Saitel DP Module PDF

Saitel DP
Modules Manual
12/2016
www.schneider-electric.com
Rev 3.2 (21-12-2016)
Change Control
Rev Date Description
3.2 30-12-2016  New versions of the SM_PS40 module.
 New configuration tool Easergy Builder and monitorization tool Saitel Webtool.
 Information about new modules SM_SER (M581) and SM_DO32T (M580)
 48 VDC terminal block has been included for SM_DO32T.
3.1 15-10-2015  Updated the information about lighted indicators.
 New chapter “Information of Safety and Health”.
 SM_CPU866FX module is classified as “Legacy Product”.
 New functionality of the backplane (lighted indicators).
 Updated information about maximum consumption and maximum distance to a external power
supply for backplane modules.
 Included information about redundancy.
3.0 14-03-2014  Saitel 2000DP’s name is changed to Saitel DP.
 Removed information about auxiliary modules. You can find this information in the document
TE-00-0000-F850-ARQ, Auxiliary Modules manual.
 New e-mail for client support: infoSaitel@schneider-electric.com.
 Removed information about SM_AC and SM_GAS. Both modules are been catalogued as
"Legacy products"
 Included information about SM_PS40 power supply.
 Completed the information about backplanes installation.
 Included information about the new CPU SM_CPU866e.
 Completed the information about backplanes installation.
General Information
The Saitel platform and all its components have been developed in accordance to the requirements for a quality
management system, complying with the ISO 9001 Norm.
Document nº: TE-HG-0000-MOD-F700

Revision/Date: Rev 3.2 (21-12-2016)
File: Saitel DP Modules-EN-Rev3.2.pdf
Retention Period: Permanent throughout its validation period + 3 years after its
cancellation.
NOTICE
In case of any further queries , please, send an e-mail about the problem or suggestion to the following address:
es-nfoSaitel@schneider-electric.com
Saitel DP Modules 2
Rev 3.2 (21-12-2016)
Index of Contents
Index of Contents .................................................................................................................................................................. 3
Index of Figures..................................................................................................................................................................... 7
Index of Tables.................................................................................................................................................................... 11
Contents.............................................................................................................................................................................. 12
Chapter 1. Safety & Health............................................................................................................................................ 13
1.1 Introduction.......................................................................................................................................................... 13
1.2 Restricted Liability ............................................................................................................................................... 13
1.3 Handling Electronical Components ..................................................................................................................... 14
1.4 Installation and Operation.................................................................................................................................... 14
1.5 Protective Grounding........................................................................................................................................... 15
1.5.1 Electric Safety.............................................................................................................................................. 16
1.5.2 EMC ............................................................................................................................................................ 16
1.6 Replacing the Battery and Recicling the Product ................................................................................................ 16
Chapter 2. Introduction................................................................................................................................................. 2-1
2.1 Saitel DP ............................................................................................................................................................ 2-1
2.2 Saitel DP Modules .............................................................................................................................................. 2-2
2.2.1 Available Module Types ............................................................................................................................. 2-2
2.2.2 General Features........................................................................................................................................ 2-2
2.3 System Buses .................................................................................................................................................... 2-3
Chapter 3. Installation .................................................................................................................................................. 3-1
3.1 Introduction......................................................................................................................................................... 3-1
3.2 Handling ............................................................................................................................................................. 3-1
3.3 Module Location within the Chassis ................................................................................................................... 3-1
3.4 Power Requirements .......................................................................................................................................... 3-1
3.5 Polarization and Commons ................................................................................................................................ 3-2
3.6 Identification and Profibus Speed....................................................................................................................... 3-2
3.7 Location.............................................................................................................................................................. 3-3
3.8 LED Indicators.................................................................................................................................................... 3-3
3.9 Cabling ............................................................................................................................................................... 3-3
3.9.1 Field Connection......................................................................................................................................... 3-3
3.9.2 Wiring Types .............................................................................................................................................. 3-5
Chapter 4. Control Unit ................................................................................................................................................ 4-1
4.1 Control Module (CPU) ........................................................................................................................................ 4-1
4.2 SM_CPU866 Module.......................................................................................................................................... 4-1
4.2.1 General Description.................................................................................................................................... 4-1
4.2.2 Internal Plate .............................................................................................................................................. 4-3
4.2.3 Code Uploading and Configuration............................................................................................................. 4-3
4.2.4 Diagnostic & Troubleshooting..................................................................................................................... 4-4
4.2.5 Technical Specifications ............................................................................................................................. 4-5
4.3 SM_CPU866e Module........................................................................................................................................ 4-7
4.3.2 Internal Plate .............................................................................................................................................. 4-9
4.3.3 Code Uploading and Configuration........................................................................................................... 4-10
3 Saitel DP Modules
Rev 3.2 (21-12-2016)
4.3.4 Diagnostic & Troubleshooting................................................................................................................... 4-10

4.3.5 Technical Specifications ........................................................................................................................... 4-11
4.4 Control Module Cabling .................................................................................................................................... 4-13
Chapter 5. Communication Modules ............................................................................................................................ 5-1
5.1 SM_SER Module................................................................................................................................................ 5-1
5.1.2 Internal Plate .............................................................................................................................................. 5-2
5.1.3 Communication Protocols........................................................................................................................... 5-2
5.1.4 Installation .................................................................................................................................................. 5-3
5.1.5 Configuration .............................................................................................................................................. 5-5
Chapter 6. Power Supplies........................................................................................................................................... 6-1
6.1 Saitel DP Power Supplies................................................................................................................................... 6-1
6.2 SM_PS Module .................................................................................................................................................. 6-1
6.2.2 Internal Plate .............................................................................................................................................. 6-2
6.2.3 Installation .................................................................................................................................................. 6-3
6.2.5 Technical Specification............................................................................................................................... 6-4
6.3 SM_PS40 Module .............................................................................................................................................. 6-6
6.3.2 Internal Plate .............................................................................................................................................. 6-7
6.3.3 Installation .................................................................................................................................................. 6-7
Chapter 7. Acquisition Modules.................................................................................................................................... 7-1
7.1 Input/Output Modules ......................................................................................................................................... 7-1
7.2 SM_DI32 Module. 32 Digital Inputs .................................................................................................................... 7-1
7.2.2 Installation .................................................................................................................................................. 7-2
7.2.3 Terminal Blocks .......................................................................................................................................... 7-4
7.2.4 Diagnostics & Troubleshooting................................................................................................................... 7-8
7.3 SM_DO32T Module. 32 Digital Outputs (Transistor) ........................................................................................ 7-12
7.3.1 General Description.................................................................................................................................. 7-12
7.3.2 Installation ................................................................................................................................................ 7-13
7.3.3 Diagnostics & Troubleshooting................................................................................................................. 7-19
7.4 SM_DO16R Module. 16 Digital Outputs (Relay) .............................................................................................. 7-22
7.4.2 Installation ................................................................................................................................................ 7-23
7.4.3 Terminal blocks ........................................................................................................................................ 7-24
7.5 SM_AI16 Module. 16 Analog Inputs ................................................................................................................. 7-30
Saitel DP Modules 4
Rev 3.2 (21-12-2016)

7.5.2 Installation ................................................................................................................................................ 7-31
7.5.3 Terminal Blocks ........................................................................................................................................ 7-32
7.5.4 Diagnostic & Troubleshooting................................................................................................................... 7-35
7.6 SM_AI8AO4 Module. 8 Analog Inputs & 4 Analog Outputs .............................................................................. 7-38
7.6.2 Installation ................................................................................................................................................ 7-39
7.6.3 Configuration ............................................................................................................................................ 7-41
7.6.4 Terminal Blocks ........................................................................................................................................ 7-42
Chapter 8. Backplane Modules .................................................................................................................................... 8-1
8.1 General Information............................................................................................................................................ 8-1
8.1.1 Electrical Features...................................................................................................................................... 8-2
8.2 SM_BPXx Model ................................................................................................................................................ 8-2
8.2.1 Mechanical Features .................................................................................................................................. 8-2
8.2.2 SM_BPX Power Supply.............................................................................................................................. 8-4
8.3 SM_CHX Model.................................................................................................................................................. 8-6
8.3.1 General Features........................................................................................................................................ 8-6
8.3.2 Mechanical Features .................................................................................................................................. 8-6
8.3.3 SM_CHX Power Supply ............................................................................................................................. 8-7
8.4 Profibus Configuration ...................................................................................................................................... 8-10
8.5 Backplane Expansion ....................................................................................................................................... 8-10
8.5.1 Expansion using RS-485 (Copper) ........................................................................................................... 8-11
8.5.2 Using BP2F for Expansion (Fiber Optic)................................................................................................... 8-13
8.6 Backplanes Power Supply................................................................................................................................ 8-15
8.6.1 Saitel DP Power Supplies......................................................................................................................... 8-15
8.6.2 Recommendations for External Powering ................................................................................................ 8-15
8.7 Supervision....................................................................................................................................................... 8-16
8.7.1 Supervision of the Profibus....................................................................................................................... 8-17
8.7.2 Supervision of the Power.......................................................................................................................... 8-17
Chapter 9. Technical Data............................................................................................................................................ 9-2
9.1 Environmental Conditions................................................................................................................................... 9-2
9.2 Coating ............................................................................................................................................................... 9-2
9.3 CE Mark ............................................................................................................................................................. 9-2
9.4 Mechanical and Consumption ............................................................................................................................ 9-2
Chapter 10. I/O Information Processing ....................................................................................................................... 10-1
10.1 Introduction....................................................................................................................................................... 10-1
10.1.1 Digital Input Acquisition ............................................................................................................................ 10-1
10.1.2 Digital Output Actuation............................................................................................................................ 10-3
10.1.3 Analog Input Acquisition ........................................................................................................................... 10-4
Chapter 11. Redundant Configurations in Saitel DP .................................................................................................... 11-1
11.1 Introduction....................................................................................................................................................... 11-1
5 Saitel DP Modules
Rev 3.2 (21-12-2016)
11.2 Power Supply Redundancy .............................................................................................................................. 11-1

11.2.1 Power Supply Redundancy in SM_BPX ................................................................................................... 11-1
11.2.2 Power Supply Redundancy in SM_CHX................................................................................................... 11-3
11.3 CPU Redundancy............................................................................................................................................. 11-5
11.3.1 CPU Physical Site .................................................................................................................................... 11-5
11.3.2 Switching Mechanisms ............................................................................................................................. 11-6
11.3.3 Switching Mode ........................................................................................................................................ 11-7
11.4 Acquisition Bus Redundancy............................................................................................................................ 11-9
11.5 System’s Duality............................................................................................................................................. 11-10
11.6 Recommendations.......................................................................................................................................... 11-11
11.6.1 Power Supply ......................................................................................................................................... 11-11
11.6.2 Control Unit ............................................................................................................................................ 11-12
11.6.3 Acquisition Bus: Profibus........................................................................................................................ 11-12
Glossary ................................................................................................................................................................................A
Saitel DP Modules 6
Rev 3.2 (21-12-2016)
Index of Figures
Figure 1-1. Protection barrier for elements handling dangerous voltage. ............................................................................ 15
Figure 1-2. Yellow and green cable for ground.................................................................................................................... 16
Figure 2-1. Saitel DP in a chassis. ..................................................................................................................................... 2-1
Figure 2-2. Saitel DP in a backplane .................................................................................................................................. 2-1
Figure 2-3. Saitel DP architecture. ..................................................................................................................................... 2-1
Figure 2-4. A Saitel DP module. ......................................................................................................................................... 2-2
Figure 2-5. Module’s switches............................................................................................................................................ 2-3
Figure 2-6. Profibus TTL and Profibus RS-485. ................................................................................................................. 2-3
Figure 2-7. Buses in a backplane. ...................................................................................................................................... 2-4
Figure 3-1. Backplane`s positions. ..................................................................................................................................... 3-1
Figure 3-2. Profibus switches for module configuration..................................................................................................... 3-2
Figure 3-3. Module with terminal connection (C1).............................................................................................................. 3-3
Figure 3-4. Module with flat-ribbon connection (C2)........................................................................................................... 3-3
Figure 3-5. Header connector for Saitel DP acquisition modules. ...................................................................................... 3-4
Figure 3-6. Cable for field connection................................................................................................................................. 3-4
Figure 3-7. Prepared cable for field connection.................................................................................................................. 3-4
Figure 3-8. Wiring of two types of terminals. ...................................................................................................................... 3-4
Figure 3-9. Position of the cables when they are installed. ................................................................................................ 3-5
Figure 3-10. Fixing cables to the cabinet or chassis........................................................................................................... 3-5
Figure 3-11. Analog signal wiring. ...................................................................................................................................... 3-6
Figure 3-12. Polarizing power supply output. ..................................................................................................................... 3-7
Figure 3-13. Example of incorrect connections of the polarization power supply. .............................................................. 3-8
Figure 3-14. General scheme of a CORRECT earth connection........................................................................................ 3-9
Figure 3-15. General scheme of an INCORRECT earth connection. ................................................................................. 3-9
Figure 4-1. SM_CPU866 - Front view. ............................................................................................................................... 4-1
Figure 4-2. SM_CPU866 – Internal plate (when the door is open)..................................................................................... 4-3
Figure 4-3. CPU configuration switches. ............................................................................................................................ 4-4
Figure 4-4. SM_CPU866e - Front view. ............................................................................................................................. 4-7
Figure 4-5. SM_CPU866e – Internal plate (when the door is open)................................................................................. 4-10
Figure 4-6. RJ-45 connector............................................................................................................................................. 4-13
Figure 4-7. PC connection (with DB-9 connector on the PC end). ................................................................................... 4-13
Figure 4-8. SFP modules to install in the ports ETH3-FX and ETH4-FX of SM_CPU866e. ............................................. 4-15
Figure 4-9. Fiber optic connectors installed...................................................................................................................... 4-15
Figure 5-1. SM_SER - Front view....................................................................................................................................... 5-1
Figure 5-2. SM_SER - Communication indicators. ............................................................................................................. 5-2
Figure 5-3. SM_SER – Internal plate.................................................................................................................................. 5-2
Figure 5-4. SM_SER – Termination resistor in full-duplex communications....................................................................... 5-4
Figure 5-5. SM_SER – Termination resistor in half-duplex communications...................................................................... 5-4
Figure 5-6. SM_SER – Cable for connection SM_SER-Auxiliary terminal in full-duplex communications.......................... 5-4
Figure 5-7. SM_SER - Cable for connection SM_SER-Auxiliary terminal in half-duplex communications. ........................ 5-5
Figure 6-1. SM_PS - Front view. ........................................................................................................................................ 6-1
Figure 6-2. SM_PS - Internal front view (when the door is opened). .................................................................................. 6-2
Figure 6-3. SM_PS40 – Front view. ................................................................................................................................... 6-6
Figure 6-4. SM_PS40 - Internal front view (when the door is opened). .............................................................................. 6-7
7 Saitel DP Modules
Rev 3.2 (21-12-2016)
Figure 7-1. SM_DI32 - Front view. ..................................................................................................................................... 7-1

