Sample Questions

UNIT 1
PART A
1. Differentiate CVD and PVD.
2. Distinguish between Microelectronics and Microsystem.
3. Label the components of a Microsystem.
4. Define Torsion and Torsional rigidity.
5. Give any five applications of Microsystems.
6. Illustrate the functional relationship between the actuating element and the
transduction unit in a Micro sensor.
7. Define shear stress and shear strain.
8. Define Hook’s law and explain elastic limit.
9. Evaluate the options for integrating micromechanical and circuit elements.
10. Explain the process of CVD with neat sketch.
11. With neat labelled figures, demonstrate the steps involved in photolithography.
12. Compare between silicon and GaAs as materials for MEMS device fabrication.
13. Describe the method of Micro actuators.
14. Define MEMS.
15. Distinguish between bulk micromachining and surface micromachining.
16. Classify the types of beams.
17. Summarize the boundary conditions for various types of beams.
18. What is bending moment.
19. What do you mean by quality factor (Q).
20. Name the material having zero stress.
PART B
1. i. Describe the role of semiconductor materials in the design of MEMS and also
calculate the charge carrier concentration. (8)
ii. Examine the concept of conductivity and resistivity. (8)
2. i. Illustrate the functional relationship between the actuating element and the
transduction unit in a Micro actuator. (8)
ii. Describe the energy domains of sensors and actuators. (8)
3. i. Discuss in detail about the properties of silicon as a substrate material. (8)
ii. Explain how oxidation principle is used in Micro system fabrication. (8)
4. i. Summarize the applications of Microsystems in different industries. (8)
ii. Give short notes on diffusion process used in MEMS industry. (8)
5. i. Summarize the processing steps of photolithography with neat sketch. (8)
ii. Describe about the PVD with neat diagrams. (8)
6. i. Explain about ion implantation technique to produce Microsystems. (8)
ii. Explain in detail about torsional deflection. (8)
7. Show the fundamental classes of fabrication technologies and design a typical
micromachining process involving one structural and one sacrificial layer.
(16)
8. i. Demonstrate the equations for Mass, Acceleration, Transient time and Power
Density using Trimmer Force Vector. (8)
ii. Compare and contrast PECVD, APCVD and LPCVD. (8)
9. Give the relation between stress and strain in brief with relevant diagrams and
equations. (16)
10. i. Define beam. Name the types of beams and point out the possible boundary
conditions. (6)
ii. Describe about the flexural beam bending analysis under simple loading
conditions. (10)
11. In detail explain about the relation between tensile stress and strains also give the
details of mechanical properties of silicon. (16)
12. Discuss in detail about torsional deflections. (16)
13. Describe about photolithography process and also about Czochralski (CZ) method for
producing single crystal silicon. (16)
14. Illustrate about crystal planes and orientation in MEMS. (16)
UNIT 2
PART A
1. Give the principle of operation of electrostatic sensors and actuators.
2. Name the materials used in fabrication of parallel plate capacitors.
3. Define pull-in voltage.
4. Summarize the advantages and disadvantages of electrostatic sensing and actuation.
5. Generalize the principle of tactile sensor with an example.
6. Name any three thermal sensors.
7. Discuss on the concept of seebeck coefficient.
8. Compare and contrast the characteristics of electrostatic and thermal bimetallic
actuation.
9. Distinguish between volumetric thermal and linear expansion coefficient.
10. Discover the need of thermal sensing.
11. Give the principle of thermal bimorph.
12. Define thermal resistance in the case of conduction, convection and radiation.
13. Summarize the advantages and disadvantages of thermal sensing and actuation.
14. Demonstrate the thermal transfer process with neat diagram.
15. Generalize the principle of magnetic actuator with an example.
16. Illustrate the relationship between B and H.
17. Compare and contrast hard and soft magnets.
18. Classify the types of magnetic materials based on susceptibility.
19. Define Lorentz force on a current carrying wire.
20. Tabulate the advantages and disadvantages of magnetic actuation.
PART B
1. i. With suitable diagram, explain the working principle of parallel plate capacitor and
the equilibrium position of electrostatic actuator under bias. (8)
ii. Describe the pull in effect of parallel plate actuators. (8)
2. i. Describe the fabrication process of condenser microphone. (8)
ii. Discuss on electrostatic actuation model with neat diagram. (8)
3. Discuss in detail about the fabrication process of pressure sensor with sealed activity.
(16)
4. i. Give short notes on Micro motors. (8)
ii. Summarize the applications of comb drive devices. (8)
5. i. With schematic diagram, explain bulk micro machined parallel plate capacitor
sensing as differential mode tactile sensor. (8)
ii. Explain the design and fabrication process of torsional parallel plate capacitive
accelerometer. (8)
6. Explain different configurations of interdigitated finger capacitors and their relative
pros and cons in terms of maximum displacement, linear / angular displacement and
force output. (16)
7. i. Define thermal resistor and thermistor. Draw the IV characteristics of thermal
resistor. (8)
ii. Describe the working of thermocouple element with neat diagram. (8)
8. i. Explain thermal bimetallic bending and evaluate the vertical displacement at the
free end of the cantilever beam. (8)
ii. Summarize the fabrication steps involved in the design of bimetallic artificial cilia
actuator. (8)
9. i. Give short notes on Micro grippers. (8)
ii. Demonstrate the two strategies of lateral thermal actuators. (8)
10. Explain in detail about the fabrication of thermal transfer shear stress sensor. (16)
11. Design an infrared sensor by giving out the fabrication steps in detail. (16)
12. Explain the fabrication process of a surface micro machined hot-wire anemometer.
(16)
13. i. Describe the principle operation of magnetic actuation and the deposition process of
magnetic materials. (8)
ii. Draw the magnetic curve for a ferromagnetic material. (8)
14. i. List out the various actuation methods used in MEMS. Explain the design and
fabrication of magnetic materials. (8)
ii. Explain about the structure and principle of a bistable magnetic switch. (8)

