tg4011 12 13la Final SM

ORDER NO.
KM41006120CE
Telephone Equipment
Model No. KX-TG4011LAT
KX-TG4012LAT
KX-TG4013LAT
KX-TGA403LAT
Expandable Digital Cordless Phone
T: Black Metallic Version
(for Latin America)
© Panasonic System Networks Co., Ltd. 2010

Unauthorized copying and distribution is a violation
of law.
KX-TG4011LAT/KX-TG4012LAT/KX-TG4013LAT/KX-TGA403LAT
2
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions----------------------------------------------- 4 16.5. Replacement Parts List--------------------------------- 76
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.2. Block Diagram (Base Unit_Main)---------------------- 9
4.3. Block Diagram (Base Unit_RF Part) -----------------10
4.4. Circuit Operation (Base Unit) -------------------------- 11
4.5. Block Diagram (Handset)-------------------------------18
4.6. Block Diagram (Handset_RF Part)-------------------19
4.7. Circuit Operation (Handset)----------------------------20
4.8. Circuit Operation (Charger Unit) ----------------------22
4.9. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------24
6 Installation Instructions ---------------------------------------24
7 Operating Instructions-----------------------------------------24
8 Test Mode ----------------------------------------------------------25
8.1. Engineering Mode ----------------------------------------25
9 Service Mode -----------------------------------------------------29
9.1. How to Clear User Setting (Handset Only)---------29
10 Troubleshooting Guide ----------------------------------------30
10.1. Troubleshooting Flowchart -----------------------------30
11 Disassembly and Assembly Instructions ---------------41
11.1. Disassembly Instructions -------------------------------41
11.2. How to Replace the Handset LCD -------------------44
12 Measurements and Adjustments---------------------------45
12.1. Equipment Required -------------------------------------45
12.2. The Setting Method of JIG -----------------------------45
12.3. Adjustment Standard (Base Unit)---------------------48
12.4. Adjustment Standard (Charger Unit)-----------------49
12.5. Adjustment Standard (Handset) ----------------------50
12.6. Things to Do after Replacing IC or X'tal ------------51
12.7. Frequency Table ------------------------------------------53
13 Miscellaneous ----------------------------------------------------54
13.1. How to Replace the Flat Package IC ----------------54
13.2. How to Replace the Shield Case ---------------------56
13.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------58
13.4. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------60
14 Schematic Diagram ---------------------------------------------61
14.1. For Schematic Diagram---------------------------------61
14.2. Schematic Diagram (Base Unit_Main) --------------62
14.3. Schematic Diagram (Handset_Main) ----------------64
14.4. Schematic Diagram (Charger Unit) -----------------66
15 Printed Circuit Board-------------------------------------------67
15.1. Circuit Board (Base Unit_Main) -----------------------67
15.2. Circuit Board (Handset_Main)-------------------------69
15.3. Circuit Board (Charger Unit) ---------------------------71
16 Exploded View and Replacement Parts List -----------72
16.1. Cabinet and Electrical Parts (Base Unit) -----------72
16.2. Cabinet and Electrical Parts (Handset) -------------73
16.3. Cabinet and Electrical Parts (Charger Unit) -------74
16.4. Accessories ------------------------------------------------75
3
1 Safety Precautions
1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer’s Instructions.
2.2. About Lead Free Solder (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
4
2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
6
4 Technical Descriptions
4.1. US-DECT Description
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.53).
4.1.1. TDD Frame Format
4.1.2. TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
7
4.1.3. Signal Flowchart in the Radio Parts

Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.

BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.

BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
8
4.2.
Q141
RLY
Q161 R151,R152 R131, R133 D101

L1T
SIDE TONE INUSE INUSE
CIRCUIT DETECT 2 DETECT 1 L1R
ANT1 ANT2 TEL JACK

X501
13.824 MHz
Q171
SW1 SP
RECEIVE DCP
AMP
DCM
Q111
LOUT BELL DC JACK
LIN DETECT
KEY 1
HOOK
KEY C
RF_PART DCIN 2
SPOUTP
SPOUTN
ANT1 DCIN 1
ANT2 BELL
HSMIP
RXp HSMIN
RXn IC302
RXON IC501 VBAT 3.0 V
VCCPA
TXp BBIC VBAT_APU REGULATOR
TXn VCC_IF
Block Diagram (Base Unit_Main)
9
VCC_FE
TXON
VCC_VCO
RSTN RESET
PDN DET
DOUBOUT 3.0V
SCL, SDA
WP
STM/CKM
VCCA
IC611 R371
VCC R372
VBAT EEPROM
MEMORY
CHARGE_CONTACT
+
IC331
RESET IC
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

ANT2
ANT2 TXp
TXn
ANT1
DA801 TXON
RXON
RXp
RXn
ANT1
KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)
10
4.4. Circuit Operation (Base Unit)

General Description:
(BBIC, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression and
memory management required in a digital telephone.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
4.4.1. BBIC (Base Band IC: IC501)

• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, Key scan, Telephone line.
4.4.2. EEPROM (IC611)

Following information data is stored.
• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
11
4.4.3. Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
12
4.4.3.1. Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.
13
4.4.4. Telephone Line Interface

Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T → L101 → R111 → C111 → Q111 → BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
14
4.4.5. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, BBIC disconnects the line after detecting parallel connection is off
hook.
15
4.4.6. Calling Line Identification (Caller ID)

Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
16
Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line → P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
17
4.5. Block Diagram (Handset)

3V
IC3
ANT1
X1
EEPROM
10.368 MHz
BATTERY
WP, CLK, DATA

CHG_DET
CHG_CTL Power_adj
TXn
TXp
IC801
VDD_PADRV
RESET PSEL
Q4 D7 PON
CHARGE C144
TXON
RXON
RF_RXn
RF_RXp
BATTERY 1.8V
3V RF PART
D1
AVD
Q2 CP_VOUT2
BATTERY LD0_CTRL
IC1 BATTERY
BBIC
MIC VDDPA
MICp
MICn 1.8V
3V Receiver
LSRp VDD2
VDD1
LED LSRn
(KEY)
Q7
KEY_LED
3V
LED
(BELL)
BELL_LED
P3_3~P3_7
P1_1~P1_4
Monitor SP
PAOUTp
PAOUTn
CKM/STM CKM//STM
3V
LCD KEYS
KX-TGA403 BLOCK DIAGRAM (Handset)
18
4.6. Block Diagram (Handset_RF Part)

ANT TXON
DA801
RXON
RF_RXn
RF_RXp
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
19
4.7. Circuit Operation (Handset)

4.7.1. Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
• RF Power Amp: IC801
- Amplifier for transmission
• EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.7.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → Q2 (1.8 V), IC1-43pin (2.5V)
The Reset signal generates IC1 (61 pin) and 1.8 V.
20
4.7.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) → F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.7.4. Battery Low/Power Down Detector

Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.25 V ± 50 mV
The BBIC detects this level and " " starts flashing.
• Power Down
Battery voltage: V(Batt) 2.0 V ± 50 mV
The BBIC detects this level and power down.
4.7.5. Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
21
4.8. Circuit Operation (Charger Unit)

Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.20)
The route for this is as follows: DC+pin of J1(+) → F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).
22
4.9. Signal Route
RF part signal route
23
5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:
24
8 Test Mode
8.1. Engineering Mode
8.1.1. Base Unit
25
Frequently Used Items (Base Unit)

ex.)
Items Address Default Data New Data Remarks

Frequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to
ID 00 02 ~ 00 06 Given value - - confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
26
8.1.2. Handset
27
Frequently Used Items (Handset)

ex.)
Items Address Default Data New Data Possible Adjusted Possible Adjusted Remarks
Value MAX (hex) Value MIN (hex)
Battery Low 00 11 / 00 12 00 / 00 - - -
Frequency 00 07 / 00 08 00 / 01 - - - (*2)
ID 00 02 ~ 00 06 Given value - - -
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
28
9 Service Mode
9.1. How to Clear User Setting (Handset Only)
Handset
Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
29
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
Cross Reference:
Check Power (P.31)
Check Battery Charge (P.32)
Check Link (P.33)
Check the RF part (P.35)
Check Handset Transmission (P.40)
Check Handset Reception (P.40)
Check Caller ID (P.40)
30
10.1.1. Check Power

10.1.1.1. Base Unit
Cross Reference: Note:

Power Supply Circuit/Reset Circuit (P.12) BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Circuit Board (Base Unit_Main) (P.67).
10.1.1.2. Handset
Cross Reference:
Power Supply Circuit/Reset Circuit (P.20)
31
10.1.2. Check Battery Charge