Figure 7-2. SM_DI32 - Direct connection (option C1)......................................................................................................... 7-3
Figure 7-3. SM_DI32 - Field connection schematics (option C1). ...................................................................................... 7-4
Figure 7-4. SM_DI32 - Field connection schematics (option C2). ...................................................................................... 7-4
Figure 7-5. TB_DI32/E Standard terminal block. ......................................................................................................... 7-5
Figure 7-6. TB_DI32/E - Electrical diagram – Phoenix Contact.......................................................................................... 7-5
Figure 7-7. TB_DI32E Standard terminal block. .......................................................................................................... 7-5
Figure 7-8. TB_DI32E – Electrical diagram - Weidmüller. ................................................................................................. 7-6
Figure 7-9. TB_DI32/N Normalized terminal block ....................................................................................................... 7-6
Figure 7-10. TB_DI32/N - Electrical diagram – Phoenix Contact....................................................................................... 7-6
Figure 7-11. TB_DI32N Normalized terminal block. ..................................................................................................... 7-7
Figure 7-12. TB_DI32N – Electrical diagram - Weidmüller................................................................................................ 7-7
Figure 7-13. TB_DI32/L Terminal block with LED indicators ....................................................................................... 7-7
Figure 7-14. TB_DI32/L – Electrical diagram – Phoenix Contact. ...................................................................................... 7-8
Figure 7-15. TB_DI32DL Terminal block with LED indicators....................................................................................... 7-8
Figure 7-16. TB_DI32DL – Electrical diagram - Weidmüller.............................................................................................. 7-8
Figure 7-17. SM_DO32T - Front view. ............................................................................................................................. 7-12
Figure 7-18. SM_DO32T - Direct connection (option C1)................................................................................................. 7-13
Figure 7-19. SM_DO32T - Field connection schematics (option C1). ............................................................................. 7-14
Figure 7-20. Cabling of the SM_DO32T module connected to terminal blocks via flat-ribbon cables. ............................. 7-15
Figure 7-21. TB_DO16/S Compact terminal block with 16 relays & medium breaking capacity................................. 7-16
Figure 7-22. TB_DO16/S – Electrical diagram – Phoenix Contact. .................................................................................. 7-16
Figure 7-23. TB_DO16/T Terminal block with 16 relays and medium breaking capacity ........................................... 7-17
Figure 7-24. TB_DO16/T - Electrical diagram – Phoenix Contact. ................................................................................... 7-17
Figure 7-25. TB_DO16/P Terminal block with 16 digital outputs and high breaking capacity..................................... 7-18
Figure 7-26. TB_DO16/P – Electrical diagram – Phoenix Contact. .................................................................................. 7-18
Figure 7-27. SM_DO16R - Front view. ............................................................................................................................. 7-22
Figure 7-28. SM_DO16R - Direct connection (option C1). ............................................................................................... 7-23
Figure 7-29. SM_DO16R - Field connection schematics (option C1). .............................................................................. 7-24
Figure 7-30. SM_DO16R - Field connection schematics (option C2). ............................................................................. 7-24
Figure 7-31. TB_DO16/P Standard terminal block ..................................................................................................... 7-25
Figure 7-32. TB_DO16/E - Electrical diagram – Phoenix Contact.................................................................................... 7-25
Figure 7-33. TB_DO16E Standard terminal block ...................................................................................................... 7-25
Figure 7-34. TB_DO16E – Electrical diagram – Weidmüller. .......................................................................................... 7-26
Figure 7-35. TB_DO16/N Normalized terminal block ................................................................................................. 7-26
Figure 7-36. TB_DO16/N - Electrical diagram – Phoenix Contact................................................................................... 7-26
Figure 7-37. TB_DO16N Normalized terminal block .................................................................................................. 7-27
Figure 7-38. TB_DO16N – Electrical diagram – Weidmüller. .......................................................................................... 7-27
Figure 7-39. SM_A16 - Front view.................................................................................................................................... 7-30
Figure 7-40. SM_AI16 - Direct connection (option C1)..................................................................................................... 7-31
Figure 7-41. SM_AI16 - Field connection schematics (option C1). ................................................................................. 7-32
Figure 7-42. SM_AI16 - Field connection schematics (option C2). ................................................................................. 7-32
Figure 7-43. TB_AI8/E Standard terminal block ...................................................................................................... 7-33
Figure 7-44. TB_AI8/E – Electrical diagram – Phoenix Contact. ...................................................................................... 7-33
Figure 7-45. TB_AI8E Standard terminal block ........................................................................................................ 7-33
Figure 7-46. TB_AI8E – Electrical diagram – Weidmüller. .............................................................................................. 7-33
Saitel DP Modules 8
Rev 3.2 (21-12-2016)
Figure 7-47. TB_AI8/N Normalized terminal block .................................................................................................. 7-34

Figure 7-48. TB_AI8/N – Electrical diagram – Phoenix Contact....................................................................................... 7-34
Figure 7-49. TB_AI8N Normalized terminal block ..................................................................................................... 7-34
Figure 7-50. TB_AI8N – Electrical diagram – Weidmüller. .............................................................................................. 7-35
Figure 7-51. SM_AI8A04 - Front view. ............................................................................................................................. 7-38
Figure 7-52. SM_AI8A04 - Direct connection (option C1). ............................................................................................... 7-39
Figure 7-53. SM_AI8A04 - Field connection schematics (option C1). .............................................................................. 7-40
Figure 7-54. SM_AI8A04 - Field connection schematics (option C2). ............................................................................. 7-40
Figure 7-55. SM_AI8AO4 - Jumpers for output configuration as Voltage / Current.......................................................... 7-41
Figure 7-56. TB_AO4/E Standard terminal block ................................................................................................... 7-42
Figure 7-57. TB_AO4/E – Electrical diagram – Phoenix Contact. .................................................................................... 7-43
Figure 7-58. TB_AO4E Standard terminal block ....................................................................................................... 7-43
Figure 7-60. TB_AO4/N Normalized terminal block................................................................................................. 7-44
Figure 7-61. TB_AO4/N – Electrical diagram – Phoenix Contact. .................................................................................... 7-45
Figure 7-62. TB_AO4N Normalized terminal block.................................................................................................... 7-44
Figure 8-1. SM_BPX. ......................................................................................................................................................... 8-1
Figure 8-2. SM_CHX .......................................................................................................................................................... 8-1
Figure 8-3. SM_BPX9 – Front view. ................................................................................................................................... 8-2
Figure 8-4. Necessary space for assembly and disassembly the modules. ....................................................................... 8-3
Figure 8-5. SM_BPX4 - Drill-hole arrangement.................................................................................................................. 8-3
Figure 8-6. SM_BPX9 - Drill-hole arrangement.................................................................................................................. 8-3
Figure 8-7. SM_BPX9 – Front view. ................................................................................................................................... 8-4
Figure 8-8. Necessary space for assembly and disassembly the modules into a chassis.................................................. 8-6
Figure 8-9. SM_CHX4 – Front view.................................................................................................................................... 8-7
Figure 8-10. SM_CHX4 – Rear view. ................................................................................................................................. 8-7
Figure 8-11. Backplane microswitches............................................................................................................................. 8-10
Figure 8-12. Connectors for expansion ............................................................................................................................ 8-10
Figure 8-13. Expansion cable connector. ......................................................................................................................... 8-11
Figure 8-14. Backplane expansion (using copper) – A main backplane / A single expansion cable ................................ 8-12
Figure 8-15. Backplane expansion (using copper) – A main backplane / A cable for each profibus ................................ 8-12
Figure 8-16. Backplane expansion (Copper) – Two main backplanes / Two expansion cables. ...................................... 8-13
Figure 8-17. Backplane expansion (Fiber optic) – A main backplane / A single cable for PF1, PF2 and SYN................. 8-13
Figure 8-18. Backplane Expansion (Fiber optic) – A main backplane / A cable for PF2 / A cable for PF1 and SYN........ 8-14
Figure 8-19. Backplane expansion (Fiber optic) – Two main backplanes / A cable for PF2 / A cable for PF1 and SYN. . 8-14
Figure 8-20. Backplane powered using two independent and redundant power supplies................................................ 8-15
Figure 8-21. Several backplanes powered by a power supply ......................................................................................... 8-16
Figure 8-22. Supervision leds on the backplane............................................................................................................... 8-16
Figure 10-1. Digital filtering in digital inputs...................................................................................................................... 10-1
Figure 10-2. Change memory in digital inputs.................................................................................................................. 10-2
Figure 10-3. Simple indication.......................................................................................................................................... 10-2
Figure 10-4. Double indication. ........................................................................................................................................ 10-3
Figure 10-5. Slow counter. ............................................................................................................................................... 10-3
Figure 10-6. Scaling at engineering units. ........................................................................................................................ 10-4
Figure 11-1 SM_BPX backplane with two Saitel DP PS modules .................................................................................... 11-2
9 Saitel DP Modules
Rev 3.2 (21-12-2016)
Figure 11-2 Power redundant configurations (SM_BPX).................................................................................................. 11-3

Figure 11-3 Power redundant configuration (SM_CHX) ................................................................................................... 11-4
Figure 11-4 Two CPU modules in the same backplane ................................................................................................... 11-5
Figure 11-5. Two CPUs in different backplanes ............................................................................................................... 11-6
Figure 11-6. Switching using the MSAC module .............................................................................................................. 11-7
Figure 11-7. Switching status under Cold Data mode ...................................................................................................... 11-8
Figure 11-8. Switching status under Hot Data mode ........................................................................................................ 11-9
Figure 11-9. Communication buses in the backplane....................................................................................................... 11-9
Figure 11-10. Dual system ............................................................................................................................................. 11-11
Figure 11-11. Example of a redundant architecture ....................................................................................................... 11-13
Saitel DP Modules 10
Rev 3.2 (21-12-2016)
Index of Tables
Table 3-1. Profibus speed. ................................................................................................................................................. 3-2
Table 3-2. Wiring groups. ................................................................................................................................................... 3-5
Table 4-1. SM_CPU866 – Communication ports. .............................................................................................................. 4-2
Table 4-2. SM_CPU866e – Communication ports.............................................................................................................. 4-8
Table 4-3. CPU - Pinout of the port CON. ........................................................................................................................ 4-13
Table 4-4. CPU - Serial port COM1.................................................................................................................................. 4-13
Table 4-5. CPU - Pinout of the serial port COM2. ............................................................................................................ 4-14
Table 4-6. CPU - Pinout of the ports COM3 and COM4................................................................................................... 4-14
Table 4-7. SM_CPU866 - Ethernet ports pinout............................................................................................................... 4-14
Table 4-8. SM_CPU866e - Pinout of the copper ports ETHx. .......................................................................................... 4-15
Table 4-9. SM_CPU866e – USB port............................................................................................................................... 4-16
Table 5-1. SM_SER - RS-232 port pinout. ......................................................................................................................... 5-3
Table 5-4. SM_SER - Addressing in serial multiplexer....................................................................................................... 5-5
Table 7-1. SM_AI8AO4 - Voltage outputs configuration................................................................................................... 7-42
Table 7-2. SM_AI8AO4 - Current outputs configuration. .................................................................................................. 7-42
Table 8-1. Pinout of the connector for external power supplies.......................................................................................... 8-5
Table 8-2. Cable length for the different transmission speeds. ........................................................................................ 8-11
Table 9-1. Mechanical and Consumption data. .................................................................................................................. 9-2
Table 11-1 Combination of redundant power supplies ................................................................................................... 11-11
Table 11-2 Control options for redundant CPU modules................................................................................................ 11-12
Table 11-3 Communication options for “Hot Data” CPU modules .................................................................................. 11-12
11 Saitel DP Modules
Rev 3.2 (21-12-2016)
Contents
I. Objective
The purpose of this manual is to provide the information about all Saitel DP modules. This manual provides
comprehensive information about design, diagnostics and features (installation, maintenance, putting into operation, …).
II. Target Audience

This manual is addressed to engineers involved in the design and implementation of a Saitel DP control system.
III. Arrangement
This manual is divided in different chapters. The chapters are listed below with their respective titles and a description of
their contents:
Chapter 1: Safety & Health

Saitel DP is designed according to IEC61010 standard (Safety requirements for electrical equipment for measurement,
control and laboratory use). Please read all information into this chapter before installation and/or operation.
Chapter 2: First Approach

General information about Saitel DR and the hardware modules which are supported by this platform.
Chapter 3: Installation
Relevant information about the correct installation of the modules in the cabinet.
Chapter 4: Control Units

Detailed information about the control modules available in the Saitel DP family, its technical features, assembly and
configuration procedures.
Chapter 5: Communication Modules

Detailed information about the communication modules available in Saitel DP.
Chapter 6: Power Supplies

Detailed information about the power supplies available in Saitel DP.
Chapter 7: Acquisition Modules

Detailed information about the design, technical specifications, and diagnostics of the I/O modules available in Saitel DP.
Chapter 8: Backplane Modules

Description of the different types of backplanes.
Chapter 9: Technical Data

Common technical information for all Saitel DP modules.
Chapter 10: Input/Output Information Processing

Detailed information about I/O signal processing performed by Saitel DP, either from the control module or the acquisition
module.
Chapter 11: Redundant Configurations

Information about available type of redundancies in Saitel DP.
Rev 3.2 (21-12-2016)
Chapter 1. Safety & Health

1.1 Introduction
As a result of the multiple uses of the product, the staff in charge of the application and the use of this control device must
ensure these usages comply with all security and performance requirements applicable in each application. The
requirements include the applicable industry-related laws, norms, regulations and standards.
Saitel DR has been designed according to the international standard IEC61010-1 with normal environmental conditions:
 Indoor use.
 Altitude up to 2000 m.
 Temperature between 5 ºC and 40 ºC.
 Maximum relative humidity 80% for temperatures up to 31 °C, decreasing linearly to 50% relative humidity at 40 °C.
 Transitional overvoltage up to category III.
 Level of contamination II.
The illustrations shown in this manual are intended for exemplary purposes. As there are variables and requirements
which depend on each particular installation, Schneider Electric will not be held responsible for the misuse of the
equipment based on the examples herein published.
Read these instructions carefully and look at the equipment to become familiar with the device before trying to install,
operate, service or maintain it. The following special messages may appear throughout this bulletin or on the equipment to
warn of potential hazards or to call attention to information that clarifies or simplifies a procedure.
Risk of electric chock

The addition of either symbol to a Danger or Warning safety label indicates that an electrical
hazard exists, which will result in personal injury or death if the instructions are not followed.
IEC ANSI
Safety alert
This is the safety alert symbol. It is used to alert you to potential personal injury hazards.
Obey all safety messages that follow this symbol to avoid possible injury.
In this manual you can find the following message types:
DANGER
DANGER indicates an imminently hazardous situation which, if not avoided, will result in death or serious injury.
WARNING
WARNING indicates a potentially hazardous situation which, if not avoided, can result in serious injury to the persons
or equipment.
NOTICE
NOTICE is used to address practices not related to physical injury.
1.2 Restricted Liability

Electrical equipment should be serviced and maintained only by qualified personnel. All person who can contact with the
equipment must be informed and must read the chapter “Safety & Health” of this manual.
Rev 3.2 (21-12-2016)
WARNING
If this equipment is used in a different form from the recommended one by Schneider Electric, the protection assured for
the equipment could be compromised.
No responsibility is assumed by Schneider Electric for any consequences arising out of the use of this manual. This
document is not intended as an instruction manual for untrained persons.
1.3 Handling Electronical Components

The normal movements of a person easily can generate electrostatic potentials of several thousands of volts. A discharge
of these voltages on the electronics during the manipulation can damage it. Is possible that this damage doesn't be
detected immediately but they can have reduced the reliability of the equipment.
While all electronic components are installed into their enclosure, they are protected for relevant levels of electrostatic
discharge.
WARNING
The enclosure shouldn’t be retired when isn’t necessary, because this action has a risk for the equipment.
If the enclosure must be removed, the following precautions must be strictly followed:
 Before removing the enclosure, the operator must be equipotential with the equipment that he is handling.
 Avoid to touch the electronic. The board must be always manipulated for the edges.
 If the equipment has to be passed between two persons, both must be equipotential.
 Put the module always on an antistatic surface or on a surface equipotential with you.
 During the storage and transport, the module will remain in its conductive or antistatic bag.
1.4 Installation and Operation

