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  • MT 09 702 QB Module IV

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    Neethu Krishna K
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    This document discusses different types of transducers used in microelectromechanical systems (MEMS) applications, including capacitive, inductive, magnetic, optical, piezoresistive, and piezoelectric transducers. It also covers thermal transduction methods, aligned wafer level bonding fusion process integration, anodic compression, thermal compression, and chemical-mechanical polishing (CMP) process.

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    MEMS QB-IV

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    Mt 09 702 Qb Module IV

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    This document discusses different types of transducers used in microelectromechanical systems (MEMS) applications, including capacitive, inductive, magnetic, optical, piezoresistive, and piezoelectric transducers. It also covers thermal transduction methods, aligned wafer level bonding fusion process integration, anodic compression, thermal compression, and chemical-mechanical polishing (CMP) process.

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    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    2 views1 page

    MT 09 702 QB Module IV

    Uploaded by

    Neethu Krishna K
    This document discusses different types of transducers used in microelectromechanical systems (MEMS) applications, including capacitive, inductive, magnetic, optical, piezoresistive, and piezoelectric transducers. It also covers thermal transduction methods, aligned wafer level bonding fusion process integration, anodic compression, thermal compression, and chemical-mechanical polishing (CMP) process.

    Copyright:

    © All Rights Reserved
    Download as DOCX, PDF, TXT or read online from Scribd
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    of 1

    MT09 702 MICRO ELECTRO MECHANICAL SYSTEMS

    MODULE-IV
    1. Explain about following transducers used for MEMS application and its
    transduction principle
    a. Capacitive
    b. Inductive
    c. Magnetic
    d. Optical
    e. Piezo resistive
    f. Piezo electric
    2. Explain about thermal transduction methods used for MEMS
    3. What is aligned wafer level bonding fusion used for process integration
    technique
    4. Explain anodic compression
    5. Explain thermal compression
    6. Explain in detail about chemical mechanical polishing (CMP)?

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