Curso de CRT

1.
SCREEN and PICTURE QUALITY

1.1 Grouping
Pitch, p
h2S h1S
C2 C1 C0
R G B R
LR LG LB
h2B h1B
What is Beam & Stripe Grouping?

Stripe Grouping = [(h1S + h2S) x 3] / 2p
Beam Grouping = [(h1B + h2B) x 3] / 2p
How to calculate Beam Grouping?

Let Sg = Stripe Grouping Bg = Beam Grouping
L R = Red landing
L G = Green landing
L B = Blue landing
Sg = [(h1S + h2S) x 3] / 2p
Bg = [(h1B + h2B) x 3] / 2p
= {[ h1S+(L B-L G) + h2S+(L G-L R) ] x3} / 2p
= [(h1S + h2S)+ (L B-L R)] x3 / 2p
i.e. Beam Gp. = Sg + {[(L B-L R)x3] /2p}
1
2. ELECTRON GUN
In a CRT operation, one of the main components in obtaining an image on the screen is the
electron gun. Electron beams emitted from the gun will strike on the screen, which is coated
with phosphor, to produce an illumination.
In the CRT design, there are basically two different types of electron gun:
1. 3-gun-3-beam
2. 1-gun-3-beam
Sony employs the 1-gun-3-beam type of gun, together with the Sony invented aperture grill
forms the Sony Trinitron tube.
2.1 Function of each gun parts

The electron is consists of mainly the following parts:
(Refer to appendix for a diagram of a Trinitron gun.)
1. Heater & sleeve - a miniature coiling of tungsten wire.

2. Cathode - a small metal cap coated with oxide that can emit electron when heated.
3. Grid 1 (G1) - controls the amount of electron being emitted.
4. Grid 2 (G2) - accelerates the electron beam, part of pre-focusing lens.
5. Grid 3 (G3) - accelerates the electron beam, part of focusing lens between G2 & G4.
6. Grid 4 (G4) - main focus lens where all three beams converge at the center.
7. Grid 5 (G5) - accelerates the electron beam.
8. Convergence plate (HV, CV) - converging the three beam at a single point on the screen.
9. IBR - a voltage divider providing the required voltage to converging plates.
10. Stem - a glass structure embedded with metal pins.
11. Bead glass - used to hold the gun grids together to form the gun.
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3. RELIABILITY
3.1 Taiatsu
Many have the idea that the meaning of the word “Taiatsu” is dust, or dust problems in TV tubes.
However, the direct translation of the word actually means “the ability to withstand high voltage ”.
Taiatsu is commonly known in SDS as one of the many defectives occurring in a CRT. Very few
actually treat it as a technology, but a name given to defects CRTs. Therefore, to understand Taiatsu,
we must first understand the three fundamental phenomenon affecting Taiatsu quality (main
symptoms of poor Taiatsu CRTs). They are (1) Arcing (2) Strays and (3) Leakage current.
Let us now put the idea of dust defects aside and look into the fundamental theory behind Taiatsu, so
that we could learn or suggest improvement methods to ensure Taiatsu quality.
How does stray, leak and arcing occur?

Arcing
Arcing(s) are electric ‘lightning’ between the grids (electrodes) of the electron guns. So with the
electron guns, arcing occurs on tiny dust and parts with scratches as little as 2µm in height (The book
‘What is arcing’ edited by M. Fujita and T. Yamada).
Items to be taken into consideration for arcing to occur are; the potential difference in voltage between
the grids (electrodes), the distance between the potential difference, shape and material of particles
coming into the path of electron travel.
(Fig. 1.3.1a)
High
(+)
Space between electrode ~2mm
Neck Glass
Low
(-)
Dust, burr ~ 2µm in height
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3.2 Emission
What is cathode emission?
HV
Heater
Cathode
Ek
EC2
Ef
From a simplified diagram above, the different voltages required for electrons emission will be
1.1 To begin with, the electrons on the cathodes must be ready. This is prepared by supplying heat to
cathode through a heater (thermionic emission). The voltage to supply current to the heater is
called Ef. For a normal CRT, this is 6.3V. (This will allow the reaction of Ba to Ba2+.)
1.2 After the electrons are ready, the next is to create a potential difference across the vacuum space.
This is supplied by the High Voltage (HV) and Cathode Voltage (Ek). This creates the driving
forces for electrons to move, and determine the general direction for electrons movement. The
HV supplied is normally in 20kV ~ 30kV. (Ek has relative small influence in making the potential
difference, in the normal range of 50V ~ 200V)
1.3 However, since the HV is supplied at a distance away, to have a more precise
control in the amount of electrons being emitted from the cathode, EC2 is applied. (Physically,
this is the electrical potential applied to Gun Grid 2.) Grid 2 has an additional function of pre-
focusing with G1 Hole diameter and G3 lower grid Hole diameter. This created an accelerated
electrical field between cathode, grounded G1 and G2.
32
3.2 Emission
What is cathode emission?
HV
Heater
Cathode
Ek
EC2
Ef
From a simplified diagram above, the different voltages required for electrons emission will be
1.1 To begin with, the electrons on the cathodes must be ready. This is prepared by supplying heat to
cathode through a heater (thermionic emission). The voltage to supply current to the heater is
called Ef. For a normal CRT, this is 6.3V. (This will allow the reaction of Ba to Ba2+.)
1.2 After the electrons are ready, the next is to create a potential difference across the vacuum space.
This is supplied by the High Voltage (HV) and Cathode Voltage (Ek). This creates the driving
forces for electrons to move, and determine the general direction for electrons movement. The
HV supplied is normally in 20kV ~ 30kV. (Ek has relative small influence in making the potential
difference, in the normal range of 50V ~ 200V)
1.3 However, since the HV is supplied at a distance away, to have a more precise
control in the amount of electrons being emitted from the cathode, EC2 is applied. (Physically,
this is the electrical potential applied to Gun Grid 2.) Grid 2 has an additional function of pre-
focusing with G1 Hole diameter and G3 lower grid Hole diameter. This created an accelerated
electrical field between cathode, grounded G1 and G2.
32
1.4 Refer to the following diagram for electrons path:
EC2 nominal
Electrons
value 500 V
G1 grounded
Equip-potential Ek, nominal 50 ~ 80 V

Field
1.5 The diagram shows a equip-potential electric field which allow the electron path to be traced.
(Electrons move in the direction perpendicular to the potential lines in the increment direction.)
However, the electric field is being modified by Ek, this is to provide individual control to the
amount of electrons coming from the cathode, as EC2 can be considered a master control for
RGB cathodes. EKR, EKG and EKB are used to balance the difference in Ik (Amount of electrons.).
1.6 As you could see from the diagram, there are two ways to draw electrons from the cathodes. One
is to increase EC2, which allow electrons to emit from all three cathodes. Another is to reduce
Ek so that more electrons could be emitted from cathodes.
There is a fundamental difference in these two methods. By fixing Ek and increasing EC2, will
intensify the field between G1 and G2 and also the field at the centre of G1 holes, therefore,
electrons will move out from cathodes easily. By adjusting Ek, we reduce the field intensity
between G1 and cathode, therefore, allowing EC2 to “penetrate” onto a large surface area on the
cathode. Therefore, helps to draw electrons.
1.7 The difference in a static and dynamic measurements are the way electrons
emitted from cathodes are being received (absorbed). A normal operation or “dynamic”
measurement, the electrons will follow the electric field which will go through the gun grids and
hit on the MB which will be conducted away through the anode button.
For static measurement, the electrons will be absorbed by the + gun grids, such as G2 or G4.
This type of measurement will normally release some gases from metal parts which could be
harmful to the cathodes.
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Inspection & Quality Standards
Inspection
In this chapter, a few methods on which emission is being evaluated are discussed.
1.1 CQF & Slumping, GR
This is normally the basis of emission judgement. Since CQF is already a value incorporating
routine Ik with D-EkCO values, a comparison could be made directly. However, if CQF is near
to 1.0 or 1.6. It is important to judge the brightness value of these CRT again, if EkCO and
brightness values are acceptable, it may be necessary to remake CQF formula again.
Slumping is an indication of Ba radical (electrons producer) generation rate. Therefore, with a

certain amount of preheat, the slumping should not be greater than certain percentage, if there is
any significant change in this slumping range, it might be necessary to revise the aging schedule
again.
GR will affect emission in a significant way, it is necessary to check GR values at keep test (to
detect outgassing property) and raster test (to detect abnormal outgassing)
1.2 EfIk
EfIk is one of the important tools to analyse cathode characteristics. It tells us of the variation of
Ik with Ef. And since cathode characteristics are very much affected by Ef supply, therefore any
abnormalities could be observed.
A Good EfIk curve should have the following characteristics

1. Clear and distinct curve for temperature and space-charge limit regions.
2. There should be no abnormal dip or spike observed in the Ik.
3. The dip voltage should be smaller than operating voltage.
4. R EfIk, G EfIk and B EfIk should not defer from each other significantly.
EfIk Curve NG will mean

1. a curve with Ik value only after operating Ef voltage means aging is insufficient.
2. A curve with very gentle temperature limit region means oxide aging is poor or GR has been
bad, example will be poor GB, causing high outgassing of G1 and G2 parts during this static
measurement.
3. A double slope (meaning no clear two regions) especially if it is near to operating Ef could
mean cathode characteristics are not stablised 2nd Aging, current aging or raster aging may
be poor.
4. A curve with a very sleep slope at space charge region, refers to rate of reaction to generate
electrons may be insufficient. Therefore, cathode composition and temperature (at operating
Ef) should be checked.
5. A curve with very much different in R G B EfIk curve, could mean some cathode structural
defects. (Example Heater float and HK leak.)
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1.3 BUT / BDT
Built-Up Time and Build down time give an indication of the initial cathode characteristics. A
longer built-up time could be due to initial design, sleeves problem, and heater problem or even
aging problem.
1.4 Sintering Level

Sintering level is a visual judgement on the cathode.
Normally,
If the cathode is enlarged 50 Times, abnormal times that we could see
1. hairline cracks (cathode press. High density cathodes)
2. arcing holes (Arcing, knocking process high, Taiatsu poor)
3. contamination (Ionic Bombardment, oil or carbon contamination from
Gas)
4. cluttering of oxides (Aging temperature high)
5. rough surface (porosity) (Initial Aging is high)
These defects could be looked at more closely at 500 times.
At 2000 times, sintering level is judged based on

1. Grain shape (long, needle shape grain shape)
2. Grain size (if the grains are melted or clustered together)
3. Grain porosity, boundary referring to dimension of the “crack”
1.5 Ba Concentration / Ba / Sr ratio
EDX could be done on oxides to determine the composition of cathodes.

A normal aging will yield a Ba/Sr ratio of 0.4 to 0.6. A lower ratio will indicate a over aging
while a higher ratio will mean a lower aging schedule.
During normal operation, it is found that Ba will slowly be depleted as it is evaporated.
Therefore the ratio will slowly move downward from the above chart.
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Gas Ratio
1.6 Theory
The basis of gas ratio measurement is by “leakage” current flow. It uses electrons from cathodes to
break down gas molecules in the path. And by rendering them into
G5 G4 G3 G2 G1 K
Current = 500 uA
Variable Ec1
Current meter voltage
Igr
Ea = - 25v Ec2 = 200 V

Collector
Voltage
positive and negative ions, a current could flow by application of electrical voltage. The magnitude of
this current will determines the Gas Ratio.
1.6 Definition
Gas Ratio is the ionic current collected by a collector when 1.0mA equivalent of electrons is given.
*In actual measurement, we used 500 µA rather than 1.0mA. The actual ionic current is “doubled” to
give the correct gas ratio. (Reason is not to cause damage to cathode, by static measurement.)
GR measurement is in µA.
(A collector is a gun grid which is designated to “collect” positive ions.)
If GR has to be measured without a complete aging process, cathode temperature must be increased to
higher such that cathode is able to produce enough electrons. (Lower Ik current can be used, by
multiplying proportion of the 1mA of Ik).
36
Different gun models will have different co-relation between GR value and actual vacuum level.
Therefore, to apply the GR value, the relationship between GR and vacuum level must be quantified.
To a relation
Vacuum Level (in torr) = A x (GR)B
GR specification is 5 x 10-6 torr. Therefore the corresponding GR value is obtained for each gun
model. However, for the convenience of easy reference, it is normally in production to use a
specification of 0.05. (As compared to last time 0.1)
To detail the process control that need to be done at each process required a long list, therefore only a
set of guidelines are put here as a general reference.
Quality Standards
In any QC system, there will be a few components that are necessary for operation
1. A sampling plan on tests
2. Monitoring Chart
3. Corrective Action Plan (Freeze and Re-inspection)
4. Defect Analysis
5. In-house Process Check
6. Improvement Plan
Tests’ Sampling Plan

1. A routine sampling on the CQF value is necessary to ensure emission level. This is done at CRT
QC. Which the Average and Sigma is monitored weekly.
2. Reliability Tests are done for both GR and emission level before and after TV’s White Raster (Set)
aging for 22 hours. This done on daily and weekly basis depends on the type of CRTs.
3. Cathode condition is checked on a weekly basis for sintering and others contamination on routine
production. (By PF Separation and SEM / EDAX Check)
Monitoring Chart
1. A monitoring chart for Average and sigma before and after Set aging is done to see abnormal
trend.
Corrective Action Plan

