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Abstract—This paper presents the analysis and implementation phase imbalances, LO leakage, LO phase noise, and symbol
of a millimeter-wave (mm-wave) I/Q modulator and determines rate are also included in the subsequent analysis to discuss the
the impact of I- and Q-channel nonlinearity, PA nonlinearity, and relative impact and how these errors are related to the com-
other nonideal circuit implementations on the error vector magni-
tude (EVM). The modulator is fabricated in 120-nm SiGe BiCMOS pression effects. Process variations and modeling limitations at
process and occupies an area of 5 mm . For a 64-QAM constella- high frequency result in systematic errors which significantly
tion at a 42-GHz carrier frequency, the EVM is less than 2.5% at degrade the EVM. Digital calibration is a preferred method to
48-Mbps data rate. The on-chip digital-to-analog conversion res- compensate for these errors instead of incurring high area and
olution is capable of employing digital pre-distortion (DPD) and power penalties to reduce the mismatches [3]. As higher -ary
calibration. An external power amplifier is linearized to improve
the EVM with DPD. To the best of the authors’ knowledge, this is QAM is considered, the overall contribution to EVM of these
the lowest EVM reported at these mm-wave frequencies. nonlinearity effects and circuit mismatches is discussed.
Additionally, digital correction through pre-distortion can
Index Terms—Adjacent channel power ratio, digital pre-distor-
tion (DPD), direct-conversion transmitter, error vector magnitude compensate the transmitter linearity without significant sacri-
(EVM), I/Q modulator, -band, quadrature amplitude modula- fice to overall efficiency. Mm-wave power amplifiers (PA) are
tion (QAM), upconverter. not particularly high-power or efficient relative to amplifiers
at RF bands. Consequently, a mm-wave PA operating at peak
efficiency degrades the EVM through gain compression. Dig-
I. INTRODUCTION ital pre-distortion (DPD) is primarily used for compensating
the PA compression. Pre-distortion has been demonstrated for
L INEAR transmitters are critical to achieving high-ca- GaAs–GaN PAs [4], [5] and in CMOS process at RF bands
pacity communication links. With the advancement of the [6]. Previously implemented I/Q modulators rely on external
fabrication processes through lithographic scaling, transmitter sources for baseband signal generation and have not shown
systems that include digital signal processing, analog baseband the capability to perform digital correction and pre-distortion
circuitry, and RF front-ends can be implemented in low-cost [7]–[11]. The implemented I/Q modulator contains high-reso-
Si/SiGe processes at millimeter-wave (mm-wave) bands. lution and high-speed digital-to-analog converters (DACs) to
High-capacity communication for satellite links suggests using perform digital calibration and pre-distortion in a monolithic
spectrally efficient -ary quadrature amplitude modulation platform.
(QAM). Isolating the impact of various circuit nonidealities on Section II presents a comprehensive analysis of the circuit
error vector magnitude (EVM) is necessary to satisfy the low nonidealities and mismatch contributions to the EVM. The
EVM demands for -QAM modulation. Existing literature on EVM is calculated from the derived equations for various cases.
transmit system analysis does not decompose sources of non- The EVM dependence on the -ary QAM modulation formats
linearity in a transmitter between the baseband, upconverter, is also discussed. Analysis presented in Section II is used to
and RF contributions. Typically, the impact of power amplifier derive the key system specifications in Section III, which is
(PA) amplitude (AM–AM) compression and phase compres- followed by the discussion of the implemented modulator
sion (AM–PM) on the EVM is treated but not distinguished architecture and the design of various building blocks. Mea-
from other sources of circuit compression [1], [2]. In particular, surement setup details and results are included in Section IV.
the separate contribution of the I/Q path compression and PA Digital calibration of the systematic errors is performed, and the
compression has not been previously analyzed. achieved EVM for different -ary QAM schemes is presented.
