output from the camera into image format on screen. In the night, during the horizontal scanning of the screen raster information is displayed on the screen. During the vertical retrace, to make use of the time Cursive information is displayed. This concept totally makes use of the time in scanning and cancels the requirement of any other monitor for Raster. Another very important advantage with HUD is the viewing angle.

FEATURES:
Jointly developed with CSIO for Light Combat Aircraft (LCA) Supplied 32 units to ADA / HAL Second variant for HJT-36 Trainer aircraft. Approval has been accorded. Order for 73 nos. expected.

5. BEACON MKIII

FEATURES
Newly developed as an upgrade of ECL Beacon Full duplex Crypto Device providing high grade of secrecy for DATA communication on normal Telephone Lines (using V.92 modem) , T/P Network, RS-232 Network AND LAN Network (10/100 Mbps). ON Line & OFF Line modes of operation

BEL PANCHKULA- A VITAL LINK IN CHAIN

In September 1982, the Government of India approved the proposals of Bharat Electronics (BE) for the establishment of two equipment factories; one of these two was to be located in Haryana. Subsequently, Panchkula was selected as the location in Haryana & approx. 23 hectares of land were given free of cost to BEL by the Haryana Government in the Industrial Area Phase- III in 1983. The establishment of the Panchkula Unit, with an investment of Rs. 248 million, marks an important milestone in the growth plans of BEL for augmenting its manufacturing capacity. Construction work commenced in 1984 & the main production & service building were occupied in 1987. BEL in 1984 set up temporary facilities in hired sheds. Production of VHF transreceivers from these sheds commenced in 1985. Professional grade radio communication has been BELs primary business & the Panchkula unit is contributing significantly to this area with the production of radio communication equipments. The wireless set STARS-V being manufactured here is largely used by the armed forces. This wireless set was used recently in OPERATION VIJAY in KARGIL by the Indian forces. BEL believes in the Quality of products. BEL Panchkula has proved this by getting & retaining the ISO 9002 Certificate since more than four years.

ORGANISATION OF BEL-PANCHKULA
BEL Panchkula has different divisions which are further divided into departments1. MKTG/D&E (Marketing division/ Development and Engineering): This is a division which is further divided into departments. They are D&E (DEVELOPMENT & ENGINEERING) It is to design the project, make the modifications to prepare design and related documents. D&E CRYPTO It is for designing of secure communication. TIC (Technical Information Centre) TIC is a library for designing purpose. DRG OFFICE - It is the Drawing office. STDS (STANDARDS) These are the standards for Drafting, Design manure, Quality standards. MKTG (Marketing Division) Sales It is to prepare ESO equipment source order. FGS (FINISH GOODS STORE) After finishing the project it is sent to FGS for final packing. TL (Technical Literature) It is the booklet with the project having instructions. PR (PUBLIC RELATION) It is the relation with the customers. EDP (ELECTRONIC DATA PROCESSING) It is the network system for copy. It is also for the inquiry of item. 2. MFG (MANUFACTURING): WA (WORK ASSEMBLY) There are different types of work assembly i.e PCB assembly, Module assembly, Final assembly. WF (WORK FABRICATION) It is the department for the mechanical work. AMF (ADVANCED MANUFACTURING FACILITIES) Advanced machines are used in the manufacturing of the projects as SMT (Surface Mounted Technology), it is an automatic system to mount the item on the PCB. PE (PRODUCTION ENGINEERING) It is for the installation of the new machinery. PPC (PRODUCTION, PLANNING and CONTROL) In this the work is planned. SC (SUB CONTRACT) 3. MM (MATERIAL MANAGEMENT): It is the management of the materials. PUR (PURCHASE DEPARTMENT) - This department purchases the materials. ISM (INTEGRATED STORE MANAGEMENT)

HS (HOLDING STORE) It has different bins that holds items after inspection. IGS (INCOMING GOODS STORE)

4. PA (PRODUCT ASSURANCE): TESTING Products are tested by different tests C TEST (CIPHER TEST) - It is the test for the secrecy. PS (PRODUCT SUPPORT) It is done after sale services. SELF CERT (SELF CERTIFICATION) It is the department which visits the place where work is going on. 5. QA (QUALITY ASSURANCE): It deals with the quality of the material. INSP(WA) {INSPECTION IN WORK ASSEMBLY) INSP(WF) {INSPECTION IN WORK FABRICATION) R&E (RELIABILITY & EVALUATION) - The materials are checked before giving it to customers. 6. P&S (PLANT AND SERVICES): It is the department for providing the services to company. Services electrical supply, transport, horticulture. are water supply,

HRD (HUMAN RESOURCES DEPARTMENT) it is the training center. SECURITY security facility is available.