1. Production as well as QA will freeze and request for corrective action when abnormal reject % and
repair % occurs in production line.
2. Evaluation should be carried out after Frozen CRTs have completed re-inspection.
Defect Analysis
1. Sampling analysis is carried on defect to analyse the failure mode and ensure the possibility of
defect going out to CTV plant is small.
2. Sampling NG CRT also has to be analysed and determine if a critical trouble occurs.
In-House Process Check

1. Production carried out in-process condition check on a shiftly and daily basis.
2. QA and Process Engineering will regular do auditing on production line.
Improvement Plan
1. Production will initiate yield improvement target and Process Engineering will then devise and
plan for improvement activities.
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Factors affecting emission of electron
Factors that affect Emission
The main factors to be considered in Emission related process issues are
A) Gas ratio, affect emission in two ways. First, inhibits electrons from reaching the screen and
prohibit activation process. Two, ions (break down by Ik) and some gases will attack the oxides.
B) Outgassing of CRT parts, as CRTs operate in vacuum condition, the gases which initial trapped in
parts or surfaces will slowly vaporise into the vacuum, which will then affect the emission the
same way as Gas ratio.
C) Cathode operating temperature, as previously discuss, the rate of reaction of Ba is very much
dependant on cathode temperature, and inversely proportional when rate of vaporisation of Ba is
concerned.
D) Activation and aging to prepare the cathode, from CO3 structure to O structure. If poor activation
and aging, the Ba on cathode might be running low as normal enough BaO for reduction and
regeneration process to continue.
E) Others problems such as dusts on oxide and arcing holes on oxides.
Therefore, the process related to all these factors will have to be considered and monitor carefully, as
any slight change will create a disastrous effect, a large quantity of CRTs will be affected.
Process Change that could affect Emission
A) Vendor
1) Vendor change of material,
2) Process Change (especially heat treatment process),
3) Change of treatment chemicals (eg anti-rust treatment).
4) Change of Packing Material.
B) AG Process
1) Frame degreasing, washing, and cleansing process : Change of Index, detergents,
concentration change.
2) AG Frame WIP storage condition and materials.
3) AG Frame Reinput condition and criteria.
3) Blackening Oven’s heat temperature and condition.
C) Screen Process
1) Uses of New chemicals in screen process.
2) Change of panels (New Panel’s materials)
3) Change of Panel washer condition and process.
4) Uses of Reinput Panels and In Process repair.
5) Use of new cone and neck carbon.
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D) Oven Process
1) Gun washer : Ultrasonic DI Water, Drying Conditions.
2) AGS Sealing condition : Sealing condition (Flame position, heat curve and
maximum temperature) that will affect the binder’s vaporisation rate and
therefore affecting the adhesion of oxides to base metal.
3) Frit Seal Oven and Exhaust Oven, Heat curve and Temperature settings.
4) Reinput and Repair at FS and EXH Ovens.
5) Change of Formation / Activation position and voltage settings.
6) Getter Flash condition change.
7) Gun Bake condition change. (Position, Index and Temperature settings)
E) FI Process
1) Ef Aging
2) Current Aging
3) Knocking Process
39
CRT’s Life
A) Introduction
In a layman term, Life-test is referring to a test which subject TV sets to run under a special condition
of high brightness to a time which it ability to maintain that level of brightness has dropped to half of
initial value.
It evaluates the reliability of the CRT in emission and reliability of various CRTs in production.
Definition
a) Lifetest is a test for CRT at white raster condition under fixed Ik and given EC2 to a time
which the Ik value from measurement has dropped to half of those initial values.
b) CCA % is referring to the proportion of Ik at certain time as compared to Ik at 24 hrs. It is

normally called constant current area %, which simply called as refer to the “working area” for
electrons emission as compared to initial condition.
c) Actual Life End is referred to CRT undergoes lifetest has reached a state which Ik (any color)
during measurement has reached 50 % CCA or less.
d) Life Running Time is referring to the time which CRT has completed running. It is necessary
to run the CRT to 10000 hours. With the measurement timing and set-up time, normally a
CRT will be going on test for a period closed to 1.3 years on CRT racks.
e) Estimated life for CRT is referring the estimated time required to reach life end condition from
an earlier time frame. The method of estimation is normally done by extrapolation.
f) Life End by other troubles refers to life end condition is reached not by capabilities of CRTs
but due to handling, running condition or measurement condition of these CRTs.
B) Life-Test Operation Flow Chart

As can be seen from the flowchart, we can divide lifetest in 4 different portions.
1) Set-up and Running Conditions

2) Measurement
3) Judgement criteria
4) Action for failure or dangerous life status.
Set-up and running conditions refer to the initial measurement of CRTs and check of chassis and
voltage supply.
For measurement, it is the determination of measurement condition and validation of measurement

data.
As for judgement criteria, it is the condition used for life judgement and the method used, and
guideline need if CRTs have not reached the required target. For action plan, it includes action to take
and evaluation procedure for life end and short life CRTs, some improvement activities for life status.
40
C) Life test set-up and running conditions
Life test is required for the following:
1) Process Change
2) Routine
3) New Gun / CRT Model introduction
4) New Parts Introduction
As from the flow chart,

Initial CRT characteristics needed to be checked for CRT is used for lifetest.
1) If a CRT failed initial Emission conditions, this CRT cannot be used for life test as it is evaluation
of CRT based on reliability of emission, an emission defect will not allow the CRT to be evaluated
under life test.
2) A process change will have to carry out life test if the following conditions are
met:
a) Any washing process change (including detergents used) which the particular parts have no
washing process after that.
b) Blackening Oven (AG frame), FS Oven (Panel, Funnel, carbon) and EXH Oven (Removal of
gases) process change. (Including Index time, heat curve and temperature change).
c) Getter Flash Process Change. (This must be ensured by getter absorption capability check)
d) Gun Bake Process. (If there is an index change or temperature down condition)
e) Aging Process. (if cathode after process change are found to have high slumping % and sintering
level is poor)
f) Sampling size for process change should be n = 3 pieces. (For change that could affect a large
quantity of CRTs). For engineering tests, the sample size is 2. (It is important if it is not for any
critical condition, lifetest should only be conducted if this change has any significant impact on
the normal CRT.)
3) A routine sampling for lifetest on CRTs being produced is a must. The following guidelines
should be used.
a) A sampling of minimum n = 3 pcs should be done on a month production. (Qty approx 50000 to
180000 CRTs).These CRTs should be taken from outgoing CRTs which has finished all
inspection check.
b) If any one line produced more than 2 models, lifetest should be carried out if the quantity of CRTs
produced is more than 20000 (or more than a week production)
c) If no sampling is done on the model in that month, and this model is being produced in the
following month, sampling has to be done on these CRTs.
d) Priority of sampling has to be given to “ critical model” which CRT life is found to be close and
near to target. Or CRTs’ estimated life is short based on design or production at another CRT
plant.
4) Life test for new CRT model introduction should follow the guideline below:
a) If CRT line is newly set-up, it is important to set-up for life test for every trial run that has been
conducted if posible.
b) Generally, life test should be carried out after line has achieved a good emission condition. That is,
CQF NG, Slumping and cathode defect has been relatively stable. This is because life test is long
term evaluation of these CRTs. Therefore, the purpose is to determine how reliable is this CRT in
term of emission, it is pointless to test a CRT which has unstable emission as no conclusion could
be drawn even if life test has failed. (Process may have already become stable after that condition).
41
c) Minimum of n =9 CRTs should be set up for any new model introduction and should have
completed 3000 hours of running time at on-line. (4.5 months before the on-line date for the last 3
CRTs) However, due to time constraint on new model introduction, the last batch of CRTs should
be at least 2000 hours at on-line time. (3 months)
5) Life test on new parts’ introduction should be carried out if

a) The performance of this part in emission is not known. (Use of a new vendor, new line or new
material.)
b) Any major parts in CRTs. (Eg AG frame, Panel and Funnel, Gun and cathode change)
c) For engineering tests, that means to compare the life test of a number of parts.
d) Only for parts to be used in routine conditions, sample of 3 will be carried out.
D) Current Loading factor- J

There is one major factor in consideration when CRT is running for life that life engineer should be
aware of. This is called current loading factor, J.
Physically, this is the current density when CRT is running for life. The higher that is, the estimated
life is shorter or rather the design expected life is shorter.
There are 2 formulae in use, one is called old SONY cathode loading factor and another is the new
SONY loading factor.
The development from old SONY loading factor to the new loading factor is due to fact that when gun
is heated up during operation, G1 hole and D01 is slightly changed, therefore to describe the design
life, new loading factor is developed.
Old Current Loading factor is calculated by
Ik
J = --------------------------------
(G1 φ1 Area)(Ed/Ekco)
where
Ik is the cathode current in A (Running condition)
(G1 φ1 Area) is the area of G1 hole in cm2.
Ed is the difference in Ekco and Ek (Drive CCA) in V.
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New Current Loading factor is calculated by
Ik
Jnew = -----------------------------------------
(G1 φ1 Area)(εKhot) ln(1-(Ed/Ekco))
Where
εKhot is a constant factor based on hot deformation.
0.572 + 0.167 (d01 hot /φ1) + 0.561(d01 hot /φ1)2
where d01 hot is d01 adjusted for hot condition.
d01 hot = d01 – (dsh – dgh)
where d01 is the distance from cathode to G1

dgh is deformation adjustment for hot G1 condition.
dsh is deformation adjustment for hot sleeves deformation.
E) CCA measurement
CCA or constant cathode area is evaluated in term of percentage point. It is calculated from Ik at
measurement divided by Ik at 24 hours. If the percentage of drop or “increase” is too much, reconfirm
the calculation and check previous Ik value.
As a guide,
a) More than 5 % drop is abnormal for 500 hrs of running time
b) If CCA % went up instead of dropping, any increase more than 5 % is considered very abnormal.
Normally this is due to measurement error. Need to consider the overall trend and decide which
measurement is out.
Other points to take note when obtaining CCA % data
a) Do a manual measurement on this CRT to confirm the auto measurement.
b) Do a manual measurement using another CRT tester to confirm the life tester measurement.
c) Cool the CRT over a day and do the measurement.
d) Run the CRT over a day to check the measurement.
Ec2co drift is referring to phenomenon of Ec2co increasing in value as CRT continued to run towards
the 10000 hours. Physically, it means that the cathodes required to have a higher Ec2co in order to
draw out current, which means the cathode has decreased in ability in emitting electrons. (This has the
opposite effect on Ekco drift). The drift should not be more than 5V per 500 hrs.
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E) Judgement Criteria
The judgement criteria are :
1) At 0hr, 24hr, 100hrs, 500hrs, 1000hrs and 2000hrs, minimum CCA % should be greater than
80 %
2) At 3k, 5k, 10khrs, the estimated life should be more than 10,000 hrs (for all cathodes)
Points to note
a) Minimum estimated life is referring to the life estimated base on the least CCA % on three
color of the CRT. This could also refer to the minimum life of the batch of CRTs.
b) Average life is referring to the average of all estimated life of CRTs. This gives an indication
in the process capability of the CRTs. However, caution should be taken not to mistake with
this with average CCA %. (which is the average of all CCA % at different time interval).
44
CRT’s Life
A) Introduction
In a layman term, Life-test is referring to a test which subject TV sets to run under a special condition
of high brightness to a time which it ability to maintain that level of brightness has dropped to half of
initial value.
It evaluates the reliability of the CRT in emission and reliability of various CRTs in production.
Definition
a) Lifetest is a test for CRT at white raster condition under fixed Ik and given EC2 to a time
which the Ik value from measurement has dropped to half of those initial values.
b) CCA % is referring to the proportion of Ik at certain time as compared to Ik at 24 hrs. It is

normally called constant current area %, which simply called as refer to the “working area” for
electrons emission as compared to initial condition.
c) Actual Life End is referred to CRT undergoes lifetest has reached a state which Ik (any color)
during measurement has reached 50 % CCA or less.
d) Life Running Time is referring to the time which CRT has completed running. It is necessary
to run the CRT to 10000 hours. With the measurement timing and set-up time, normally a
CRT will be going on test for a period closed to 1.3 years on CRT racks.
e) Estimated life for CRT is referring the estimated time required to reach life end condition from
an earlier time frame. The method of estimation is normally done by extrapolation.
f) Life End by other troubles refers to life end condition is reached not by capabilities of CRTs
but due to handling, running condition or measurement condition of these CRTs.
B) Life-Test Operation Flow Chart

As can be seen from the flowchart, we can divide lifetest in 4 different portions.
1) Set-up and Running Conditions

2) Measurement
3) Judgement criteria
4) Action for failure or dangerous life status.
Set-up and running conditions refer to the initial measurement of CRTs and check of chassis and
voltage supply.
For measurement, it is the determination of measurement condition and validation of measurement

data.
As for judgement criteria, it is the condition used for life judgement and the method used, and
guideline need if CRTs have not reached the required target. For action plan, it includes action to take
and evaluation procedure for life end and short life CRTs, some improvement activities for life status.
40
C) Life test set-up and running conditions
Life test is required for the following:
1) Process Change
2) Routine
3) New Gun / CRT Model introduction
4) New Parts Introduction
As from the flow chart,