This paper presents theoretical derivations and discussions EVM enhancement with the aid of DPD of the input signal is
of the EVM contributions due to I/Q path nonlinearity and demonstrated in Section IV-D while an external PA is operated
PA AM–AM and AM–PM compression for various -QAM close to the compression point.
schemes. Other well-known sources of errors like I/Q gain and
II. SYSTEM ANALYSIS
Manuscript received January 03, 2012; revised June 27, 2012; accepted
EVM is the key metric for the transmit systems employing
July 03, 2012. Date of publication August 20, 2012; date of current version
September 27, 2012. -QAM. A low EVM is desired to achieve reliable transmis-
The authors are with the Department of Electrical and Computer Engineering, sion, but various circuit nonidealities, such as amplitude non-
University of California at San Diego, La Jolla, CA 92037 USA.
linearity, in-band noise, LO or carrier phase noise, IQ gain and
Color versions of one or more of the figures in this paper are available online
at http://ieeexplore.ieee.org. phase imbalances, and LO leakage, degrade the EVM. While
Digital Object Identifier 10.1109/TMTT.2012.2209435 prior work has discussed some of these individual contributions
(2)
to EVM, this analysis seeks to describe the impact of nonlin- B. Linearity of the I/Q Signal Path
earity before and after the upconversion and how these sources Assuming that I/Q baseband circuit blocks are differential, a
of nonlinearity interact to impact EVM. weakly nonlinear model includes only third-order nonlinearity.
As shown in Fig. 1, the direct-conversion I/Q modulator is Since the I and Q signal paths are identical, the envelope of the
decomposed into a series of dominant sources of nonideality RF carrier is expressed as
and mismatch that impact EVM. The I/Q signal path is repre-
sented as a third-order polynomial given by , where (3)
and are the first-order (linear) and third-order coefficients,
respectively, and is the input I or Q voltage. Parameters and where and represent the linear and third-order nonlinearity
denote the I/Q gain and phase mismatches in Fig. 1. Since LO of the I/Q channel gain. Therefore, the scaling factor for the
leakage or carrier feed-through appears as the dc offset in the reference constellation is determined from the nonlinear coef-
envelope after down-conversion, it is modeled as an additive ficients
dc voltage in the I/Q path. The multiplicative term repre-
sents the LO phase noise. Finally, denote the PA AM–AM
nonlinearity and denotes the PA AM–PM nonlinearity.
A thorough analysis and discussion on how each of these issues where
affect the EVM is presented in the following sections. (4)
C. I/Q Imbalance
For small gain and phase imbalances, the linear component
of the envelope described in (3) is
Fig. 3. EVM degradation due to IQ and PA AM–AM nonlinearity for the same
and .
(6)
to match the reference constellation to the transmitted envelope
where is the gain error and is the phase imbalance. The EVM
power. This factor is calculated in the same manner as
due to the I/Q imbalance is
(7) where
(10)
For the remainder of this treatment, we will assume that I/Q
imbalance is small and independent of the I/Q nonlinearity.
The EVM contribution due to the I/Q imbalance and the I/Q The EVM resulting from AM–AM compression is similar to (5)
compression is treated as two separate independent sources of and is shown as
error. For large mismatch and high compression, this might not
be completely accurate but is a reasonable assumption for low
EVMs. (11)
To compare the effect of nonlinearity in the transmitter in the
D. PA AM–AM Compression
I/Q circuit blocks and in the PA, the EVM is plotted in Fig. 3 in
PA AM–AM compression is conventionally the dominant terms of the margin between the average power of the signal and
form of nonlinearity in the transmitter. This compression is the 1-dB compression point of the circuit. The 1-dB compres-
distinct from the compression calculated in the Section II-B. sion based on the weakly nonlinear model of the circuit is given
While I/Q channel nonlinearity compresses the I and Q sig- by . At a given margin between
nals independently, PA AM–AM compresses the magnitude the 1-dB compression and average signal power, the EVM is
of the vector sum of the I and Q signals. The difference is higher for the I/Q nonlinearity than for AM–AM compression.
distinguished in Fig. 2, where a fixed amount of nonlinearity is Typically, the I/Q blocks are operated away from compression
described in each example constellation. At the PA input, the to avoid any contribution of the I/Q compression to EVM. How-
magnitude and phase of each symbol is ever, PAs operated close to their compression point operate at
and . For PA compression, the RF and higher overall system power efficiency. Therefore, in practice,
reference envelopes are expressed as the linearity margins are not necessarily the same for PA and I/Q
path.
G. LO Phase Noise
where and are the power series coefficients of the AM–PM If the LO signal has an rms phase noise of radians, the
conversion. Based on this behavior, the EVM is EVM contribution is approximately [1]
(15)
(13)
If the rms phase noise is 1 , the EVM will be 1.74%.
where the factor is determined in (10).