7. P&A (PERSONNEL & ADMINISTRATION): PERSON. (PERSONNEL) In this department the recruitment of employees is done. ESTD. (ESTABLISHMENT) It is to use manpower in different areas. MEDICAL Medical facilities are also available. CRECHE CANTEEN WELFARE 8. F&A (FINANCE & ACCOUNT): FINANCE - Department for the sanction of money. PAYROLL It is the salary of the employees. BUDGET It is made for one year. ACCOUNTS It is the record of the money.

AUDIT Survey of the systems.

9. QM (QUALITY MANAGEMENT): ISO (INTERNATIONAL STANDARDS ORGANISATION) It is to sell our products in the international market. 6 SIGMA It is the statistical Technique for maintaining Quality. TES (TEST EQUIPMENT AND SUPPORT) Calibration or measuring of instruments. IGI (INCOMING GOODS INSPECTION) QCC (QUALITY CONTROL CIRCLE) In this department there is a group of employees who discuss the problems, find out its solution and present it to manager.

LECTURES
In this first stage that is during the first week of the training, the most efficient faculty members delivered lectures on various topics concerned with the productivity area of the company. The topics that were covered in the lecture are: INTRODUCTION TO BEL RADIO COMMUNICATION ADVANCED MANUFACTURING FACILITY DESIGN PHILOSOPHY

INTRODUCTION TO BEL

Bharat Electronics Limited(BEL) is a public sector undertaking under the Ministry of Defence. It is a professional electronic company in India incorporated in 1954. BEL was born to meet the growing needs of Indian Defence Services for electronic systems. Employing the best engineering talent available in the country, BEL has progressed manufacturing state-of-the-art products in the field of defence electronics like communications including encryption, radars and strategic components. BEL has diversified to meet the needs of civilian customers as well and has provided products and network solutions on turnkey basis to customers in India and abroad. The Heads: Nowadays BEL is headed by the Chairman and Managing Director Mr. Anil Kumar. The general manager of BEL, Panchkula is Mr. Suresh N. Milestones: BEL has nurtured itself to be known as one of the best public sector units in the nation. Mission: To be the market leader in defence electronics and in other chosen fields and products. Motto: The motto of BEL is Quality, Innovation, Technology

 RADIO COMMUNICATION
Various frequency ranges: HF 3MHz to 30 MHz VHF 30MHz to 300 MHz UHF 300 MHz to 3000 MHz Radio Communication is done in the VHF range i.e. 30MHz-300MHz. BEL Panchkula works in this range only. Consider a radio communication system consisting of two radios. The basic requirements of this system are: 1. Height of antenna=3.5Km. In case of VHF height=1m. 2. Frequency Modulation has to be done .Both radios should be on same frequency because of tuned circuits inside them as they have high selectivity. 3. Channel should be there between two radios. 4. Some environment should be there between two radios. HARDWARE OF RADIO The basic hardware of a radio consist of the following 1. Frequency Synthesizer-It is the heart of the radio. 2. Power Amplifier 3. Antenna Matching Unit. 4. Duplexer-It is there for isolation. Full duplex can transmit and receive simultaneously. There is one PTT(press to talk) switch in it. Half duplex either transmit or receive at a time. 5. Microprocessor-It is used for the controlling purpose. 6. Power Supply Unit (PSU) 7. Receiver 8. Demodulator

AMF
(ADVANCE MANUFACTURING FACILITY) MANUAL MOUNT ASSEMBLY (SMT) SURFACE TECHNOLOGY

Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit board (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs) or terminations on the body of the component.

History
Surface-mount technology was developed in the 1960s and became widely used in the late 1980s. Much of the pioneering work in this technology was byIBM. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the Launch Vehicle Digital Computer used in the Instrument Unit that guided all Saturn IB and Saturn V vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities. Often only the solder joints hold the parts to the board, although parts on the bottom or "second" side of the board are temporarily secured with a dot of adhesive as well. Surfacemounted devices (SMDs) are usually made physically small and lightweight for this reason. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of equivalent through-hole parts.

Assembly techniques

Assembly line with SMT placement machines The complete SMT line consists of total five machines as given below: 1. PRINTER MACHINE : Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer.

2.

PICK & PLACE MACHINE : After pasting, the boards then proceed to the pick-and-place machines, where they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays. Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB. In BEL, Panchkula, there are two pick and place machines.

The 1st pick and place machine is the old one made by SIEMENS, consisting of two heads;

(a) Hydra head, high speed and have 8 nossels (i.e. it can pick 8 components at a time) (b) Midass head, precision and has 1 nossel especially to pick big components.