The user is responsible for checking that the rated characteristics of the device are suitable for its application. The user is
responsible for reading and following the device’s operating and installation instructions before attempting to commission
or maintain it. Failure to follow these instructions can affect device operation and constitute a hazard for people and
property.
Some Saitel modules can have elements with dangerous voltages (> 50 V). It is recommended to install the equipments
inside a cabinet with a key. This cabinet only should be opened by a qualified person. If this type of cabinet isn't available,
a barrier must be installed in order to avoid an accidental contact with these dangerous elements. This barrier only should
can be removed using an special tool.
An electrical risk symbol with enough size must be included on the cabinet’s door or on the barrier.
WARNING
If the barrier has to be removed in order to access to equipment, personnel responsible for the task must be sure that
the barrier is installed again when the task is finished.
Following image shows an example:
Rev 3.2 (21-12-2016)
Figure 1-1. Protection barrier for elements handling dangerous voltage.
WARNING
The terminals mustn't be accessible to the user directly when the installation of the equipment has been finished. The
cabinet should remain blocked with key or the protection barrier installed.
Modules that handle dangerous voltages are marked with a sticker of electrical hazards on the front (size 12.5 mm). This
is the case of SM_PS and SM_PS40 modules and SM_DI32 when digital inputs are polarized with voltage higher than 50
V.
DANGER
As for SM_DO16R modules, since alone does not handle high voltages, NO will be marked at the factory. This module
must be marked to inform about the risk when some equipments that manage voltage higher than 50 V are connected
to digital outputs.
The cabinet or installation must have a general switch placed just in the cable entry of the installation in order to assure
the absence of dangerous voltages. This switch must be placed in such a way that it doesn't allow be manipulated by a
third person whereas anybody operates inside the cabinet.
In addition, the installation must have a switch in order to protect the internal installation of the cabinet of short-circuits in
the supply from this one. Both switches have to be marked with the symbol O for OFF and the symbol I for ON.
WARNING
The switch for connection / disconnection must be installed on a fix element (i.e. the wall of the cabinet) and it mustn’t
interrupt any ground cable.
Only a dry cloth should be used for the cleanliness of the surface of the equipment when excessive presence of powder is
detected or when there is a foreign body deposited on the surface.
WARNING
You mustn't use a liquid product of cleanliness due to the presence of active parts.
1.5 Protective Grounding

WARNING
 Before energizing the equipment, this must be correctly grounded as it is indicated in paragraphs 1.5.1 and
1.5.2.
 In the installation of the equipment, ground is the first thing that should be connected and the last one that
should be disconnected.
Rev 3.2 (21-12-2016)
Saitel must be grounded for two different reasons:

 Electric safety (Protective Earth or PE).
 To Improve the behaviour in EMC and to derive the perturbances to earth.
1.5.1 Electric Safety

In order to compliance with the international norm IEC 61010-1, these indications must be followed. The installation
manager must assure that all requirements indicated in this manual are followed.
When Saitel DP is mounted on back-panel, the backplane on is metallic enclosure must be installed on a
metallic surface. This surface must connected to the ground of the cabinet or installation according to the
norm IEC 61010-1. When Saitel DP is mounted on a chassis, this chassis must be connected to the ground
of the installation.
Cables used for grounding of the metallic surface used in the installation of the modules must be yellow and green, with an
enough section in order to support 25 A (ground bonding test).
Figure 1-2. Yellow and green cable for ground.
The installation manager is responsible for compliance with all the existing international and national electrical codes
concerning protective grounding of any device.
WARNING
According to the norms about Electric Safety, the screw for ground must be exclusive for this use.
About the plastic enclosure of the modules, electric safety regulation doesn’t apply.
1.5.2 EMC
The available rear connector on each module allows the bus connection and it offers protection in case of electric derive.
The EMC grounding is implemented via three pins of this connector.
WARNING
Never connect modules on the backplanes if the power supply hasn’t been disconnected of all circuits with dangerous
voltages.
The only modules with a ground connection are the power supplies (SM_PS and SM_PS40). Both must be connected to
the ground of the cabinet.
1.6 Replacing the Battery and Recicling the Product

Some Saitel DP modules could include a Lithium battery NOT rechargeable. More information about the model in the
technical data table for each module.
Rev 3.2 (21-12-2016)
WARNING
When necessary, the battery must be replaced with another of the same model.
Only a qualified person should change the battery when is necessary. The appropriate tools should be used for
disassembly of enclosure and to accede to the plinth where the battery lodges. It must be replaced by the same indicated
model.
When the product is marked with this symbol, it means that, at the end of its life cycle, you mustn't eliminate
the product together with habitual residues. To avoid the possible damage to the environment or to the
human health that represents the uncontrolled elimination of residues, please, separate the battery (if there
is one) of the other elements, and each one must be recycled according to the local regulation.
WARNING
If the batteries aren't recycled correctly, the substances contained could produce personal injuries or damage to the
environment.
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Chapter 2. Introduction
2.1 Saitel DP
The Saitel DP platform is a complete set of devices provided by Schneider Electric for real-time control applications and
power line automation. It is a high-technology platform which gives a solution to the business areas of Schneider Electric.
Figure 2-1. Saitel DP in a chassis. Figure 2-2. Saitel DP in a backplane
Saitel DP’s design has been optimized to meet the most demanding requirements of multiple sectors:
 Cost-efficiency, minimum downtime, and compliance with electric safety, electromagnetic compatibility and
environmental standards.
 Safety and reliability requirements for power, gas, water, residual water supply, etc.
 Centralized monitoring and control of geographically-distributed systems which support hierarchical data acquisition
and redundant networks.
 Local monitoring and control with data sharing capabilities of plant-distributed devices.
 Quick troubleshooting by means of programmable automation execution.
 One of the most remarkable features of Saitel DP is its modular design. All I/O, CPU, power supply and
communication modules have an identical format, sharing the same enclosure.
Figure 2-3. Saitel DP architecture.
2-1 Saitel DP Modules

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2.2 Saitel DP Modules

The Saitel DP electronic modules have been designed to operate in aggressive industrial environments, complying with
the highest standards, such as Electromagnetic compatibility (EMC). The low-consumption design allows modules to
operate without a forced ventilation system, which creates a wide range of possible applications.
2.2.1 Available Module Types

The set of modules making up the platform are:
 Control Units. The modules SM_CPU866 (using VxWorks OS) and SM_CPU866e (using Linux OS) are powerful
CPU modules with abundant memory processing capabilities and Fast-Ethernet connections.
 Serial Communication Modules. SM_SER allows extend the communication capability of the CPU.
 Power Supply. There are two options: we can use the SM_PS and SM_PS40 modules or an external power
supply.
 I/O Modules. There is a wide range of I/O modules, for analog and digital signals: SM_DI32, SM_DO32T,
SM_DO16R, SM_AI16 and SM_AI8AO4.
 Backplanes. This type of module is completely different from the modules described above, as its main purpose is
to support the rest of the modules, by providing additional functions. There are two backplane models available:
SM_BPX and SM_CHX.
Each module is described in detail in the following chapters of this manual.
2.2.2 General Features

Appearance
The next figure shows an example of a Saitel DP module:
Figure 2-4. A Saitel DP module.
Cover
The modules have a plastic enclosure that especially it is designed to facilitate the insertion and the wiring of the modules.
The level of protection provided by the enclosure is IP20.
DANGER
Never open the module’s enclosure. Never install an electronic board without the plastic enclosure.
Interface
Internally, all modules are electrically connected to the backplane using a 48-pin connector on the rear side. In relation to
the connection with external devices, all the elements required for the module’s operation and maintenance tasks are
located on the front side.
Each type of module provides a specific feature and its connection interface is further discussed in this manual.
Switches
The modules integrate a 12-position switch on the rear side. The function of these switches depends on the module type,
but in general, it is used to set the addresses and communication rate.
The concrete application of each module type is explained in the respective sections of this manual.
Saitel DP Modules 2-2

Rev 3.2 (21-12-2016)
Figure 2-5. Module’s switches.
Indications
All modules include several LED indicators on the front panel which provide status and diagnostic information. The
meaning of these LEDs depends on the module type. This information will only be valid if the module is completely
configured and operational.
In addition, a diagnosis can be made using the Saitel Webtool.
2.3 System Buses

Each backplane includes a multifunctional bus (Profibus TTL) that covers the power and intercommunication
requirements. This bus is designed to be tolerant to failures, both from a power aspect, as from a communications aspect.
Additionally, a Profibus RS-485 is included to support backplane expansion.
The figure below shows schematically the situation of both buses in the system:
Figure 2-6. Profibus TTL and Profibus RS-485.
NOTICE
It is important to note that, both the first chassis and the last chassis or backplane, must be configured as bus
terminations. See chapter “Backplane Modules” of this manual.
These buses integrate the following bus lines:

 Profibus TTL:
o PE - Protection ground.
o PW1/2 – Power bus (primary and redundant).
o PF1/2 (TTL) - Primary and redundant Profibus TTL buses.
o MUX - Serial data bus for communications with the SM_SER module.
o SYN (TTL) - Bus for synchronization for the modules. (Pulse Per Second or PPS).
o SER - Serial bus for synchronization between redundant CPU modules.
 Profibus RS-485:
o PF1/2 (485) - Primary and redundant Profibus RS-485 buses.
o SYN (485) - Bus RS-485 for synchronization for the modules. (PPS).
The figure below shows the buses available in the backplane:

Rev 3.2 (21-12-2016)
Figure 2-7. Buses in a backplane.

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Chapter 3. Installation
3.1 Introduction
Some steps of the installation procedure of a module in its backplane are common for all modules, and other steps will
depend on the type of module to be mounted. The following steps are common for the installation of any module:
 Handling the module with extremely care (paragraph 3.2).
 Selecting the right location within the backplane (paragraph 3.3).
 Considering the backplane power requirements (paragraph 3.4).
3.2 Handling
WARNING
The electrostatic discharges may damage semi-conducive devices within the module, if the connector pins are in
contact with the backplane.
Please note the following precautions to avoid electrostatic damages:

 You should handle the module from the front side, as far as possible from the backplane connectors.
 You should never touch the pins of the backplane connector.
 You should keep the module in its antistatic bag, when unused.
3.3 Module Location within the Chassis

All modules must be installed always in vertical position.
When using a power supply such as the SM_PS or SM_PS40 module, it must be located in the position 1 (slot1 left-hand
side). In redundant-power supply configurations, there must be two reserved positions for the two power supply modules.
These positions must be 1 and 2.
Remaining modules can be located in any position (slot) within the chassis.
Figure 3-1. Backplane`s positions.
Modules must be grouped to minimize the adverse effects caused by noise and heat, therefore, modules, and more
specifically the CPU modules, must be placed as far as possible from the modules which operate at alternating currents or
high currents.
If the system has redundant CPUs, both control modules must be put together in the backplane.
3.4 Power Requirements
WARNING
The voltage input for the backplane is 5.4 ± 0.2 VDC. The external voltage input isn't protected against overvoltage nor
polarity inversion, so an incorrect wiring or an incorrect adjustment of the supply voltage could damage electronic.

Rev 3.2 (21-12-2016)
More information about how backplanes could be powered using external power supplies in paragraph 8.6.
The SM_PS and SM_PS40 modules (power-supplies) are scalable to supply power to the modules connected to the
backplane, as required. When using auxiliary power supplies it is necessary to scale them depending on the installed
Saitel DP modules.
The power consumption is indicated in the technical specification table for each module in this manual. The consumption
of all modules will be added plus a safety margin (between 20% and 50% of the full power). The power supply efficiency
(typically, 70 - 90%) shall also be considered, in order to prevent the chassis and power supply from overloading.
3.5 Polarization and Commons

The information related to the polarization and commons of each module is provided in the respective chapter of this
manual.
3.6 Identification and Profibus Speed

NOTICE
It is possible to connect up to 96 Saitel DP modules.
The module’s identification and Profibus communication speed can be set using the microswitches on the module's rear
panel. Each microswitch has the following functions:
Figure 3-2. Profibus switches for module configuration.
The module’s identification must be unique, selecting between 1 and 96 using microswitches 1 to 7. The address 0 and
from 97 to 127 are reserved and never can be assigned. In other case, several error are generated when the system boot.
The address definition will be as follows:
P1*20 + P2*21 + P3*22 + P4*23 + P5*24 + P6*25 + P7*26
Assuming Px is the value assigned to the position of microswitch x (0 is OFF and 1 is ON). For example, if switches 2, 4
and 5 are in the ON position, the Profibus address of the module is 26.
The Profibus communication speed must be the same for all Saitel DP modules, which is determined by the speed of the
master, configured by software, in the control module. The speed is set using microswitches 9, 10 and 11 as shown in the
following table:
Position 11 Position 10 Position 9 Profibus Rate
OFF OFF OFF 19.2 kbaud
OFF OFF ON 93.75 kbaud
OFF ON OFF 187.5 kbaud
OFF ON ON 500 kbaud
ON OFF OFF 1.5 Mbaud
ON OFF ON Not available
ON ON OFF Not available
ON ON ON Not available
Table 3-1. Profibus speed.
NOTICE
For optimal system performance is recommended to set the Profibus rate to 1.5 Mbaud.
Microswitches 8 and 12 are reserved and must be set to OFF, except for the SM_DI32 module. See section 7.2.2.4.

Rev 3.2 (21-12-2016)
3.7 Location
To mount the module in the backplane, please follow the following instructions:
 Switch off the backplane’s power supply.
 Mount the module at the desired position within the backplane and verify that the rear rails are properly mounted
using the pre-drilled holes on the backplane.
 Firmly press the module to assure the connector fits in the backplane connector properly. Check whether the
module is correctly mounted to the backplane base.
 Fix the module to the backplane using the screw located at the top.
 Insert the terminal or flat ribbon connectors.
WARNING
When installing a SM_CPU866e module with fiber optic, we have to make sure that there is enough space between the
front of the module and the cabinet door when it is closed, because the fiber optics can be pinching with the risk of
breakage. In addition, have in account that the module's flap door must remain opened
3.8 LED Indicators

The Saitel DP modules include some visible LEDs (light emitting diodes) on the front side. All acquisition modules have
common LEDs, and the rest are specific for each module, which are detailed in the corresponding section.
The front panel of each acquisition module has a red indicator DIA and a green indicator RUN. The module performs a
self-check during the start-up process. If no error is detected, the red indicator is switched off and the green indicator
displays the module’s configuration status.
If any problem is detected, the red indicator DIA is switched off. Its meaning for each module is detailed later in this
manual.
This manual provides a complete description of the possible module’s errors and corrective actions.
3.9 Cabling
3.9.1 Field Connection
Acquisition modules can be connected to the field using two different procedures:
 C1: Terminal connection or Direct connection. It is used when the length of the field cabling is short, for example,
when interconnections and assemblies are done within the cabinet, signals are generated in a close site or proceed
from an interface cabinet located at the same site, etc.
 C2: Flat-ribbon connection through terminal blocks. It is used when the distance between the module and the signal
source is long or when the cable gauge needs to be bigger than 0.5 mm2 due to the cabling layout.
The following figures show the available connection options C1 and C2:
Figure 3-3. Module with terminal connection (C1). Figure 3-4. Module with flat-ribbon connection (C2).
A module can be easily replaced by disconnecting the two field-connectors and removing the module from its slot, in both
direct and terminal-block connections.
In some modules, input circuits need to be polarized in order to perform signalling and command functions.
The configuration of each cabling option is further detailed in different chapters in this manual.