In Fig. 4, EVM due to AM–PM nonlinearity is plotted for H. LO Leakage
and . The corresponding impact on a
64-QAM constellation is shown in the inset where the sym- For direct-conversion modulators, dc offsets present in the I
bols with higher magnitudes are rotated more than the inner and Q channels cause the LO signal to leak to the RF output and
symbols. To characterize the AM–PM response, the maximum contribute LO power to the RF output for direct upconversion
phase deviation over the output power range is consid- transmitters. From [1], the EVM degradation due to LO leakage
ered. When the I and Q paths are normalized to unity, the max- is
imum phase shift is calculated from (12). For example,
. Different values of and (16)
could result in a different maximum phase deviation. The EVM
degradation corresponding to the maximum phase deviation of
the signal path is plotted in Fig. 4. If the carrier power is 20 dB below the average signal power,
the EVM will be 10%. LO leakage is particularly significant
for direct conversion receivers since the LO contributes to a dc
F. Correlation Between AM–AM and AM–PM Compression in offset in the received constellation.
I/Q Upconverter and PA
I. Overall EVM
Since transmission of symbols at peak power levels implies
that high signal levels are seen in both the I/Q channels as The EVM contributions due to each of the discussed sources
well as in the PA, it is reasonable to assume that correlation of circuit nonideality are now tallied. The overall EVM is
exists between the AM–AM behavior in the I/Q signal path
and the AM–AM and AM–PM behavior in the PA. To account
for this correlation, we introduce the factors and
as
(17)
Fig. 5. Contour plots for the EVM codependence between nonlinearity in the I/Q and PA signal paths for 64-QAM. (a) . (b) .
(20)
% (21)
dB
Although a 7-b DAC is sufficient to achieve less than 1% EVM,
a 12-b DAC is implemented to enable precise digital correction
of systematic circuit errors like I/Q gain and phase imbalance,
canceling LO leakage by introducing dc offsets in the trans-
mitter and DPD to compensate PA compression.
To handle DPD, the I/Q channel must support a larger band-
width than the desired signal bandwidth. For example, the DAC
sample rate is typically more than a factor of three larger to com-
pensate the compression related to the third-order nonlinearity.
However, the higher DAC sample rate offers the advantage of
Fig. 7. Block diagram of the implemented IQ modulator.
pushing signal aliases appearing at clock harmonics to higher
frequency.
The DAC is followed by a third-order active filter to reduce
this work, modulator output is targeted to be 0 dBm. From
the signal aliases and spurious harmonic content. For a signal
Table I, this translates to 6 dBm of typical for the mod-
BW of 20 MHz, the filter cutoff frequency is chosen to be
ulator. Therefore, each of the I and Q channels should have
60 MHz to enable DPD. The use of a high DAC sampling rate
3 dBm and 9 dBm.
equal to 200 MHz along with the filter limits the signal aliases
For the I/Q channel, the overall 1-dB compression point is
to below 40 dBc, which is well under our adjacent channel
composed of a composite linearity for the baseband circuit, e.g.,
power ratio (ACPR) specification ( 35 dBc). The filter output
the DAC and filter, and the mixer and is derived with a standard
is fed to an active double-balanced Gilbert cell mixer. A hybrid
analysis for cascaded systems [14]. The voltage compression of
coupler along with the passive RF baluns is used to provide the
each channel is calculated as
differential I and Q LO signals to the mixers. Mixer outputs
are summed in current domain and converted to a single-ended
(18)
output using another RF balun.