The speed of the machine is 24000 cph. Here the value of the components are measured. The 2nd pick and place machine is the new one made by SWEDEN. It also consists of two head

(a) Revolving head containing 12 nossels, this means that it can pick 12 components at a time. (b) Reciprocating head contains 2 nossels and used to pick big components. The speed of the machine is 17000 cph. The value of the components are not required here. 3. REFLOW MACHINE : The boards are then conveyed into the reflow soldering oven. They first enter a preheat zone, where the temperature of the board and all the components is gradually, uniformly raised. The boards then enter a zone where the temperature is high enough to melt the solder particles in the solder paste, bonding the component leads to the pads on the circuit board. The surface tension of the molten solder helps keep the components in place, and if the solder pad geometries are correctly designed, surface tension automatically aligns the components on their pads. If the circuit board is double-sided then this printing, placement, reflow process may be repeated using either solder paste or glue to hold the components in place. If glue is used then the parts must be soldered later using a wave soldering process. After this rapid cooling at 40 to 45 degrees is done. Total 12 heaters are used, 6 above and 6 below the conveyor belt. For heating purpose thermocouples are used.

4. AUTOMATIC OPTICAL INSPECTION MACHINE (AOI) : Finally, the boards are visually inspected for missing or misaligned components and solder bridging. The camera used here is of 3.2 mega pixels.

5.

X-RAY MACHINE :

Some joints or wires are below the components which can be inspected using Xrays as they can penetrate a certain amount of thickness.

Advantages
The main advantages of SMT over the older through-hole technique are:

Smaller components. As of 2012 smallest was 0.2 x 0.1 mm (0.01 in x 0.005 in: 01005). Much higher component density (components per unit area) and many more connections per component. Fewer holes need to be drilled. Simpler and faster automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.* Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads.

Components can be placed on both sides of the circuit board. Lower resistance and inductance at the connection, consequently fewer unwanted RF signal effects and better and more predictable high-frequency performance. Better mechanical performance under shake and vibration conditions. Many SMT parts cost less than equivalent through-hole parts. Better EMC compatibility (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the smaller lead inductance.

Disadvantages

The manufacturing processes for SMT require positioning of parts on unperforated boards instead of accurate drilling of many holes and pushing component pins through them, reducing the initial cost and time of setting up for production. Manual prototype assembly or component-level repair is more difficult and requires skilled operators and more expensive tools, due to the small sizes and lead spacings of many SMDs. SMDs cannot be used directly with plug-in breadboards (a quick snap-and-play prototyping tool), requiring either a custom PCB for every prototype or the mounting of the SMD upon a pin-leaded carrier. For prototyping around a specific SMD component, a less-expensive breakout board may be used. Additionally,

stripbpard style protoboards can be used, some of which include pads for standard sized SMD comportments. For prototyping, "dead bug" breadboarding can be used

SMDs' solder connections may be damaged by potting compounds going through thermal cycling. Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints become more of a concern, as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when reflowing a solder paste in the SMT application. The presence of voids can deteriorate the joint strength and eventually lead to joint failure. SMT is unsuitable for large, high-power, or high-voltage parts, for example in power circuitry. It is common to combine SMT and through-hole construction, with transformers, heat-sinked power semiconductors, physically large capacitors, fuses, connectors, and so on mounted on one side of the PCB through holes. SMT is unsuitable as the sole attachment method for components that are subject to frequent mechanical stress, such as connectors that are used to interface with external devices that are frequently attached and detached.

DESIGN PHILOSOPHY:
The devices manufactured for military have some different and special designs. Such as they are huge and bulky. The smallest device is of about 700 gm whereas the largest is of 20 kg. This is done because these devices are used and have to work at extreme conditions.

Ruggedness: Components range or types are - Industrial range, military range, aerospace range, and space range. The ruggedness increases in the increasing order of the components types.

Physical Infrastructure: communication towers cannot be built everywhere, so transmitter and receivers are within the system making it bulky.

Modular Design: For each function there is a separate PCB circuit. Like a card for crypto, separate card for transmitter and receiver etc. This makes easier to remove any defect or problem in the device.

Hardware v/s Software: In software the keys are less and each key performs many functions. So to save time we use hardware and each function is performed by a different key.

DEPARTMENT ALLOTED
DEVELOPMENT AND ENGINEERING :
This is a department where the technologies developed by organizations like DRDO, CSIO etc. are brought to realty. They are practically tested on every condition as per the requirement of the customer. Also modifications of old products are also done here.