10.1.2.1. Base Unit
Cross Reference:
Charge Circuit (P.13)
10.1.2.2. Handset
Cross Reference:
Check Power (P.31)
10.1.2.3. Charger Unit
Cross Reference:
32
10.1.3. Check Link

10.1.3.1. Base Unit
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.51) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes13.824 MHZ±55HZ.
33
10.1.3.2. Handset
Cross Reference:
Note:
*1 How to adjust the frequency of X1:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-46pin).
To adjust frequency, send command “SFR “ until the frequency counter becomes10.368 MHz±55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.52) for Handset.
34
10.1.4. Check the RF part

10.1.4.1. Finding out the Defective part
After All the Checkings or Repairing

1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Note:
(*1) HS: Handset
(*2) BU: Base Unit
35
10.1.4.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.37).
Please refer to the each item.
Note:
(*1) Refer to Check Link (P.33).
36
10.1.4.3. Check Table for RF part
No. Item BU (Base Unit) Check HS (Handset) Check

1 Link Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link.
2 X'tal Frequency confirmation Check X'tal Frequency. Check X'tal Frequency.
(13.824000 MHz ±100 Hz) (10.368000 MHz ±100 Hz)
HS, BU Mode: [Adjustment]
3 TX confirmation 1. Place Regular HS 15 cm away from a 1. Place Regular BU 15 cm away from a
checked BU. checked HS.
Regular HS (BU) Mode: 2. Confirm "TXDATA" waveform of BU (*1) 2. Confirm "TXDATA" waveform of HS (*2)
[Test RX Mode] and “RXDATA“ waveform of Regular HS by and "RXDATA" waveform of Regular BU by
Digital Oscilloscope. Digital Oscilloscope.
BU (HS) Mode:
[Test TX_Burst Mode]
4 RX confirmation 1. Place Regular HS 15 cm away from a 1. Place Regular BU 15 cm away from a
checked BU. checked HS.
Regular HS (BU) Mode: 2. Confirm "RXDATA" waveform of BU (*1) 2. Confirm "RXDATA" waveform of HS (*2)
[Test TX_Burst Mode] and “TXDATA“ waveform of Regular HS by and "TXDATA" waveform of Regular BU by
Digital Oscilloscope. Digital Oscilloscope.
BU (HS) Mode:
[Test RX Mode]
5 Range Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode: [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link. 3. Compare the range of the HS (being
3. Compare the range of the BU (being checked) with that of the Regular HS.
checked) with that of the Regular BU.
Note:
(*1) Adjustment Standard (Base Unit) (P.48)
(*2) Adjustment Standard (Handset) (P.50)
37
10.1.4.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item BU (Base Unit) Check HS (Handset) Check

Range Confirmation TX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(TX Power check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the HS and the Regular BU
HS, BU setting according to CHART1. according to CHART1.
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK. Link OK = TX Power of the HS is OK.
No Link = TX Power of the BU is NG. No Link = TX Power of the HS is NG.
Range Confirmation RX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(RX sensitivity check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the Checking HS and the Reg-
HS, BU setting according to CHART1. ular BU according to CHART1.
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK. Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the BU is NG. No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (to be checked) Regular_HS

TX Power TX Power
BU (Base Unit) TX Power Check Low High
BU (Base Unit) RX Sensitivity Check High Low
HS (to be checked) Regular_BU

TX Power TX Power
HS (Handset) TX Power Check Low High
HS (Handset) RX Sensitivity Check High Low
Note:
(*1) Refer to Commands (P.47).
38
10.1.5. Registering a Handset to the Base Unit
10.1.6. Deregistering a Handset
10.1.7. Deregistering All Handsets by the Base Unit
39
10.1.8. Check Handset Transmission
Cross Reference:
Signal Route (P.23)
10.1.9. Check Handset Reception
Cross Reference:
Signal Route (P.23)
Note:
When checking the RF part, Refer to Check the RF part
(P.35).
10.1.10. Check Caller ID
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID) (P.16)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really
a subscriber of the service.
40
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1. Base Unit
41
11.1.2. Handset
42
11.1.3. Charger Unit
43
11.2. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
44
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.30)
12.1. Equipment Required

• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

<Preparation> Note:
• Serial JIG cable: PQZZ1CD300E* *: If you have the JIG Cable for TCD500 series
• PC which runs in DOS mode (PQZZ1CD505E), change the following values of
• Batch file CD-ROM for setting: PNZZTG4011LA resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
Resistor Old value (kΩ) New value (kΩ)

R2 22 3.3
R3 22 3.3
R4 22 4.7
R7 4.7 10
12.2.1. Connections (Base Unit)

Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
Note:
*: COM port names may vary depending on what your PC calls it.
45
12.2.2. Connections (Handset)

Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
Note:
*: COM port names may vary depending on what your PC calls it.
46
12.2.3. How to install Batch file into P.C.
Note:
• “*****” varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name Function Example

rdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readid Read ID (RFPI) Type “readid”, and the registered ID is read out.
writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
hookoff Off-hook mode on Base Type “hookoff”.
hookon On-hook mode on Base Type “hookon”.
getchk Read checksum Type “getchk”.
wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
47
Note:
DC
6.5V
12.3.1. Bottom View
YLW GRN CHG RED RED WHT BLK
CHARGE+ CHARGE- SPP SPN DCP DCM CL1

ANT1
SP DC
L1T L1R C351 Spectrum Analyzer
C478 C477
L361
L371
D473 D472
F301
3.0A
D361 TDO
TDI
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)

STM/CKM/P15
12.3. Adjustment Standard (Base Unit)
48
RSTN TCK
(*1) is referred to No.2 of Check Check Table for RF part (P.37)

ANT2 Frequency Counter (*1)
C142
C301
R301
TMS
Q161
C167
R165
R507
R512
D142
CL2 FCT
C476 R321 C343
R305
C479
RA502
D143
VBAT
C307
R302
R166 R322 * Send command "SFR", then
R162
C163 C165 L476
C513
C171 8 5 R502 R304
R307
C601
C512
R161 R164 C181
C514
DCDC_OUT
the frequency output on this TP.
L474 RTCK
When connecting the simulator equipment for checking, please refer to below.
C184
IC302
C510 C530 IC601 RTCK C322
R601
C511 R607
R181
C133
3
Q601
C186
C321
C473
C475
1 4
C472
R163
E
Oscilloscope (*2)
R603
RA151 +3.0V
C124 C123
C521
C151
R604
R503
C168
R602
C120
R115 R335
C332
VCCA
R334
VREF D133
C525
R136
R167
R178 R612 +6.5V * Start Monitor
VBG VDDC
C125 R605
C115
C611
R152 D153 RA504 R606

C121 R121
R112 C152 IC611
C524
C122 R151
R505
R506
L372
C126
R122
D363 C112
C352 C661
L362
PNLB1712Z
CHG+2 CHG-2 GND UTX URX
PbF B
RED BLK
12.4. Adjustment Standard (Charger Unit)

12.4.1. Bottom View

Digital
Volt Meter
Charge+
Charge-
12 /2 W
PQUP11532Y
TP4
J1
F1
PbF
1
PNLP1029YA
TP3
2
TP3
TP4 (GND)
DC POWER
DC 6.5 V
49
12.5. Adjustment Standard (Handset)

12.5.1. Component View

KX-TGA650XX
KX-TGA651XX
KX-TGA250XX PNLB1734Y
KX-TGA251XX
KX-TGA403XX
PbF
GND
R
TP_ANT1
VE
EI
EC
DECT Tester
ED
R
R
CMD60
K
BL
TGA650XX
TGA651XX
C175 C152
ANT
C186
C70 C71
C187
C580
R578
150
TGA250XX
AF Volt Meter
Oscilloscope
D21 D22
TGA251XX
TGA403XX
C204
56
R55
C106 R231C201C200
C104
C107 C105 BLK
C103
R233
SPEAKER
C206
R232
1 F
R54
R53 R50 C203
8
R236
C138
C139
RED
1
56
D13
D14
C863 C864
C806
L803
C811 C814 C72

C804
C813 C73
IC801
R801
C803
L802
C812
R808
C805
RA800
R802 C880
C810
RA32
C802 R880
C881
DA801
R805
C861 C825
C
C809
C819
Q880
80 R806
8
C827
L801
STM JTAG
C834 R405 R63
R66
C46
C45
C44 R225
C820
C837
C182
C860
R64
1
C826
CLK
Counter (*1)
C822
R807
Frequency
R203
22pF
IC1
RA1
C43
100
C47
X1
C48 C40
R215
GND
C54
Q2
C52
C17
C10
C49
C50
C53
(at battery low)
1.8V RA4 C55