UNIT 3
PART A
1. Distinguish between longitudinal and transverse piezoresistors.
2. Differentiate longitudinal and transverse gauge factor.
3. Describe PVDF.
4. Relate the effective and ineffective design of cantilevers with piezoresistors.
5. Discuss about the materials that are used as piezoresistors.
6. Analyze, why the doping concentration takes an important consideration when
designing silicon photo resistors.
7. List the applications of piezoresistive sensors.
8. Summarize the advantages and disadvantages of using piezoresistive sensors.
9. Define piezoelectric effect.
10. Illustrate the relationship between electrical polarization and applied mechanical
stress.
11. Illustrate the relationship between stress and strain.
12. Define electromechanical coupling coefficient.
13. Point out the assumptions that have been made for calculating the curvature of ending.
14. Define Curie temperature.
15. Discover the need of acoustic sensors.
16. Generalize the principle of piezoelectric accelerometer.
17. Why ZnO is used instead of PZT?
18. Name the materials used as bonding agent in preparing PZT materials.
19. Describe the need of flow rate sensors.
20. Summarize the advantages and disadvantages of piezoelectric sensing and actuation.

PART B
1. i. Discuss about the properties of the materials used in the fabrication of piezoelectric
sensors. (8)
ii. With neat diagram, describe the fabrication process of PZT piezoelectric acoustic
sensor. (8)
2. i. Discuss on the concept of cantilever piezoelectric actuator model with neat diagram.
(8)
ii. Discuss about the properties of the materials used in the fabrication of
piezoresistive sensors. (8)
3. i. List some of the piezoelectric materials and piezoresistive materials. Differentiate
between them based on their property. (8)
ii. Describe the working principle of membrane piezoelectric accelerometer and its
fabrication process. (8)
4. i. Discover the need of flow rate sensor. Demonstrate the working and fabrication
process of piezoelectric flow rate sensor. (8)
ii. Demonstrate the working principle of tactile sensor array with neat diagram. (8)
5. i. Describe the fabrication process of cantilever type piezoelectric microphone. (8)
ii. Summarize the fabrication steps involved in the design of silicon proof mass with
cantilever. (8)
6. Explain the stress analysis following mechanical elements:
i. Stress in flexural cantilevers.(8)
ii. Stress and deformation in membrane. (8)
7. i. Demonstrate the working and fabrication process of surface micro machined
piezoresistive pressure sensor. (8)
ii. Define piezoresistivity. Discuss on a multi-axis piezoresistive tactile sensor. (8)
8. i. Formulate the fabrication steps to design an artificial hair cell element. (8)
ii. Give the comparison between various sensing methods. (8)
9. i. Summarize the advantages and disadvantages of various actuation methods. (8)
ii. List the applications of piezoresistive sensors. Explain the fabrication process of
piezoresistive shear-stress sensor. (8)
10. i. Formulate the fabrication steps to design a bulk micro machined single crystal
silicon accelerometer. (8)
ii. Illustrate the mathematical description of piezoelectric effect with relevant
diagrams. (8)
11. Summarize the properties of representive PZT materials. (16)
12. Describe about piezoelectric flow rate sensor. (16)
13. In brief explain about PZT piezoelectric Microphone. (16)
14. With neat sketch explain about cantilever piezoelectric accelerometer. (16)