THE PROJECT WORKED ON:

NAVAL VHF RADIO

Naval VHF Radio is a half duplex transceiver for ship-toship, ship-toshore and shore-to-ship radiotelephony communication in the frequency band 146-174MHz.It consists of dedicated receivers for Digital Selective Calling (DSC CH70) and Analog Distress Channel (CH16). The design is based on the Digital Signal Processor (DSP), Direct Digital Frequency Synthesiser (DDFS) and high-end Micro controller (ARM) with built-in RTOS. The radio has built-in GPS and is available in variable power output 2W/5W/10W/15W/25W.

Salient Features
DSP Based Software Configurable Radio Frequency Range 146 MHz to 174 MHz with 25 KHz channel spacing 2.8 TFT display DSC Protocol compliant to ITU R 493.11 Dedicated DSC receiver for Channel 70 monitoring Dedicated receiver for Channel 16 Monitoring IP connectivity VoIP Remote control operation over IP USB interface In-built GPS Receiver Serial data interface (RS232) Menu driven GUI for ease of operation. In-built speaker

TECHNICAL SPECIFICATIONS

GENERAL
Frequency Range Channel spacing Type of operation Modulation Modes of operation (Channel 70), VoIP Role GPS Receiver 146 MHz to 174 MHz 25 kHz Half duplex PTT based Clear Voice FM DSC - FSK Fixed Frequency VOICE Clear, DSC DATA facility in Fixed Frequency Mode Man pack, Mobile, Static L1 frequncy, C/A Code, 12 channels

TRANSMITTER RECIEVER
RF output power 0.5uV 10dB SINAD Audio deviation Harmonics Better than 90dB Spurious >60dB : : : : 1W/2W/5W/10W/15W/25W 5 kHz > 45 dB > 60 dB Sensitivity IF Rejection Image Rejection Audio Output 5mW/300 ohm adjustable : : : :

POWER SUPPLY ENVIRONMENTAL

I/P Voltage : 12-16V DC : -15C to +55C Tx Current <500 mA : -40C to +70C :< 1.5 A (1W mode) @14V Operating temperature Storage temperature Rx Current < 10 A (25W mode) ACCESSORIES Antenna Programmer Loud Speaker unit : :

DIMENSIONS/WEIGHT Dimension (mm): 264(L) x 218(W) x 94(H) GPA, Vehicular, whip Weight : 5 kg PC

Brief Description of Naval VHF Radio

Naval VHF Radio is a half duplex transceiver for ship-toship, ship -to- shore and shore-to-ship radiotelephony communication in the frequency band 146-174MHz. The transceiver is remotely controlled through IP interface. The radio has following major sub systems: Processor It consists of DSP, Microcontroller & FPGA circuitry to implement Modulation/Demodulation in software, DSC modem, Control functions, Baseband to IF interface, IP and USB interface modules. RF: It consists of three receivers and one transmitter section: Transceiver for radio telephony communication Receiver for DSC function (Ch-70) Receiver for Audio Distress call (Ch-16) Power Amplifier & Power supply

It consists of Power amplifier section of 25W and Factorized Power supply Section to operate over a dynamic range of 12V-16V . Display It consists of Graphical display, Keypad, Volume switch, USB interface, Audio handset interface, AUX connector and External Speaker interface. Interfaces The radio has been provided with the following interfaces: IPv4, USB, Audio, External Speaker Basic Call Description Audio Distress Call: Distress Audio call will be received by the radio set on RF link. The received audio will then be processed by G.711/G.729 codec engine and will be converted into VoIP packets. These VoIP packets will be transmitted on IP interface to the backbone network. Reply to these Audio Distress calls will be initiated by remote station connected to radio on backbone IP interface .Audio call thus initiated will be converted to VoIP call & routed onto IP interface. These VoIP call will be received by radio on IP interface & then will be transmitted on RF link. DSC Call DSC call received by Base station radio will be transmitted in form of packets on IP interface to remote station. Reply to DSC call will then be transmitted on IP interface in form of packets to the base station radio. These packets will be transmitted on RF link. After allocation of voice channel for DSC call, normal voice communication will be conducted as VoIP call as mentioned in Audio Distress call procedure. Normal Voice Call: Normal voice call will be made as VoIP call similar to audio distress call.

CONCLUSION
The six weeks of summer training at BEL, Pkl unit generated a lot more interest in my subject. It made me more aware of the scope of electronics and communication Engineering. It has also made me appreciative of an industrial work environment. Undergoing training on the indoor substation has helped me integrate conceptual knowledge with real life application. I was fortunate to have personal guidance from experienced professionals who took keen interest in explaining the working details of various equipments. I feel that without this opportunity, my own understanding of this subject and also the motivation to acquire more knowledge would have remained incomplete.