C97
C96
D400 21
Q400 C51
Power Key
C18 R28
CP 4.0V
L47
L46
C188
R249
R401
CP4.0V
GND
R37
Volt Meter
C13
C11
C400 R23 R36

R402 C39 C30 CP 3.0V
C12
Oscilloscope (*2)
R248
DC POWER
R400 R27
Digital
2.00~2.25V
CP3.0V
C38
CLK
R403
R406
R407
Q401 R20 RA40 1.8V

Q10
R404
POWER
C332 8 5
C172
C2
Q12 R332
GND
IC3
R331
Q11
C331 1 4
R330
Current
Probe
C342
RA30 RA31
Generator
+
D1
E
AF
Q7
+
C341
DC 6.5V
C1
RCV- MIC+
RCV+ MIC-
C340 RX
RA61
URX
URX
TX
PC
C150
UTX
R2 GND
R6
BAT GND
D7
C3
Q4
R45
R8
C35
R3
R31
Q9
C121
F1 R7 R4
BATT+ R30 BATT-
2.30~2.60V
C147
DC Power
Zener
2.7 V
C75
C74
R74
R73
CHG(+) CHG(-)
C5 D3 D4
C113
A
MIC
MIC+ MIC-
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.37)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
50
12.6. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.6.1. How to download the data

12.6.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.45).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC611) Adjusted parameter data is stored in memory. 1) Change the address “0001” of EEPROM to “55” to download
(country version batch file, default batch file, the data.
etc.) 2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TG4011USLArevXXX_YYY.bat”. (*1)
4) Clock adjustment
X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 6.5V between DCP ad DCM with DC power.
2) Input Command " sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the fre-
quency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 15 Hz.
Note:
(*1) XXX_YYY: revision number
“XXX”, “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.45).
51
12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG(P.45).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC3) Adjusted parameter data is 1) Default batch file: Execute the command “default.bat”.
stored in memory. 2) Default batch file (remaining): Execute the command
(country version batch file, “TGA402USDEFrevXXX_YYY.bat”. (*2)
default batch file, etc.) 3) Country version batch file: Execute the command
“TGA402USLArevXXX_YYY.bat”. (*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
Battery Monitor Check - 1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write “YY“
Execute the command “wreeprom 00 09 01 YY“.
EEPROM = 000A (No Voltage) write “YY - 1D“
Execute the command “xwreeprom 00 0A 01 ZZ“.
Note:
No Voltage writing data limit is “00“.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.
4)Confirm that there is flashing of Battery lcon.
Battery Clock Adjustment CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.
(X1) 2) Input Command “sendchar sfr“, then you can confirm the current value.
3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).
4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK exe-
cute in the command “sendchar sfr xx xx (where xx is the value)“ so that the reading
of the frequency counter is 10.368000 MHz ± 5 Hz.
Note:
(*2) XXX_YYY: revision number
“XXX” and “YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.45).
52
12.7. Frequency Table
Ch. (hex) TX/RX Frequency (MHz)

Channel 0 00 1928.448
Channel 1 01 1926.720
Channel 2 02 1924.992
Channel 3 03 1923.264
Channel 4 04 1921.536
53
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
54
13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
55
13.2. How to Replace the Shield Case

13.2.1. Preparation
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608°F ± 68°F (320°C ± 20°C)
13.2.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the Shield Case

Note:
If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
56
13.2.4. How to Install the Shield Case

Note:
• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
• Shield case’s No. : PNMC1013Z
1. Put the shield case.
2. Solder the surroundings.
57
13.3. How to Replace the LLP (Leadless Leadframe Package) IC

Note:
This description is only applied on the model with Shield case.
13.3.1. Preparation
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
13.3.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.3.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
58
13.3.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
13.3.5. How to Remove a Solder Bridge

When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
59
13.4. Terminal Guide of the ICs, Transistors and Diodes

13.4.1. Base Unit
13.4.2. Handset
60
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
14.1.1.1. Acoustic Testing Mode
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
61
14.2. Schematic Diagram (Base Unit_Main)

ANT2
R892
470
R807
470
C892 RXON
ANT2 5p
C822 C827
W 0.15mm 10p 10p
W 0.2mm GND
L mm L 20mm
GND 1st layer 3rd layer GND GND RXn
CL2 C894
C826
2.2p
W 0.2mm 10p
L 10mm
C863
1st layer C820
1.5p
1.5p RXp
GND
GND GND
ANT1
DA802 TXp
DA801
1 2 C805
C895 L809 C812
3 3 2.7p
GND 2 1 7.5n GND
1.2p 0.9p
CL1 C893 C896 C859
2.2p 2.2p C810 TXn ANT1
C813
2.4p
2p
3p TXON
W 0.2mm W 0.2mm GND GND W 0.15mm TXn
L 10mm L mm L 20mm TXp
1st layer 1st layer GND 3rd layer RXp
GND C806
GND GND 2.7p RXn
R806 RXON
GND VBAT ANT2
W 0.15mm W 0.15mm C825
R891
GND 470
470
C891 L 5.0mm L 5.0mm 10p

5p 1st layer 1st layer W 0.2mm
L 10.0mm TO RF BLOCK
GND 1st layer
GND C811
10p VBAT
(1)
GND (2)
TXON (3)
(4)
ANT1
45
TXp
* Start Monitor 46
47 RXp
* When "SFR" command 48 RXn
GND_RF
49
is executed, 13.824MHz GND 50 TRSW_p
51 ANT_n
frequency will be output. 52 ATST_n
+3.0V ATST_p
53
54 TEST
*Q651 RSTN
C515
RSTN *IC501
K1u
55
VBAT
NC NC
*R507
*R512
56
NC
VCC_VCO
1k
5 1 MSG_LED C516 0.1u 57
C1 B1 GPIO[27]
58
STM/CKM/P15 VDDUSB
10 E
2 C517 0.1u 59
FCT 60 DM_USB/GPI28
2APVCC DP_USB/GPI29
*R651 NC 4 3 ANS_LED C518 0.1u 61
MSG_LED C2 B2 RA501 33 VDDC1
*R652 NC JTAG_TDO 62
ANS_LED JTAG_TDO
JTAG_TDI 5 4 63
NC JTAG_TDI
KEYIN1 JTAG_TCK 6 3 64
KEYIN1 JTAG_TCK
KEYIN2 JTAG_TMS 7 2 65
KEYIN2 JTAG_TMS
KEYIN3 JTAG_RTCK 8 1 66
KEYIN3 JTAG_RTCK
KEYS_C 8
7
6
KEYS_C VDDC
KEYS_D RA502
KEYS_D 10k
KEYS_E
45
+3.0V
1
2
3
KEYS_E
NC
NC
NC
NC
NC
NC
C658 NC
C659 NC
C660 NC
1
C651
C652
C653
C654
C655
C656
*WBX01 NC
(5)
*SW1
2 1 *C661
PARALLEL WIRE
NC
AP1
(6)
UTX
URX
JTAG_TDO
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG_RTCK
R502
33
GND
UTX
URX
TDO
TCK
TMS
TDI
RTCK
NC: No Components
62
*R604
(6)
(5)
(4)
(3)
(2)
(1)
C508 10p
SPP
SPN
EEP_SCL 67 44
NC GPIO[0]/SCL_IIC TXn
EEP_SDA 68 43
GPIO[1]/SDA_IIC TRSW_n C478 10p
EEP_WP 69 42
GPIO[2] ANT
70 41 C514 0.1u
GPIO[3] VCC_FE C477 10p
MSG_LED 71 40 C513 K2.2u
X501
GPIO[4] VDD_IF
13.824M
4
3
2
1
R509 NC
ANS_LED 72 39 C512 0.1u *D473 NC
GPIO[5] VCC_IF A K
SPI_DI 73 38 C511 10u
SO
*CE
GPIO[6] VDD_APU
VSS
*WP
SPI_DO C519 74 37 C510 K1u *D472 NC
GPIO[7] VBAT_APU C509 12p A K
*C601
SPI_CLK 0.1u 75 36 C530 10p
GPIO[8] XIN
NC
76 35
VDDIO1 XOUT C479 10p
*IC601
SPI_CS C473 NC
NC
77 34
GPIO[9] DCINS
SI
SCK
*HOLD
VDD
*R607 FLASH_RST 78 33
5
6
7
8
GPIO[10] PWM0 C475 NC C476 10p
KEYIN1 79 32 C522 10p
GND
NC GPIO[11] PWM1
*IC501
C
KEYIN2 80 31 *L476 NC
GPIO[12] SPOUTP
KEYIN3 81 30 C507 K2.2u
+3.0V
GPIO[13] VCCPA
82 29 C472 NC L474 NC
B
*R601 GPIO[14] SPOUTN
NC
NC
83 28
R602
GPIO[15] LOUT
Q601
NC 84
GPIO[16] HSSPOUTP 27 C185
85 26
C520 GPIO[17] MPWR
86 25 NC
VDDIO2 HSMIP
NC
87 24
R603
0.1u GPIO[18] HSMIN
FLASH_RST 88 23
GPIO[19] MIP C176 10u
C120
C178 0.022u
1000p
SPI_CLK
SPI_DO 89
R171 R175 R176
E
C
SPI_DI C124 NC
GPIO[20]
GPIO[21]
GPIO[22]
GPIO[23]
GPIO[24]
GPIO[25]
GPIO[26]
VDDC2
COREOUT
VBAT
DOUBCAPN1
DOUBCAPN
DOUBCAPP
DOUBCAPP1
DOUBOUT
DCIN0/LIN0
DCIN1
DCIN2
DCIN3/LIN1
VREF
VCCA
MIN
SPI_CS
+3.0V
22 560 100
10
11
12
13
14
15
16
17
18
19
20
21
22
C123 10p
1
2
3
4
5
6
7
8
9
B
C174
R172
C175
C164 NC
VREF
C504
C521
NC
Q171
VCCA
3.0V
VCCA C161 10u
4
3
2
1
R177
100k
VDDC
1u
1u
A2
A1
A0
C524 NC
R501 NC
10u
VDDC
GND
1u
10
10u
C502
C126
+3.0V
C611
C506
C505
910
R505 2.2k
C173
R160
1000p K0.22u
C503 C186 C171

