INDIAN INSTITUTE OF TECHNOLOGY ROORKEE

NAME OF DEPT./CENTRE: Electronics and Computer Engineering

1. Subject Code: EC – 632N Course Title: RF and Microwave MEMS

2. Contact Hours: L: 3 T: 0 P: 0

3. Examination Duration (Hrs.): Theory 0 3 Practical 0 0

4. Relative Weight: CWS 115 PRS 00 MTE 35 ETE 50 PRE 00

5. Credits: 0 3 6. Semester 
Autumn Spring Both

7. Pre-requisite: EC-331, EC-332 or equivalent, and knowledge of semiconductor

physics and devices.

8. Subject Area: DEC

9. Objective: To introduce the students to the new area of Microelectromechanical Systems (MEMS)
and their applications in RF and wireless engineering.

10. Details of the Course:

Sl. Contents Contact

No. Hours
1. Introduction: RF MEMS for microwave applications, MEMS technology 6
and fabrication, mechanical modeling of MEMS devices, MEMS materials
and fabrication techniques.
2. MEMS Switches: Introduction to MEMS switches; Capacitive shunt and 12
series switches: Physical description, circuit model and electromagnetic
modeling; Techniques of MEMS switch fabrication and packaging; Design
of MEMS switches.
3. Inductors and Capacitors: Micromachined passive elements; 9
Micromachined inductors: Effect of inductor layout, reduction of stray
capacitance of planar inductors, folded inductors, variable inductors and
polymer-based inductors; MEMS Capacitors: Gap-tuning and area-tuning
capacitors, dielectric tunable capacitors.
4. RF Filters and Phase Shifters: Modeling of mechanical filters, 6
micromachined filters, surface acoustic wave filters, micromachined filters
for millimeter wave frequencies; Various types of MEMS phase shifters;
Ferroelectric phase shifters.
5. Transmission Lines and Antennas: Micromachined transmission lines, 6
losses in transmission lines, coplanar transmission lines, micromachined
waveguide components; Micromachined antennas: Micromachining
techniques to improve antenna performance, reconfigurable antennas.
 6. Integration and Packaging: Role of MEMS packages, types of MEMS 3
packages, module packaging, packaging materials and reliability issues.
Total 42

11. Suggested Books:

Sl. Name of Books / Authors Year of

No. Publication
1. Varadan, V.K., Vinoy, K.J. and Jose, K.J., “RF MEMS and their 2002
Applications”, John Wiley & Sons.
2. Rebeiz, G.M., “MEMS: Theory Design and Technology”, John Wiley 1999
& Sons.
3. De Los Santos, H.J, “RF MEMS Circuit Design for Wireless 1999
Communications”, Artech House.
4. Trimmer, W., “Micromechanics & MEMS”, IEEE Press. 1996
5. Madou, M., “Fundamentals of Microfabrication”, CRC Press. 1997
6. Sze, S.M., “Semiconductor Sensors”, John Wiley & Sons. 1994