Initial CRT characteristics needed to be checked for CRT is used for lifetest.
1) If a CRT failed initial Emission conditions, this CRT cannot be used for life test as it is evaluation
of CRT based on reliability of emission, an emission defect will not allow the CRT to be evaluated
under life test.
2) A process change will have to carry out life test if the following conditions are
met:
a) Any washing process change (including detergents used) which the particular parts have no
washing process after that.
b) Blackening Oven (AG frame), FS Oven (Panel, Funnel, carbon) and EXH Oven (Removal of
gases) process change. (Including Index time, heat curve and temperature change).
c) Getter Flash Process Change. (This must be ensured by getter absorption capability check)
d) Gun Bake Process. (If there is an index change or temperature down condition)
e) Aging Process. (if cathode after process change are found to have high slumping % and sintering
level is poor)
f) Sampling size for process change should be n = 3 pieces. (For change that could affect a large
quantity of CRTs). For engineering tests, the sample size is 2. (It is important if it is not for any
critical condition, lifetest should only be conducted if this change has any significant impact on
the normal CRT.)
3) A routine sampling for lifetest on CRTs being produced is a must. The following guidelines
should be used.
a) A sampling of minimum n = 3 pcs should be done on a month production. (Qty approx 50000 to
180000 CRTs).These CRTs should be taken from outgoing CRTs which has finished all
inspection check.
b) If any one line produced more than 2 models, lifetest should be carried out if the quantity of CRTs
produced is more than 20000 (or more than a week production)
c) If no sampling is done on the model in that month, and this model is being produced in the
following month, sampling has to be done on these CRTs.
d) Priority of sampling has to be given to “ critical model” which CRT life is found to be close and
near to target. Or CRTs’ estimated life is short based on design or production at another CRT
plant.
4) Life test for new CRT model introduction should follow the guideline below:
a) If CRT line is newly set-up, it is important to set-up for life test for every trial run that has been
conducted if posible.
b) Generally, life test should be carried out after line has achieved a good emission condition. That is,
CQF NG, Slumping and cathode defect has been relatively stable. This is because life test is long
term evaluation of these CRTs. Therefore, the purpose is to determine how reliable is this CRT in
term of emission, it is pointless to test a CRT which has unstable emission as no conclusion could
be drawn even if life test has failed. (Process may have already become stable after that condition).
41
c) Minimum of n =9 CRTs should be set up for any new model introduction and should have
completed 3000 hours of running time at on-line. (4.5 months before the on-line date for the last 3
CRTs) However, due to time constraint on new model introduction, the last batch of CRTs should
be at least 2000 hours at on-line time. (3 months)
5) Life test on new parts’ introduction should be carried out if

a) The performance of this part in emission is not known. (Use of a new vendor, new line or new
material.)
b) Any major parts in CRTs. (Eg AG frame, Panel and Funnel, Gun and cathode change)
c) For engineering tests, that means to compare the life test of a number of parts.
d) Only for parts to be used in routine conditions, sample of 3 will be carried out.
D) Current Loading factor- J

There is one major factor in consideration when CRT is running for life that life engineer should be
aware of. This is called current loading factor, J.
Physically, this is the current density when CRT is running for life. The higher that is, the estimated
life is shorter or rather the design expected life is shorter.
There are 2 formulae in use, one is called old SONY cathode loading factor and another is the new
SONY loading factor.
The development from old SONY loading factor to the new loading factor is due to fact that when gun
is heated up during operation, G1 hole and D01 is slightly changed, therefore to describe the design
life, new loading factor is developed.
Old Current Loading factor is calculated by
Ik
J = --------------------------------
(G1 φ1 Area)(Ed/Ekco)
where
42
New Current Loading factor is calculated by
Ik
Jnew = -----------------------------------------
(G1 φ1 Area)(εKhot) ln(1-(Ed/Ekco))
Where
εKhot is a constant factor based on hot deformation.
0.572 + 0.167 (d01 hot /φ1) + 0.561(d01 hot /φ1)2
where d01 hot is d01 adjusted for hot condition.
d01 hot = d01 – (dsh – dgh)
where d01 is the distance from cathode to G1

dgh is deformation adjustment for hot G1 condition.
dsh is deformation adjustment for hot sleeves deformation.
E) CCA measurement
CCA or constant cathode area is evaluated in term of percentage point. It is calculated from Ik at
measurement divided by Ik at 24 hours. If the percentage of drop or “increase” is too much, reconfirm
the calculation and check previous Ik value.
As a guide,
a) More than 5 % drop is abnormal for 500 hrs of running time
b) If CCA % went up instead of dropping, any increase more than 5 % is considered very abnormal.
Normally this is due to measurement error. Need to consider the overall trend and decide which
measurement is out.
Other points to take note when obtaining CCA % data
a) Do a manual measurement on this CRT to confirm the auto measurement.
b) Do a manual measurement using another CRT tester to confirm the life tester measurement.
c) Cool the CRT over a day and do the measurement.
d) Run the CRT over a day to check the measurement.
Ec2co drift is referring to phenomenon of Ec2co increasing in value as CRT continued to run towards
the 10000 hours. Physically, it means that the cathodes required to have a higher Ec2co in order to
draw out current, which means the cathode has decreased in ability in emitting electrons. (This has the
opposite effect on Ekco drift). The drift should not be more than 5V per 500 hrs.
43
E) Judgement Criteria
The judgement criteria are :
1) At 0hr, 24hr, 100hrs, 500hrs, 1000hrs and 2000hrs, minimum CCA % should be greater than
80 %
2) At 3k, 5k, 10khrs, the estimated life should be more than 10,000 hrs (for all cathodes)
Points to note
a) Minimum estimated life is referring to the life estimated base on the least CCA % on three
color of the CRT. This could also refer to the minimum life of the batch of CRTs.
b) Average life is referring to the average of all estimated life of CRTs. This gives an indication
in the process capability of the CRTs. However, caution should be taken not to mistake with
this with average CCA %. (which is the average of all CCA % at different time interval).
44
(Fig. 1.3.1b)
High
Pin shaped dust
Round shaped dust

Low
To conclude, arcing happens when tiny dust particles or scratches appear on the low potential
(negative) region of the two grids (electrodes).
Arcing Phenomenon
1. Arcing between Electrodes of High and Low Electric Potential
Arcing occurs between electrodes with high potential different when there is present of foreign
matters such as dust, scratches or connection leads close to the electrodes. These cause electrical short
between the high voltage electrodes and the low voltage electrodes resulting in arcing.
2. Stray arcing (Creeping arcing)

Stray arcing is also related to foreign matters and also non-conductive material such neck glass, bead
glass, IBR etc. If scratch, burr, or dust is present on the low potential electrode, it gathers electric field
and arcs. When the arced electrons hit neck glass or bead glass, the energy from that impact ‘light’ up
the glass (strays). At this time, if more electrons are emitted than the input electron (secondary
electron emission) from the glass surface, it will be positively charged. Electrons are then pulled from
the low electrodes and stray ‘grows’. After reaching a certain limit, stray charges along the neck
surface and the outer carbon capacity (Q) ‘creep’ to the stem side (earth side) and arcing happens.
23
3. Back Emission Arcing
(a) Acceleration from the Sleeve Electric Potential of the Side Beam
If oxide emission source exits in the cathode sleeve surface, the electrons are emitted to the outside
accelerated by the electric potential of the side cathode sleeve during the single color condition. This
phenomenon occurs with any of the red, green, or blue cathodes.
(Fig. 1.3.1c)
(b) Accelerated Arcing from Electric Potential on Connecting Wire (lead)

If the emission source exists in the cathode sleeve surface near the IBR and grid connectors (e.g. G4
lead) at the stem, especially the higher potential of G4 connector, resulting from the acceleration of
the electrons are emitted to the outside and cause arcing.
(Fig. 1.3.1d)
24
(c) Accelerated Arcing from the Heater Electrical Potential
The voltage supply of the heaters are usually set at 200V. Therefore, the heater rests connected to the
heaters become 200V. If the emission source exist in the cathode sleeve surface, arcing will occurs.
When the heater is turn to zero electric potential, it serves as a shield. The current TV set gets its
effect by introducing the heater grounding.
6.3V
Heater rest
(Fig. 1.3.1e)
(d) When Arcing the B Electrodes of IBR

When back emission happens at the neck inner wall and the surrounding area of IBR electrodes reach
charged-up, a big electric potential difference occurs between the non-conductive materials of the
electrodes and the surrounding glass. The electric field concentrates on the edge of the electrode, and
IBR
(- )
Neck Glass
Back Emission
creeping arcing is induced to the IBR surface from the electrodes of the IBR surface. (Fig. 1.4.1f)
25
(e) To Arc Between the G2 and G3 grid
Like the IBR, if the back emission happens near the bead glass, the bead glass and the spaces between
the neck surface charged-up. Arcing will occurs from the G2 grid that is along the side of the bead
glass towards G3 grid. (Characteristic of arcing for the back emission is that arcing falls on the IBR, B
electrode, G1, or G2 grids)
Neck
G3 Glass
Bead
Glass
G1
(Fig. 1.3.1g)
For poor Taiatsu quality CRTs (with occurrence of back emission), intermittent arcing is repeated
with a certain interval. (Fig. 1.4.1h)
Arcing
Charge
Discharge
Repeat
Strays and Leakage current

Stray is a phenomenon where the electrons are released from the lower electric potential of the
electron gun as a result of the Cold Emission. Or, the electrons flow into certain area or path where it
should not normally flow.
26
Cold Emission is the phenomenon in which the electrons are emitted from the surface of the matter
when it is subjected to a strong electric field well above the limited value for the matter. An electric
field (F) is present in the space (d) between 2 parallel electrodes when high voltage (V) is added to it.
Voltage : V
d
Electric Field : F
The direction
of the electric field is from positive to negative. (Fig 1.3.1i)

F = V/d (v/mm)
Generally, the electric field strength of the cold emission start from the very clean and smooth metal
surface is approximately 10^6 V/mm.
The electric field strength of the cold emission at the starting point is 10^6 V/mm. We can apply this
into the CRTs we produce, which has a grid distance of approximately 2mm between G4 & G3, G4 &
G5 of the electron guns. Therefore, under ideal circumstance, unless there is an electric potential
difference of 2 × 10^6 V (2000KV) between the electrodes, stray does not occur.
Even the projector tube with the highest voltage uses 33KV, so stray will not occur unless a higher
voltage of 60 times more is applied. However, we are still troubled by stray in CRTs because there are
phenomenon that lower the stray start voltage for the stray to occur. We call these [stray source].
Phenomenon for lowering the Stray Start Voltage :

A. Electric Field Concentration
When there is a protrusion on the surface of the matter, the electric field distribution is disturbed only
to that area, and the electric field strength becomes stronger.
(Fig 1.3.1j)
Positive
Negative
27
B. Lowering of the working function
To start emission of electrons from the surface of the matter, it is necessary to reach the intrinsic
energy level of that matter. This is called the [working function]. When the working function
decreases, strays occur even with smaller electric field.
C. Rising of temperature
When the temperature increases, the electron’s motion energy also increases and reaches the working
function energy value. Therefore, stray happens even with small electric field.
D. Unbalance Characteristics of The Electric Potential Surface of the Matter

When the electric potential of the surface of the matter is partially changed, the electric field of the
surrounding area becomes stronger. This phenomenon occurs easily on surface of insulating materials.
Therefore attention must be place on insulating material that is around the electrodes of the lower
potential.
Leak : Basically, all stray is a kind of unnecessary leak current. Sometimes the current flowing
between the grids (electrodes) directly is also expressed as leak. Some leaks do not results from stray:
these are called external leakage.
Inspection & quality standard

As far as quality assurance is concern, we do not want to send CRTs with poor Taiatsu quality to
customers. Long running reliability of CRTs can’t be assured if phenomenon like arcing, leak and
stray are present.
Therefore, quality inspections and standards were set in the Final Inspection Process to stop poor
Taiatsu quality CRTs from passing to customers. In addition, the Reliability Section in the Quality
Assurance Department conducts routine CRT test to ensure that no abnormal Taiatsu quality is pass
out from FI stations.
1. Final Inspection Process
FI process checked on all CRTs (100%) produced for any ‘Taiatsu defects’ namely:
• Leakage current
• Strays
• Arcing
Since movable dust is considered to be the major cause of most Taiatsu defects, a ‘cosmetic’
inspection is introduced to specially reject any dust seen inside the neck even when the phenomenon
of arcing, stray and leakage current is not present.
28
2. Reliability test to Ensure Taiatsu Quality
Sampling tests carried out to ensure the reliability of CRTs (Taiatsu quality) are:
A. 22hrs TV Set aging.

• To ensure that no intermittent occurrence of arcing from the CRTs due to dust, charge-up (back
emission) or creeping arcing (cause by strays)
• The % ratio of zero arcing CRTs in the sampling should be 80% or more.
• No CRT should have more than 2 arc counts.
• CRTs set up will be monitor for the first 2hrs for abnormal occurrence of arc counts.
B. Starting Voltage Test (VI).

• To check the occurrence of cold emission by subje cting the CRTs to about 1.5 times its normal
operation voltage.
• There should be no arcing, strays and leakage current (3nA) before the target voltage (operation
voltage).
C. Panel/Funnel Separation (Taping test).

