LAPORAN MAKALAH

MATA KULIAH
PENGEMASAN RANGKAIAN TERINTEGRASI (IC PACKAGING)

CLEAN ROOM DAN FLOW CHART PEMBUATAN IC

1. CRISTIAN VIERI (3221811002)

2. STEVEN LOIT PRASCO. S (3221811004)
3. M. RIANSYAH. D (3221811016)
4. MELLA FITRYANI (3221811017)

PROGRAM STUDI ELEKTRONIKA MANUFAKTUR

JURUSAN TEKNIK ELEKTRO
POLITEKNIK NEGERI BATAM 2020
A. Explanation of Clean Room STD 1000
Clean Room is a facility ordinarily utilized as a part of specialized industrial
production or scientific research, including the manufacture of pharmaceutical items,
integrated circuits, CRT, LCD, OLED and microLED displays. Cleanrooms are designed to
maintain extremely low levels of particulates, such as dust, airborne organisms, or vaporized
particles. Cleanrooms typically have a cleanliness level quantified by the number of particles
per cubic meter at a predetermined molecule measure. The ambient outdoor air in a typical
urban area contains 35,000,000 particles for each cubic meter in the size range 0.5 μm and
bigger in measurement, equivalent to an ISO 9 cleanroom, while by comparison an ISO 1
cleanroom permits no particles in that size range and just 12 particles for each cubic meter of
0.3 μm and smaller.
**The classification is like this :

As we see in the picture Class STD 1000 has specifications like that .

However, since Class 1,000 clean rooms are lower level clean rooms, they may have all of
the requirements for certain higher-grade applications. For instance, they may not have an air
shower at the entrance and may not require individuals to wear special shoes, although some
still do; everyone wears a head-to-toe bunny suit to keep skin and hair particles out.

Some of the many contaminants that Class 1,000 clean rooms are used to keep out include
human hair, dust particles, paint, air conditioning debris, lint, skin flakes, and lubricants. The
most common sources of these contaminants are people, tools, fluids, the facility, and the
product that is being manufactured. In order to keep these pollutants out and meet the
standards of strict regulations, acrylics, steel, stainless steel, aluminum, and polycarbonate are
generally the materials that are used to fabricate the walls of Class 1,000 clean rooms.
B. Assembling Process
The Integrated Circuit Assembly (IC) Process has the following process flow
sequence:

1. Wafer Mounting
Wafer mounting is a step that is performed during the die preparation of a wafer
as part of the process of semiconductor fabrication. During this step, the wafer is mounted
on a plastic tape that is attached to a ring. Wafer mounting is performed right before the
wafer is cut into separate dies. more compact Wafer Mounting Is the process of attaching
wafers to the Adhesive Tape and Dicing Frame.

Wafer mounting process

2. Wafer Dicing
s the process of cutting the wafer that has been mounted in order to separate the
combined chips into individual chips (die).In the context of manufacturing integrated circuits,
wafer dicing is the process by which die are separated from a wafer of semiconductor
following the processing of the wafer. The dicing process can involve scribing and breaking,
mechanical sawing (normally with a machine called a dicing saw) or laser cutting.

Wafer Dicing

3. Wafer Cleaning
Is the process of cleaning the surface of the wafer that has been cut from the
remnants of the dust of the cutting process.

The objective of the wafer cleaning process is the removal of chemical and particle
impurities without altering or damaging the wafer surface or substrate. The surface of the
wafer must be maintained not affected so that roughness, corrosion or pitting negates the
results of the wafer cleaning process.

The yield of a silicon wafer is inversely related to the defect density (cleanliness and
particle count) from the processing done on the wafer. One way to reduce defect density and
increase yields is to use efficient wafer cleaning processes that remove particle contaminants
efficiently. With smaller semiconductor devices and geometries the removal of smaller
particles from silicon wafers has become more critical. Small particles can be difficult to
remove since strong electrostatic forces exist between the particles and the wafer substrate.
 Wafer Cleaning

4. Die Bonding

Is the process of sticking a Chip / Die onto a leadframe using Epoxy.

Die Bonding Process Leadframe

5. Epoxy Curing

It is an epoxy drying process using an oven so that the epoxy on the leadframe can
stick to the IC chip perfectly.

Oven of Epoxy

6. Wire Bonding

Wire bonding is the process of creating electrical interconnections between

semiconductors (or other integrated circuits) and silicon chips using bonding wires, which are
fine wires made of materials such as gold and aluminium.

The two most common processes are gold ball bonding and aluminium wedge
bonding.

Gold wire bonding is achieved through thermosonic bonding. This involves melting
the end of the wire to form a gold ball, which is known as a free-air ball. The diameter of the
free-air ball measures 1.5 to 2.5 times the diameter of the wire. After being formed, the free-
air ball is placed into contact with the bond pad and pressure, heat and ultrasonic forces are
applied to it for a certain amount of time. This forms a metallurgical weld between the ball
and the bond pad while also allowing deformation of the ball bond into its ending shape.

In the next step, the wire is run to a finger of the lead frame, which forms an arc
between the bond pad and the lead finger. A second bond, called a wedge bond, is then
formed through applying pressure and ultrasonic forces to the wire using the lead finger. A
machine called the wirebonder then clamps the wire and raises the capillary in order to break
the wire to prepare for the next wirebonding.

Aluminium wedge wire bonding involves bringing a clamped aluminium wire in

contact with the aluminium bond pad. The wire is then held down while ultrasonic energy is
applied to it for a certain amount of time, which forms the first wedge bond between the wire
and bond pad, before being pressed against the corresponding lead finger. Further application
of ultrasonic energy to the wire forms the second bond, before the wire is broken off by being
clamped and moved.

Picture of Wire Bonding

7. Molding

Is the process of printing a package by closing a chip that has a wire attached with
thermosetting plastic material.
A mold is a mold that has a cavity in it that will be filled with liquid material such
as plastic, glass, or metal. The liquid will harden according to the shape of the cavity in the
mold. The cavity is produced by 2 parts that are put together (Cavity and Core). The division
of the two parts is based on the needs of the product to be produced. The division is called
partingline (PL).

The process is called Injection Molding, what is it?

` Injection molding is a method of forming thermoplastic materials where the

material that is melted by heating is injected by the plunger into a mold that is cooled by
water so it hardens.

Molding
8. Marking
Is the process of labeling the package as IC identity. Usually this labeling uses a
laser.
Giving this label aims to provide history on the ic about its manufacture such as
date, location, lot area, the machine used and others.

Example for IC Marking

9. Tin Plating
Is a leadframe coating process with Tin / tin to prevent oxidation and simplify
soldering of IC legs.

Tin Plating

10. Dejunk & Trim Form (DTFS)

Is the process of releasing Dam Bar and forming IC legs.

Dejunk - removal of flashes from the package of the newly molded parts.. Flashes
are the excess plastic material sticking out of the package edges right after molding.
Trim - cutting of the dambars that short the leads together.
Form - forming of the leads into the correct shape and position.
Singulation - cutting of the tie bars that attach the individual units to the leadframe,
resulting in the individual separation of each unit from the leadframe.
 DTFS Machine

11. Singulation
Is the process of releasing a package / unit from a leadframe. this process is the last
in ic packaging

C. Metrology Equipment

1. 3D Microscope (Keyence)

` 2. Profile Projector (Mitutoyo)

3. X-Ray Inspection System (Scienscope)

4. SEM / Scanning Electron Microscope ( Phenom )

5. Digital Microscope (Motic)

6. Depth Measurement ( Nissho )