MODULE 4 B1 31/08/17

Q1) PCB circuit testing after final manufacturing

1) Each individual PCB
2) One from each batch
3) Every alternate PCB

Q2) PCB circuit switching through

1) Nickel
2) Copper
3) Gold
4) Aluminum

Q3) Which device difficult to mount on PCB

1) Transistor
2) FET
3) Diode
4) Capacitor

Q4) PCB manufactured

A) As per circuit requirement and required specification

Q5) Diode which have double layer in P and N region

1)Sckhorty Diode
2)Zener Diode
3)Varactor Diode

Q6) Syncro system for

1) Use for light loads like moving pointers for remote indication
2) Use for heavy loads
3)Both

Q7) Torque syncro transmitter and receiver in

1) Same Construction
2) Same in electrical operation
3) Both

Q8) Photo Diode

1) Power Indicator
2) Use for 7 segment display
3) Counter

Q9) Photo Diode

1) Power Indicator
2)
3)

Q10) Photo Diode will illuminate because of

1) Fwd Current pass through junction
2) Due to leakage current
3) Due to increase in reverse voltage

11) IC is
1) Large
2) Small
3) Extra Small
Q12) IC is made out of
1) Silicon
2) Copper
3) Aluminum

13) Advantage of IC
1) Can be operated in high temperature

Q14) In transisters
1) One is fwd bias and another is reverse biased
2)
3)

Q15) How to connect transisters in PCB

1) One transister terminal with other two tansisters
2) Two transister terminals with other transister terminal
3) All three terminal with connect on pcb as it is single crystal

Q16) Rotor of torque syncro transmitter made of

A) 2 wire connected in series

Q17) Sutaible right size capacitor across stator

A) Current decrease accuracy improve

Q18)