Rev 3.2 (21-12-2016)
3.9.1.1 C1 – Terminal Connection

The acquisition modules have Eurostyle ™ 20-way and 3.81 mm connectors, allowing the user to use multiple solutions to
your needs header connector (terminal screw, spring, small screw ... ).
An example is shown in the following figure:
Manufacturer: Phoenix Contact

Reference: FK-MCP 1.5/20-STF-3.81.
Figure 3-5. Header connector for Saitel DP acquisition modules.
3.9.1.2 C2 – Flat Ribbon Connection Through Terminal Blocks

When the connection is established through terminal blocks, they can be simple connecting interfaces made up by a flat
ribbon and terminals. These spring-type terminals with capacity for 2.5 mm2 gauge cables have a DIN 35 rail fixing base.
The flat ribbon cable has 20 ways, so two terminal blocks for each module are required.
3.9.1.3 Wiring Recommendations for Saitel DP Acquisition Modules

It is necessary to take into account the following considerations regarding the wiring of the modules:
 Recommended cable type: Low voltage computer with 20 x 0.14 by EMELEC.
Figure 3-6. Cable for field connection.
 For connection, you should remove the shield of the cable between 8 and 10 cm and protect the cut with an
insulating material, as shown in the figure:
Figure 3-7. Prepared cable for field connection.
 The shield at the end of each individual cable should be removed for a distance of 0.5 cm, which will be the part of
copper to introduce in the terminal:
Figure 3-8. Wiring of two types of terminals.

Rev 3.2 (21-12-2016)
 You can see that the space is enough to the door to be closed:
Figure 3-9. Position of the cables when they are installed.
To avoid jerking and the weight of the cable doesn't fall on the terminal, when the module is installed in the cabinet, both
wires will be joined with a plastic bracket, and they should be fixed to the cabinet or chassis too.
The following image shows an example:
Figure 3-10. Fixing cables to the cabinet or chassis.
3.9.2 Wiring Types

There are five possible types of wiring:
Group Connection Type
1 Analog input and output to the field.
2 Digital input and output to the field.
3 Communications.
Electronic power supply.
4 Signal polarization.
Auxiliary power supply.
Earth connection for human protection.
5
Earth connection for EMC.
Table 3-2. Wiring groups.
3.9.2.1 Common Recommendations

The following recommendations should be observed:
 Whenever possible, cables of groups 1, 2 and 3 must be wired separately. That is, the analog, digital, and
communication signals should have separate gutters.
 If separate wiring is not possible and the number of signals is low, exceptionally this gutter may be shared. In this
case, as analog and communication signals are the most sensitive, these two types of signals should be wired
through the same gutter, whereas digital signals should be wired separately.
 When none of the above is possible, it is extremely important to prevent analog, digital and communication signals
to be wired in parallel. If there are some sections in which parallel wiring cannot be avoided, these should be as
short as possible.
 If the cables need to be crossed, theses crossings will be perpendicular to each other.
 In order to increase protection in the field inputs and outputs, terminal blocks are normally used to reinforce the
protection barrier. The power supply and protection terminal blocks of DI, DO, AI and AO are protection barriers.

Rev 3.2 (21-12-2016)
The input wiring to these elements must always be independent from the output wiring of these barriers. They
should never share the gutter.
NOTICE
 The analog, digital and communication signals cables should never share the gutter with the cables of the
electronic power supply.
 Field input signal cables must never be laid using cables with filtered signals
3.9.2.2 Group 1(Analog Signals)

In the case of analog signals, always shielded cables should be used for the connection of the analog module to the
resistor and protection terminal block. The cable shield corresponding to the terminal block connection must be earthed
using a DIN-rail terminal.
Figure 3-11. Analog signal wiring.
3.9.2.3 Group 2 (Digital Signals)

The polarization power supply for DI and DO signals will be treated similarly to analog signals.
3.9.2.4 Group 3 (Communications)

The communication bus can be installed using 2-wire communication or 4-wire communication. In order to increase the
immunity to electromagnetic interference (EMC), the use of a shielded twisted pair is recommended.
WARNING
Particular care must be taken when connecting the shielding to make sure it is effective.
The shield connection depends on the equipotentiality between the connected devices:
 Guaranteed equipotentiality: Both devices are connected to an earth system, so that the same potential level is
guaranteed The shield must be connected at both ends.
 Limited equipotentiality: Both devices are connected to earth but not to the same earth system. To limit the
difference of potential that can be produced among them a cable with the appropriate cross-section will be installed
between the grounding of both. The shield must be connected at one end.
 No guaranteed equipotentiality: The connection to earth of both devices can’t be guaranteed (both devices must
be connected to an earth system). Copper mustn’t be used in this case.
DANGER
Connecting NOT equipotential devices could be dangerous for persons and equipment.
RS-485 Communications
For RS-485 the pairs are shielded individually or all together by a copper braid. The recommendations for the cable are:
 Resistance: < 100 Ω/km.
 Section: 0.22 mm2 (24 AWG)
 Characteristic impedance: 120 Ω.
 Maximum length: 1200 m.

Rev 3.2 (21-12-2016)
RS-422 Communications
For RS-422 the pairs must be shielded individually. The recommendations for the cable are:
 Resistance: < 100 Ω/km.
 Section: 0.22 mm2 (24 AWG)
 Characteristic impedance: 100 Ω.
 Maximum length: 1200 m.
3.9.2.5 Group 4 (Power Supply)
Electronic Power Supply

The power supply for the electronic elements is the main barrier between the existing disturbances in the power supply
line and the system. That is the reason why, this power supply is equipped with some additional filters to assure a good
EMC behaviour of the system. It is extremely important to keep the filter’s input wiring independent from the output wiring.
Polarization.
The output of the polarizing power supplies follows the same route in the field as the digital signals in which they are used,
so the treatment is the same as for a field input/output signal. In some projects, supplementary filters are installed. In
these cases the wiring should be independent for the filter’s input and output.
Figure 3-12. Polarizing power supply output.
Auxiliary
The auxiliary power supply and its wirings do not have any galvanic connection to Saitel DP, so they should be sufficiently
separated from each other (independent gutters and layout) in order to prevent possible disturbances to reach the Saitel
DP wiring itself. In some projects, supplementary filters are installed. In these cases, the wiring should be independent for
the filter’s input and output.
Filtering
Generally, a filter will be included as a means to reinforce the protection of the power supply of the electronic elements.
The use of filters for the polarizing power supply is optional.
The polarizing power supply should never be combined with the power supply for electric elements. The protecting filter
cannot be shared in any case, as the polarizing power supply goes to field with the rest of inputs/outputs. As shown in the
figures, an incorrect connection of the polarization power supply reduces the effect of the protection barriers.

Rev 3.2 (21-12-2016)
Figure 3-13. Example of incorrect connections of the polarization power supply.
3.9.2.6 Group 5 (Earth Connection)
General Recommendations
 The cable section used should be have the appropriate size for each installation, and earthing braid should be used
whenever possible.
 The equipment or cabinet need to have a ground wire in a given point in order to guarantee a low impedance for the
rest of the elements. Horizontal copper bars, as well as vertical cooper bars (whenever possible) should be
assembled. All metal pieces of the equipment shall be connected to the protection earth. If metal cabinets are used,
the cabinet's walls can also be used to distribute the EMC earth.

Rev 3.2 (21-12-2016)
Figure 3-14. General scheme of a CORRECT earth connection.
Earth Connection for Human Safety

 All metal elements need to be connected to the protection earth.
 All connections must be established through a dedicated cable and connected to the main earth connection bar of
the cabinet.
 A “cascading” earth connection of the elements is not allowed, as the earth disconnection of one element would
leave other elements within the cabinets without an earth connection. Figure 3-14 shows a correct connection, in
which all metal elements are connected through a dedicated cable to the earth-connection bar. In Figure 3-15 the
two earth connection cables are joined together to simplify the connections, resulting in an incorrect earth
connection.
Figure 3-15. General scheme of an INCORRECT earth connection.

Rev 3.2 (21-12-2016)
Earth Connection to avoid Electromagnetic Disturbances (EMC)

 The connections to metal parts (which are earth connected) must be rather short.
 Earth distribution will be done using the shortest cable lengths as possible. It is very relevant that EMC earth-
connection cables are as short as possible, therefore the entire cabinet metal surface will be used for the
connection.
 The electronic elements with metal coating, such as power supplies, must be earth connected in two points. Firstly,
they are connected to the protection earth using a cable with section enough, linking the earth terminal and the
earth-connection bar. Secondly, there is a second cable linking the earth terminal to the closest metal surface (as
shown in the previous figures through the power supply elements).
 It is recommended to use flexible earthing braid for mobile earth parts (such as the cabinet’s doors). The earthing
braid must be short but with a wide surface (the surface is an essential value in order to reduce high-frequency
disturbances).

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Chapter 4. Control Unit

4.1 Control Module (CPU)
The CPU performs control functions for the complete equipment, by centralizing the information acquired by other system
modules, and executing logical control programs, communication protocols and user-specific applications. The master
CPU polls the slave modules in the chassis through two internal asynchronous serial communication channels at a speed
of 1.5 Mbps. Every 2 ms the CPU polls the next slave module.
There are two models:
 SM_CPU866
 SM_CPU866e
4.2 SM_CPU866 Module

4.2.1 General Description
The following figure shows a schematic front view:
This module consists of:

 A controller block.
 Memory banks.
 Communication channels.
 A power supply manager.
 A lithium battery.
 An indication block.
Figure 4-1. SM_CPU866 - Front view.
Controller Block
The controller block integrates an MPC866 microcontroller from the PowerPC family. Characteristics:
 32-bit architecture.
 4 + 4 KB code and data cache.
 Compact-Flash controller.
 Up to 4 Fast-Ethernet communication ports.
Memory Banks and File Systems

Memory banks are made up by:
 SDRAM memory for executing programs.
 FLASH memory. This memory type is composed by two zones accessible for the user:
o /bf: Boot sector. It is a general purpose unit where ISaGRAF and other applications are located.
o /flash: Operating system’s kernel and binControllers. More information about these elements in the
manual “Configuration and Startup of Saitel DP")
 /nvRam: Non-volatile SRAM memory with a Lithium battery for data backup. This memory is usually used for data
storage.

Rev 3.2 (21-12-2016)
 /c: Compact- Flash memory (optional). This memory isn't soldered to the circuit board but is removable.
Conceptually it is similar to a hard disk and the capacity is much higher than that of other memory areas. It is usually
used when the databases are very large or logs or event recording are required (SOE)
NOTICE
The installation of Compact-Flash cards over 4 GB is NOT recommended.
Communication Channels
The available communication channels are:
 CON. Console channel for monitoring and diagnostics.
 COM1. Asynchronous isolated RS-232 communication channel with modem control. This channel allows integrating
an additional signal for synchronization (PPS) through the DCD signal.
 COM2. Asynchronous isolated RS-232 communication channel with modem control.
 COM3-COM4. RS-232 communication channels which can operate in synchronous mode as well in asynchronous
mode.
 ETH1-4. Up to 4 Fast-Ethernet communication ports which operate as 10BaseT and 100BaseT self-management
capabilities.
The next table shows the available ports and functionality in the module SM_CPU866:
Port Communications Connector Function

CON Serial RJ-45 Console.
GPS and MSAC (Arbitration and switching control module for redundant
COM1 Serial RJ-45
systems). Asynchronous communication with modem control.
COM2 Serial RJ-45 Asynchronous communication with modem control.
COM3 Serial RJ-45 Synchronous and asynchronous communications with modem control.
COM4 Serial RJ-45 Synchronous and asynchronous communications with modem control.
ETH1 Ethernet RJ-45 Copper (10/100BaseT auto-negotiation )
ETH2 Ethernet RJ-45 Optional. Copper (10/100BaseT auto-negotiation )
Table 4-1. SM_CPU866 – Communication ports.
Additional communication channels can be added by using SM_SER modules.
Power Supply Manager

This module supports a redundant power supply through the interconnecting backplane. The power supply manager
provides the adequate power levels, as well as reset and failure indications to assure the correct system’s performance.
Lithium Battery
The SM_CPU866 module includes a Lithium battery to backup the data in NVRAM memory in case of a power loss. The
module includes a mechanism of rearmament of the battery, so that when the battery is connected, it solely begins to be
effective once the module is connected to backplane and it is power-on. The battery is able to maintain the NVRAM data
during approximately 4 months and it is not rechargeable.
NOTICE
For releases prior to B9 of the SM_CPU866 module, if after to be power-on the CPU this one is going to be
disconnected during a long period of time it recommends to extract the battery.
For B9 and later, we can disconnect the battery using switch 5, located on the back of the module. (ON  The battery
is connected / OFF  The battery is disconnected).
Indicators
The indications block provides the following information:
 PWR: Correct power supply of the module.

Rev 3.2 (21-12-2016)
 RUN: Application status.

 FAIL: Fault detected in the RTU.
 DIO: There is at least a module out of order.
 BAT: Battery status (see use of switch 5 in the document TE-00-0000-CYP-F700, “Configuration & Startup of Saitel
DP").
 ONL: CPU status (online/offline). It is off in systems without redundant CPU.
 SYN: Synchronization status.
Furthermore, each communication channel has two LEDs. For serial channels, these LEDs indicate
transmission/reception. For Ethernet channels, they indicate link/activity.
4.2.2 Internal Plate

The general aspect of the internal plate, with the door open, is shown in the Figure 4-2.
Figure 4-2. SM_CPU866 – Internal plate (when the door is open).
4.2.3 Code Uploading and Configuration

The SM_CPU866 module has the following factory preloaded elements:
 The startup software "BootRom" allows downloading files via TFTP and setting the initial IP address.
 The VxWorks operating system.
NOTICE
From revision B7 of the SM_CPU866 module, a VxWorks release previous to VxW_09:12:03:16:29:46 CANNOT be
used.
 The default IP address is "172.0.0.1". The user can connect to this IP address from the configuration software
Easergy Builder or from any other FTP client software.
As for the configuration, in the back of the module there is a group of switches as is shown in the figure:

Rev 3.2 (21-12-2016)
Figure 4-3. CPU configuration switches.
 Switch 9 position configures the console communications rate: ON  19.200 bps and OFF  38.400 bps.
 Only for revision B9 of the SM_CPU866 and later, switch 5 is used for connection / disconnection of the
battery.
 The remaining switches haven't got any associated functionality and should be in OFF state.
The document TE-00-0000-CYP-F700, "Configuration & Startup of Saitel DP" details the steps to configure the CPU.
4.2.4 Diagnostic & Troubleshooting

The module’s diagnostics can be performed in two different ways:
 Remotely, through the Saitel Webtool.
 Locally, using the console.
For further information about the diagnostics procedure, please refer to the document TE-00-0000-CYP-F700,
"Configuration & Startup of Saitel DP ".
PWR RUN FAIL DIO BAT ONL SYN Description
Normal state of the CPU.