UNIT 4

PART A
1. Illustrate about Anisotrophic Wet Etching.
2. Define Native Oxide.
3. Explain about Plasma Etching.
4. Name the substrate materials for LIGA process.
5. Define Photoresist materials.
6. Describe Electroplating in LIGA process.
7. Explain the Principle of SLIGA process.
8. Name the major Categories of processes for Bulk Silicon Etching.
9. Discuss the term TMAH.
10. Define Sputtering.
11. Tell about the unit process required in Surface Micromachining.
12. Give the applications of DRIE.
13. Express about SOI Wafer.
14. Illustrate about DRIE process.
15. Design the Electrochemical Etch Stop Layer.
16. Develop the points about Surface Micromachining.
17. Explain the term Bulk Micromachining.
18. Classify the types of Etching process.
19. Explain about Etching process.
20. Summarize the advantages in Surface Machining.
PART B
1. i. Describe about the rules of Anisotrophic Etching in Simplest Case. (8)
(ii. Describe about the rules of Anisotrophic Etching in Complex Structures (8)
2. Demonstrate the chemicals for wet anisotrophic etching (16)
3. Explain about materials selection criterion for two layer process. (16)
4. Discuss in detail about the thin film by low pressure chemical vapor deposition.(16)
5. Rewrite short notes on:
i. Gas phase etchants (8)
ii.Acceleration of sacrificial etch (8)
6. Explain in detail about LIGA process. (16)
7. i.Deduce the limitations in micromachining? (8)
ii. Summarize the advantages in surface machining. (8)
8. Explain in detail about surface micromachining cantilever beam. (16)
9. Discuss in detail about micro motor fabrication process in first pass and second pass. (16)
10. Describe about:
i.Three dimensional structure with surface micromachining. (8)
ii. Stiction and anti-stiction methods. (8)
11.i. Describe the Working principle of Sputtering.(8)
ii.With an example show where and how Deep Reactive Ion Etching(DRIE) is done.(8)
12. With neat sketches,describe the principle the following micromachining techniques.
i.Bulk micromanufacturing (8)
ii.Surface micromachining (8)
13. Discuss in detail about the Assembly of 3D MEMS with any one Applications.(16)
14. Describe about a Modular CMOS foundary process for Integrated Piezoresistive Pressure
Sensor.(16)
UNIT 5
PART-A
1. How the polymers are being classified?
2. Explain about polymer material.
3. Differentiate thermo plastic polymer and thermal setting polymer.
4. Define polymide.
5. Give the mechanical properties of polymers differ from metal and semiconductor.
6. Express about SU-8.
7. Describe about LCP.
8. Illustrate about PDMS.
9. Define the term PMMA.
10. Rewrite about fluorocarbon.
11. Point out the term bio degradable polymer material.
12. Generalize the term polycarbonate.
13. Define pressure sensor in polymer MEMS.
14. Give the principle behind multimodal polymer based tactile sensor.
15. Express the term viscoelastic creep.
16. Deduce the maximum tensile strength for polymers.
17. Classify the families of polymers.
18. Summarize the properties of Teflon.
19. List the actuators for optical MEMS.
20. Define optical mirrors.
PART B
1. Describe the short notes on
i.Polymide (8)
ii. LCP (8)
2. i. Explain in detail about PDMS with case study.(8)
ii. Write short notes SU-8 and Parylene. (8)
3. i. Describe about the fabrication process of silicon accelerometer with Parylene beams.(8)
ii. Explain in detail about schematic diagram of LCP polymer flow sensors. (8)
4. Give the fabrication steps in Parylene surface micromachined pressure sensor. (16)
5. Discuss the catergories and Sources in Optical MEMS.(16)
6. Describe about Optical MEMS from Micromirrors to Complex Systems. (16)
7. Deduce the role of MEMS as Secondary Storage in Computer System. (16)
8. Demonstrate the Active Micro-Actuators for Optical Modulation based on a Planar
Sliding Triboelectric Nanogenerator. (16)
9. Illustrate about Optical Applications of MEMS Devices. (16)
10. Explain the Principle of Operation of aTypical Micromirror. State how micromirror
technology is applied in Scanning Electron Micrograph. (16)
11. Discuss about pneumatic controlled PDMS valve.(16)
12. i.Describe about fabrication process for a parylene channel.(8)
ii. Write short notes on Fluorocarbon and PMMA. (8)
13. Explain the top and cross-sectional view of Parylene surface micromachined
membrane with integrated metal resistors. (16)
14. Describe the following as applied to DNA chip:
i. Basic microarray (3)
ii. Principle of microarray (4)
iii. Uses and Types of microarray (4)
iv. Any one fabrication Technology for microarray (5)