where is the mixer conversion gain in V/V. Preliminary 1) D/A Converter: The DAC circuit diagram is shown in
simulations reveal that an equal allocation of dc current between Fig. 8. A standard current-steering architecture is adopted to im-
the baseband and mixer circuits is a good compromise between plement the DAC due to its advantage of high-speed operation
linearity and signal swing. Therefore, from a net power budget [15]. Partial segmentation (6 b) is used to relax the matching
of 100 mW (or 50 mW per I/Q path), 25 mW is assigned to requirements on the current sources and to reduce the data-de-
the mixer. The mixer exhibits 0.316 V/V ( 10 dB) pendent glitches [15], [16]. The DAC current cell is designed
and 280 mV ( 1 dBm) for 25 mW to reduce the mismatch and thereby achieve a high spur-free
of assigned power budget. From (18), the should be dynamic range (SFDR). SFDR is defined as the ratio of the am-
approximately 1.12 V and should be 0.355 V to get plitude of the fundamental tone to the amplitude of the highest
9-dBm output power after upconversion. undesired spur. Since third-order distortion is usually dominant,
The third-order harmonic distortion (HD3) is the ratio of the SFDR becomes equal to the inverse of HD3. DAC SFDR affects
third-harmonic tone and the fundamental tone. For a third-order the harmonic content of the baseband signal and therefore, the
nonlinearity and are directly related as fol- P1dB of the I/Q path. For 12-b resolution, the standard deviation
lows: of the current mismatch for an 0.5 LSB is 0.5% for 70%
yield [17]. Monte Carlo simulations for the thin- and thick-oxide
pMOS devices available in the 120-nm SiGe BiCMOS process
(19)
are performed at the same unit current. Thin-oxide devices are
3278 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 60, NO. 10, OCTOBER 2012
used to implement the current cell due to their low area for
the same mismatch performance and headroom. A current-cell
layout configuration which minimizes linear and second-order
process variations in two dimensions is chosen to mitigate the
impact of process variations on current source matching [16].
Simulations show that the SFDR due to harmonic distortion
of the DAC remains better than 55 dBc up to 20 MHz of the
signal bandwidth. As expected, the DAC SFDR rolls off with
higher signal frequency [18]. A high DAC sampling rate of
200 MHz is used to oversample the input. Oversampling en-
ables pre-distortion and better filtering of the signal copies at
DAC clock harmonics. Typical DAC full-scale current is 2 mA
from a 2.5-V supply and can be scaled to 10 mA to increase
output power. With a 200- differential load resistance, the
full-scale DAC output voltage ranges from 400 mVpp to 2 Vpp
with little impact on harmonic distortion. At the low end of the
full-scale current range, the DAC power consumption is 5.5 mW Fig. 9. Third-order active gm-C filter.
including the digital circuits.
2) Filter Design: High-order filtering is necessary to elimi-
nate sample clock harmonics and signal aliases. On-chip pas- third-order roll off ( 60 dB/decade) and cutoff frequency at
sive filters provide high linearity and no power consumption three times the signal bandwidth (60 MHz). Gm cells used with
but occupy very large area considering the desired signal band- feedback to implement gyrators (or inductor) can be used to im-
width. Therefore, an active gm-C filter is implemented with a plement higher order filters [19]. In Section III, at
GUPTA AND BUCKWALTER: LINEARITY CONSIDERATIONS FOR LOW-EVM, MILLIMETER-WAVE DIRECT-CONVERSION MODULATORS 3279
digital I/O, dc bias voltages and currents, and the -band car-
rier. The mixed-signal nature of the circuit requires a hybrid ap-
proach to measure the chip. All digital signals and bias volt-
ages are wire-bonded to a standard FR-4 PCB. Since the FR-4
substrate becomes excessively lossy for signals above 10 GHz, Fig. 15. SFDR versus output voltage.
the -band LO and modulated RF signals are probed using
ground–signal–ground (GSG) RF probes.
Fig. 13 shows the four-layer PCB board and chip-on-board reduction in the measured cutoff frequency relative to simula-
assembly. Controlled-impedance microstrip lines carry the tion is observed and results from additional parasitic loading of
high-speed digital signals. Digital lines are routed to one side of PCB traces on the filter outputs. The filter roll-off matches the
the PCB while the bias voltages are supplied from the opposite anticipated third-order response.
side for the ease of connections. Low-profile surface-mount Baseband signal quality is measured from the SFDR defined
components are used to ease the use of RF probes. The chip is as the ratio of the fundamental signal power to the power of
epoxied to the PCB and a via-field to the bottom ground plane the highest spur. A high-bandwidth Agilent DSO80604B oscil-
acts as a heat sink. loscope is used with an high-input impedance active probe to
While the design power budget was constrained to 100 mW, monitor the baseband signals. The SFDR is plotted as a func-
the power consumption is 138 mW for the implemented I/Q tion of output voltage in Fig. 15. The output voltage swing is
modulator. This is due to an additional gm-cell to interface be- varied by scaling the DAC full-scale current. As mentioned in
tween the DAC and the filter. Also, the baseband circuits require Section III-A1, DAC SFDR reduces with output frequency.