• To check for any abnormal carbon peel from neck and cone coatings.
• To check for poor welding conditions.
• To check for burr (scratches) from raw parts.
• To check for metal back peel and any phosphor deposition on panel pin.
29
Symptoms for poor Taiatsu quality CRTs
We know that phenomenon of a poor Taiatsu quality CRT are arcing, strays and leakage current. But
why are they bad for CRT long run reliability, and what kind of customers’ related defect symptoms
are created by poor Taiatsu quality CRTs?
1. Why is it bad for CRTs to have Acing?
• It produced loud noise within the CRTs which customers disliked.
• Current discharged from arcing CRTs could damage the circuits of the TV Set.
• Arcing can cause oxide damage or other problems (e.g. neck crack, BG crack).
2. Why is it bad for CRTs to have Strays/Leakage current?

• Induction of Arcing
Arcing can be easily induced, especially from neck stray. The secondary electron source hitting on the
surface of the neck or bead glass causes it to becomes positively charged. From this, Electric Potential
Localization occurs. Therefore, stray is accelerated along with the acceleration of the electric potential
localization. At this point, ion develops in the surrounding area due to the stray, and it generates ion
flow with the strong action of the electric field. When this ion flow passes a certain limit, it increases
rapidly and the charge electron is discharged in a very short time (arcing).
(Fig. 1.3.3a)
Stray (-) ion Stray

(-)
(-)
(-)
(-)
(-)
ion
Secondary electrons
Arcing creates all kinds of problems. It can damage the semiconductor of the circuit and causes the
circuit to malfunction. At times, arcing occurs between the cathodes, causing emission problems also.
• Residual Spot by Surface Stray

When neck or surface stray occurs, the screen luminates after the deflection is off, which cannot be
observed during the normal operation.
30
• Focus Change/ Poor Focus
Normally, the electric potential of G4 is supplied by resistance divider, Therefore, when the stray
happens, current flows to these resister and EC4 changes. This cause focus change (poor focus).
• Brightness Change/ White Balance Change

There are 2 circuit methods to adjust the electric potential of G2: Resistance Divider Supply and
Constant Voltage Power Supply. Generally, the Resistance Division Method is used more often due to
its low cost. At this time, if stray happens from G2, the current flows to this resistance divider, and G2
electric potential changes. The symptom appears as a brightness change on the screen. With the
projector tube, the balance of 3 beams of the CRTs changes. That causes the white balance to change
or can’t adjust the white balance. Also, depending on the circuit, some G1 electric potentials are not
zero. In this case, the same phenomenon happens by the stray from G1.
• Horizontal Static Miss-convergence (HME)

Sometimes the current flows through the C plate and IBR’s C electrode by the electron hitting when
the stray happened from G1, G2, G4, etc. which was pulled by the inner wall of the neck glass, IBR,
and the surface of the bead glass then travels towards G5 side or passing through the inside of the
electron gun to G5 side.
Stray sometimes come from IBR’s C and B electrodes, In these conditions, the C plate’s electric
potential changes due to stray current, causing horizontal static convergence that cannot be adjusted.
• IBR’s Resistance Value Change

IBR temperature rises locally from the stray hitting the IBR ant at the same time, ion invades into IBR
easily. As a result, IBR resistance becomes damage, changing the resistance value. As for the screen
symptom, the horizontal static convergence becomes shifted gradually with use.
• Metal Coat On Neck Glass

When the stray hits strongly on the high voltage side of the electrodes, the metal of the electrodes
evaporates as a result of temperature rising, electron energy and adheres to the neck glass. Depending
on the extent of metal adhesion, arcing could be induced. From the increase of leak current, decrease
of high voltage could happen or operation of circuit could stop.
31
Structure of Cathode
The general structure of cathode is shown below.
Electoron Beam
Oxide Thickness
eeeeee
G1
Oxid
Base Metal
Sleeve
Heater
Base metal & Oxides

The oxides are made up of carbonate, that is BaCO 3, SrCO3, and CaCO3. The oxides will be converted
into pure barium in the Gun bake and Aging process which we call the cathode activation process.
The oxides were sprayed on to the base metal, which is made up of Ni, and a small amount of W and
Mg is added to help the cathode activation.
Heater & sleeve
The heater consists of tungsten wire coated with Al2O3 that provides an insulation the heater wires.
The sleeve is metallic tubing made up of nickel and chromium. Its purpose is to house the heater as
well as to transfer the heat to the base metal and cathode.
19
Structure of IBR
Inner Bleeder Resistor (IBR) is basically a voltage divider providing the required voltage for the
convergence plates.
Electrode C Electrode B
Electrode A
IBR is a 3 layered structure with the resistance printed on the ceramic plate and then coated with
protective glass. The resistance value between electrode A and C is represented by Rc, and the entire
resistance between electrode A and B is Rt. The Rc to Rt ratio is called “Divided resistance ratio α”
and is represented by the following equation:
α = Rc / Rt x 100%
According to Ohm’s law, the potential difference (Vab) is equal to the current flow (I) multiply the
resistance (Rt).
Vab = I x Rt
I = Vab / Rt
Then, the potential difference (Vac) is the voltage drop corresponding to the resistance (Rc), as shown
at the equation below.
Vac = I x Rc
= Vab / Rt x Rc
= Rc / Rt x Vab
= α / 100 x Vab
20
How to control current
The amount of electron emitted from the cathode surface can be controlled by the Ec1, Ec2 and the
cathode voltage. In Trinitron CRT, the cathode drive method is used where the Ec1 is fixed at 0V and
the cathode voltage at a positive voltage.
The higher the Ec2 voltage, the higher is the cathode current.
The higher Ek voltage, the lesser cathode current. Their relation ship as follow:
Ik ∝ Ec2
Ik ∝ 1 / Ek
Cutoff Voltage
Cutoff voltage is the voltage required to cut off any current or electron emission from the cathode.
There are two types of cutoff voltage.
• Ekco : Cutoff voltage at cathode drive. (Ec1 & Ec2 constant)
• Ec2co : Cutoff voltage at Ec2. (Ec1 & Ek constant)
The graphical explanation for the cutoff voltage is as follow:
G2=500V
G2=500V
G1=0V G1=0V
Equal potential line Cathode

Cathode
150V
80V
Maximum cathode No cathode

surface emission
surface emission
=> Cathode cutoff
Ik (µA)
Ec2=400V
MIk
Ec2=500V
Ek (V)
Ekco
21
Inspection & Quality Standards
Beam Grouping (%) Stripe Grouping (%)
98 98 98 98 98 98
98 98 98 98 98 98
98 98 98 98 98 98
tolerance = ± 5% tolerance = ± 5%
However in some models, the Beam Grouping’s target is >98%.
This is so, when the R-G or B-G beam-mismatch target is not zero.
** important : carbon stripe(CS) width must not be too small or too big.
CS width too small => poor mis-landing allowance
CS width too big => dark patches/dark corner (‘mura’ effect)
How to estimate CS width ?
Sg = Stripe Grouping
p = pitch
W = white ratio
R = Red PVA/PVP window
G = Green PVA/PVP window
B = Blue PVA/PVP window
Assume H1 = H2, C 1= C2 , R=G=B
=> Sg = 3(H1+H2) / 2p
= 3(C1 + C2 + 2R) / 2p
=> 2p(Sg) = 3(2C1 + 2R)
= 6C1 + 6R since W = (R+G+B)/p = (3R)/p……...(a)
from (b), = 6C1 + 2W.p i.e. 2W = (6R)/p => 2Wp = 6R……(b)
6C1 = 2p(Sg) – 2Wp
C1 = p(Sg-W) / 3
Since p = (R+G+B) +C1+C2+C0
from (a) = (W.p) + 2C1 + C0
i.e. C0 = p(1-W) –2C1
Question:
Why grouping target is 98% in stead of 100%?
2
1.2 White Ratio
PS Red PS Green PS Blue PS Red
C2 C1 C0
Pitch
What is White Ratio ?

It is the ratio of effective phosphor area with respect to pitch area.
PS Red + PS Green + PS Blue

White Ratio = --------------------------------------- X 100%
Pitch
In general, White Ratio at the corner of screen is smaller than the center of the screen. This is
so because more landing allowance is needed at the corner, it is then necessary for carbon
width at the corners to be wider.
Inspection & Quality Standards for White Ratio

In QC, White Ratio of the CRT can be measured through Yamato Scope(manual) or Mitutoyo
CCD Video Camera(auto), depending on the size of the CRTs/CDTs. There are usually 9
measurement points, which covers 4 extreme corners of screen and the X and Y axis at the
center. Below is an example of 14NDXM White Ratio Target. Target for all model of CRT
are different.
White ratio target ** Important : White ratio must not be

too low or too high
52 59 52
White ratio too low => Brightness becomes low
59 66 59 White ratio too high => Poor mis-landing allowance.
52 59 52
Tolerance ± 5%
3
Factors affecting white ratio
WHITE RATIO
CRT MEASUREMENT
Screen Human Equipment
CAD filter Screen PVA/PVP

distribution light Exposure Calibration
intensity time
Poor Poor focus of stripe

alignment measurement m/c
of scope
4
1.3 CONVERGENCE
Static Convergence is the mis-convergence value at the center of the screen,
without the 4 pole & 6 pole magnet correction.
Blue
B Red
A Green
C D
HMC, VMC is the distance from Blue to Green when Red & Green converged.
HMC = C + D
VMC = A + B
Gun Twist, GTW (or Neck Twist, NT) is the vertical distance from Red to Green.
NT = A
H-static and V-static is the distance from Red to Blue.
H-static = D – C
V-static = B - A
5
VERTICAL TILT (TLV)
TLV is an example of mis-convergence pattern resultant from BOA-x and the barrel-patterned
vertical deflection of the DY.
Possible causes of TLV:

• DY - Ferrite sheet, TLV correction pin, V-coil shape.
• CRT - BOA-x, Centre landing.
• Measurement - Convergence meter setting, DY spacer.
BOA-X positive case TLV negative pattern
Red
Blue
Due to the difference in the

strength of the magnetic field,
Magnetic field line producedby red beam is deflected vertically
the DY vertical deflection coil more than blue beam.
BOA-x positive case means that the

RGB beam is aligned to the
right side of the deflection center.
6
CROSS BOW (XBV)
XBV means x-axis Bow-Shape vertical mis-convergence, which is caused by gun rotation
and DY horizontal magnetic field.
Possible causes of XBV:

• DY - H-coil orientation.
• CRT - Gun rotation
Gun Rotation negative case XBV positive pattern
Red
Blue
The red beam is deflected up while

the blue is deflected down.
Horizontal magnetic field in

DY with a vertical
deflection component.
Gun rotation means that the RGB
beams are not aligned horizontally.
In this case, Blue is on the upper
side compared to Red.
7
Y-axis CROSS (YCH)
YCH means Red & Blue cross along Y-axis, which is horizontally mis-convergence.
This is caused by BOA-Y and vertical magnetic field.
Possible causes of YCH:

• DY - V-coil orientation.
• CRT - BOA-Y
BOA-Y +ve case YCH –ve pattern
Blue Red
Due to the barrel shape magnetic field

line, red beam is deflected to the right
Magnetic field line produced by side while blue beam is deflected
the DY vertical deflection coil to the left side.
BOA-Y positive case means that the

RGB beam is deflected to the
upper side of the deflection center.
8
VERTICAL CONVERGENCE (VCR)
VCR means Vertical Center Raster. It is a measure of vertical mis-convergence of Red and
Blue from Green. The mis-convergence is normally caused by beam space of Red and Blue
with respect to green, being too big horizontally.
VCR -ve pattern

Red, Blue
Green
Green
Red, Blue
Due to the big beam space, Red and Blue

beams are deflected vertically more than
Magnetic field line produced by green. This is so because Red and Blue
the DY vertical deflection coil are then closer to stronger magnetic field.
To correct for this problem, an additional metal sheet called “pole piece” was included in the
design of the electron gun. The pole piece function is to alter the electrical field at the gun
convergence plates such that Green vertical field is stronger than Red & Blue.
9
Beam Off Axis(BOA)
Beam off axis is the measure of electron beam position with reference to the x and y axis of
the neck.
Possible causes of BOA:

• Gun - G4 shift, Gun parts alignment.
• Funnel - Funnel neck tilt.
• CRT - AGS stem shift.
BOA jig explanation diagram
BOA JIG BOA JIG
Magnetized coil
X X
Adjust BOA jig knob until

get center 1 dot.
Y Y
Neck axis
Electron beam at
Electron beam not the center of
at the center of BOA jig
neck.
Center of BOA jig.
BOA jig turned 180°

Y Y
X X
Neck axis
Electron beam at
Electron beam not the center of
at the center of BOA jig after
neck, & not at the
knob adjust.
center of BOA
jig. BOA knob adjustment
distance is 2X actual
Center of BOA jig. BOA distance.
10
1.4 LANDING
WHAT IS LANDING?
Landing is description, in distance, where the electron beam hits the phosphor stripe.
Mis-landing is said to have occurred when the center of the electron beam, which landed on
the intended phosphor stripe, does not land on the center of the stripe; Mis-landing is a
measure of distance of mis-alignment of the beam with respect to the center of stripe.
JUST LANDING
AG
Electron beam
carbon stripe
Beam centre = Stripe centre

i.e. Mis-landing = 0um
MIS-LANDING
Beam centre ≠ Stripe centre
** important : Beam lands towards LEFT => -ve mis-landing.

Beam lands towards RIGHT => +ve mis-landing.
11
LANDING PATTERN & BEAM MISMATCH
Landing Pattern
Due to thermal drift of the Aperture Grille (AG), we do not want the landing to be zero
throughout the effective screen when the CRT/CDT is at the ‘cold’ stage.
At different position of the screen, there is a calculated target mis-landing value for ‘cold’
stage. The collective target for different points on the screen forms the Landing Pattern target.
Why do Thermal Drift of AG occur ?