10p C167 1000p
IC611
R506 NC +3.0V
10u
0.1u
0.1u
10p 0.022u
C501
C125
3
4
R165 27k
SDA
SCL
WP
VCC
64K EEPROM
C523 NC
0
5
6
7
8
R503 NC
R181
R166 NC
1.2V
NC C181
C172 NC R178 1k
Rx
C168 NC
2
1
R122
R121
+3.0V
C151 10p
+3.0V
2.7k
NC
R164
R612 C133 NC
C165 NC
VBG
R606
R605
R167 27 R163
68
2
E
C
1
10k C525 NC D153 NC
RA504
A K
12
1k
VDDC
100n
L501
3.3k
3.3k
B
RA151
D133
Q161
4
3
EEP_SCL A K
NC
R136
EEP_SDA
100k
R161
C184
K1.0u
C163 NC
EEP_WP
R162
URX
UTX
KEYS_C
KEYS_D
KEYS_E
BELL
HOOK
PDN_DET
390k C122 680p
390k C121 680p
47k
Tx
100k
R151
R152 470k
BELL
63
HOOK
C332
C342 0.1u
R114 C152 0.01u
PDN_DET
E
C
NC
Caller ID
0
C341 330u
+3.0V
47k
3.0V
R334
R335
B
C142 K0.01u
Q111
C343 10p
+3.0V
47k D113
A K
R321 R322 D143 25V
C113
F140 F100 D142 NC
NC
4
R145 2.2k A K
VSS
K0.68u
*IC331
C111
VBAT VBAT
NC
NC 3
1 VOUT VIN 2
R113
Q143
0.047u R111 100k

R144 NC
4
R333 10k
*R332
B
NC NC C112 R112 100k C

R142
Q142
1
VOUT2
2 VOUT1
ADJ
C331 0.047u
IC302
E
C
*R331
INPUT
B
Q141
2.7k
Bell
E
3
VBAT +6.5V
NC NC
C322 10p
R141
D331
GND
100k
C321 1u
NC R133 330k R131 10M
C132
C307 R307
DCDC_OUT
K0.01u
NC NC
4
3
R305 R304
NC NC
NC
NC
C305 NC
R115
C115
D101
*D363 *D361 R372 R371

A K A K
1
2
C102 680p
C101 680p
C304 NC 5.6 5.6

NC NC
GND
*C306
NC
12
11
L301
+6.5V +6.5V
NC
1 2
10
NC
NC
DC/DC CONVERTOR
L372
L362
*L371
*L361
220nH
220nH
C301
33u
33u
9
JJ301
L102
L101
Q301
SA103
3 4
8
1 2
8XX : RF
NC
5
3
2
1
7
5XX : BBIC
ZA1 NC
REFERENCE
NC
NC
4XX : MIC, SP
7XX : FOR DK
SA101
6
1XX : TEL LINE
VSS
NC
1 2
NC
VIN
EXT
IC301
DCDC_IC
*C352 *C351
VOUT 4
ON/*OFF 5
270V
R302
F301
3.0A
GAP
0.1u 1u
3XX : POWER, CHARGE
NC
P101 22
C303 R301 NC
L1T
L1R
NC
DCP
CHG-2
DCM
6XX : FLASH, EEPROM, KEY, LCD
C308 NC
CHG+2
CHARGE-
CHARGE+
(GREEN)
C302 10p
(YELLOW)
NC: No Components
+6.5V
KX-TG4011/4012/4013LA SCHEMATIC DIAGRAM (Base Unit_Main)

14.3. Schematic Diagram (Handset_Main)

Charge Current BATTERY
F1
BATT+
5.6n
C340 C341 C342
NC
C1CP1
C3
+1.8V R406 NC J39p NC
6.3V
C150
NC R407 GND GND GND
NC
BATTERY 330u (MAX500mA)
NC BATTERY +1.8V
GND GND
R401
NC
1.8V 1.8V
BATT- D400 R400 R330 Q11

Q400 1M
NC D1 Q2
NC NC
R402
NC
C400 C331 Q12
R45 C35 NC 1u
0.1 J56p C2CP2 C10
GND GND GND GND R331 6.3V K2.2u
27k C332 330u
Q401 R332 1u GND
R403 NC GND 27k GND
NC
LDO_CTRL
R404 GND GND
GND SOCn NC
SOCp
GND CKM
CHARGE_CTRL
R20
R7 CHARGE
LCD_CD
LCD_SCL
LCD_SDA
KEY_LED
ROW1
ROW2
ROW3
ROW0
COL5
10
3.0V 4.0V
C39 NC
CP+3.0V CP+4.0V
1.2k
R2 NC
CP3.0V CP4.0V
Q4 D7 GND
CHG(+)
(1)
C5 K1u
CHARGE (2)
C147
1.5k
R30
NC
Terminal R4 R6 R31 POWER

NC NC 100 C53 K10u (3)
C51
k0.1u
C40
K1u C38
8
7
6
5
CHG(-) +1.8V C52 K10u
RA1
GND
1k
NC
C54 D10p
1
2
3
4
R3 GND
Q9 C55
D10p GND S1
1k
47
41
1 2
44
60
59
58
57
56
55
54
53
52
51
50
49
48
46
42
45
43
C121 GND
100
R8
R405 NC
P0_0/UTX
P0_1/URX
P0_2/SDA2
P0_3/SCL2
P0_4/SPI_EN
P0_5/SPI_CLK
P0_6/SPI_DO
P0_7/SPI_DI
P2_6/WTF_IN
P1_1/INT1/LE
P1_2/INT2/SK
P1_3/INT3/SIO
P1_4/INT4/TDOD
P1_5/INT5/RDI/VDDE
P2_7/BXTAL
VDD1
PON/P1_6
CP_VOUT2/LED2
CP_VOUT1/LED1
CP_C2y
NC
C49
1u
GND GND
GND GND
C44
K0.1u 61 40
+1.8V RSTn VBAT2
R225 62 39
JTAG CP_C1y
LCD_CSB 0 63 38
C50
1u
P2_5/PCM_FSC/SF CP_C2x
64 37
STM P2_4/SCL1/PCM_DO/DP3 CP_C1x
65 36
Power_adj
R64
R66
P2_3/SDA1/PCM_DI/DP2 VBAT1
10k
*IC1
1k
LCD_RESET 66 35
BAT
2 3 UTX 67
P2_2/PCM_CLK/CLK100 PAOUTn/P3_0
34
(4)
UTX
URX BELL_LED_A 68
P2_1/ECZ2/PWM1/LED4 VDDPA
33 (5)
URX
1 4 C45 69
P2_0/ECZ1/PWM0/LED3 PAOUTp/P3_1
32 CHARGE (6)
GND RA61 VDD2 P1_7/CHARGE
K0.1u 70 31 CHARGE_CTRL
220 C46 71 LDORF_CTRL CHARGE_CTRL
GND 30 L46 SOCn
RF_SUPPLY2 SOCn
GND 72 29 L47 SOCp
R63 10p RFP0n SOCp
JTAG 73 28
JTAG PON RFP4 NTC/ADC2
100 74 27
PSEL RFP3 ADC1/INT0/P1_0
75 26 COL0
VDD_PADRV VDD_PADR ADC0/P3_3
76 25 COL1
TX _RF 77
VSS_PADR1 PARADET/P3_4
24 COL2
TXp RF_TXp RINGOUT/RINGING/P3_5
78 23 COL3
TXn RF_TXn RINGn/P3_6 GND
COL0 79 22 COL4
VSS_PADR2 RINGp/P3_7
80 21
SHARP
RF_SUPPLY1
TXON RFP2 CIDINp/VREFp
2
CIDOUT/MICn
CIDINn/MICp
BATTERY
LDO_CTRL
AVD_XTAL
VSS_LNA1
VSS_LNA2
AVS_XTAL
3
REF_RES
R23
1k
1
RF_RXp
RF_RXn
VREFm
XTAL2
XTAL1
RFP1
RFP0
LSRn
LSRp
To PA
MICh
COL1
AVD
81
C182
3p
2
1
2
3
4
5
6
7
8
9
10
C47 1u 11
12
13
C48 NC 14
15
16
17
18
19
20
2
K10u
C12
1
10p
GND R203 C17
COL2 RF_RXp F56k D10p
C43
RF_RXn
2
RXON
AST
C18 VREFm
1
D10p
1
RX _RF
D10p
D10p
COL3 RA4
C96
C97
TO RF BLOCK
3.3k
DOWN
VREFm
2
(7)
UP
SP
GND *X1
(8)
1
3 1
250mVp-p
C11
K0.1u
COL4 2
C13
K0.1u
10.368M R215
SOFT_C
SOFT_A
SOFT_B
GND 0
2
TALK
0.75V R27 820