a higher supply voltage (2.5 V) compared with the mixer (1.8 From our simulation, the DAC SFDR is better than 55 dB
V) to allow for headroom. up to 20 MHz and the distortion is mainly dominated by the
filter. Our measurements indicate that the DAC SFDR showed
A. Baseband Measurements degraded frequency dependence, thereby reducing SFDR at
The baseband signal measurements are discussed here. The 20 MHz by 10 dB. The possible reasons for this are the addi-
baseband filter frequency response is shown in Fig. 14. A tional capacitances seen by the current sources after layout and
GUPTA AND BUCKWALTER: LINEARITY CONSIDERATIONS FOR LOW-EVM, MILLIMETER-WAVE DIRECT-CONVERSION MODULATORS 3281
Fig. 17. LO and RF port matching. Fig. 18. Measured output RF spectrum at 42 GHz and 10 MHz
before and after LO leakage calibration.
Fig. 19. Measured RF output spectrum with sideband (image) suppressed. (a) Lower sideband suppression. (b) Upper sideband suppression.
Fig. 20. Measured output and third-order intercept point. (a) RF output power versus DAC full-scale current. (b) Output third-order intercept point.
40 GHz and RF port is well-matched to below 8 dB beyond I and Q path. The I/Q gain and phase imbalances are expressed
37 GHz. as [22]
The uncalibrated modulator measurements show high LO
leakage ( 20 dBc) and low sideband suppression ( 15 dBc), (23)
which prevents demonstration of high-order modulation for-
mats since sideband suppression reflects high I/Q gain and where
phase imbalances. Sideband suppression (SB) is represented in
terms of I/Q magnitude and phase errors as [1] (24)
To correct for the errors, the raw I/Q symbols are multiplied by
(22) using digital techniques.
Fig. 18 shows the output RF spectrum at a 42-GHz RF and
where is the absolute magnitude error and is the phase im- 10-MHz IF frequency when the LO power is 8 dBm and DAC
balance. From Table I, and are specified to be under 2% full-scale current is 2 mA. Measurements are done at 42 GHz
and 1 to satisfy the EVM and, therefore, the required side- instead of higher frequency due to higher output power at 42
band suppression is 37.5 dB. Lower sideband suppression re- GHz. This is because of slightly degraded RF port matching at
sults from device mismatches, process variations, and mistuning higher frequencies and increased losses from on-chip passive
of RF baluns; however, these systematic errors are static and can components. At this condition, the output RF power from the
be corrected. A digital correction is performed to compensate modulator is 8 dBm. The I and Q channels are supplied with
for the LO leakage and I/Q imbalances. For instance, the LO identical sinusoidal patterns. The LO leakage is below 39 dB.
leakage is compensated by introducing a d.c. offset between the Similarly, sideband suppression is below 39 dBc after digital
GUPTA AND BUCKWALTER: LINEARITY CONSIDERATIONS FOR LOW-EVM, MILLIMETER-WAVE DIRECT-CONVERSION MODULATORS 3283
Fig. 21. Measured output constellations and eye diagrams at 8-MS/s symbol rate. (a) QPSK, EVM 2.2%. (b) 16-QAM, EVM 2.3%. (c) 64-QAM, EVM
2.1%.