In a system with redundant CPU the led ONL is On for the CPU
ONLINE. In a system with external synchronization, the led SYN
is On if the CPU is synchronized and is off in other case.
No power supply.
No running application or DOING_WELL has not been configured

for supervision.
RTU in fail. This led is associated to the supervision signal

FAIL_RTU.
DOING_WELL signal must be defined in STATUS table as
destination for supervision. Important: The field INIT VALUE for
this signal must be 1.
Diagnostic error in at least one I/O module. The led DIA of the I/O
module in fail should be On too (except for previous revision to
DA of the module SM_DO32T). Is possible that the module isn’t
inserted on the bus. If the module remain out of the bus, the led
DIO is off. If the module is inserted on the bus, the led DIO blinks.
An I/O module is missing on the bus. When you re-install the

module, the led DIO blinks for about 40 seconds and if all is fine,
will remain on.
Low battery or not installed. See the instructions in this manual for
replacement and battery recycling.
 Blinking  On  Off

Rev 3.2 (21-12-2016)
4.2.5 Technical Specifications

SM_CPU866 - Basic-Performance CPU
Hardware Specifications
Processing unit. Micro PowerPC / 100 MHz
Architecture. 32 bits.
FLASH memory. 12 or 16 MB. (Depending on ordering options).
Static RAM memory. 4 MB.
Static backup RAM memory. Built-in Lithium battery.
Dynamic RAM memory. 32 or 128 MB. (Depending on ordering options).
Compact-Flash memory. Internal, optional. (Depending on ordering options).
(The installation of cards over 4 GB is NOT recommended).
RTC. High accuracy, < 7 ppm / ºC derivation.
Console channel (CON). Simple RS-232 connector (38,400-8-N-1) with isolation.
Communications channel COM1 and COM2. Complete isolated RS-232 connector, max. 38,400 bps.
Communications channels COM3 and COM4. Complete RS-232 connector, synchronous and asynchronous support, 300-
38,400 bps.
ETH1 channel. Fast-Ethernet 10/100BaseT.
ETH2, ETH3 and ETH4 channels. Fast-Ethernet 10/100BaseT. (Depending on ordering options).
Communications with acquisition modules. RS-485 and via backplane, Profibus-DP, 1.5 Mbps.
Communications with SM_SER. Via backplane, internal bus 1.5 Mbps.
Maximum number of modules SM_SER 8.
Field channel connections RJ-45.
Software Specifications
Operating System VxWorks
External synchronization. Using GPS through COM1 / Protocol / SNTP (accuracy of ms)
Discrimination time between events. 1 ms
Supervision. Watchdog.
Standard Compliance
CE Mark
See paragraph 9.2.
Electromagnetic Compatibility (EMC).
Electromagnetic immunity (EN 61000-6-2):
Electrostatic discharges (EN 61000-4-2). ±8 kV contact and ±15 kV air (Level 4).
Radiated, radio-frequency (EN 61000-4-3). 10 V/m (Level 3).
Radiated, radio-frequency (ANSI C37.1). 1 V/m/MHz from 10 kHz to 25 MHz (AM).
Radiated, radio-frequency (ANSI C37.90.2). 35 V/m/MHz from 25 MHz to 1000 MHz (FM).
EFT burst (EN 61000-4-4). ±4 kV/5kHz in power lines (Level 4).
Surge (EN 61000-4-5). ±4 kV in power lines and ±2 kV in I/O lines (Level 4).
Common mode RF (EN 61000-4-6). 10 VRMS from 150 kHz to 80 MHz (Level 3).
Magnetic field (EN 61000-4-8). 30 A/m at 50 Hz (Level 4).
Pulse magnetic field (EN 61000-4-9). 10 A/m at 50 Hz (Level 3).
Voltage drops and power faults (EN 61000-4-11). 0% voltage supply, 20 ms (Level 0).
Oscillatory wave (ANSI C37.90.1). 1 MHz at ±2.5 kV.
Electromagnetic emission (EN 61000-6-4):
Radiated emission (EN 55011). From 30 MHz to 1000 MHz (Class A).
Radiated emission (ANSI C37.1). At 1 m from 10 kHz to 1000 MHz
Conducted emission (ANSI C37.1). <1.5% Vpp voltage supply from 1 kHz to 10 kHz.
Harmonics limits (EN 61000-3-2, IEC 61000-4-7). Class A.
Electric Safety
General requirements (IEC 255-1). Compliant with all the standard's requirements.
Dielectric rigidity (IEC 60255-5). Isolation >100 MΩ, 2 kVRMS.
Impulse voltage (IEC 60255-5). ±2 kV in AC or DC power.
Environmental
Cold test (IEC 60068-2-1). -10 ºC during 16 h.
Dry heat test (IEC 60068-2-2). +55 ºC during 16 h.
Vibration test (IEC 60068-2-6). @ 2 g, from 9 to 350 Hz.
Mechanical chock test (IEC 60068-2-27). @ 15 g, 11 ms.
Cyclic humid heat (IEC 60068-2-30). From 25 ºC to 55 ºC with 95% RH, 2 cycles of 24 h.

Rev 3.2 (21-12-2016)
SM_CPU866 - Basic-Performance CPU

Ordering Options

Rev 3.2 (21-12-2016)
4.3 SM_CPU866e Module


 An encryption block.
 Memory banks.
 Communication channels.
 A power supply manager.
 A lithium battery.
Figure 4-4. SM_CPU866e - Front view.
The SM_CPU866e is fully backwards compatible with all Saitel DP elements, including backplanes, acquisition modules
and others CPUs. It is backward compatible with another SM_CPU866e or SM_CPU866.
Controller Block
The controller block integrates an P1021 microcontroller from the Freescale QorlQ family, which gives to this module a
greater power of processing and better capabilities of communication than the SM_CPU866 model. The P1021 processor
integrates, among others, the following characteristics.
 Dual high-performance 32-bit cores, built on Power Architecture® technology (533 MHz up to 800 MHz clock
frequency).
 TCP/IP acceleration, quality of service, and classification capabilities.
 Double-precision floating-point support.
 USB 2.0 connectivity (Host).
 32 KB + 32 KB data cache for each core and 256 KB of L2 cache.
 SD, MMC and SDHC devices up to 32 GB are allowed.
 10/100/1000 Mbps Gigabit-Ethernet ports.
 Reset button.
 Watchdog output.
 Synchronization:
o By GPS, using COM1 (SM_CPU866 compatible).
o Terminal for IRIG-B signal (standard 200-04, 002, 003, 006 and 007 codes).
o IEEE® 1588 PTP support for synchronization by Ethernet.
Encryption Block
The P1021 microcontroller Integrates a security engine (SEC 3.3.2). The SEC is a modular and scalable security core
optimized to process all the algorithms associated with IPsec, IKE, SSL/TLS, iSCSI and SRTP. Although it is not a
protocol processor, the SEC is designed to perform multi-algorithmic operations (for example, 3DES-HMAC-SHA-1) in a
single pass of the data. The version of the SEC used in the P1021 is specifically capable of performing single-pass
security cryptographic processing for SSL 3.0, SSL 3.1/TLS 1.0, IPSec and SRTP.

Rev 3.2 (21-12-2016)
Memory Banks
Memory banks are made up by:
 32-bits DDR3 SDRAM memory (512 MB ) for executing programs.
 Non-volatile SRAM memory (4 MB) with a Lithium battery for data backup.
 NOR flash memory of 128 MB (64 MB + 64 MB).
 NAND flash memory of 128 MB.
The SM_CPU866e module’s memory can be expanded through a SD/MMC card for those applications requiring a greater
capacity. Additionally, a USB 2.0 port is available for massive storage devices connection.
NOTICE
SD cards up to 32 GB have been tested.
Communication Ports
The available communication ports are:
 CON. Console port for monitoring and diagnostics.
 COM1. Asynchronous isolated RS-232 communication port with modem control. This channel allows integrating an
additional signal for synchronization (PPS) through the DCD signal.
 COM2. Asynchronous isolated RS-232 communication port with modem control.
 COM3-COM4. Asynchronous RS-232 communication port with modem control.
 ETH1 and ETH2: Gigabit-Ethernet communication ports using copper. They allow 10BaseT(Ethernet),
100BaseTX(Fast-Ethernet) and 1000BaseT(Gigabit-Ethernet) communications .
 ETH3/ETH3_FX and ETH4/ETH4_FX: Gigabit-Ethernet communication ports using copper (RJ-45) or fiber optic
(SFP type).
o Copper ports (ETH2 and ETH3) allow 10BaseT(Ethernet), 100BaseTX(Fast-Ethernet) and
1000BaseT(Gigabit-Ethernet) communications.
o Fiber optic ports (ETH2_FX and ETH3_FX): SFP-based (Small Form-Factor Pluggable). They allow
communications 100FX(Fast-Ethernet), 1000baseLX(Gigabit-Ethernet) and 1000base-SX(Gigabit-
Ethernet) communications
WARNING
The Ethernet ports 3 and 4 can be used with fiber optic or copper, but never at the same time. You can use:
 ETH3 and ETH4 / ETH3_FX and ETH4 / ETH3 and ETH4_FX / ETH3_FX and ETH4_FX
The next table shows the available ports and functionality in the module SM_CPU866e:
Port Communications Connector Function

CON Serial RJ-45 Console.
GPS and MSAC (Arbitration and switching control module for redundant
COM1 Serial RJ-45
systems). Asynchronous communication with modem control.
COM2 Serial RJ-45 Asynchronous communication with modem control.
COM3 Serial RJ-45 Asynchronous communications with modem control.
COM4 Serial RJ-45 Asynchronous communications with modem control.
ETH1 Ethernet RJ-45 10/100/1000BaseT copper with auto-negotiation.
ETH2 Ethernet RJ-45 10/100/1000BaseT copper with auto-negotiation.
RJ-45 (ETH3) 10/100/1000BaseT copper with auto-negotiation.
ETH3 Ethernet
LC (ETH3-FX) 1000Base-LX, 1000Base-SX or 100Base-FX fiber optic
RJ-45 (ETH4) 10/100/1000BaseT copper with auto-negotiation.
ETH4 Ethernet
LC (ETH4-FX) 1000Base-LX, 1000Base-SX or 100Base-FX fiber optic.
Table 4-2. SM_CPU866e – Communication ports.
Additional communication channels can be added by using SM_SER modules.

Rev 3.2 (21-12-2016)
Power Supply Manager

This module supports a redundant power supply through the interconnecting backplane. The power supply manager
provides the adequate power levels, as well as reset and failure indications to assure the correct system’s performance.
Lithium Battery
The SM_CPU866e module includes a Lithium battery to backup the data in SRAM (NVRAM) memory in case of a power
loss. The module includes a mechanism of rearmament of the battery, so that when the battery is connected, it solely
begins to be effective once the module is connected to backplane and it is power-on.
On a continuous power supply fault, the battery is able to maintain the NVRAM data during approximately 4 months (with
an environmental temperature around 20 ºC). Have in account that this time could be different depending on the
temperature
In the other hand, the battery has a self-discharge depending on the environmental temperature:
Environmental Self-discharge ratio
temperature (each year)
20 °C 1%
40 °C 4%
70 °C 32%
80 °C 64%
WARNING
The battery is NOT rechargeable.
Indicators
 PWR: Correct power supply of the module.
 RUN: Application status.
 FAIL: Fault detected in the RTU.
 DIO: There is at least a module out of order.
 BAT: Battery status (see use of switch 5 in the document TE-HG-0000-CYP-F700, “Configuration & Startup of Saitel
DP").
 ONL: CPU status (online/offline). It is off in systems without redundant CPU.
 SYN: Synchronization status.
 GP1 – GP4: 4 general purpose indicators. For current revision of the module, these indicators haven't a function.
Furthermore, each communication channel has two LEDs. For serial channels, these LEDs indicate
transmission/reception. For Ethernet channels, they indicate link/activity.
The section 4.3.3 describes the meaning of the each indicator.

The general aspect of the internal plate, with the door open, is shown in the Figure 4-5.

Rev 3.2 (21-12-2016)
Figure 4-5. SM_CPU866e – Internal plate (when the door is open).
4.3.3 Code Uploading and Configuration

The SM_CPU866e module has the following factory preloaded elements:
 The startup software "BootRom" allows downloading files via TFTP and setting the initial IP address.
 The Linux operating system.
The default IP address is "10.1.1.1". The user can connect to this IP address from the configuration software Easergy
Builder or from any other FTP client software.
As for the configuration, in the back of the module there is a group of switches (see Figure 4-3).
 Switch 9 position configures the console communications rate: ON  19.200 bps and OFF  38.400 bps.
 Switch 5 is used for connection / disconnection of the battery.
 The remaining switches haven't got any associated functionality and should be in OFF state.
The document TE-HG-0000-CYP-F700, "Configuration & Startup of Saitel DP" details the steps to configure the CPU.

The module’s diagnostics can be performed in two different ways:
 Remotely, through the Saitel Webtool.
 Locally, using the console.
For further information about the diagnostics procedure, please refer to the document "Configuration & Startup of Saitel
DP ".

Rev 3.2 (21-12-2016)
PWR RUN FAIL DIO BAT ONL SYN Description
Normal state of the CPU.

In a system with redundant CPU the led ONL is On for the CPU
ONLINE. In a system with external synchronization, the led SYN
is On if the CPU is synchronized and is off in other case.
No power supply.
No running application or DOING_WELL has not been configured

for supervision.
RTU in fail. This led is associated to the supervision signal

FAIL_RTU.
DOING_WELL signal must be defined in STATUS table as
destination for supervision. Important: The field INIT VALUE for
this signal must be 1.
Diagnostic error in at least one I/O module. The led DIA of the I/O
module in fail should be On too (except for previous revision to
DA of the module SM_DO32T). Is possible that the module isn’t
inserted on the bus. If the module remain out of the bus, the led
DIO is off. If the module is inserted on the bus, the led DIO blinks.
An I/O module is missing on the bus. When you re-install the

module, the led DIO blinks for about 40 seconds and if all is fine,
will remain on.
Low battery or not installed. See the instructions in this manual for
replacement and battery recycling.
NOTICE
Leds GP1, GP2, GP3 and GP4 without function.

SM_CPU866e – High-Performance CPU
Processing unit. Freescale QorlQ Dual™ P1021E
Clock frequency 800 MHz.
Architecture. 32-bit Power Architecture® e500v2
FLASH memory (NOR) 128 MB
FLASH memory (NAND). 128 MB
Static RAM memory. 4 MB.
Static backup RAM memory. Internal lithium battery.
Dynamic RAM memory (DDR3). 512 MB.
RTC High accuracy, < 7 ppm / ºC derivation.
Security engine SEC 3.3.2 (XOR acceleration).
Supported cryptographic algorithms. 3DES, AES, MD5/SHA, RSA/ECC, and FIPS deterministic RNG.
Processing Single pass encryption/message authentication
Security protocols IPsec, SSL y SRTP
Console port (CON). Simple isolated RS-232 (38.400-8-N-1).
COM1 port Asynchronous isolated RS-232 connector, max. 38,400 bps (GPS
COM2 port. connection)
COM3 and COM4 ports. Asynchronous isolated RS-232 connector, max. 38,400 bps.
Asynchronous RS-232, max. 38.400 bps.