Not all the electron beams, which emit from the cathodes, hit the screen. A significant portion
of the electrons land on the AG. Once the electrons land on the AG, it convert kinetic energy
to heat energy, which is transferred to the AG.
As the AG has high thermal coefficient, the AG then expands which subsequently change the
Grille Height (GH). Landing will then be affected.
Beam Mismatch
It is a measure of the mis-landing of Red & Blue beams, when Green beam is just landing.
AG
Electron beam
carbon stripe
Red Mismatch (+ve) Blue Mismatch (-ve)
12
INSPECTION AND QUALITY STANDARDS
LANDING PATTERN
L2 Yu L1
X2L X1L X1R X2R
L3 YL L4
1. SRX – Symmetry component of rotation around x-axis ( ‘A’ & ‘V” shape ).
SRX = [ - (L1 – L4 ) + ( L2 – L3 ) ] / 2 If SRX = -ve => ‘V’ shape.
If SRX = +ve => ‘A’ shape.
2. ARX – Asymmetry component of rotation around x-axis ( corner twist )

ARX = [ - (L1 – L4 ) - ( L2 – L3 ) ] / 2 If ARX = -ve => / / corner twist
If ARX = +ve => corner twist
3. Twist – Twist at Y-axis

TWT = YU – YL
4. S1 - 1st ‘S’ pattern at the x-axis.

S1 = X1R - X1L
5. S2 - 2nd ‘S’ pattern at the x-axis.

S2 = X2R - X2L
13
1.5 White Uniformity
WHAT IS WHITE UNIFORMITY?
It is a measure of deviation of color from white across the screen, with respect to the specific
white color set at the center.
There are two types of unit for the color, they are expressed by:
(i) x & y chromaticity for color monitor.
e.g. D93 (x,y) = (283, 298), D65 (x,y) = (313, 329)
(ii) R/G & B/G color ratio for color TV.
Chromaticity
Chromaticity (Color) can tell with x, y value in CIE Chart.
As you know CRT has 3 color stripes Red, Green, and Blue. Combination of any of the 3
primary colors in different intensity, will produce a whole world of different colors.
RED Magenta BLUE

Green + Blue = Cyan
Green + Red = Yellow
White
Blue + Red = Magenta
Yellow Cyan
Green + Red + Blue = White
GREEN
Rule of color mixing

Red, Green and Blue gives White.
Therefore white color-point and brightness are dependent on Red, Green and Blue’s color-
point and brightness.
The formula is as following :
For example, if three colors are like following.
Red (x, y, Y) = (xr, yr, Yr) = (0.625, 0.340, 20.730)
Green (x, y, Y) = (xg, yg, Yg) = (0.280, 0.595, 68.055) x, y is CIE color point
Blue (x, y, Y) = (xb, yb, Yb) = (0.155, 0.070, 11.216) Y is brightness.
We can get D93 White 100cd/m^2.
White (x,y,Y) = (xw, yw, Yw) = (0.283,0.298, 100)
But this means the brightness balance and chromaticity effects white color.
14
INSPECTION & QUALITY STANDARDS
In QC, White Uniformity is inspecting through visual judgement and WB701 color analyzer.
For consumer models, JND must be <5 JND, from the data provided by WB701. Whereas for
visual judgement, the White Uniformity quality must be C- or better.
Rule of thumb is that magenta or red are generally more visible to our eyes. Cyan is less
visible. Of course, white throughout the screen is ideal.
15
1.6 BRIGHTNESS / CONTRAST
WHAT IS BRIGHTNESS?
Brightness is one of the measure of illuminence of Red, Green , Blue and White individually.
Display and Color TV have two functions to change illuminance of picture. There are
Brightness and Contrast or Picture.
DC Level of signal changes the brightness of the picture displayed; It also changes the
background from dark to bright, and vice-versa.
Darker
Brighter
WHAT IS CONTRAST?
Contrast changes the AC Level of Ed (Drive Voltage) as following. Pedestal Level is fixed, it
changes mainly the brightness of the picture. Background brightness remains unchanged
by Contrast change.
Darker
Brighter
16
BRIGHTNESS and LANDING
Each R, G, B colors brightness and landing has a relationship as following.
Brightness Ratio=0.007*Landing^2 (20SH8 0.256mm pitch 20inch)
For the equation, it shows that brightness will directly affect by landing of CRT.
EXAMPLE : Model 20SH8
Brightness Level
100%
95%
90%
85%
80%
-20 -15 -10 -5 0 5 10 15 20
Mis-landing (um)
Red Green Blue
Red curve Green curve Blue curve
17
4. SAFETY
Product Safety
Product safety test consists of Implosion, X-ray measurement and frit leak.
4.1 Implosion Proving
A) Inspection and quality standards

Below is the various product safety certification that is needed in the various countries.
Basically the certification is based on two standards, namely; UL 1418 and IEC 65.
Sampling plan under different safety standard:
Monthly Ball Production qty

Inspection standard 0 ~ 500 501 and above
Ball (7.0 J) 2 4
UL 1418 * Ball (3.5 J) 1 1
Missile 1 2
Thermal 0 1
IEC 65 Ball (5.5 J) 2 4

(Dentori, VDE, BS, GB) Thermal 0 1
45
1) * If a hole of greater than diameter 3 mm developed on the CRT face, this test will be
repeated using a diameter 51 mm ball applying a force of 3.5 J will be performed.
2) If a hit point has failed the test, an ADDITIONAL of 2 pieces must be selected from
the same lot and retest using the same hit point that had failed.
Implosion test in accordance with UL 1418 standards.
1) Ball Test
A impact strength of 7 nm obtained from a solid, smooth, steel sphere 50.8 mm in diameter,
weighing approximately 0.535 kg and having a C-scale rockwell hardness of 65, is applied to
any point on the face of the useful screen area., but a distance of no less than 38.1 mm from the
edge of the useful screen area. For the test ,the test cabinet supporting the cathode-ray tube is
to be placed so that the surface tested is vertical and in the same vertical plane as the point of
support of the sphere.
The impact is to be applied by the sphere, which is suspended by a cord so that when released it is
permitted to fall freely from rest-as a pendulum-through the distance necessary to cause it to strike the
surface with the required force.
2) missile impact test

The missile impact method of inducing devacuation is to be as follows. The face of the tube at the top
and bottom edge is to be scratched approximately 3.2 mm from the screen or phosphor edge in the
viewing area. The scratches are to be two horizontal lines,100 mm long . The impact object is to be
steel missile weighing 2.27 KG and having C-scale Rockwell hardness of 65 and having one end
rounded on a radius 25.4mm . The impact object is to be swung through the arc of the pendulum to
obtain an impact of not less than 7.0 Joule or more than that value necessary to cause devacuation but
no more than 20.3 N.m. The impact area is to be the area bounded by two concentric circles where the
radius of one circle 1/6 the height of the useful screen ; the second-circle radius is ½the h eight of the
useful screen, less 50.8 mm.The impact object travel is to be restricted so that the rounded end of the
missile penetrates the tube face a maximum of 25.4 mm as a means of inducing he implosion .
3) Thermal shock Test

The thermal-shock method of inducing implosion is to be as follows An area shall be scratched with a
glass cutter, diamond scribe,or hard tool . On the long side of the tube rim or facepanel skirt. The
Scratches are to be as near as possible to the weld or juncture of the faceplate and funnel. If space is
limited, the scratched are may extend onto the funnel surface. The end of an ordinary flint glass rod,
approximately 9.5 mm in diameter , is to be heated until red hot until nearly fluid. The heated end of
the rod is to be passed through a prepared access hole in the cabinet and pressed firmly on the
scratched surface of the tube. If the Implosion of the tube does not occur within 10 seconds, the rod is
to be withdrawn and cold water is to be poured slowly onto the scratched area. If implosion is not
induced, the process is to be repeated twice.
If use of a heated glass rod does not induce fracturing, liquid nitrogen shall be used to induced
fracturing. If fracturing still does not occur, thermite in powder form shall be used to induce
fracturing.
46
UL 1418 criteria
IEC 65 criteria
47
4.2 X-ray
In an x-ray set, radiation is created by accelerating electrons into a target (much as in a TV tube), and
the energy of the resulting radiation depends on accelerating voltage. The purpose of x-ray
measurement is to obtain x-radiation characteristics of cathode ray tube. The X-radiation emitted from
TV tube, as measured in accordance with the procedure of EIA (Electronic Industries Association)
Standards and PTB (Phryikalish Technisch Budesanstalt (Germany) Standard.
Inspection and Quality Standard

Sampling Method for EIA standard (DHHS) = 1 / 5000
Sampling Method for PTB standard = 3 / models / month
4.3 Frit Leak

Frit le ak check – detects any current leak between the panel and funnel during the application of high
voltage. Frit with impurities such as carbon or damper wire causes insulation breakage .
Inspection and Quality Standard

The sampling quantity is 3 CRTs per week.
The frit leak current should not exceed 30 nA.
48
SONY DISPLAY DEVICE (SINGAPORE)
OPERATION STANDARD
TITLE : DOCUMENT NO:
DY POSITION AND NECK SHADOW ALLOWANCE MEASUREMENT QA-QC-OS-013
MODEL : PROCESS : EFFECTIVE DATE PAGE EDITION - REVISION
14/15/17/21/25/29 QA 20/10/00 1/8 2-J
EDITION - REVISION DESCRIPTION CHANGED BY DATE

CHANGED
2- D ADDITION OF 25RS AND 29RS NEW MODEL ANG K.L 24/08/98
2- E ADDITION OF 21RS NEW MODEL SPECIFICATION JACK ANG K.L 01/10/98

ON PAGE 4 / 14
2- F ADDITION OF 17TK AND 14RS NEW MODEL JACK ANG K.L 01/04/99
SPECIFICATION ON PAGES 3 / 15 AND 4 / 15
2- G REVIEW IN MEASUREMENT PROCEDURE JACK ANG K.L 10/06/99

FORMAT AND THE FLOW CHART FORMAT.
2- H CHANGE IN 29RS DY POSITION SPECIFICATION NG K. K 17/11/99
2- I CHANGE IN 21RS DY POSITION SPECIFICATION NG K. K 1/7/00
2- J Remove 17FR disconued model and addition of 15TK new

model Ng K.K 20/10/00
ORIGINATOR CHECKED BY APPROVED BY DOCUMENT CONTROL
Ng K.K Ng K.K T. Shirahama
QC Engineer QC Section Leader QA Divisional Manager

OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 2/8 2-J
1.0 OBJECTIVE
To document the method adopted for DY POSITION AND DY ALLOWANCE measurement.
2.0 SCOPE
This operation standard applies to each week's sampling CRTs and all QC check CRTs.
3.0 RESPONSIBILITIES
The QC technicians are responsible to take accurate data for all measurement.
4.0 ASSOCIATED DOCUMENTS
CRT QC SAMPLING STANDARD (QA-QC-S-001).

CRT SETUP PROCEDURE IN HHC (QA-QC-OS-069).
5.0 EQUIPMENT USE
5.1 Helm Holtz Coil.

5.2 Wooden CRT Stand.
5.3 Standard DY.
5.4 Landing Checker.
5.5 Auto degausser.
5.6 Hand degausser.
5.7 Pattern generator or digital video pattern generator.
5.8 Wobble Coil.
5.9 Mask.
5.10 10X LUPE.
6.0 SAFETY EQUIPMENTS
Safety gloves.
7.0 FORMS
SDS CRT QC WEEKLY DATA FORM.
8.0 SAMPLING METHOD
CRTs used for measurement must be randomly selected after final inspection process.
OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 3/8 2-J
9.0 GROUNDING
Check that the spring of the CRT Stand is touching the outer carbon, and the CRT Stand
is grounded.
10.0 MEASUREMENT CONDITIONS
Done in the Helm Holtz Coil with the following magnetic field:
Magnetic field Model Vertical BV Horizontal BH

14NDXM, 14 RS
Normal (Japan) 21PX, 21RS 35 µΤ 0
25GXS, 25RS
14NDX(AS)
Australia (AS) 21PX(AS) - 55 µΤ 0
25GXS(AS)
Southern 17TK
21RS(GE), 21RS(LA)
GE 29GX2T(GE) -10 µΤ 0
29RS(GE)
ME 29GX2T(ME) 30 µΤ 0
29RS(ME)
ME 21RS(NA) 40 µΤ 0
ME 15TK 45 µΤ 0
17TK
11.0 SPECIFICATION
14NDXM 14RSN 15TK 17TK 21PX 21RSN 25GXS 29GX2 25RSN 29RSN
DY POSITION (mm) 3.5±1.0 2.7±1.5 2.5±1.0 2.5±1.0 2.5±1.5 3.0±1.5 3.0±1.5 2.5±1.5 2.5±1.5 2.5±1.2
NECK SHADOW > 2.5 > 2.5 > 1.0 > 1.0 > 2.0 > 2.0 > 1.0 > 1.0 > 1.0 > 1.0
ALLOWANCE (mm)
12.0 SETUP
Refer to QA-QC-OS-069.
OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 4/8 2-J
13. MEASUREMENT PROCEDURE
S/N Measurement Human Environmental Equipment/tools