1
COL5 0V
R28 820 (9)
(10)
ROW0 RIGHT
2
1
LEFT
LDO_CTRL
1
2
ROW3
ROW2
ROW1
(11)
(12)
[EX /FX] [RU]
(13)
(14)
BELL_LED_A
KEY_LED
CP+3.0V CP+4.0V
BATTERY (15)
3
*R248 *R249
0 NC
NC
NC
KEY B/L LCD B/L

4
*C139
BELL LED RF-SHIELD

NC
RE2
2
(Amber)
5
*LED8
*LED7
*LED9
*LED4
*LED6
*C138
*LED5
NC *LED1
*LED2
*LED3
1
NC
*LED12 GND
6
*LED21
*LED22
*LED23
GND
GND
1
2
4
3
2
1
*RA31
5
6
7
8
*RA30 *RA32
330 330 120
5
6
7
8
4
3
2
1
4
3
Q7
GND
NC: No Components
64
W 0.15mm R807
L 20+/-2mm RXON
220
C822
3rd layer
10p
L801 C827
TP_ANT1
27n 10p GND
*C826
RX_RF
2 4p
GND C803 RF_RXn
C837
NC
3
C820
NC
1.5p 1
DA801
C804
C802
BATTERY
2p
2p
GND RF_RXp
R37
C30 NC
NC GND GND GND GND W 0.125mm
GND
L 7.6mm
R36 Gap 0.125mm
NC CP+3.0V W 0.15mm BPF W 0.15mm
L 5.0mm 1st layer
L 5.0mm
1st layer 1st layer
GND RA40 C172
10k K0.1u
Q10
NC
8
7
6
5
8 1
VCC A0
7
1
2
3
4
2
(1) 6
WP A1
3 BATTERY
(2) SCL A2
5 4 R801:220k
(3)
*R801 1.2k
SDA GND
R808 NC
C880 NC
R880 NC
R808:NC
C860
C861
*IC3
10p
3p
Q880
GND W 0.15mm NC
L 20+/-1mm
C808
100n
3rd layer Power_adj
GNDGNDGND
C881
C811
10p
NC
11
C809
10p
GND GND GND GND
GND 10 1
VCC PSET
9 2
PO GND VCCS TXn
BATTERY 8 3
*R802
GND POX PI
C810
C805
L803
L802
3.6n
3.6n
1.6p
3.3p
7 4 *C834
100
C812
6
PSEL
PAON
PIX
PRAMP
5 1p TX_RF
GND GND TXp
C814
10p
IC801
3.3n
C813
1.6p
W 0.15mm
(4) L 3.0mm x2
(5) 1st layer R805 47 VDD_PADRV
(6) RA800
C806
GND
3.3p
C188 Balun 1k
C863 NC
C819
10p
K1u PSEL
2 3
W 0.15mm GND PON
GND 1 4
L 20+/-2mm
3rd layer GND
Pre-matching
R806 GND
TXON
C864
NC
220
C825
10p
GND
GND Sp-phone RX/Beep 1
+
2 SP-PHONE_SPEAKER
-
C73 NC
C72 NC
D14
D13
GND GND
GND GND
LSRp LSRp
(7)
(8) LSRn
RX-AF (Handset)
(9)
(10) C152
CP+3.0V k1000p
*C187
*R50
10k
*C186 RCV+
*R236
*R51
*R52
*R53
*R54
3.3k
470
10k
NC
LSRp
1k
GND NC NC 1
+
LCD_SDA
(11) LCD_SCL
GND RECEIVER
(12) LCD_CD 2 -
NC
(13) LSRn
*C206*C203
C71NC
LCD_RESET R55
*C175
*R578
1
(14) RCV-
NC
LCD_CSB 1k
NC
C70
(15)
*R232 820k
D22
D21
430k*R231
*C201
NC
*R233
1
100p
100p
J33p
*C200 1
10p
TX _AF
NC
NC GND GND GND

MIC+ GND C113 D10p
MICp R73
*C104
*C107
*C106
*C103
*C105
*C204 82 1
MIC AP1
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
0.1 R74
*C580
NC
GND 2
GND GND GND GND GND MICn 82
MIC-
11
10
12
13
14
15
16
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
6
7
8
9
D4 D3 C74
NC C75
NC D10p D10p
GND
RS
/CS
SCL
VDD
V0
VR
VOUT
CAP2-
CAP2+
CAP1-
CAP1+
VSS
/RES
GND
GND
OPT_PWR
LCD_CSB
RESETB
A0
SCLK
SID
VDD
VDDA
VSS
V0
GND
SI
GND VREFm
GND
GND VREFm
to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250) to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)
KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)
65
14.4. Schematic Diagram (Charger Unit)
TP3
1
F1 R1 12 TP2
2
J1
TP4
TP1
SCHEMATIC DIAGRAM (Charger Unit)
66
15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)
CL2
ANT2
YLW
D363
L362
L1T
RED
CHG+2
L1R
L372
C352
D142
GRN
CHG-2
C115
R112
D143
R115
L361
} GND R162 C142
BLK
CHARGE+
C112
C121
R161 R164
C163 C165
D361
C122
Q161
C168
C351
L371
GND
for JIG UTX

R122 R167
PbF
R165
UTX
R121
C126
C125
URX R163 C184 C167
C171
R166
CHARGE-
URX
R181
C181
CHG
C186
VCCA
C514
C510
C511
C475 C512
VREF
C473 C513
R178
C661
C530
C472
VBG
C120
L476
C124 C123
L474
C525
C152
R151
R152
C151
R136
C133 C479
RA151
RED
C601
D473
C478
D153
8
1
SPP
RSTN
C521 R507
C476
D133
PNLB1712Z
IC601
R604 STM/CKM
SP
D472
C524 C332 R512
VDDC
STM/CKM/P15
R505
SPN
RA504
FCT
R503
VDDC
C477
4
5
R602
R603
R601
RED WHT
R335
R506
R502
R607 RA502
RTCK
E
Q601
C611 F301
DCP
R334
RTCK
C301
+3.0V
3.0A
R612
DC
+3.0V
IC611
R304
DCDC_OUT
R305
C321
DCM
R301
C322
C307
R307
BLK
R302
3
R321 C343
R606
R605
ANT1
IC302
VBAT
+6.5V
R322
4
CL1
B
VBAT
TMS
TCK
TDI
TDO
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Component View))
67
BLK RED WHT RED GRN YLW
PbF
DC SP TEL
C894
15.1.2. Bottom View
PNLB1712Z
DA802
KX-TG65XX/75XX/40XX
ANT1
C859
C896
C822
C893
C892 C895 C132 C101

