Transistor

2SB0835 (2SB835)
Silicon PNP epitaxial planer type

For low-frequency output amplification

Unit: mm

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6.9±0.1 2.5±0.1
1.5
1.5 R0.9 1.0
■ Features

0.4

1.0
R0.9

Low collector to emitter saturation voltage VCE(sat).

2.4±0.2 2.0±0.2 3.5±0.1

●

4.5±0.1
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1.0±0.1

.
● M type package allowing easy automatic and manual insertion as

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well as stand-alone fixing to the printed circuit board.

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4.1±0.2
0.85

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■ Absolute Maximum Ratings

cy
(Ta=25˚C)
on na
0.55±0.1 0.45±0.05

life
1.25±0.05
Parameter Symbol Ratings Unit

ct
3 2 1
Collector to base voltage VCBO –20 V

du
Collector to emitter voltage VCEO –18 V

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Emitter to base voltage VEBO –5 V 2.5 2.5

Peak collector current ICP –2

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A

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Collector current IC –1 A 1:Base

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2:Collector EIAJ:SC–71
Collector power dissipation PC* 1 W

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3:Emitter M Type Mold Package

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Junction temperature Tj 150 ˚C
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Storage temperature Tstg –55 ~ +150 ˚C
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* 1cm2
Printed circuit board: Copper foil area of or more, and the board
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thickness of 1.7mm for the collector portion
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■ Electrical Characteristics
M

(Ta=25˚C)
d
ue

Parameter Symbol Conditions min typ max Unit

tin
p

ICBO VCB = –10V, IE = 0 –1 µA

on

Collector cutoff current

ICEO VCE = –18V, IB = 0 –10 µA
sc

p
Di

Collector to base voltage VCBO IC = –10µA, IE = 0 –20 V

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Collector to emitter voltage VCEO IC = –1mA, IB = 0 –18 V

nc

Emitter to base voltage VEBO IE = –10µA, IC = 0 –5 V

na

tp t f

hFE1* VCE = –2V, IC = –0.5A 130 280

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te

Forward current transfer ratio

ain

hFE2 VCE = –2V, IC = –1.5A 50

se
M

Collector to emitter saturation voltage VCE(sat) IC = –1A, IB = –50mA – 0.5 V

ea

Base to emitter saturation voltage VBE(sat) IC = –500mA, IB = –50mA –1.2 V

Pl

Transition frequency fT VCB = –6V, IE = 50mA, f = 200MHz 200 MHz

Collector output capacitance Cob VCB = –6V, IE = 0, f = 1MHz 40 pF

*h Rank classification
FE1

Rank R S
hFE1 130 ~ 210 180 ~ 280

Note.) The Part number in the Parenthesis shows conventional part number.

208
 Transistor 2SB0835

PC — Ta VCE(sat) — IC VBE(sat) — IC
1.2 –100 –100

Collector to emitter saturation voltage VCE(sat) (V)

IC/IB=20 IC/IB=20

Base to emitter saturation voltage VBE(sat) (V)

Printed circut board: Copper
foil area of 1cm2 or more, and
Collector power dissipation PC (W)

the board thickness of 1.7mm –30 –30

1.0
for the collector portion.
–10 –10

0.8
–3 –3
25˚C Ta=–25˚C

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0.6 –1 –1
75˚C
– 0.3 Ta=75˚C – 0.3
0.4 25˚C

– 0.1 –25˚C – 0.1

tin nc
0.2

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– 0.03 – 0.03

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0 – 0.01 – 0.01
0 20 40 60 80 100 120 140 160 – 0.01 – 0.03 – 0.1 – 0.3 –1 –3 –10 – 0.01 – 0.03 – 0.1 – 0.3 –1 –3 –10

cle
Ambient temperature Ta (˚C) Collector current IC (A) Collector current IC (A)

cy
on na

life
hFE — IC Cob — VCB

ct
600 120

du
VCE=–2V IE=0
Collector output capacitance Cob (pF)

f=1MHz

ro
Forward current transfer ratio hFE

Ta=25˚C
500 100

m R ue ue yp typ r P
sc te

400
se g U tin tin t e ou 80
Ta=75˚C

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300 25˚C 60

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–25˚C
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200 40

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100
nic st 20
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2SB
lan inc

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0 0 Type
M

– 0.01 – 0.03 – 0.1 – 0.3 –1 –3 –10 –1 –3 –10 –30 –100

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Collector current IC (A) Collector to base voltage VCB (V)

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tin
p
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209
 Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

ue e/
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.

tin nc
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

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d
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

sta
Standards in advance to make sure that the latest specifications satisfy your requirements.

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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

cy
on na
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

life
defect which may arise later in your equipment.

ct
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

du
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

ro
m R ue ue yp typ r P
sc te

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
se g U tin tin t e ou
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

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w. win con con nce anc ng f

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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20080805
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lan m m es

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lan inc

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This datasheet has been downloaded from:

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