Steps factor Factor / safety factor
1 Set up the CRT in the HHC. -Mark Dummy DY Room temperature -Select the correct HHC fie ld
positions using Dummy 23°C~25 °C. setting.
DY. -Check that there is no spacer
& no ferrite sheet in Dummy
DY.
2 -Auto degausses the CRT. -Ensure degauss coil is - Input correct voltage for the
-For 17” Hand & Auto at the correct position. degauss coil.
degauss the CRT. -Auto degausses for 10 - Check that the degauss coil
sec. are with the correct capacitor
or resistor.
3 Power ‘ON’ the CRT. Ensure anode button
is firmly attached.
4 Adjust DY rotate.
5 Adjust center landing =
0 µm.
6 Adjust DY position until the -Check DY rotates
landing at the right & left with center horizontal
sides are equal. line.
-Ensure DY tightens
after side balance.
7 Mark DY positions on the Ensure that the pencil is
masking tape. perpendicular when
marking the NSA.
8 Adjust convergence. Ensure best -Select cross hatch pattern.
(Picture mode = ‘soft’) convergence. (Center -Adjust using 4 & 6 pole
& corner) magnet.
9 Move DY backwards -Take note of the -Select red or blue raster to
biggest shadow. get this shadow.
-Ensure DY is not
tilted.
10 Move DY inwards -Until the biggest
shadow just disappears
at the corner.
-Ensure DY is not
tilted.
OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 5/8 2-J
S/N Measurement Human Environmental Equipment/tools

Steps factor Factor / safety factor
11 Select X-hatch signal Confirm DY tilt. Select red and blue to
reconfirm shadow is
disappear.
12 Mark NSA on the masking
tape.
13 Measure & record the the Use 10X LUPE to measure
value.(Refer to explanation the DY position & NSA.
diagrams)
14 Power OFF.(End)
OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 6/8 2-J
APPENDIX A
EXPLANATION DIAGRAMS
SCREEN
A B
SIDE BALANCE
JUST DY :- A=B
A = LEFT MISLANDING
B = RIGHT MISLANDING
CRT’s Funnel
a = DY position
b = Neck Shadow Allowance (NSA)
b
Dummy DY
position
OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 7/8 2-J
APPENDIX B
DY POSITION AND NECK SHADOW ALLOWANCE MEASUREMENT FLOWCHART
Set up the CRT

(Mark Dummy DY position)
Room temperature 23 °C ∼ 25 °C
-Auto degausses the CRT.

-For 17” Hand & Auto degauss the CRT.
Power ‘ON’ the CRT.

(Ensure anode button is firmly attached.)
Adjust DY rotate.
Adjust center landing = 0µm.
Adjust DY position until the landing at the

right & left sides are equal.
Mark DY positions on the masking tape.
Adjust convergence.
(Picture mode = ‘soft’)
A
OPERATION STANDARD
14/15/17/21/25/29 QA 20/10/00 8/8 2-J
Move DY backwards
Move DY inwards
Select X-hatch signal
Mark NSA on the masking tape.
Power OFF.(End)
SONY Display Device (Singapore) Pte. Ltd. Engineering Gp. QA Dept.
SONY Trinitron
QA Technology Course
Issued by Sony Display Device (Singapore) Pte. Ltd.
Engineering Gp. QA Div. CS Section
Ver. 0.3
Background
This document was made for further understanding for QC Item.
It will tell you what QC item will effect what Picture Performance.
If you face the picture Quality Problem, you can decide what you need
check first after finish this couse.
The Table of Contents
Landing & Grouping
BeamLanding
Purity Magnet & DY Position
Landing Checker
Landing Checker Calibration
Landing Pattern
Thermal Drift
Magnetic Drift
Helm Holz Coil
Environmental Drift
Beam Mismatch & Grouping
Stripe Gp , Beam Gp and White Ratio
Convergence & DY
Trinitron Gun & Tri-Focus Gun
BOA Measurment
Static Convergence
H-Static (CV)
NTC ( Neck Twist Coil )
4 pole Magnet (H-Static,V-Static Correction)
6 pole Magnet (HMC, VMC Correction)
DY ( Difrecrion York )
CFD & APH YBH
HCR & VCR
YLH TLV
XCV YCH
XBV APV
White Balance & White Uniformity

Video Signal
Video Signal
Brightness & Contrast
Illuminence vs Ik, Ik vs Ed(Cathode Drive)
White Balance (Delta Ekco & CQF)
Brightness vs Landing
Chromaticity
White Uniformity
Distortion
Distortion and Convergence Drift by TM Field
Distortion and Convergence Drift by DY Tilt
Holizontal Trapezoide
BOA & CLD by TM Field
Beam Landing
Landing means that Electron Beam hits Phosphor or the value of Mislanding.
Basically Landing usues only Green Beam Landing as reference.
Red & Blue Beam Landing with respect to Green Landing is called Beam Mismatch.
Just Landing
Red Green Blue

Beam Center = Stripe Center
Landing=0
Mislanding
Red Green Blue
Beam Center ≠ Stripe Center
This value is called Landing

Positive Value means Right Shift(Blue Side)
Negative Value means Left Shift(Red Side)
0 value means Just Landing.
Purity Magnet(2pole Magnet) & DY Position

Purity Magnet is made by 2 pcs of 2 pole magnets as following.
This Magnet is used for Correcting Center Landing.
S S
N S
+ S N =
N N
Purity Magnet effects Landing on the whole Screen like this,positive or negative Shift.
Positive Shift ( to Blue ) Negative Shift ( to Red )
DY Position effect to the Value at X-axix end like this.
Blue Green Red Red Green Blue
DY Backward Shift DY Forward Shift
Questions
Let's consider why Landing change by Purity Magnet & DY position.
And what should you make sure to adjust 2 pole magnets?
Purity Magnet(2pole Magnet) & DY Position
Purity Magnet
Purity Shift(2 pole Mag)
Diflection Center
AG
DY Position
Diflection Center
Diflection Center
Landing Checker
Landing Checker is use for measuring Center Landing , landing Pattern & Mismatch.
Landing Checker have 3 compornents, Wobbling Coil, Photo Senser & Body.
This equipment make AC & DC Current and work as following.
Wobbling Coil
AC & DC Body
- 005
AC Power
Photo Senser
Wobbling Current
Positive
GND
Negative
CS PS Green CS
DC
Current
Wobbling
Negative Positive
Photo Sensor get illuminence in positive wobble.
Photo Sensor get illuminence in negative wobble.
And compere iluminence in each wobble.
Then make DC current to correct Landing.
When Landing become Just Landing.
The iluminece became even. and stop to feedback to DC Circuit.
Landing Checker Value is DC Current Value.
Landing Checker Calibration
Step1 Magnetize CRT like this.

Messure Green Landing and Red Landing at same point.
Green Landing Value=A
Red Landing Value=B
Distance btw G-R = ABS(A)+ABS(B)
Magnetize CRT like this.

Step2 Messure Green Landing and Blue Landing at same point.
Green Landing Value=C
Blue Landing Value=D
Distance btw G-B = ABS(C)+ABS(D)
Magnetize CRT like this.

Step3 Messure Red Landing and Green Landing at same point.
Red Landing Value=E
Blue Landing Value=F
Distance btw R-B = ABS(E)+ABS(F)
CS CS PS Green CS PS Blue CS PS Red

PS Red
Red Beam Green Beam Blue Beam
Step-1 Step-2 Step-3

Pich
Landing Checker Sensituvity =

Landing Pattern
We have a Target Landing Pattern in each model.
This Target is decided from Thermal Drift.
After measuring Landing,we check value whether it is OK or not.
Landing Pattern calculation is as follows.
0. Multiply Landing Checker Sensitivity
1. Center Landing Correction(Make Center Value=0)
2. DY Position Correction(Make Left-End=Right-End)
3. Multiply Center Corner Sensitibity
For Example ( Landing Checker Sensitibity=1.0,Center Corner Sensitivity=1.0)
Raw Data ( Purity Off)
+17 +8 +1
+13 +7 +5
+15 +5 +8
-7 -7 -7
CenterLanding Correction -7 -7 -7
-7 -7 -7
+10 +1 -6
Shift All Screen -7
+6 0 -2
+8 -2 +1 -4 0 +4
-4 0 +4
DY Position Correcton
-4 0 +4
+6 +1 -2 X-Axis Value=(6-2)/2=2
+2 0 +2 So, Shift Left Side -4, Right Side +4
+4 -2 +5
-2 -2
Corner A-Shape
-2 -2
+4 +1 -4
+2 -2 +3
This is the Landing Pattern.
X-Axis=+2, CLD=+7
TWT=+3,A-Shape=4.5,Coner A-Shape=+1.75
Question
When you have CLD Problem , what item should you check?
ThermalDrift
Thermal Drift is the Change Landing by AG warm up.
Some Beam are through AG and hit stripes.
But other Beam hits AG. And Beam energy change to warm energy.
After Warm Up
FAG Warm Up
Before Warm Up
Red Green Blue
Thermal Drift
First , FAG will expand and shift Landing,because of small heat capacity.
0min~5min is called Initial Drift.
second, AG-Frame will expand and GH change and shift Landing.
5min~180min is called MainDrift.
ThermalDrift(µm)
Main
Drift
Initial
Drift
Time(min)
0 5 180
Question
Which part of the AG will correct for Thermal Drift
and How does it correct Thermal drift?
ThermalDrift
Terrestrial Magnetism Drift 1

Terrestrial Magnetic Filed is from South to North.
It is able to divide Holizontal & Vertical Compornets.
North Pole
Bh
Bv
South Pole
Vertical force component(1955)
50µT
40µT
0µT
-20µT
-50µT
Bh is always from South to North. Standerd Field(Bv)

Bv is from Up to Down in the Nothern Hemisphere. USA&CANADA 55 T
And from Down to Up in the Southern Hemisphere. EUROPE 40 or 45 T
JAPAN 35 T
CHINA 30uT
HONG KONG 15uT
BANGKOK 10 T
KL 0 T
SINAGPORE -10 T
JAKALTA -25 T
AUSTRALIA -55 T
x,y,z componets of Beam Current
Electric Gun
Electron
z y
Magnetic Field
in the Northern Hemisphere
E S Fleming's Left-Hand Law

N W F
Force
B I
Mag Field Electric Current
Question
Let's consider how Landing will change
when CRT faces North,South,East,West & when in the Southern Hemisphere

Face to North Face to South
Face to East Face to West
the Southern Hemisphere(AS Field) The Direction of Force

North South East West AS
(+z) (-z) (+y) (-y) (+x)
Current
+x +y -y -z +z -
+y -x +x - - +z
+z - - +x -x -y
Environment Drift
Beam Landing will also be affected by Environment Temperature.
This Environment Temperature will change Panel Temperture.
And Panel will extend or shrink and thus change Landing.
Question
When you face a Landing problem , what items should you check for mesurement conditions?
HHC (Helm Holz Coil)

HelmHolz Coil make the magnetic filed what you want.
It is made from 3 pairs of Coils U-L Coil, N-S Coil and E-W Coil.
N
N-S Coil
Mag Field
E-W Coil
U-L Coil
Mag Field
Mag Field
U-L Coil can controll Bv field (Vertical Magetic Filed)

N-S and E-W can control Bh field ( Horizontal Mangetic Filed)
Question
Why is the horizontal standard field Bh=0?
Degauss
Beam Mismatch
Mismatch is the Red & Blue Beam Landing when Green is Just Landing.
When measuring Mismatch ,Landing & Convergence & Focus & rough W/B must be adjusted
GreenBeam
Blue Beam Red Beam
AG
Red Green Blue
Red Mismatch Blue Mismatch
How to Caluculate Mismatch

Raw Data Red Raw Data Green Raw Data Blue
+7 +8 +7 +1 +2 +1 -3 +0 -2
+6 +7 +5 -2 +1 +3 -3 -3 -1
+5 +5 +8 +2 +4 +4 -1 +2 +1
Red Mismatch Blue Mismatch

(Red-Green) (Blue-Green)
+6 +6 +6 -4 -2 -3
+8 +6 +2 -1 -4 -4
+3 +1 +4 -3 -2 -3
Question
When you have Mismatch Problem, How do you solve them?
Let's consider which factor will effect Mismatch.
Stripe Gp Beam Gp & White Ratio
CS CS PS Green CS PS Blue CS PS Red

PS Red
Red Beam Green Beam Blue Beam
C0 C2 C1 C0
SH2(Stripe) SH1(Stripe)
Pich
Red M/M
Blue M/M
BH2(Beam) BH1(Beam)
How to caluculate Grouping Value

SH1+SH2 BH1+BH2
2 2
Stripe Gp= Beam Gp=
Pitch Pitch
3 3
PS Red + PS Green + PS Blue

White Ratio=
Pitch
Question
If you have Stripe Grouping Problem , how do you solve it?
What factors effect St Gp?
Why Stripe Grouping Spec is 98±4% ?