TABLE II
PERFORMANCE SUMMARY AND COMPARISON
is specified at under 2.5%. Probe contact resistance was found of the PA is digitally premultiplied with the compensation factor
to introduce an uncertainty of around 0.5% EVM and con- . From (8), the compensated PA
tributes to some of the irregular behavior of measured data output becomes
points in Fig. 21. Predicted EVM is lower than the specified
since the LO phase noise is no longer a significant contributor
to EVM. Also, EVM is almost independent of symbol rate. (25)
EVM measurements could only be done upto symbol rates of
10 MS/s due to the IF bandwidth limitation of Agilent E4448A After memoryless DPD is applied, the outlier symbols are
spectrum analyzer’s digital modulation utility. Nonetheless, the pushed back towards their ideal locations the EVM improves
modulator can theoretically achieve the symbol rates in excess from 8.2% to 4.9%. Closer inspection of the constellation
of 40 MS/s (240 Mbps with 64-QAM) without significant after pre-distortion reveals that there is some spread in the
degradation of EVM beyond 2.5%. high-power constellation symbols and suggests a possible
Measured output constellation and eye diagram for various memory effect in the PA. PA memory effects occur when the
QAM modulation formats are presented in Fig. 22 at 8-MS/s output depends on previous inputs. For a random input enve-
symbol rate and 8-dBm RF output power. Eye diagrams for lope, a spread in the output voltage is observed which tends
QPSK, 16-QAM, and 64-QAM have two, four, and eight dis- to become worse with high output power. Memory effects are
tinct voltage levels and almost identical I and Q eye opening. often caused by bias circuits, self-heating, and trapping effects
Spectrum of the modulated RF signal with 8-MS/s symbol in transistors [23]–[25]. This suggests the need for real-time
rate is shown in Fig. 23. Raised-cosine filtering with unity closed loop correction to eliminate the memory effect.
roll-off factor is applied to the baseband data to minimize the DPD is also performed at 64-QAM under the same conditions
out of band sidelobes. The ACPR is about 35 dBc and is equal as 16-QAM (DAC current, symbol rate, and center frequency).
to SNR in this case which implies that ACPR is not limited by The EVM improved from 5.7% to 4.2% for 64-QAM. Note that
the IQ channel nonlinearities. Output power is 8 dBm. EVM is lower for 64-QAM than 16-QAM since, for the same
DAC current, peak power is the same but average power is lower
D. Digital Predistortion for 64-QAM. This implies that linearity margin
is higher, hence lower EVM from Fig. 3.
To reach high-power levels needed for satellite communica-
tion, substantial external power amplification is required. The E. Comparison to Prior Work
linearity of the I/Q modulator can be used to introduce DPD The implemented mm-wave I/Q modulator performance is
for external PA compression. Here, the EVM results presented compared with prior work in I/Q modulators in Table II. The
in the prior section are extended to demonstrate the digital pre- I/Q modulator achieves the lowest EVM at similar data rates to
distortion with a Spacek Labs 20-dBm PA (SG4510-30-15 V) prior demonstrations and initially supports DPD for PAs. The
when operated close to its 1-dB compression point. lowest LO leakage and highest image suppression at mm-wave
Fig. 24 illustrates the output constellation prior to predistor- carrier frequencies is shown.
tion using a 16-QAM constellation at 18-dBm output power.
Notably, the highest power points in the constellation show V. CONCLUSION
maximum deviation from the ideal positions due to a dominant A high-linearity I/Q signal modulator is implemented in
AM–AM compression. The measured EVM is 8.2%. a 0.12- m SiGe process. A new analysis of the impact of
Estimation of the power compression at the high power points signal compression considers how the combination of baseband
is used to create a compensation scheme for the DPD. The input and RF compression contributes to EVM degradation. The
GUPTA AND BUCKWALTER: LINEARITY CONSIDERATIONS FOR LOW-EVM, MILLIMETER-WAVE DIRECT-CONVERSION MODULATORS 3285
breakdown of EVM suggests a linearity specification for the [15] B. Razavi, Principles of Data Conversion System Design. New York:
implemented circuit. The measured I/Q modulator achieves an IEEE, 1995.
[16] K. O’Sullivan, C. Gorman, M. Hennessy, and V. Callaghan, “A 12-bit
EVM of less than 2.5% at a 48-Mb/s bit rate while performing 320-MSamples/s current-steering CMOS D/A converter in 0.44 mm ,”
64-QAM at 42 GHz. DPD capability is demonstrated by driving IEEE J. Solid-State Circuits, vol. 39, no. 7, pp. 1064–1072, Jul. 2004.
an external PA into compression at 18 dBm, and the EVM is [17] A. Van den Bosch, M. Steyaert, and W. Sansen, “An accurate statistical
yield model for CMOS current steering D/A converters,” in Proc. IEEE
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itations for high-speed high resolution current steering cmos d/a con-
ACKNOWLEDGMENT verters,” in Proc. IEEE Int. Conf. Electron., Circuits Syst., Sep. 1999,
pp. 1193–1196.
