Experiment: Grinding

Objective:
To study the effects of grinding variables on grinding forces and specific energy

Equipment Used:

Ayush
Sinha
Roll
no.13188
Group
B2G1

Grinding Machine and Grinding wheel

Vernier Callipers
Dynamometer
The dynamometer consists of four 3 component Piezoelectric force sensor. The force components are measured
in terms of voltage across piezoelectric sensor. A four range miniature change amplifier is fitted. Therefore, the
output signal at the dynamometer is of low impedance. The integrated cable is connected to the control unit.

Stereo Microscope
The number of active grains on the wheel surface can be measured by observing the active surface of the wheel
under a stereo-microscope. The active grains will have glazed appearance because of metal deposit. A
magnification factor of X45 will be sufficient for the purpose.

Balancing Module
To test the balance of the grinding wheel, a balancing module of counter weights is used. The wheel when placed
on the module, if stays still is balanced and if it rotates, it has to be modified accordingly.

Portable surface roughness measuring instrument (SJ 301)

The portable device when moved over the surface of the work piece, being piezoelectric, generates some voltage,
which is measured by it and using that value, the roughness is estimated. In the plot of the surface roughness,
input the sample length and the evaluation length, it takes average over the sample length data and adds them up
for the final value.

Formulas Used:
t

4v
VCr

d
D

t = Chip thickness
D = Wheel diameter

b'
1.5
t

u=

FtV
vdb
l = Chip length
d = Wheel depth of cut

V = Wheel speed

v = Work speed

b = Width of grinding path

per unit area

C = no. of active grains

Observations:

Grinding wheel specifications: A46 J5 V CJ

Grinding wheel RPM: 1500
Work piece Material: EN-8
Work piece width: 10.02 mm (b)
Wheel diameter: 284.50 mm

Calculation of the number of active grains on the wheel, using stereo-microscope

Area = 0.25 cm2
Number of particles = 18
Therefore, C = 72x104 per m2

Table
speed v,
m/min
5

10

S.
No.

15

20

3000

Depth of
Cut d
(10-6m)
6
10
14
20
6
10
14
20
6
10
14
20
6
10
14
20

Tangentia
l force
(Ft), kgf
329.2984
614.9976
899.6323
773.9448

Normal
force
(Fq), kgf
249.5932
455.4115
1137.626
2000.325

674.6708
1245.237
1659.675
1549.603
1539.971
1785.995
2188.485
2483.916
2177.203
1351.665
2246.323
2726.277

280.3468
1129.693
2127.885
1352.326
936.011
1275.383
2422.376
3171.357
1817.579
2857.877
856.1517
1977.056

Ft (kgf) vs v
(m/min)

2000
v=5
v=10

1500

v=15
1000

v=20

500
0
10

14

20

3000
2500
2000
d=6
d=10

1500

d=14
1000

d=20

500
0
5

10

7.964
9.048
9.843
10.761
11
.263
12.797
13.921
15.218
13.795
15.673
17.049
18.639
15.928
18.098
19.688
21.522

Ft (kgf) vs d
(microns)

2500

Chip thickness
(t), (10-6m)

15

20

Specific
Energy, u
(kJ/mm3)
14.687
16.457
17.196
10.355
15.045
16.661
15.862
10.367
22.894
15.922
13.944
11.078
24.276
9.043
10.734
9.119

Fq (kgf) vs v
(m/min)

3500

Fq (kgf) vs d
(microns)

3000
2500
2000

v=5

1500

v=15

v=10
v=20

1000
500
0
6

10

14

20

3500
3000
2500
2000

d=6

1500

d=14

d=10
d=20

1000
500
0
5

10

15

20

Specific Energy (kJ/mm3) vs Chip Thickness (microns)

30
25
20
15
10
5
0

Conclusion :
Tangential force increases with both Table speed as well as Depth of cut.
Normal force increases with both Table speed as well as Depth of cut.
Specific Energy generally increases with chip thickness.