Let's consider it. PS Width,Pitch are fixed and no Delta H.
It means to cosider CS Width.
How to decide Stripe grouping Target

Conditions
White Ratio = Fix, means each PS width = Fix.
No delta H means SH1=SH2. Therefore C1=C2
And Pitch = Fix.
P=Pitch , C=C1=C2 , A=PS Width=RedPS=GreenPS=BluePS
SH1+SH2
2
Stripe Gp=
Pitch
3
(G/2+C1+B/2)+(G/2+C2+R/2)
2
StGp=
Pitch
3
2*Gp*P=3*(2C+2A) 1
C= P*Gp-A
6C=2GpP-6A 3
P=2C+3A+C0
C0=P-2C-3A 2
C0=P-2*(P*Gp/3-A)-3A C0= (1- Gp)*P-A
C0=P-2PGp/3+2A-3A 3
As you can see , C0 is twice as sensitive to Grouping than C1 & C2.
Gp vs CS Width(White Ratio=50%,1pitch=600um,DeltaH=0,DeltaPS=0)
Gp 92 93 94 95 96 97 98 99 100 101 102 103 104
C 92 93 94 95 96 97 98 99 100 101 102 103 104
C0 116 114 112 110 108 106 104 102 100 98 96 94 92
Gp 84 86 88 90 92 94 96 98 100 102 104 106 108

C 84 86 88 90 92 94 96 98 100 102 104 106 108
C0 132 128 124 120 116 112 108 104 100 96 92 88 84
Grouping Spec. is decided from CS Width Balance.

If we can accept 6% narrow CS, Gp spec become 94~103% = 98.5±4.5%
If we can accept 10% narrow CS, Gp spec become 90~105% = 97.5±7.5%
So, Gp Target is not DeGrouping.
Trinitron Gun & Tri-Focus Gun (3 Gun)
Trinitron Gun (TG-61,68,77)

G5 G4 G3 GM G2 G1
Fv
Fc
Trinitron Gun Model
Prizm
Large One Lens
Tri-Ficus Gun (TG-85) Fc

G6 G5c G5v G2
Fv
G4 G2G1
G3c G3v
Tr-Focus Gun Model
Small 3 Lens
Static Convergence
Static Convergence is the misconvergence value at the center of screen
Measure without Vsatic(4pole Mag) & 6 pole Mag Correction.
y
Blue
Red
B
A Green
D
C
HMC=C+D
H-Static=D-C
HMC,VMC is the Distance from Green to Blue When Red & Green Converged.
HMC=C+D
VMC=A+B
GTW(NT) is the vertical Distance from Green to Red without V static Correction.
GTW(NT)=A
H-Static and V-Static is the Distance from Red to Blue.<Trifocus Gun,3Gun>
H-Static=D-C
V-Static=B-A
Trinitron Gun Tri-Focus Gun(3Gun)

HMC * *
VMC * *
NT * -
ECR (V) * -
H-Static - *
V-Static - *
Caution:
Some kind of scope shows opposite pattern.
It means Right and Left is shown Left and Right,when seen through the scope.
Question
If you face static convergence problem.
What CRT parts will you check?
BOA Measurement
H-Static (CV,IBR <Tinitron Gun Only> )

Trinitron Gun can adjust H-Static by Electric field.
There are Conver shield and Conver Plate at the top of Gun.
Conver Plate voltage (CV) is lower than Conver Sield(HV) voltage.
IBR divide HV-ECR, then it make CV.
This differnce in voltage between HV and CV change the beam direction.
Then R,G,B will converge on the Screen.
Rc
CV= HV- (HV-ECR) Rc=R1, Rt=R1+R2
Rt
When you see each beam from top , It is look like following.
ECR
R1 R2
IBR
CV Focus
G5 G4 G3 Red
Cathode
Green
Cathode
Screen Blue
Cathode
HV
Anode
Under Convergence Just Convergence Over Convergence
Blue AA A Red A Red AAA Blue

Neck Twist Coil(<Trinitron Gun Only>)

NTC (Neck Twist Coil) is the Coil winded on the CRT Neck
to correct V static misconvergence for Trinitron Gun only by the Circuit wave form .
This NTC can not use for Tri-focus Gun(3-Gun).
NTC(Neck Twist Coil) or GTC(Gun Twist Coil)
Current wave
When you see each beam from top , It is look like following.
Blue NTC
Beam Components
Cathode
Green
Mag Field by NTC Cathode

G4 Focus
Red
Green Beam :Z component only NTC

Cathode
Red Beam :Z & X components
Blue Beam :Z & X components
Magnetic Field by NTC:Z component only
Z
Front View NTC Current X
NTC
Current
Mag Field
Red Blue
Green
Time
1V
NTC can correct V static top,center,bottom separetely
by use waveform like this.
Question
Could you explain why this NTC can't use for Tri-Focus Gun?
4 pole Magnets
Basicaly the 4 pole Magnet is used for correct V Static misconvergence.
But this magnet is also used for correct H Static of 3 Gun CRT(17FR,16GI,20GI).
S S
N N + N N =
S S
90degrees 0degrees
180degrees
SN SS NN
SN
N N S S
N N S S
S
N NS
SS NN
Off Set Max Correction Max Correction
When each pole is at the following position, V Static and H-Static will move like this.
V-Static Correction H-Static Correction

South
South North
Blue Blue Red

Green Green
North North
Red
North South
South
Front View Front View
6 pole Magnets
6 pole Magnets are made by 2pcs of some 6 pole magnet.
It is used to correct HMC, VMC.
S S
N N N N
S S
+ S S =
N N
120degrees
0degrees 60degrees
SS NN
N SN SN
N S S
N N S S
S N
N S
S S N N
S S NS S N N
NN N SS
Max Correction
Off Set
To correct BMC, change the angle between Max Correction
each fin,and rotation them.
Vary the Angle of 2 Magnet-> Change the Correct Value.
Vary the Rotation of 2 Magnet -> Change the Correct direction
South
South
North
North North
Blue Green Red Blue Green Red

North South
South South
South North
North
Front View Front View
Question
How can you know that 4pole or 6pole is OFF SET?
Tell me the way to check it?
DY ( Deflection York )
DY is one of the key parts for Display. It work to spread beam all across the screen.
DY is made by 2 Main Coils as follows.
H Coil V Coil
H Coil Top
Holizontal Defrection
H Coil Bottom
The Magnet field of H coil is vertical then beam deflect holizontal.

The Magnet field of V coil is holizontal then beam deflect vertical.
H deflecton is faster than V deflection.
So the beam will hit from Left to Right then go down like this.
H Fly Back (Retrace Line)

V Fly Back (Retrace Line)
1 Line ( 1H )
H Coil Current
Right scan
Left scan
1H
V Coil Current
Bottom scan
Upper scan
1V
CFD ( Convergence free yoke ) & APH YBH

If the Magnet Field of DY is even, each R,G,B beam will bend same angle.
Then the Convergence pattern become Over Convergence like this.
Because CRT Panel Plane & Convergence Plane are not same.
Convergence pattern on Screen B G R
by Even Mag Field DY
( APH Positive + YBH Positive Pattern)
Red Blue
Convergence Plane
Panel
RGB RGB
CFD ( Convergence Free Yoke)
To correct this pattern , Change the Magnet field as follows,H Coil Field is Pin pattern, V Coil
Field is Barrel pattern.
This kind of DY is called CFD Type ( Convergence Free DY ).
H Coil Top
H Coil Bottom
H Coil Feild V Coil feild

B B
Strong Week Strong Strong Week Strong

APH & YBH

APH ( Holizontal Amp ) and YBH ( Vaxis Baw shape H-Miscon) are
affected by H-Coil Pin pattern and V-Coil Barrel pattern respectively.
Right Difrection
Left Difrection APH Negative Pattern
Blue Red
B G R B G R
Green
Center Magnet is weaker than side,
Strong Weak Strong
Panel Side View
VCR Negative ( narrow ) Pattern
Blue Red
B G R
Blue Red
Center Magnet field is weaker than sides,
Convergence Pattern
Blue Red
Strong Weak Strong
Neck Side View
This Pin & Barrel pattern make the Convergence look like this,
then CFD can cancel APH & YBH Pattern.
HCR & VCR

HCR ( Holizontal Center Raster Size ) and VCR ( Vertical Center Raster Size ) are
affected by H-Coil Pin pattern and V-Coil Barrel pattern respectively.
HCR Negative ( narrow ) Pattern

R,B R,B
B G R
Green Green
Center Magnet is weaker than side,

then Green Raster become smaller than R & B.
Strong Weak Strong
Neck Side View
VCR Negative ( narrow ) Pattern

R,B
Green
B G R
Green
R,B
Center Magnet field is weaker than sides,

therefore Green Beam get deflected less than Red
Strong Weak Strong and Blue beams.
Neck Side View
Pole Piece on the Gun will correct these HCR VCR Pattern.
TLH & TLV ( Misconvergence rerated BOA-x )

BOA X-axis will cause TLH(Tilt H-Miscon) and TLV(Tilt V-Miscon)
by DY Magnetic Feild.
BOA-X + Case
TLH Positive Pattern

Red Blue
B G R
Because of H-Coil Pin pattern.

If CRT have BOA-x ,
Strong Weak Strong
Each Beam will have un balance
H-Deflection.
Neck Side View
BOA-X + Case
TLV Negative Pattern

Red
Blue
B G R
Because of V-Coil Barrel pattern.

If CRT have BOA-x ,
Each Beam will have un balance
V-Deflection.
Strong Weak Strong
Neck Side View
XCV & YCH ( Misconvergence rerated BOA-y)

BOA y-axis will cause XCV(X axis Cross shape V-Miscon)
and YCH(Y axis Cross shape H-Miscon) by DY Magnetic Feild.
BOA-Y + Case
B G R B G R XCV Positive Pattern
Red
Blue
Becouse of H-Coil Pin pattern.

Left Defrection Right defrection In case CRT have BOA-y ,
Beam will have v component and unbalance.
Panel Side View
BOA-Y + Case
Upper Def.
B G R YCH Negative Pattern
Blue Red
B G R V-Coil Barrel pattern will correct YBH.

Lower Def.
But in case CRT have BOA-y + ,
Top become over correction,
and Bottom become under correction.
It means Top is Under Convergence.
Panel Side View Bottom is Over Convergence.
Then it become cross pattern.
XBV & APV ( Misconvergence rerated Gun Rotation )

Gun Rotation will make XBV(X-axis Bow-shape V-Miscon) and
APV(V Amp) by DY Magnetic Field.
Gun Rotation -ve Case
XBV Positive Pattern
B B
Red
G
G
R Blue
R
Because of H-Coil Pin pattern.

If CRT have Gun Rotation ,
Left Def. Right Def. Each Beam will have differnt
V-component.
Panel Side View
Gun Rotation -ve Case
APV Pattern
Red
Blue
B
G
R Red
Blue
Main cause is like APH,

Gun rotation will cause Beam Space in Vertical.
Convergence Plane Then Top & Bottom become Over Convergence.
Panel
Video Signal Flow

Video Signal
Typical Video Signal for Display is as following.
Ed(Drive Voltage) is for Display Pattern on CRT.
Ekco(Pedistal Level) is for Backgronund Brightness.
Sync Signal is to Sycronize Video Timming and DY Deflection Timming.
Blanking Pulse is for erase retrace line.
Sync Signal Pedistal Level
Ed=Drive Voltage
Ek
Ekco=CutOff Voltage
G1
Blanking Pulse
Pedistal Level of each color will be changed by CRT Ekco.

Drive Voltage of each color will be changed by CRT CQF.
Blanking Pulse is on G1 or Ek(Cathode). It is dependent on chassis design.
Usually TV set have catode blanking,then Display have G1 blanking.
Sync Signal is on Green Signal when "Sync on Green " . This signal doesn't have Sync cable.
Separate Sync case, H-Sync and V-Sync will be supplied by two Sync cables.
Composite Sync case, H and V-Sync will combined and supplied by one Sync cable.
Cable types are BNC, D-sub 15pin, D-sub 21pin.....etc.

Brightness & Contrast

Display and Color TV have two function to change illuminence of picture.
One is called "Brightness" The other is called "Conrast" or "Picture".
Brightness change the DC Level of Signal as following.

So it change the brightness to Dark side and Bright side.
Background brightness also change.
Darker
Brighter
Contrast change the AC Level of Ed (Drive Voltage) as following.

Pedistal Level is fixed.
So it change the brightness Bright side mainly.
Background brightness is not affected by Contrast change.
Darker
Brighter
Illuminence vs Ik
Illuminence and Ik have a following relation.
Illuminence is linear to Ik until certain Ik current.
But at the high current the illuminence starts to saturate.
Illumunence[cd/m^2]
The Iluminence saturate in high current
Iluminence=CONST * Ik
Ik[A]
Ik vs Ed(Cathode Drive)
Ik and Ed have a following relation.
This is called GAMMA curve. It is not linear.
So, the Video circuit have GAMMA Correction.
Ik[A]
Ik=CONST * Ed^GAMMA
Ed(Drive)[V]
White Balance
White Balance means to make certain white screen from Dark to Bright.
To adjust white balance, use G2, Ek,Drive Volume and Brightness and Contrast Volume of User.
First, Set Contrast Volume Max, Brightness Volume 50%,Ek and Drive certain value.
Then adjust G2 until cut off last like this.
Illuminence[cd/m^2] After G2(Screen) Adjustment

Blue Target
Green
Red
Cut off Last Bar

Because of Delta Ekco Video Level
Next is adjust other color cutoff like this.
Illuminence[cd/m^2] After Cut Off Adjustment
RGB Tilt Difference

is caused by CQF or
Screen Brightness.
Adjust Dark Bar as White Video Level
Finaly adjust RBG Drive to be White.