Rev 3.2 (21-12-2016)
SM_CPU866e – High-Performance CPU

ETH1 port. 10/100/1000BaseT copper with auto-negotiation
ETH2 port. 10/100/1000BaseT copper with auto-negotiation
(ETH3 or ETH3-FX) and (ETH4 or ETH4-FX) ports. Copper or fiber optic (Both cannot be connected simultaneously):
 10/100/1000BaseT copper with auto-negotiation
 Fiber optic: 1000Base-LX, 1000Base-SX, 100Base-FX
USB port 2.0 (Host)
SD slot SD, MMC and SDHC devices up to 32 GB.
Communications with acquisition modules. RS-485 and through the backplane, Profibus-DP, 1.5 Mbps.
Communications with SM_SER. Through the backplane, 1.5 Mbps (internal bus).
Maximum number of modules SM_SER. 8.
Communications channel COM1 – COM4. RJ-45. A category 5 cable or better must be used. (100 m. max)
ETH1-4 channels RJ-45. A category 5 cable or better must be used. (100 m. max)
ETH3-FX and ETH4-FX communication channels LC-Duplex connector for SFP module (not provided). The recommended
models for each standard are (consult others):
 100BaseFX (MMF, distance < 2 km en full-duplex)  HFBR 57E0APZ (M.B.: 500MHz for km at 1300 nm).
 1000BaseSX (MMF 62.5 µm, distance < 220 m)  AFBR-5715ALZ (M.B.: 160 MHz for km at 850 nm)
 1000BaseSX (MMF 50 µm, distance < 500 m)  AFBR-5715ALZ (M.B.: 400 MHz for km at 850 nm)
 1000BaseLX (SMF 50 µm, distance < 5 km)  AFCT-5715ALZ
Operating system Linux
Cybersecurity CyberSecurity Brick software integrated
External synchronization. GPS through COM1 / Protocol (PTP1588)/SNTP (accuracy of ms)/IRIG-B
Supported IRIG_B Standard 200-04 (002, 003, 006 and 007 codes)
Discrimination time between events. 1 ms.
Supervision. Watchdog.
Standard Compliance
CE Mark
See paragraph 9.2.
Electromagnetic Compatibility (EMC).
EFT burst (EN 61000-4-4). ±4 kV/5kHz in power lines (Level 4).
Surge (EN 61000-4-5). ±4 kV in power lines and ±2 kV in I/O lines (Level 4).
Electric Safety
General requirements (IEC 255-1). Compliant with all the standard's requirements.
Impulse voltage (IEC 60255-5). ±2 kV in AC or DC power.
Environmental
Ordering Options

Rev 3.2 (21-12-2016)
4.4 Control Module Cabling

The control module receives the information from the other modules through the backplane. Only the RJ-45 ports located
on the module front panel, which are used to communicate with other systems, need to be wired. The SM_CPU866e
module has two fiber ports, but the user does not need additional information about the wiring of these ports. The pin
numbers in the RJ-45 connector are the same for all cases:
Figure 4-6. RJ-45 connector.
CON. Console Port.

The console port is a 3-wire RS-232 serial channel with galvanic isolation. The console channel gives access to the OS
command console. Please, refer to the document”Configuration & Startup of Saitel DP" for details about the these
commands.
Pin Description I/O
1 No connected -
2 No connected -
3 Data transmission O
4
CON GND -
5
6 Data reception I
7 No connected -
8 No connected -
Table 4-3. CPU - Pinout of the port CON.
If we use a DB-9 connector for the PC connection, the cabling should be as follows:
Figure 4-7. PC connection (with DB-9 connector on the PC end).
We can configure the port speed using switch 9 on the back of the module. When the CPU starts, the console window will
show a message informing the user about the selected speed: "Dip-Switch 9 OFF: Set to 38400 CONSOLE_TTY."
COM1. Serial Port

The serial port COM1 wiring is described below:
Pin Description I/O
1 /CTS I
2 /DTR O
4 -
COM1 GND
5 -
6 Data reception I
7 /DCD or /DSR I
8 /RTS O
Table 4-4. CPU - Serial port COM1.

Rev 3.2 (21-12-2016)
COM2. Serial Port

The serial port COM2 wiring is described below:
Pin Description I/O
1 /CTS I
2 No connected -
COM2 4
GND -
5
6 Data reception I
7 Reserved (no connect) -
8 /RTS O
Table 4-5. CPU - Pinout of the serial port COM2.
COM3 and COM4. Serial Ports

The serial ports COM3 and COM4 wiring is described below:
Pin Description I/O
1 CTS I
2 /DTR O
4 -
COM3 GND
5 -
COM4
6 Data reception I
Reserved (SM_CPU866 and SM_CPU866FX) -
7
/DCD (only SM_CPU866e) I
8 /RTS O
Table 4-6. CPU - Pinout of the ports COM3 and COM4.
NOTICE
In a redundant system, if you want to interconnect both control modules by using serial ports, you can use any of them
(except for the console port) and the cabling should be as follows (the other pins are not connected):
SM_CPU866 - ETH1 - ETH4. Fast-Ethernet Ports

The SM_CPU866 module can integrate up to 4 10/100BaseT Fast-Ethernet ports (ETH1 to ETH4). All ports have
10BaseT and 100BaseT self-management capabilities (see pinout in Figure 4-6).
Pin Description I/O
1 TD+ O
2 TD- O
3 RD+ I
4 -
ETHx Reserved
5 -
6 RD- I
7 Reserved -
8 Reserved -
Table 4-7. SM_CPU866 - Ethernet ports pinout.

Rev 3.2 (21-12-2016)
SM_CPU866e – ETH1 and ETH2. Copper Gigabits-Ethernet Ports.

The SM_CPU866e module has no mounting options for Ethernet ports, so there are always 4 ports available.
The ports ETH1 and ETH2 are 10/100/1000BaseT with self-management capabilities (see pinout in Figure 4-6).
Pin Name Description TIA/EIA 568A TIA/EIA 568B
1 BI_DA+ Bi-directional pair A+ (TX) White/Green White/Orange
2 BI_DA- Bi-directional pair A- (TX) Green Orange
3 BI_DB+ Bi-directional pair B+ (RX) White/Orange White/Green
4 BI_DC+ Bi-directional pair C+ Blue Blue

ETHx
5 BI_DC- Bi-directional pair C- White/Blue White/Blue
6 BI_DB- Bi-directional pair B- (RX) Orange Green
7 BI_DD+ Bi-directional pair D+ White/Brown White/Brown
8 BI_DD- Bi-directional pair D- Brown Brown

Table 4-8. SM_CPU866e - Pinout of the copper ports ETHx.
TIA/EIA 568A and TIA/EIA 568B are the two color codes used for wiring eight-position RJ45 modular plugs. Both are
allowed under the ANSI/TIA/EIA wiring standards. The only difference between the two color codes is that the orange and
green pairs are interchanged.
WARNING
Each network segment cable length may be up to 100 m.
SM_CPU866e – ETH3/ETH3_FX and ETH4/ETH4_FX. Copper/Fiber Optic Gigabits-Ethernet Ports.

The ports ETH3 and ETH4 can be wired using copper or fiber optic:
 Connectors ETH3 and ETH4: Copper connection (10/100/1000BaseT). The pinout is shown in the previous section.
(In this case, the connectors ETH2-FX and ETH3-FX mustn’t be used).
 Connectors ETH3-FX and ETH4-FX. Fiber optic connection (1000BASE-LX, 1000BASE-SX, 100BASE-FX) using
SFP module with LC connector. The type of fiber to be installed must be according to the standard used and it will
depend on the internal connector installed. (In this case, the connectors ETH3 and/or ETH4 mustn’t be used)
Into the ports ETH3-FX and ETH4-FX a SFP modules could be mounted :
Figure 4-8. SFP modules to install in the ports ETH3-FX and ETH4-FX of SM_CPU866e.
These connectors are mounted into the available hole at the bottom of the module. Both connectors must be installed with
the ejector inwards. the next figure shows the connectors when they are mounted:
Figure 4-9. Fiber optic connectors installed.
The SFP modules by “Avago Technologies” manufacturer are recommended. The recommended models are detailed
below:

Rev 3.2 (21-12-2016)
 Model: AFCT-5715ALZ
o Compliant to IEEE 802.3Z Gigabit Ethernet (1.25 GBd) 1000BASE-LX.
o 1310 nm long wave laser.
o Link lengths at 1.25 GBd:
 0.5 to 550 m, 50 µm MMF (multimode fiber).
 0.5 to 550 m, 62.5 µm MMF.
 0.5 to 10 km, SMF.
 Model: AFBR-5715ALZ
o Compliant to IEEE 802.3 Gigabit Ethernet (1.25GBd) 1000BaseSX.
o 850 nm Vertical Cavity Surface Emitting Laser (VCSEL).
o Link lengths at 1.25 GBd:
 2 to 550 m, with 50/125 µm fiber.
 2 to 275 m, with 62,5/125 µm fiber.
 Model: HFBR 57E0APZ
o Full compliance with the optical performance requirements of 100Base-FX version of IEEE802.3u.
o Operates with 62.5/125 µm and 50/125 µm multimode fiber, uses a reliable 1300 nm LED source.
o Distance up to 2 Km.
NOTICE
The fiber optic used must be compliant with the modal bandwidth required for the standards.
SM_CPU866e – USB Port.

This module has available an USB 2.0 port type A (female) for massive storage devices allowing download information to
external devices:
Pin Name Cable color Description
1 VBUS Red O
2 D- White O
USB
3 D+ Green I
4 GND Black -
Table 4-9. SM_CPU866e – USB port.

Rev 3.2 (21-12-2016)
Chapter 5. Communication Modules

5.1 SM_SER Module
All information included in this manual about SM_SER refers to modules with P/N M581. For modules with P/N M512,
please refer to earlier versions of this manual.

The SM_SER serial communication module expands the control module communication capability. This module is linked
with the CPU through a bidirectional high-speed channel.
The SM_SER module supports asynchronous communications (byte oriented).
The following figure show a schematic front view:
The SM_SER module consists of:

 8 communication ports with independent isolation.
Figure 5-1. SM_SER - Front view.
Communication Blocks
Each module includes eight completely configurable communication channels with the following features:
 Input protection against electromagnetic disturbances.
 Galvanic isolation through iCouplers® avoiding the use of optocouplers.
 6 signals for each channel: TX, RX, RTS, CTS, DTR and DSR.
 RS-232 / RS-485 / RS-422 signal levels. All channels are configurable as RS-232, RS-485 or RS-422.
Controller Block
The controller block supports the following functions:
 Parameterization and control of the communication blocks.:
o Asynchronous communication.
o Configurable transmission/reception.
o Configurable transmission rate up to 38,400 bps.
o Configurable stream (number of bits, start, stop and parity bit).
o RTS/CTS flow control.
o Transmission/reception of complete streams.
 Block indication update with the new block module information.
 Communication bus Interface to connect with the CPU.

Rev 3.2 (21-12-2016)
Indications Block
 DIA: General diagnostics.
 RUN: Operation status.
 ST1 - ST2: One diagnostic LED for each block of 4 communication channels.
 TXx, RXx, RTSx and CTSx: Thirty-two indications (green color) for the channel signals. Four indications for each
channel to display the “Transmission” status (TX1-TX8), “Reception” (RX1-RX8), “Request to Send “(RTS1-RTS8)
and “Clear to Send” (CTS1-CTS8).
Apart from these indicators, there are four LEDs, one for each communication channel, as shown in Figure 5-2. They have
the following meanings:
Figure 5-2. SM_SER - Communication indicators.
 RX: Receiving data through the communication channel.

 TX: Transferring data through the communication channel.
 RTS and CTS: Indications of these two RS-232 protocol signals.

The general aspect of the internal plate, with the door open, is shown in the following picture:
Figure 5-3. SM_SER – Internal plate.
5.1.3 Communication Protocols

The SM_SER module supports multiprotocol, which enables different protocols (physical level) to be associated to each
channel. It operates as a communication multiplexer, so all the processing is done by the CPU.

Rev 3.2 (21-12-2016)
5.1.4 Installation
About the installation of SM_SER, these elements are described below:
 Cabling.
 Light emitting indicators.
5.1.4.1 Cabling
All connectors are RJ-45 type. The module integrates 8 channels supporting RS-232, RS-485 or RS-422 communications:
The pin numbers in the RJ-45 connector are the same in all cases (see Figure 4-6). The SM_SER module does not
include LED indicators in the connector base.
RS-232 Communication Channels

The 8 communication channels can be configured as full RS-232 with galvanic isolation.
Pin Description I/O
1 /CTS I
2 /DTR O
RS-232 4 -
GND
5 -
6 Data reception I
7 /DCD I
8 /RTS O
Table 5-1. SM_SER - RS-232 port pinout.

All channels can be configured as RS-485 half-duplex or full-duplex.
Pin Description I/O
1 RX(-) I/O
3 TX(+) I/O
RS-485 4 -
GND
5 -
6 RX(+) I/O
8 TX(-) I/O
The cabling for a half-duplex communication is:

 Join wires 1 and 8.
 Join wires 3 and 6.
 Join wires 4 and 5 to GND.

All channels can be configured as RS-422.
Pin Description I/O
1 RX(-) I
3 TX (+) O
RS-422 4 -
GND
5 -
6 RX(+) I
8 TX(-) O

Rev 3.2 (21-12-2016)
Termination Resistor (RS-485 y RS-422)

In a communication bus (RS-485 or RS-422) the devices installed on the ends of the bus must include a termination
resistor. Usually, this is the case of the SM_SER module where its communications ports exclude the possibility of
installing this resistance.
For each communications port that works as end of the bus, a terminal with termination resistors (120 to 150 Ω) for both
reception and transmission channels must be installed.
NOTICE
It is important to note that for each bus, two and only two devices must function as termination of the bus.
There are two recommended models for these auxiliary terminal (both by Phoenix Contact):
FL-PP-RJ45-SC VIP-3/PT/RJ45
For example, the following figure shows how you can use a 5-pin terminal for RS-422 and for RS-485 in full-duplex
communications:
Figure 5-4. SM_SER – Termination resistor in full-duplex communications.
For RS-485, using half-duplex communications, a 3-pin terminal must be used:
Figure 5-5. SM_SER – Termination resistor in half-duplex communications.
NOTICE
These figures should be understood as an example. You can use some other mechanism that provides you with the
same functionality.
To connect the SM_SER port with the auxiliary terminal, if the bus is RS-422 or full-duplex RS-485, the cable to be used is
shown in the following figure:
Figure 5-6. SM_SER – Cable for connection SM_SER-Auxiliary terminal in full-duplex communications.
If the communication is half-duplex RS-485 the cable is shown in the following figure:

Rev 3.2 (21-12-2016)
Figure 5-7. SM_SER - Cable for connection SM_SER-Auxiliary terminal in half-duplex communications.
5.1.5 Configuration
To have the maximum multiplexer capability, it is possible to use a SM_BPX9 or SM_CHX9 as backplane, an external
power supply and one CPU. This configuration allows installing 8 SM_SER modules.
NOTICE
The SM_SER module only can be installed in the same backplane that the CPU module.
5.1.5.1 Identification
The configuration switches are located at the module’s rear panel (see Figure 4-3). The first four switches are used to
configure the multiplexer's address. The position allocation is shown in the following table:
4 3 2 1 Address
OFF OFF OFF ON 1
OFF OFF ON OFF 2
OFF OFF ON ON 3
OFF ON OFF OFF 4
OFF ON OFF ON 5
OFF ON ON OFF 6
OFF ON ON ON 7
ON OFF OFF OFF 8
Table 5-4. SM_SER - Addressing in serial multiplexer.
The speed is selected using switches 9 to 11, as detailed in paragraph 2.6 of this manual. The selected speed must be the
same as the setting for the CPU.
The rest of the switches should to be set to the OFF position.
5.1.5.2 Data Configuration

Easergy Builder is used to configure the functions of the communication channels and protocols. We can found all details
about this procedure in the manual “Configuration & Startup of Saitel DP”.