The authors would like to thank the staff of the DARPA LEAP [19] R. Schaumann, H. Xiao, and M. E. V. Valkenburg, Design of Analog
Pogram for access to the IBM 8HP technology, Dr. S. Raman of Filters. Oxford, U.K.: Oxford Univ., 2010.
the DARPA ELASTx program, and Dr. D. Palmer, U.S. Army [20] A. J. Lewinski and J. Silva-Martinez, “A 30-MHz fifth-order elliptic
low-pass cmos filter with 65-dB spurious-free dynamic range,” IEEE
Research Office, for support. The authors would also like to Trans. Circuits Syst. I, Reg. Papers, vol. 54, no. 3, pp. 469–480, Mar.
thank Prof. P. Asbeck, Prof. L. Larson, and J. Kim for discus- 2007.
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[6] S. Chung and J. L. Dawson, “A 73.1 db SNDR digitally assisted sub- He was with Cosmic Circuits Pvt. Ltd., Bangalore,
sampler for rf power amplifier linearization systems,” in Proc. IEEE India, as an Intern in 2007 and as a Design Engineer
Symp. VLSI Circuits, 2009, pp. 148–149. from 2007 to 2009. There, he worked on high-speed
[7] H. Y. Chang, P. S. Wu, T. W. Huang, H. Wang, C. L. Chang, and J. serial links, ring oscillators, ultra-low-noise crystal
G. J. Chern, “Design and analysis of CMOS broadband compact high- oscillators, and various power management circuits
linearity modulators for gigabit microwave/millimeter-wave applica- including LDO regulators and precision bandgap references. His research inter-
tions,” IEEE Trans. Microw. Theory Tech., vol. 54, no. 1, pp. 20–30, ests include analog/RF/millimeter-wave circuit design.
Jan. 2006.
[8] S. Gueorguiev, S. Lindfors, and T. Larsen, “A 5.2 GHz CMOS I/Q
modulator with integrated phase shifter for beamforming,” IEEE J.
Solid-State Circuits, vol. 42, no. 9, pp. 1953–1962, Sep. 2007. James F. Buckwalter (S’01–M’06) received
[9] Y. Hamada, K. Maruhashi, M. Ito, S. Kishimoto, T. Morimoto, and the B.S. degree from the California Institute of
K. Ohata, “A 60-GHz band compact IQ modulator MMIC for ultra- Technology, Pasadena, in 1999, the M.S. degree
highspeed wireless commuication,” in IEEE MTT-S Int. Microw. Symp. in electrical engineering from the University of
Dig., 2006, pp. 1701–1704. California, Santa Barbara, in 2001, and the Ph.D.
[10] C. Wagner, M. Hartman, A. Stelzer, and H. Jaeger, “A fully differen- degree in electrical engineering from the California
tial 77-GHz active IQ modulator in a silicon-germanium technology,” Institute of Technology in 2006.
IEEE Microw. Wireless Compon. Lett., vol. 18, no. 5, pp. 362–364, From 1999 to 2000, he was a Research Scientist
May 2008. with Telcordia Technologies. During the summer of
[11] Y.-J. Ko, S. Stapleton, and R. Sobot, “ -band image rejection 2004, he was with IBM T. J. Watson Research Center,
sliding- IF transmitter in 0.13-mum CMOS process,” IEEE Trans. Yorktown Heights, NY. In 2006, he joined Luxtera,
Microw. Theory Tech., vol. 59, no. 8, pp. 2091–2107, Aug. 2011. Carlsbad, CA, where he developed high-speed circuits for optical interconnects.
[12] M. Ibnkahla, Signal Processing for Mobile Communication Systems. In July 2006, he joined the faculty of the University of California at San Diego,
Boca Raton, FL: CRC, 2000. La Jolla, where he is an Associate Professor of electrical engineering.
[13] J. G. Proakis and M. Salehi, Digital Communications. New York: Dr. Buckwalter was the recipient of a 2004 IBM Ph.D. Fellowship, the 2007
McGraw-Hill, 2008. Defense Advanced Research Projects Agency Young Faculty Award, and the
[14] D. M. Pozar, Microwave Engineering. New York: Wiley, 2005. 2011 National Science Foundation CAREER Award.