Illuminence[cd/m^2] After High Light Adjustment
Adjust Bright Bar as White Video Level

Between each color brightness and landing have a relationship as following.
Brightness Ratio=0.007*Landing^2 (20SH8 0.256mm pitch 20inch)
So, the brightness become sencitive to landing when CRT have a big misslanding.
Brightness
(Center100%) (20SH8 0.256mm pitch )
100%
95%
90%
85%
80%
-20 -15 -10 -5 0 5 10 15 20
MissLanding(um)
Red Green Blue
Red Curve Green Curve Blue Curve

Chromaticity
Chromaticity(Color) can tell with x,y value in CIE Chart.
As you know CRT has 3 color stripes Red, Green, Blue.
Then other colors are made by mixing of this 3 colors.
Green+Blue=Cyan
Green+Red=Yellow
Blue+Red=Magenta
Green+Red+Blue=White
CRT can show you the colors inside triangle which is conected that 3 primary colors.
y(1/1000)
CIE Cromaticity Chart
700
Green
600
Yellow
500
400
Red
Cyan White
Plancklan Lucus
300
200
Blue Magenta
100
0
100 200 300 400 500 600 700
x(1/1000)
White D93 (x,y)=(0.283,0.298)

White D65 (x,y)=(0.313,0.329)
White D50 (x,y)=(0.345,0.358)
Red(P22) (x,y)=(0.625,0.340) (Y2O2S:Eu)
Green(P22) (x,y)=(0.280,0.595) (ZnS:Cu,Al)
Blue(P22) (x,y)=(0.155,0.070) (ZnS:Ag,Al)
White Uniformity 1
Rule of color mixing
CRT White Color is made by Red,Green and Blue.
So, white color point and brightness is decide by these three color's color point and brightnes.
The fomula is like following.
For example, if three colors are like following.

Red (x,y,Y) =(xr,yr,Yr) =(0.625, 0.340, 20.730)
Green (x,y,Y) =(xg,yg,Yg) =(0.280, 0.595, 68.055) x,y is CIE color point
Blue (x,y,Y) =(xb,yb,Yb) =(0.155, 0.070, 11.216) Y is brightness.
R,G,B Color point are

xr yr .625 .340
xg yg .280 .595
xb yb .155 .070
Yr
R,G,B Brightness are
yr
Yr 20.73 Sr
Yg
Yg 68.055 Sg
yg
Yb 11.216 Sb
Yb
yb
Yr Yg Yb White Color point and Brightness are

Yw xr. Sr xg. Sg xb. Sb Yw 100.001
xw Sr Sg Sb xw = 0.283
yw yr. Sr yg. Sg yb. Sb yw 0.298
Sr Sg Sb
We can get D93 White 100cd/m^2.

White (x,y,Y) =(xw,yw,Yw) =(0.283, 0.298, 100.0)
But this means the brightness balance and chromaticity effect to white color.
White Uniformity 2
Between RGB Brightness% Balance and White Color,there are the co-reration as follows.
Because of the CIE Color position against White Color point.
Green Brightness effects onlty CIE y value.Red Brightness effects mainly CIE x value.
But Blue effects CIE x and CIE y both.
CIE Color(1/1000) White Color Point vs RGB Brightness Ratio (20SH8)

320
315
Blue-y Green-y
310
305
300
Red-y
295
Red-x
290
285
Green-y
280
275
Blue-x
270
85 90 95 100 105 110 115
RGB Brightness Ratio(%)
Redx Redy Greenx
Greeny Bluex Bluey
Red x Liner Red y Liner Green x Liner
Green Y Liner Blue x Liner Blue y Liner

Distortion and Convergence Drift by TM Field

Distortion and Convergence will change by TM Field like this.
Because TM will effect beam curve and change Gun Rotation and BOA of CRT.
Face to North
Face to North
Face to South Face to South
Face to East Face to East
Face to West
Face to West
Distortion and Convergence Drift by DY Tilt(Horizontal Trapezoid and V Pin)
DY Tilt Right DY Tilt Right
DY Tilt Up DY Tilt Up
DY Rotate to Clockwise
DY Rotate to Clockwise
TLV Change Positive TLV Change Positive

H-Trapezoid
OPERATION STANDARD
GUN TWIST, HMC & VMC MEASUREMENT QA-QC-OS-017
14/15/17/21/25/29 QA 25/10/00 1/7 2-F
EDITION – REVISION DESCRIPTION CHANGED BY DATE

CHANGED
2- B ADDITION OF 17", 25RS AND 29 RS NEW MODEL ANG K.L. 01/09/98
2- C ADDITION OF 21RS NEW MODEL SPECIFICATION JACK ANG K.L. 01/10/98

ON PAGE 3 / 13
2- D ADDITION OF 17TK AND 14RS NEW MODEL JACK ANG K.L. 01/04/99
SPECIFICATION ON PAGES 3/13, 4/13 AND 5/13
2- E CHANGE IN MEASUREMENT PROCEDURE JACK ANG K.L 10/06/99

FORMAT AND THE FLOW CHART FORMAT.
2- F Remove 17FR discontinued model and addition 15TK new

model Ng K. K 25/10/00
ORIGINATOR CHECKED BY APPROVED BY DOCUMENT CONTROL
Ng K. K Ng K. K T. Shirahama
QC Engineer QC Section Leader QA Division Manager

OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 2/7 2-F
1.0 OBJECTIVE
To document the method adopted for GUN TWIST, HMC & VMC measurement.
2.0 SCOPE
This operation standard applies to each week's sampling CRTs, and all QC check CRTs.
3.0 RESPONSIBILITIES
The QC technicians are responsible to take accurate data for all measurement.
4.0 ASSOCIATED DOCUMENTS
CRT QC SAMPLING STANDARD (QA-QC-S-001).

CRT SETUP PROCEDURE IN HHC (QA-QC-OS-069).
5.0 EQUIPMENT USE
5.1 Helm Holtz Coil.

5.2 Wooden CTV Set.
5.3 Standard DY.
5.4 Landing Checker.
5.5 Auto degausser.
5.6 Pattern generator or digital video pattern generator.
5.7 Wobble Coil.
5.8 MINOLTA CRT Convergence Meter ( CC-100 ).
5.9 Television Set
6.0 SAFETY EQUIPMENTS
Safety gloves.
7.0 FORMS
SDS CRT QC WEEKLY DATA FORM.
8.0 SAMPLING METHOD
CRTs used for measurement must be randomly selected after final inspection process.
OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 3/7 2-F
9.0 GROUNDING
Check that the spring of the CRT Stand is touching the outer carbon, and it is grounded.
10.0 MEASUREMENT CONDITIONS
Done in the Helm Holtz Coil with the following magnetic field:
Magnetic field Model Vertical BV Horizontal BH

14NDXM, 14 RS
Normal (Japan) 21PX, 21RS 35 µΤ 0
25GXS, 25RS
14NDXM(AS)
Australia (AS) 21PX(AS) - 55 µΤ 0
25GXS(AS)
Southern 17TK
21RS(GE), 21RS(LA)
GE 29GX2T(GE) -10 µΤ 0
29RS(GE)
ME 29GX2T(ME) 30 µΤ 0
29RS(ME)
ME 21RS(NA) 40 µΤ 0
ME 15TK 45 µΤ 0
17TK
11.0 SPECIFICATION
Measurement
14NDXM 14RSN 15TK 17TK 21PX 21RSN 25GXS 25RSN 29GX2 29RSN
Item (mm)
HMC ±1.1 ±1.2 ±0.65 ±0.7 ±0.9 ±1.2 ±1.2 ±1.2 ±1.2 ±1.2
VMC ±1.3 ±0.9 ±0.85 ±0.9 ±0.9 ±0.9 ±0.9 ±0.9 ±0.9 ±0.9
Gun Twist ±0.75 ±0.8 - - ±0.8 ±0.8 ±0.9 ±0.9 ±0.9 ±0.8
12.0 SETUP
Refer to OS No.QA-QC-OS-069.
OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 4/7 2-F
13.0 MEASUREMENT PROCEDURE
Measurement Human Environmental Equipment/tools

Steps factor factor/Safety factor
1. Set up the CRT in the HHC. Room temperature
23°C~25 °C.
2. Degauss the CRT. Degauss coil is at the - Input correct voltage for
correct position. the degauss coil
- Check degauss coil with
the correct capacitor or
resistor.
3. Switch on the CRT, and select Set to soft mode.

X-hatch signal.
4. Adjust DY rotation. Check DY rotate with - Select X-hatch signal

Adjust center landing zero and center horizontal line. when adjusting DY
side balance, the n tighten the Check that the 4 pole & rotation.
DY. 6 pole magnet are all - Select green raster to
neutral. adjust center landing.
5. Start measurement with the Check that the measuring - Set the reference color
Minolta CRT Convergence head is at the center of to Green.
Meter CC-100. the screen, and it is in - Select X-hatch signal.
contact with the panel - Adjust focus at the
face. measuring head and press
the measuring button.
6. Record the R-G(x,y values) Ensure that the values are

and B-G (x,y values) from the consistent before
display. recording.
OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 5/7 2-F
7. Calculate GT, HMC & VMC.

GT = R-G(y)
HMC = R-G(x) + B-G(x)
VMC = R-G(y) + B-G(y)
8. Power off. End.
APPENDIX A
EXPLANATION DIAGRAMS
1. Gun twist
R – G (y) = +ve R – G (y) = -ve

R Gun Twist + ve G B Gun Twist - ve
G
R
B
2. HMC
R – G (x) + B – G (x) = +ve R – G (x) + B – G (x) = -ve

HMC +ve HMC -ve
G G
R R
B B
3. VMC
B
R – G (y) + B – G (y) = +ve R G R – G (y) + B – G (y) = -ve
VMC +ve VMC -ve
OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 6/7 2-F
R G
B
4. Measurement point
Cross Hatch
Location of Useful screen edge.

measuring head.
RGB
As seen in
television
OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 7/7 2-F
APPENDIX B
GUN TWIST, HMC & VMC MEASUREMENT FLOWCHART
Set up the CRT

(Room temperature 23°C ∼ 25°C)
Degauss the CRT

(Check correct input voltage for the degauss coil )
Switch on CRT, select X-hatch signal

(Set to soft mode.)
Adjust DY rotation, center zero and side balance

(Check DY rotate and PS, 4 Pole & 6 Pole in neutral position.)
Start measurement with the Minolta Convergence Meter.

(Set the reference color to Green. Select X-hatch signal, and check that the
measuring head is at the center of the screen.)
OPERATION STANDARD
14/15/17/21/25/29 QA 25/10/00 8/7 2-F
Calculate GT, HMC & VMC:-
GT = R-G(y)
VMC = R-G(x) + B-G(x)
HMC = R-G(y) + B-G(y)
Power off. End.

Curso de CRT

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1.

SCREEN and PICTURE QUALITY

What is Beam & Stripe Grouping?

How to calculate Beam Grouping?

2.1 Function of each gun parts

1. Heater & sleeve - a miniature coiling of tungsten wire.

How does stray, leak and arcing occur?

Space between electrode ~2mm

Dust, burr ~ 2µm in height

Equip-potential Ek, nominal 50 ~ 80 V

1.1 CQF & Slumping, GR

Slumping is an indication of Ba radical (electrons producer) generation rate. Therefore, with a

A Good EfIk curve should have the following characteristics

EfIk Curve NG will mean

1.4 Sintering Level

These defects could be looked at more closely at 500 times.

At 2000 times, sintering level is judged based on

1.5 Ba Concentration / Ba / Sr ratio

EDX could be done on oxides to determine the composition of cathodes.

Ea = - 25v Ec2 = 200 V

Vacuum Level (in torr) = A x (GR)B

Tests’ Sampling Plan

Corrective Action Plan

In-House Process Check

The main factors to be considered in Emission related process issues are

Process Change that could affect Emission

b) CCA % is referring to the proportion of Ik at certain time as compared to Ik at 24 hrs. It is

B) Life-Test Operation Flow Chart

1) Set-up and Running Conditions

For measurement, it is the determination of measurement condition and validation of measurement

As from the flow chart,

5) Life test on new parts’ introduction should be carried out if

D) Current Loading factor- J

Old Current Loading factor is calculated by

εKhot is a constant factor based on hot deformation.

0.572 + 0.167 (d01 hot /φ1) + 0.561(d01 hot /φ1)2

where d01 hot is d01 adjusted for hot condition.

d01 hot = d01 – (dsh – dgh)

where d01 is the distance from cathode to G1

b) CCA % is referring to the proportion of Ik at certain time as compared to Ik at 24 hrs. It is

B) Life-Test Operation Flow Chart

1) Set-up and Running Conditions

For measurement, it is the determination of measurement condition and validation of measurement

As from the flow chart,

5) Life test on new parts’ introduction should be carried out if

D) Current Loading factor- J

Old Current Loading factor is calculated by

εKhot is a constant factor based on hot deformation.

0.572 + 0.167 (d01 hot /φ1) + 0.561(d01 hot /φ1)2

where d01 hot is d01 adjusted for hot condition.

d01 hot = d01 – (dsh – dgh)

where d01 is the distance from cathode to G1

Pin shaped dust

Round shaped dust

2. Stray arcing (Creeping arcing)

(b) Accelerated Arcing from Electric Potential on Connecting Wire (lead)

(d) When Arcing the B Electrodes of IBR

Strays and Leakage current

of the electric field is from positive to negative. (Fig 1.3.1i)

Phenomenon for lowering the Stray Start Voltage :

D. Unbalance Characteristics of The Electric Potential Surface of the Matter

Inspection & quality standard

A. 22hrs TV Set aging.

B. Starting Voltage Test (VI).