Rev 3.2 (21-12-2016)

In the front panel of the module, a indicator DIA and a indicator RUN are located. During the power up the module runs an
autocheck. If there isn`t any failure, the indicator DIA is turned off while the indicator RUN shows the configuration state. If
there is an internal failure, the indicator DIA is turned on.
Then, front indicators inform about the module status according to the following table:
DIA RUN STx RXx TXx RTSx CTSx Description
The module is configured and communication with the CPU.
Configuration error. Is probably the module has assigned the address 0.
(2)
Configuration error. Is probably the module has assigned an address

(1) greater than 8.
On when Request To Send (RTS) or Clear To Send (CTS) signals are

activated. The channel has to been set with ENABLE for “RTS Control”. If
the channel has been set as TOGGLE (or AUTO for revision DA and
later), these leds are only on if there is transmission/reception. These leds
are off for any other situation.
Firmware error. It is necessary to load the software again.

(2)
Hardware failure.
(3)
Hardware failure on the block x.

(2)
Receiving data.
Transmitting data.
The actions to be taken are:

1. If the module address does not match with any configured address, this module will not be able to exchange data with
the control unit. Check if the module address is correct (see paragraph 3.6 in this manual). The module may also be
switched off.
2. Check the wiring, if correct, contact the support service.

SM_SER - Communications Multiplexer
Number of channels. 8.
Isolation between channels. 2 kVRMS.
Signal level. RS-232 / RS-485 / RS-422.
Signals. Rx - Tx - RTS - CTS - DTR - DSR.
Field connection (channel connections). RJ-45.
Functional Specifications
Transmission features. Configurable per channel.
Transmission rate. Up to 38,400 baud.
Transmission / Reception. By complete streams.

Rev 3.2 (21-12-2016)
SM_SER - Communications Multiplexer

Standard Compliance
CE Mark
See paragraph 9.2.
Electromagnetic Compatibility (EMC)
EFT burst (EN 61000-4-4). ±4 kV/5 kHz in communication lines (Level 4).
Surge (EN 61000-4-5). ±2 kV in AC or DC power (Level 3).
Special level: Voltage falls of 30% during 10 ms.
Voltage falls of 60% during 100 ms.
Voltage falls of >95% during 5000 ms.
Oscillatory wave
(IEC 60255-22-1, according to EN 61000-4-12). Class III, ±2.5 kV/5 kHz (Level 3).
Radiated emission (ANSI C37.1). At 1 m from 10 kHz to 1000 MHz.
Conducted emission (EN 61000-3-3). Compliant with voltage fluctuations and flicker.
Electric Safety
General requirements (EN 61010-1). Compliant with all the standard's requirements.
Dielectric rigidity (IEC 60255-5). 2 kVRMS.
Impulse voltage (IEC 60255-5) ±2 kV in AC or DC power and ±1 kV in I/O lines.
Environmental
Ordering Options

Rev 3.2 (21-12-2016)
Chapter 6. Power Supplies

6.1 Saitel DP Power Supplies
Saitel DP includes power supplies modules which have been specifically designed to power the electronic components on
the backplanes and provide the required polarization voltage to the acquisition modules.
Saitel DP backplanes also support external power supplies. For more information, please refer to chapter “Backplane
Modules” of this manual.
There are two power supplies in the Saitel DP family:
 SM_PS
 SM_PS40
6.2 SM_PS Module

DANGER
HAZARD OF ELECTRIC SHOCK, ELECTRIC ARC OR BURNS
 Only qualified personnel should install this equipment. Such work should be performed only after reading this
entire set of instructions and checking the technical characteristics of the device.
 NEVER work alone.
 Turn off all power supplying this equipment before working on or inside it. Consider all sources of power, including
the possibility of backfeeding.
 Always use a properly rated voltage sensing device to confirm that all power is off.
 Start by connecting the device to the protective earth and to the functional earth.
 Screw tight all terminals, even those not in use.
Failure to follow these instructions will result in death or serious injury.
The main function of the SM_PS module is to power the modules through the backplane. The SM_PS power supply
module has the same format as the rest of Saitel DP modules.
Optionally, the SM_PS module can provide one auxiliary power supply output to perform the polarizations which are
required for the operation of electronic components, and the field interfaces of the acquisition modules.

 A power supply block.
Figure 6-1. SM_PS - Front view.

Rev 3.2 (21-12-2016)
Power Supply
The power supply block converts the input power into a regulated 5.4 VDC output to power the electronic control
components of the modules within the backplane. Additionally, this block can provide an auxiliary voltage for the
polarization of the I/O interfaces of the acquisition modules. The functional features of this block are:
 Compliance with EMC standards for industrial environments.
 Direct and/or alternating input current ranging, depending on the model. (See technical specifications table)
 Direct auxiliary current with different values depending on the model. (See technical specifications table).
 Galvanic isolation.
 Power supply failure reporting to the CPU.
Indication
 WDOG: Not used in new systems. For compatibility with older systems only.
 PWR: Status of the main power.
 AUX: Status of the auxiliary power.

The general aspect of the internal plate, with the door open, is shown in the Figure 6-2. The user interface consists of:
 Connector for monitoring signals.
 Connector for the auxiliary output.
 Fuse for power supply input (F1).
 Fuse for auxiliary output (F2).
 Connector of power supply input.
 Three state indicators.
Figure 6-2. SM_PS - Internal front view (when the door is opened).

Rev 3.2 (21-12-2016)
6.2.3 Installation
WARNING
When you install the SM_PS module into the backplane, you must be sure that it is not connected to the power. If the
user doesn’t follow this instruction, an electric spark will be generated injuring the equipment.
The SM_PS module supports two different power supply configurations:

 Simple. The module is installed in the first slot (left-hand-side) in the backplane.
 Redundant. Two identical modules are used. The modules are mounted side by side from the first slot (left-hand-
side) in the backplane.
6.2.3.1 Connection
Figure 5-2 shows the connectors listed in this section.
Input Power Supply
DANGER
Depending on the ordering options, there could be a hazard of electric if you come into contact with this connector.
Input power supply voltage through a three-pole front connector with the following features:
 Model: Phoenix Contact Combicon: 3-MC 1.5/2 –ST-5.08.
 Screw-terminals for cables with a maximum 2.5 mm2 gauge.
 Two terminals for direct or alternating current (1,2).
 A terminal for Protection Earth (GND).
Following table shows how the connection has to be made depending on the type of current (alternate or direct):
Connector POWER Direct current Alternate current
1 Positive Phase
2 Negative Neutral
GND GND GND
NOTICE
The power supply input is protected against inversion of polarity.
Auxiliary Output
The auxiliary output is available through a front two-pole connector with the following features:
 Model: Phoenix Contact Combicon: 2-MC 1,5/2 –ST-3.5.
 Two terminals for direct current (with the labels “-“ and “+”).
Cable type
Rigid or flexible. 0.14-1.5 mm / 28-16 AWG (For PE, 5 mm).

The following table specifies the module states indicated by the indicators in the front:

Rev 3.2 (21-12-2016)
WDOG PWR AUX Description
(2) If auxiliary output is not mounted in the module, the indicator AUX must be off. If this
auxiliary output is mounted, revise fuse F2. If it is correct, consult the support service.
Main power supply failure. The module is not powered.

(1)
Without function for new systems
 On  Off
The corrective actions are:

1. Revise fuse F1. If it is correct, consult the support service.
2. If auxiliary output is not mounted in the module, the led aux must be off. On the other hand, please, revise fuse F2. If
it is correct, consult the support service.
6.2.5 Technical Specification

SM_PS – Basic-Performance Power Supply
Input voltage level.
 Option A2 24 / 48 VDC (Range: 19,2 VDC - 57,6 VDC).
 Option A4 48 VRMS (Range: 38.4 VRMS – 57.6 VRMS) or 110 / 125 VDC (Range: 88 VDC - 132 VDC)
 Option A5 110/125/220 VRMS (Range: 92 VRMS - 264 VRMS) or 220 VDC (Range:176 VDC – 264 VDC)
Input/Output isolation. 3 kVRMs
Input/Ground isolation. 1.5 kVRMS
Output/Ground isolation. 500 VRMS
Surge inrush current:
 Option A2 < 27 A
 Option A4 < 31A
 Option A5 < 37 A
Main output power. 5.4 VDC (25 W).
Auxiliary output power. - / 24 / 48 VDC (25 W) (Depending on ordering options).
Output protection. Permanent short-circuit.
Input protection. Overvoltage and overcurrent.
Maximum cutting time. 50 ms
Fuse F1 (main power output) 7 A. Type T (delay-action) and cylindrical body 5x20 mm
Fuse F2 (auxiliary power output) 4 A. Type T (delay-action) and cylindrical body 5x20 mm
Connection. Front connectors.
Typical efficiency (full load) > 70%
Standard Compliance
CE Mark
See paragraph 9.2.
EFT burst (EN 61000-4-4). ±4 kV/5 kHz in AC or DC power (Level 4).
Surge (EN 61000-4-5). ±4 kV in AC or DC power and ±2 kV in I/O lines (Level 4).

Rev 3.2 (21-12-2016)
SM_PS – Basic-Performance Power Supply

Oscillatory wave
(IEC 60255-22-1, according to EN 61000-4-12) Class III, ±2.5 kV/5 kHz (Level 3).
From 150 kHz to 30 MHz (Class A).
Electric Safety
General requirements (EN 61010-1 and IEC 255-1). Compliant with all the standard's requirements.
Impulse voltage (IEC 60255-5). ±5 kV in AC or DC power and ±4 kV in I/O lines.
Environmental
Cyclic humid heat (IEC 60068-2-30) From 25 ºC to 55 ºC with 95% RH, 2 cycles of 24 h.
Ordering Options

Rev 3.2 (21-12-2016)
6.3 SM_PS40 Module

DANGER

 A power supply block.
Figure 6-3. SM_PS40 – Front view.
All features of this module are identical to the SM_PS module, except the followings:
 The fuses of main power and auxiliary power outputs can’t be directly manipulated.
 Only one input voltage option is available.
 There are several power output levels available for main output and auxiliary output. See the technical specification
table.
Power Supply
The power supply block converts the input power into a regulated 5.4 VDC output to power the electronic control
components of the modules within the backplane. Additionally, this block can provide an auxiliary voltage for the
polarization of the I/O interfaces of the acquisition modules.
The functional features of this block are:
 Compliance with EMC standards for industrial environments.
 Direct and/or alternating input current ranging, depending on the model. (See technical specifications table)
 Direct auxiliary current with different values depending on the model. (See technical specifications table).
 Galvanic isolation.
Rev 3.2 (21-12-2016)
 Power supply failure reporting to the CPU.
Voltage Level Test on the Bus

A test device (two terminals) is available on the module SM_PS40. It allows to check the level voltage on the bus using a
voltmeter.
In order to make the system work properly, the voltage has to be 5.4 ± 0.2 VDC.
Indication
 WDOG: Not used in new systems. For compatibility with older systems only.
 PWR: Status of the main power.
 AUX: Status of the auxiliary power.

The general aspect of the internal plate, with the door open, is shown in the Figure 6-4. The user interface consists of:
Figure 6-4. SM_PS40 - Internal front view (when the door is opened).
6.3.3 Installation
WARNING
When you install the SM_PS module into the backplane, you must be sure that it is not connected to the power. If the
user doesn’t follow this instruction, an electric spark will be generated injuring the equipment.
The SM_PS40 module supports two different power supply configurations:

 Simple. The module is installed in the first slot (left-hand-side) in the backplane.
 Redundant. Two identical modules are used. The modules are mounted side by side from the first slot (left-hand-
side) in the backplane.

Rev 3.2 (21-12-2016)
6.3.3.1 Connection
Figure 6-4 shows the connectors listed in this section.
Input Power Supply
DANGER
Input power supply voltage through a three-pole front connector with the following features:
 Model: Phoenix Contact Combicon: 3-MC 1.5/2 –ST-5.08.
 Two terminals for direct or alternating current (1,2).
 A terminal for Protection Earth (GND).
Following table shows how the connection has to be made depending on the type of current (alternate or direct):
Connector POWER Direct current Alternate current
1 Positive Phase
2 Negative Neutral
GND GND GND
NOTICE
The power supply input is protected against inversion of polarity.
Auxiliary Output
The auxiliary output is available through a front two-pole connector with the following features:
 Model: Phoenix Contact Combicon: 2-MC 1,5/2 –ST-3.5.
 Two terminals for direct current (with the labels “-“ and “+”).
Cable type
Rigid or flexible. 0.14-1.5 mm / 28-16 AWG (For PE, 5 mm).

WDOG PWR AUX Description
If auxiliary output is not mounted in the module, the indicator AUX must be off. If this
auxiliary output is mounted, revise fuse F2. If it is correct, consult the support service.
Main power supply failure. The module is not powered.
Without function for new systems
 On  Off

Rev 3.2 (21-12-2016)

SM_PS40 Module – High-Performance Power Supply
Hardware Features
Input voltage level.
 Option A2 24 VDC (Rango: 19.2 VDC – 28.8 VDC)
 Option A3 48 VDC (Rango: 38.4 VDC – 57.2 VDC)
 Option A4 110 / 125 VDC (Range: 88 VDC - 132 VDC)
Input/Output isolation. 3 kVRMS.
Input/Ground isolation. 1.5 kVRMS.
Output/Ground isolation. 500 VRMS.
Main output power. 5.4 VDC (40 W at 25 ºC / 30 W at 70 ºC)
Auxiliary output power. - / 24 VDC (25 W) (Depending on ordering options).
Output protection. Permanent short-circuit.
Input protection. Overvoltage / Overcurrent.
Maximum cutting time. 50 ms.
Surge inrush current
 Opción A2 12 A
 Opción A3 10 A
 Opción A4 10 A
Connection. Front connectors.

Typical efficiency (full load) 85%
Standard Compliance
CE Mark
See paragraph 9.2
Electric Safety
Isolation (IEC 60255-5) <100 MΩ,
Dielectric rigidity (IEC 60255-5). 2 kVRMS.
Environmental
Cold test (IEC 60068-2-1). 40 ºC during 16 h.
Ordering Options

Rev 3.2 (21-12-2016)
Chapter 7. Acquisition Modules

7.1 Input/Output Modules
Saitel DP integrates different types of modules which are used to perform input (indications, status and measurements)
and output (commands and instructions) functions.
These modules are:
 SM_DI32. 32-digital input module.
 SM_DO32T. 32-digital outputs to transistor module.
 SM_DO16R. 16-digital outputs to relay module.
 SM_AI16. 16-analog input module.
 SM_AI8AO4. Combined analog-signal module with 8 inputs and 4 outputs.
7.2 SM_DI32 Module. 32 Digital Inputs

DANGER
The SM_DI32 module includes 32 configurable and high-precision digital inputs. These signals can be configured as:
 Simple and double state indications.
 Slow pulse counters, activated by simple edge and double edge. A maximum of 25 inputs can be configured as slow
counters.
The figure below shows a schematic front view:

 Two blocks with 16 digital inputs each.
 A control block.
Figure 7-1. SM_DI32 - Front view.