R131
C306
JJ301 DA801
R133
R807
C827 C825
R892
R145 ANT2
C302 C826 C891
C811
D101
SA103
C517
C308 C863 3
C303
C515
81
Q142
C812 L809
IC301
R144
C
C820 C102
Q301
R806
R891
C518
0
C516
RA501
81
C805
C
R142
C806
P101
C508
R141
L301
C305
68
IC501
C519
Q143
R509
X501
C522 Q141
C520 C185 C507
C341
C304
R160
C509
C523 C504
SA101
C501
L101
L102
C506
C505
C342
R333
R501
C173
C172
C502
C164
1
C503
C161
R331 R172
ZA1 R177
C331
C178 C175
R332
E
1 SW1
Q171
R175
R171
R111
D331
Q651
R371
IC331
C174
Q111 HAK_CL1
R113
C111
R652
C176
C113
R176
R651
R372
C651
C652
C653
C654
C655
C656
R114
C659
C658
C660
D113
KEYS_D KEYIN3 KEYIN1 ANS_LED 2APVCC BLK RED

1 10
KX-TG4011/4012/4013 CIRCUIT BOARD (Base Unit_Main (Bottom View))

WBX01 B
KEYS_E KEYS_C KEYIN2 NC MSG_LED CHG
15.2. Circuit Board (Handset_Main)

KX-TGA650XX
KX-TGA651XX
KX-TGA250XX PNLB1734Y
KX-TGA251XX
KX-TGA403XX
PbF
R
VE
TP_ANT1
ED
RCV+
EI
EC
R
R
K
BL
RCV-
TGA650XX
TGA651XX
C175 C152
C186
C70 C71
C187
C580
R578
TGA250XX D21 D22
TGA251XX
TGA403XX
C204
R55
C106
R231C201C200
C104
C107 C105 BLK
C103
R233
SPEAKER
C206
SP-
R232
R54
R53 R50 C203
R236
SP+
C138
C139
RED
D13
D14
C863 C864
C806
L803
C811 C814 C72
C804
C813 C73
IC801
R801
C803
L802
C812
R808
C805
RA800
R802 C880
C810
RA32
C802 R880
C881
DA801
C861 C825 R805

C
C809
C819
Q880
80 R806
8
C827
L801
STM JTAG
C834 R405 R63
R66
C46
C45
C44 R225
C820
C837
C182
C860
R64
1
C826
C822
R807
R203
IC1
RA1
C43
C47
X1
C48 C40
R215
C54
Q2
C52
C17
C10
C49
C50
1.8V RA4 C55 C53

C97
C96
D400 21
Q400 C51
C18 R28
L47
L46
C188
R249
R401
R37 CP4.0V
X_CLK
C13
C11
C400 R23 R36

R402 C39 C30
C12
R248 CP3.0V
R400 R27
(10.368MHZ)
C38
CLK
R403
R406
R407
Q401 R20 RA40

Q10
R404
POWER
C332 8 5
C172
C2
Q12 R332
IC3
R331
Q11 C331 1 4
R330
C342
RA30 RA31
D1
E
Q7
C341
C1
RCV- MIC+
RCV+ MIC-
URX
}
C340
RA61
URX
UTX JIG
C150
UTX
R2
GND
R6
BAT GND
D7
C3
Q4
BAT
R45
R8
C35
R3
BATT+
R31
Q9
BATT-
C121
F1 R7 R4
BATT+ R30 BATT-
C147
C75
C74
R74
R73
CHG(+) CHG(-)
CHG (+) C5 D4
D3
C113
A
CHG (-)
MIC
MIC+ MIC-
KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))
69
15.2.2. Bottom View
LED12
PNLB1734Y
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
PbF KX-TGA251XX
KX-TGA403XX
CN5
12 1
TGA650XX
TGA651XX
CN51
TGA250XX
TGA251XX
R51 TGA403XX
R52
LED1 LED21
LED2 LED22
LED23
LED3
SOFT_A SOFT_B SOFT_C
UP
TALK S1
LEFT RIGHT
LED8 LED6
SP DOWN R
1 2 3
LED7
LED5
4 5 6
7 8 9
LED4
LED9
0 #
A
MIC
KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))
70
15.3. Circuit Board (Charger Unit)

PQUP11532Y
R1 J1
PNLP1029YA
PbF
CIRCUIT BOARD (Charger unit (Component View))
15.3.2. Bottom View
TP4 (GND)
PQUP11532Y
TP4
J1
F1
PbF
1
PNLP1029YA
TP3
TP3
CIRCUIT BOARD (Charger unit (Bottom View))
71
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
1
3
4
2
7(*1)
5
7(*1)
PCB1
9 A
Ref.No. Figure
A
Ǿ2.68 mm
Note:
(*1) The SPACERs (No.7) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)
(P.73).
72
16.2. Cabinet and Electrical Parts (Handset)

111
E106
107 E105
104 E103
E101(*1)
E107
106
105
103
102
E102
108 E104 B
113
112
MIC100
109 110 PCB100

101
118 120
116 (*2) 119 (*3)

115
114
117 B
Battery cover
Ref.No. Figure
Spacer (No.119)
B
Stick it between
Ǿ28 mm ribs.
Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.44).
(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 119) to the exact location described above.
73
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
PCB200
200-3
200-2
B
200-4
Ref.No. Figure
B
2 8 mm
74
16.4. Accessories
A1 A2
75
16.5. Replacement Parts List 16.5.1.2. Main P.C. Board Parts

1. RTL (Retention Time Limited) Note:
(*1) When replacing IC611 or X501, make the adjustment
Note:
The “RTL” marking indicates that its Retention Time is using PNZZTG4011LA Refer to How to download the data
Limited. (P.51) of Things to Do after Replacing IC or X'tal.
When production is discontinued, this item will
continue to be available only for a specific period of Safety Ref. Part No. Part Name & Description Remarks
No.
time.
PCB1 PNWP14011LAH MAIN P.C.BOARD ASS'Y
This period of time depends on the type of item, and (RTL)
the local laws governing parts and product retention. (ICs)
At the end of this period, the item will no longer be IC302 C0CBAYG00016 IC S
IC501 C2HBCY000064 IC(BBIC)
available.
IC611 PNWI14011LAH IC(EEPROM)(*1)
2. Important safety notice (TRANSISTORS)
Components identified by the mark indicates special Q111 2SC6054JSL TRANSISTOR(SI)
characteristics important for safety. When replacing any Q141 B1ACGP000008 TRANSISTOR(SI)
Q142 PQVTBF822T7 TRANSISTOR(SI)
of these components, only use specified manufacture's
Q161 2SD0874AS TRANSISTOR(SI)
parts. Q171 2SC6054JSL TRANSISTOR(SI)
3. The S mark means the part is one of some identical parts. (DIODES)
For that reason, it may be different from the installed part. D101 PQVDMD5S DIODE(SI)
4. ISO code (Example: ABS-94HB) of the remarks column D113 MA111 DIODE(SI) S
D133 MA111 DIODE(SI) S
shows quality of the material and a flame resisting grade
D143 MANV250GEL DIODE(SI)
about plastics. DA801 B0DDCD000001 DIODE(SI)
5. RESISTORS & CAPACITORS DA802 B0DDCD000001 DIODE(SI)
Unless otherwise specified; (COILS)
L101 PQLQXF330K COIL S
All resistors are in ohms (Ω) k=1000Ω, M=1000kΩ
L102 PQLQXF330K COIL S
All capacitors are in MICRO FARADS (µF) p=µµF L361 G1CR22J00006 COIL
*Type & Wattage of Resistor L371 G1CR22J00006 COIL
L501 G1CR10J00010 COIL
L809 G1C7N5JA0044 COIL
(RESISTOR ARRAYS)
RA151 D1H410220001 RESISTOR ARRAY
RA501 EXB28V330 RESISTOR ARRAY
RA502 EXB28V103 RESISTOR ARRAY
RA504 D1H468020001 RESISTOR ARRAY
(VARISTOR)
SA101 J0LF00000048 VARISTOR (SURGE
ABSORBER)
(RESISTORS)
R111 PQ4R10XJ104 100k S
R112 PQ4R10XJ104 100k S
R113 ERJ3GEYJ103 10k
R131 PQ4R18XJ106 10M S
R142 PQ4R18XJ272 2.7k S
R145 ERJ2GEJ222 2.2k
R151 ERJ2GEJ104 100k
16.5.1. Base Unit R152 ERJ2GEJ474X 470k
R160 ERJ3GEYJ911 910
16.5.1.1. Cabinet and Electrical Parts R161 ERJ3GEYJ104 100k
R163 ERJ12YJ120 12
Safety Ref. Part No. Part Name & Description Remarks R164 ERJ3GEYJ272 2.7k
No. R165 ERJ3GEYJ273 27k
1 PNKM1129U3 CABINET BODY PS-HB R167 ERJ12YJ270 27
2 PNBC1303Z2 BUTTON, LOCATOR ABS-HB R171 ERJ2GEJ220 22
3 K2ECYZ000001 JACK, DC R172 ERJ2GEJ104 100k
4 PQJJ1T039S JACK, MODULAR R175 ERJ2GEJ561 560
5 PNJT1046Z CHARGE TERMINAL R176 ERJ2GEJ101 100
6 PNLA1030Z ANTENNA R178 ERJ2GEJ102 1k
7 PNYE1027Z SPACER, ANTENNA R181 ERJ2GE0R00 0
8 PNKF1097Z1 CABINET COVER PS-HB R321 ERJ2RKF1400 140
9 PQHA10023Z RUBBER PARTS,FOOT CUSH- R322 ERJ2RKF1000 100
ION
R334 ERJ2GEJ473 47k
R335 ERJ2GE0R00 0
R371 ERJ1TYJ5R6U 5.6
76
Safety Ref. Part No. Part Name & Description Remarks Safety Ref. Part No. Part Name & Description Remarks
No. No.
R372 ERJ1TYJ5R6U 5.6 C806 F1G1H2R7A480 2.7p
R501 ERJ3GEYJ100 10 C810 F1G1H2R4A480 2.4p
R502 ERJ2GEJ330 33 C811 F1G1H100A723 10p
R505 ERJ2GEJ222 2.2k C812 F1G1HR90A480 0.9p
R507 ERJ2GEJ102 1k C813 F1G1H2R0A480 2p
R605 ERJ2GEJ332 3.3k C820 F1G1H1R5A480 1.5p
R606 ERJ2GEJ332 3.3k C822 F1G1H100A723 10p
R612 ERJ2GEJ103 10k C825 F1G1H100A723 10p
R806 ERJ2GEJ471 470 C826 F1G1H100A723 10p
R807 ERJ2GEJ471 470 C827 F1G1H100A723 10p
R891 ERJ2GEJ471 470 C859 F1G1H2R2A480 2.2p
R892 ERJ2GEJ471 470 C863 F1G1H1R5A480 1.5p
(CAPACITORS) C891 F1G1H5R0A480 5p
C101 F1K2H681A008 680p C892 F1G1H5R0A480 5p
C102 F1K2H681A008 680p C893 F1G1H3R0A480 3p
C111 F1J2A473A024 0.047 C894 F1G1H2R2A480 2.2p
C112 F1J2A473A024 0.047 C895 F1G1H1R2A480 1.2p
C113 PQCUV1A684KB 0.68 C896 F1G1H2R2A480 2.2p
C120 ECUE1H102KBQ 0.001 (OTHERS)
C121 F1K2H681A008 680p P101 D4DAY220A022 THERMISTOR (POSISTOR)
C122 F1K2H681A008 680p SW1 K0H1BA000259 SPECIAL SWITCH
C123 ECUE1H100DCQ 10p F301 K5H302Y00003 FUSE
C126 ECUE1H100DCQ 10p X501 H0J138500011 CRYSTAL OSCILLATOR (*1)
C132 ECUV1H103KBV 0.01
C142 ECUV1H103KBV 0.01 16.5.2. Handset
C151 ECUE1H100DCQ 10p
C152 ECUE1C103KBQ 0.01 16.5.2.1. Cabinet and Electrical Parts
C161 F2G1H1000009 10
C167 ECUV1H102KBV 0.001
C171 ECUV1C223KBV 0.022 Safety Ref. Part No. Part Name & Description Remarks
No.
C173 ECUV1A224KBV 0.22
101 PNGP1087Y5 PANEL, LCD PMMA-HB
C175 ECUE1H102KBQ 0.001
102 PNYE1026Z TAPE, DOUBLESIDED
C176 PQCUV0J106KB 10
103 PNKM1123Y6 CABINET BODY PS-HB
C178 ECUE1C223KBQ 0.022
104 PNHS1072Z SPACER, RECEIVER NET
C184 ECUV1A105KBV 1
105 PQHS10467Z COVER, SPEAKER NET
106 L0AD02A00043 RECEIVER
107 PQHG10729Z RUBBER PARTS, RECEIVER
C321 ECUV1A105KBV 1
108 PNYE1027Z SPACER, CUSHION LCD
109 PNBC1003Y3 BUTTON, VOLUME KEY ABS-HB
C341 F2A1A3310040 330
110 PNJK1071V KEYBOARD SWITCH
C342 ECUV1C104KBV 0.1
111 PNHX1165Z COVER, LCD SHEET
112 PNJT1027Z CHARGE TERMINAL (L)
C351 ECUV1C105KBV 1
113 PNJT1026Z CHARGE TERMINAL (R)
C352 ECUV1C104KBV 0.1
114 PQHR11315Z GUIDE, SPEAKER ABS-HB
115 L0AA02A00095 SPEAKER
116 PQHS10784Y SPACER, SPEAKER NET
117 PQJC10056W BATTERY TERMINAL
118 PNKF1093Z1 CABINET COVER ABS-HB
C501 ECUE1A104KBQ 0.1
119 PNHS1079Z SPACER, BATTERY
C502 ECJ1VB0G106M 10
120 PNKK1038Y1 LID, BATTERY ABS-HB
C503 ECJ1VB0G106M 10
C504 ECUE0J105KBQ 1
C505 ECJ1VB0G106M 10 16.5.2.2. Main P.C. Board Parts
C506 ECUV1A105KBV 1 Note:
C507 ECUV1A225KB 2.2 (*1) Reconfirm the model No. written on the handset's name
C508 ECUE1H100DCQ 10p plate when replacing PCB100. Because the model No. of
C509 ECUE1H120JCQ 12p
the optional handset may differ from the included handset.
C510 ECUV1A105KBV 1
C511 ECJ1VB0G106M 10 (*2) When replacing IC3 or X1, make the adjustment
C512 ECUE1A104KBQ 0.1 using PNZZTG4011LA. Refer to Handset (P.52) of Things
C513 ECUV1A225KB 2.2 to Do after Replacing IC or X'tal.
(*3) When replacing the handset LCD, See How to
C515 ECUV1A105KBV 1
Replace the Handset LCD (P.44).
C517 ECUE1A104KBQ 0.1 (*4) When removing E106, use special tools (ex. Hot air
C518 ECUE1A104KBQ 0.1 disordering tool).
C521 ECUE0J105KBQ 1 Safety Ref. Part No. Part Name & Description Remarks
C522 ECUE1H100DCQ 10p No.
C530 ECUE1H100DCQ 10p PCB100 PNWPGA403LAR MAIN P.C.BOARD ASS'Y
(RTL) (*1)
(ICs)
C805 F1G1H2R7A480 2.7p
IC1 C1CB00003361 IC (BBIC (FLASH))
77
No. No.
IC3 PNWIGA403LAR IC (EEPROM) (*2) R331 ERJ2GEJ273X 27k S
IC801 C1CB00001842 IC R332 ERJ2GEJ273X 27k S
(TRANSISTORS) R801 ERJ2GEJ122 1.2k S
Q2 B1ADGE000004 TRANSISTOR(SI) R802 ERJ2GEJ101 100 S
Q4 B1ADGE000004 TRANSISTOR(SI) R805 ERJ2GEJ470 47 S
Q7 UN9219J TRANSISTOR(SI) S R806 ERJ2GEJ221 220 S
Q9 2SC6054JSL TRANSISTOR(SI) R807 ERJ2GEJ221 220 S
Q11 B1ADCF000161 TRANSISTOR(SI) (CAPACITORS)
Q12 B1ADCF000161 TRANSISTOR(SI) C1 F2A0J3310067 330
(DIODES) C2 F2A0J3310067 330
D1 MA2YD2120L DIODE(SI) C5 ECUV1A105KBV 1
D7 MA2ZD0200L DIODE(SI) C10 ECUV1A225KB 2.2
D13 MA8043M DIODE(SI) S C11 ECUE1A104KBQ 0.1
D14 MA8043M DIODE(SI) S C12 PQCUV0J106KB 10
D21 MA8043M DIODE(SI) S C13 ECUE1A104KBQ 0.1
D22 MA8043M DIODE(SI) S C17 ECUE1H100DCQ 10p
DA801 B0DDCD000001 DIODE(SI) C18 ECUE1H100DCQ 10p
(LEDS) C35 ECUE1H560JCQ 56p
LED4 B3ACB0000190 LED C40 ECUE1A104KBQ 0.1
LED5 B3ACB0000190 LED C43 ECUE1H100DCQ 10p
LED8 B3ACB0000190 LED C46 ECUE1H100DCQ 10p
LED9 B3ACB0000190 LED C47 ECUV1A105KBV 1
(COILS) C52 PQCUV0J106KB 10
F1 PQLQR2M5N6K COIL S C53 PQCUV0J106KB 10
L801 G1C27NJ00010 COIL C54 ECUE1H100DCQ 10p
L802 G1C3N6ZA0063 COIL C55 ECUE1H100DCQ 10p
L803 G1C3N6ZA0063 COIL C74 ECUE1H100DCQ 10p
(RESISTOR ARRAYS) C75 ECUE1H100DCQ 10p
RA1 D1H810240004 RESISTOR ARRAY S C96 ECUE1H100DCQ 10p
RA4 D1H433220001 RESISTOR ARRAY C97 ECUE1H100DCQ 10p
RA30 D1H83314A013 RESISTOR ARRAY S C103 ECUE1H101JCQ 100p
RA31 D1H433120001 RESISTOR ARRAY C104 F1G1H100A723 10p
RA32 EXB28V121JX RESISTOR ARRAY C105 ECUE1H101JCQ 100p
RA40 EXB28V103 RESISTOR ARRAY C107 ECUE1H330JCQ 33p S
RA61 D1H422120001 RESISTOR ARRAY C113 ECUE1H100DCQ 10p
RA800 D1H410220001 RESISTOR ARRAY C152 ECUE1H102KBQ 0.001
(IC FILTERS) C172 ECUE1A104KBQ 0.1
L46 J0JDC0000045 IC FILTER C182 F1G1H3R0A480 3p
L47 J0JDC0000045 IC FILTER C188 ECUE0J105KBQ 1
(RESISTORS) C200 ECUV1C105KBV 1
R3 ERJ2GEJ102 1k S C201 ECUV1C105KBV 1
R7 ERJ2GEJ122 1.2k S C203 ECUV1C105KBV 1
R8 ERJ2GEJ101 100 S C204 ECUV1C104KBV 0.1
R20 ERJ2GEJ100 10 S C331 ECUE0J105KBQ 1
R23 ERJ2GEJ102 1k S C332 ECUE0J105KBQ 1
R27 ERJ2GEJ821 820 S C341 ECUE1H390JCQ 39p
R28 ERJ2GEJ821 820 S C802 F1G1H2R0A480 2.0p
R30 ERJ3GEYJ152 1.5k S C803 F1G1H1R5A480 1.5p
R45 ERJ6RSJR10V 0.1 C805 F1G1H3R3A480 3.3p
R50 ERJ2GEJ103 10k S C806 F1G1H3R3A480 3.3p
R51 ERJ2GEJ471 470 S C808 ECUE1A104KBQ 0.1
R52 ERJ2GEJ102 1k S C809 F1G1H100A723 10p
R53 ERJ2GEJ332 3.3k S C810 F1G1H1R6A480 1.6p
R64 ERJ2GEJ103 10k S C814 ECUE1H332KBQ 0.0033
R73 ERJ2GEJ820 82 S C822 F1G1H100A723 10p
R74 ERJ2GEJ820 82 S C825 F1G1H100A723 10p
R203 D0GA563ZA006 56k C826 F1G1H4R0A480 4p
R215 ERJ2GE0R00 0 S C827 F1G1H100A723 10p
R225 ERJ2GE0R00 0 S C834 F1G1H1R0A480 1p
R232 ERJ2GEJ434X 430k S C861 F1G1H3R0A480 3p
R248 ERJ2GE0R00 0 S (OTHERS)
R330 ERJ2GEJ105X 1M S MIC100 L0CBAY000032 MICROPHONE
78
No. No.
E101 L5DYBYY00012 LIQUID CRYSTAL DISPLAY PQZZ430PIR TIP OF SOLDERING IRON
(*3) (*2)
E102 PNHR1247Z TRANSPARENT PLATE, LCD PMMA-HB PQZZ430PRB RUBBER OF SOLDERING IRON
E103 PNHR1246Z GUIDE, LCD ABS-HB (*2)
E104 PNHX1254Z COVER, LCD
E105 PNLA1020Z ANTENNA
E106 PNMC1013Z CASE,MAGNETIC SHIELD
(*4)
E107 PNVE1002Z BATTERY TERMINAL
X1 H0J103500033 CRYSTAL OSCILLATOR (*2)
16.5.3. Charger Unit

16.5.3.1. Cabinet and Electrical Parts
Safety Ref. Part No. Part Name & Description Remarks

No.
200 PNLC1010ZT CHARGER UNIT ASS'Y
without NAME PLATE
(RTL)(for KX-
TG4012LAT)(for KX-
TG4013LAT)
200-1 PNKM1131Y2 CABINET BODY PS-HB
200-2 PNJT1010Z CHARGE TERMINAL
200-3 PNKF1098Z1 CABINET COVER PS-HB
200-4 PQHA10023Z RUBBER PARTS, FOOT
CUSHION
16.5.3.2. Main P.C. Board Parts

No.
PCB200 PNWPTGA641CH MAIN P.C.BOARD ASS'Y
(RTL)
(JACK)
J1 K2ECYB000001 JACK S
(RESISTOR)
R1 ERG2SJ120 12
(FUSE)
F1 K5H302Y00003 FUSE
16.5.4. Accessories
Note:
You can download and refer to the Operating Instructions
(Instruction book) on TSN Server.

No.
A1 PQLV219Y AC ADAPTOR
A2 PQJA10075Z CORD, TELEPHONE
16.5.5. Screws

No.
A XTB26+8GFJ TAPPING SCREW
B XTB2+8GFJ TAPPING SCREW
16.5.6. Fixtures and Tools

Note:
(*1) See Equipment Required (P.45), and The Setting
Method of JIG (P.45)
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.44)
T.I
KXTG4011LAT
Safety Ref. Part No. Part Name & Description Remarks KXTG4012LAT
No.
PQZZ1CD300E JIG CABLE (*1)
KXTG4013LAT
PNZZTG4011LA BATCH FILE CD-ROM (*1) KXTGA403LAT
79

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© Panasonic System Networks Co., Ltd. 2010

• ICs and LSIs are vulnerable to static electricity.

2.2. About Lead Free Solder (PbF: Pb free)

2.2.1. Suggested PbF Solder

2.3. Discarding of P. C. Board

4.1.1. TDD Frame Format

4.1.2. TDMA system

4.1.3. Signal Flowchart in the Radio Parts

As for a handset RF, RF signal is received in one antenna.

As for a base unit RF, RF signal is received in two antennas.

Q161 R151,R152 R131, R133 D101

ANT1 ANT2 TEL JACK

KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

KX-TG4011/4012/4013 BLOCK DIAGRAM (Base Unit_RF Part)

4.4. Circuit Operation (Base Unit)

4.4.1. BBIC (Base Band IC: IC501)

4.4.2. EEPROM (IC611)

4.4.3. Power Supply Circuit/Reset Circuit

4.4.3.1. Charge Circuit

4.4.4. Telephone Line Interface

4.4.5. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Parallel connection detection when off hook:

4.4.6. Calling Line Identification (Caller ID)

Call Waiting Caller ID

4.5. Block Diagram (Handset)

WP, CLK, DATA

KX-TGA403 BLOCK DIAGRAM (Handset)

4.6. Block Diagram (Handset_RF Part)

KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)

4.7. Circuit Operation (Handset)

4.7.2. Power Supply Circuit/Reset Circuit

4.7.3. Charge Circuit

4.7.4. Battery Low/Power Down Detector

4.8. Circuit Operation (Charger Unit)

4.9. Signal Route

RF part signal route

5 Location of Controls and Components

Frequently Used Items (Base Unit)

Items Address Default Data New Data Remarks

Frequently Used Items (Handset)

10.1.1. Check Power

Cross Reference: Note:

10.1.2. Check Battery Charge

10.1.2.3. Charger Unit

10.1.3. Check Link

10.1.4. Check the RF part

After All the Checkings or Repairing

10.1.4.2. RF Check Flowchart

10.1.4.3. Check Table for RF part

No. Item BU (Base Unit) Check HS (Handset) Check

10.1.4.4. TEST RANGE Check

Item BU (Base Unit) Check HS (Handset) Check

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

BU (to be checked) Regular_HS

HS (to be checked) Regular_BU

10.1.5. Registering a Handset to the Base Unit

10.1.6. Deregistering a Handset

10.1.7. Deregistering All Handsets by the Base Unit

10.1.8. Check Handset Transmission

10.1.9. Check Handset Reception

10.1.10. Check Caller ID

D363 D361 R372 R371