Rev 3.2 (21-12-2016)
Digital Input
Each digital input block admits 16 signals performing the following functions:
 Input protection against electromagnetic disturbance.
 In the sampling procedure, 3 samples are taken at the same millisecond and the highest is noted.
 Automatic input test.
 External polarization. (See technical specifications table).
 Automatic polarization test.
 Two common contacts.
 Galvanic isolation through optocoupler.
Controller Block
 Advanced processing of digital inputs, including the management of simple or processed inputs with chronological
register and time stamping.
 Digital filtering.
The following parameters can be set for each input:
 Change memory time.
Indication
The SM_DI32 module integrates 36 indicators with the following functions.
 ST1 - ST2: Indicates whether there is a polarization fault in the specific signal block.
 DIn: Indicates whether input n is active or inactive.
7.2.2 Installation
There are two options to connect field signals to SM_DI32 module, option C1 (terminal connection), and option C2 (flat-
ribbon connection). Above, this manual describes the major differences between these two connection options.
This section provides information about the following issues:
 Configuration.
 Polarization.
 Commons.
 Connection diagrams.
7.2.2.1 Configuration
The configuration of the micro-switches, shown in chapter “Installation” of this manual, also applies to this module, except
for pins 8 and 12.
7.2.2.2 Field Connection

DANGER
The following figure shows the pin allocation of the connectors for option C1. The connector B1 is located at the top and
connector B2 at the bottom.

Rev 3.2 (21-12-2016)
Figure 7-2. SM_DI32 - Direct connection (option C1).
Where:
 DIxx: Digital input xx.
 COMn: Common terminal group n.
 +Vi: Polarization positive terminal.
 -Vi: Polarization negative terminal.
7.2.2.3 Polarization
The digital inputs need a polarization voltage for operation.
The 32 inputs of the SM_DI32 module are divided into two 16-input polarization blocks. Each block can be polarized
independently but both must have the same value.
The polarization of V1 and V2 voltages is supplied externally from the module. Even in case there are two power supplies
available, it is possible to use only one power supply by bridging the terminals, depending on the chosen connection
option, that is, C1 or C2.
 For option C1, the V1(+) terminal (B1) must be interconnected with the V2(+) terminal (B2) and the V1(-) terminal
(B1) with the V2(-) terminal (B2).
 For option C2, the V+ and V- terminals of the power supply must be interconnected with the V+ and V- terminals of
the terminal block.
NOTICE
Check operation of the jumpers S1 and S2 in the section 7.2.3.
7.2.2.4 Commons
Field receivers are powered with the positive of the polarization voltage (V1 and V2). The best way of doing this is through
the common outputs of the module's connectors.
 For option C1, these commons are present in COMx terminal of each connector (poles 9 and 18).
 For option C2, please, consult the electrical schematic for the used terminal block.
WARNING
The commons wiring should be independent for each of the blocks. This means that the commons of the different
blocks can’t be joined, and must be assigned to the correct block.
If the signal polarization is given correctly through the commons, the module may to do a comprehensive test of the input
signals. In order to enable the verification of digital inputs, the module must be powered up with the micro-switches 8 and
12 in the back of the module set to the OFF position
In those cases where the receivers cannot be polarized through their respective commons (recommended option), they
must be directly powered through the positive of the polarization voltage (V1 or V2). In this case the module must boot
with the switches 8 and 12 in the ON position

Rev 3.2 (21-12-2016)
7.2.2.5 Field Connection Schematics (Option C1)
Figure 7-3. SM_DI32 - Field connection schematics (option C1).
Figure 7-4. SM_DI32 - Field connection schematics (option C2).
7.2.3 Terminal Blocks

DANGER
Depending on the ordering options, there could be a hazard of electric if you come into contact with the terminals of
these devices.
Some terminal blocks within the Saitel DP platform have been specifically designed to be used with the SM_DI32 module.
These terminal blocks can help to simplify wiring, use thicker cables for field signals and provide different connectors than
those offered by the option C1.
Terminal blocks are connected to the module using two 20-way flat-ribbon cables. The module is polarized through the
terminal block.
These terminal blocks have two jumpers S1 and S2 (one for each block of signals, see Figure 7-6 and Figure 7-10) which
allow the following:
 S1 and/or S2 to the left: This is the normal position of the jumpers. In this case the common of the corresponding
block is polarized by the voltage that reaches the module through the flat ribbon. The module controls the inputs
polarization through internal wiring.
 S1 and/or S2 to the right: The common of the corresponding block receives the supply voltage directly, so that the
module is not involved in the digital inputs polarization.

Rev 3.2 (21-12-2016)
NOTICE
When the SM_DI32 module is configured with microswitches 8 and 12 in the OFF position, if an external voltage is
supplied to the inputs of the modules (not provided by the COMn outputs), the module will detect an inconsistency
during the boot test. The module will be blocked and the indicators associated with each input and the LED DIA will
flash.
In the electrical diagrams of the terminal blocks which are described below (Figure 7-6 and Figure 7-10) we can see the
normal position of these jumpers.
7.2.3.1 Standard Terminal Block (TB_DI32/E)

Technical Specifications of TB_DI32/E
Manufacturer Phoenix Contact
Reference (code) T-UM 45/TELVENT/32DI-E (0625774)
Assembly DIN rail.
Rated voltage UN. SM_DI32 rated voltage.
Maximum current capacity per branch. SM_DI32 rated current.
Number of wires. 40.
Dimensions (width x height). 130,5 x 45 mm.
Field connector. 42-way flat-ribbon PCB connector.
Figure 7-5. TB_DI32/E Connector type. PCB header with fixing screws.
Standard terminal block. Min / Max wire cross section (rigid). 0.2 / 4 mm2.
Min / Max wire cross section (flexible). 0.2 /2.5 mm2.
Min / Max wire cross section AWG/kcmil. 24 / 12.
Module connector. 2x20-way flat-ribbon cable.
Connector type. Pluggable.
Used with modules. SM_DI32.
Electrical diagram
Figure 7-6. TB_DI32/E - Electrical diagram – Phoenix Contact.
Technical Specifications of TB_DI32E

Manufacturer Weidmüller
Reference (code) TB_DI32E (7508000582)
Assembly DIN rail
Rated voltage UN. SM_DI32 rated voltage.
Maximum current capacity per branch. SM_DI32 rated current.
Number of wires. 40
Figure 7-7. TB_DI32E Dimensions (width x height). 133 x 45 mm.
Standard terminal block. Field connector. 42-way flat-ribbon PCB connector.
Connector type. PCB header with fixing screws.
Min / Max wire cross section (rigid). 0.5 / 6 mm2.
Min / Max wire cross section (flexible). 0.6 / 4 mm2.
Used with modules. SM_DI32

Rev 3.2 (21-12-2016)
Electrical diagram
Figure 7-8. TB_DI32E – Electrical diagram - Weidmüller.
7.2.3.2 Normalized Terminal Block (TB_DI32/N)
Technical Specifications of TB_DI32/N

Reference (code) T_UM 45/TELVENT/32DI (0625773)
Assembly DIN rail
Rated voltage UN. SM_DI32/B rated voltage.
Maximum current capacity per branch. SM_DI32/B rated current.
Dimensions (width x height). 234.6 x 45 mm.
Figure 7-9. TB_DI32/N Connector type. Knife disconnect terminals with fixing screws.
Normalized terminal block Min / Max wire cross section (rigid). 0.2 / 4 mm2.
Min / Max wire cross section (flexible). 0.2 / 2.5 mm2.
Used with modules. SM_DI32 .
Electrical diagram
Figure 7-10. TB_DI32/N - Electrical diagram – Phoenix Contact.

Rev 3.2 (21-12-2016)
Technical Specifications of TB_DI32N

Reference (code) TB_DI32N (7508000581)
Assembly DIN rail
Dimensions (width x height). 245 x 45 mm.
Figure 7-11. TB_DI32N Connector type. Knife disconnect terminals with fixing screws.
Normalized terminal block. Min / Max wire cross section (rigid). 0.5 / 6 mm2.
Electrical diagram
Figure 7-12. TB_DI32N – Electrical diagram - Weidmüller.
7.2.3.3 Terminal Block with LED Indicators (TB_DI32/L)
Technical Specifications of TB_DI32/L

Reference (code) T-UM 72/SA-32ED 150DC/L (E0625728)
Assembly DIN rail
Dimensions. 60 x 90 x 228 mm.
Figure 7-13. TB_DI32/L Field connector. 43-way flat-ribbon PCB connector.
Terminal block with LED indicators Connector type. Knife disconnect terminals with fixing screws.
Module connector. 40-way flat-ribbon cable.

Rev 3.2 (21-12-2016)
Electrical diagram
Figure 7-14. TB_DI32/L – Electrical diagram – Phoenix Contact.
Technical Specifications of TB_DI32DL

Reference (code) TB_DI32DL (7508000589)
Assembly DIN rail
Number of wires. 40
Figure 7-15. TB_DI32DL
Dimensions. 240 x 87 mm.
Terminal block with LED indicators.
Connector type. Knife disconnect terminals with fixing screws.
Module connector. 40-way flat-ribbon cable.
Electrical diagram
Figure 7-16. TB_DI32DL – Electrical diagram - Weidmüller.
7.2.4 Diagnostics & Troubleshooting

The module integrates an input verification mechanism to detect hardware faults. The verification is performed when
powering the module or when resetting the field polarization after a polarization interruption.
This verification system monitors polarization voltages, the general status of the module and communications.

Rev 3.2 (21-12-2016)
 RUN: Will flash every 0.5 s if the value of the allocated slave Profibus address is zero or higher than 96. It will also
flash if the module is not correctly setup by the CPU. If the above mentioned conditions do not occur and the
module switches to data exchange mode with the CPU through Profibus, the LED RUN will remain on. In any other
case, it will be off.
 DIA: Is switched on after a module’s reset, and switched off if the power-up process is successfully completed. This
LED will flash every 0,5 seconds if the ST1 or the ST2 indicators are active, and when the verification system
detects any faulty digital input.
 ST1: Is switched on when there is a polarization fault in the first block of 16 inputs (1-16).
 ST2: Is switched if there is a polarization fault in the second block of 16 inputs (17-32).
 Din: There is a LED associated to each digital input and it is switched on when the associated digital input is active.
This LED will flash every 0.5 s if a fault in the associated input is detected (by the self-verification mechanism).
The front indicators inform about the module status according to the following table:
DIA RUN STx DIx Description
Polarization and configuration OK. The module is in service. Digital input x is

deactivated.
The Profibus slave number assigned to the module is 0 or greater than 96.
The CPU may have detect a problem into the configuration, for example, the
(1) type of the module is different.
Module not configured or disconnected. If the module is connected, the

(2) address is between 1 and 96 but this address haven’t been configured.
Digital input x is active.
It lights briefly during startup. If it remains on, an error has been detected in
(3) the firmware or during the startup process.
Polarization failure in block x.

(4) (4)
Fail detected in the verification mechanism for the digital input x.

(5) (5)
 Blink  On  Off

1. Check the type of the module and the selected address with the rear switches.
2. Check that the module is properly inserted in the bus and that the assigned address is correct.
3. Contact the support service.
4. If the ST1 or ST2 indicator is flashing, the polarization voltage is lower than the minimum required. In this case, the
LED DIA is also flashing.
5. If any of the DIn indicator is flashing, it means the input self-verification system has detected a fault in the associated
input. In this case, the DIA LED is also flashing. This verification mechanism requires cabling to be performed as
indicated in section 7.2.2. If the wiring is correct, contact the support service.

Rev 3.2 (21-12-2016)

SM_DI32 - 32 Digital Inputs
Number of inputs. 32.
Inputs per common. 8.
Inputs per polarization block. 16.
Polarization voltage (PV). 12 / 24 / 48/ 125 VDC.
Input current per signal. 1 mA at nominal polarization.
Nominal value at level “1”. 80% PV at 120% PV.
Nominal value at level “0”. From 0 to 40% PV.
Polarization range. From 80% PV to 120% PV
Polarization blocks isolation. By optocoupler 2.5 kVRMS.
Input test. In line.
Transient voltage protection (polarization) Peak pulse power dissipation 1500 W on 10/1000µs waveform.
Bidirectional.
Transient voltage protection (inputs) Peak pulse power dissipation 600 W on 10/1000µs waveform.
Bidirectional.
Field connection. Terminal/Flat ribbon
Digital input types. Status indication, single and double.
Slow pulse counters 32 bits, 40 Hz (single and double edge).
Maximum inputs as slow counters. 25.
Time stamping. 1 ms resolution.
Filtering time (TF). 0 – 255 ms.
Settling time (TS). 0 – 25500 ms.
Change memory time (TM) 0 – 2550 ms.
Standard Compliance
CE Mark
See paragraph 9.2.
EFT burst (EN 61000-4-4). ±4 kV/5 kHz in AC or DC power and I/O lines (Level 4).
Oscillatory wave
Oscillatory wave (ANSI C37.90.1). 1 MHz at ±2.5kV.


Rev 3.2 (21-12-2016)
SM_DI32 - 32 Digital Inputs

Electric Safety
General requirements (IEC 61010-1 and IEC 255-1). Compliant with all the standard's requirements.
Environmental
Cold test (IEC 60068-2-1). From -40 ºC during 16 h.
Dry heat test (IEC 60068-2-2). +85º C during 16 h.
Vibration test (IEC 60068-2-6). @ 2 g, From 9 to 350 Hz.
Ordering Options

Rev 3.2 (21-12-2016)
7.3 SM_DO32T Module. 32 Digital Outputs (Transistor)

All information included in this manual about SM_DO32T refers to modules with P/N M580. For modules with P/N M521,
please refer to earlier versions of this manual.

The SM_DO32T module provides 32 passive digital configurable outputs to transistor. According to IEC-60870-3, a
passive output is defined when the polarization source is external to the control equipment.
These signals can be:
 Single: pulsed (fixed time) or latched.
 Double: pulsed (fixed time) or latched.

 Two blocks with 16 digital outputs each.
 An advanced command safety mechanism.
Figure 7-17. SM_DO32T - Front view.
Digital Output
There are two independent acquisition blocks with a main connector each one for field connection. Each digital output
block admits 16 signals which perform the following functions:
 Permanent output checks.
 Command permission output.
 Overvoltage protection in output transistors.
 External polarization.
 Automatic polarizing test.
Controller Block
 Hot-swap functionality.
 Parameterization and control of digital output blocks.
 Advanced processing of digital outputs.
 The indication block is updated with the module status information.
 Interface with the Profibus communication bus to connect with the CPU.

Rev 3.2 (21-12-2016)
Indications
The SM_DO32T module integrates 36 indicators with the following functions:
 ST1 - ST2: Indicates whether there is a polarization fault in the corresponding signal block.
 DOn: Indicates whether input n is active or inactive.
More information in section 0.
7.3.2 Installation
The SM_DO32T module can be connected to the field using two different procedures defined by option C1 (terminal
connection), and option C2 (flat-ribbon connection). Chapter “Installation” describes the major differences between these
two connection options.
 Polarization.
 Commons.
7.3.2.1 Connectors
The following figure shows the pin allocation of the connectors for C1. The B1 connector is located at the top and the B2
connector at the bottom.
Figure 7-18. SM_DO32T - Direct connection (option C1).
Where:
 DOxx: Digital output xx.
 COMn: Common terminal group n.
 +Vi: Voltage, positive terminal.
 -Vi: Voltage, negative terminal.
Paragraph 7.3.2.5 shows the connection of the polarization terminal for option C2.
The digital outputs need an external polarization voltage for operation (see technical specifications table in section 7.3.4).
The 32 outputs of the SM_DO32T module are divided into two 16-output polarization blocks. Each block can be polarized
independently but both must have the same value. Both polarization are monitored in order to check if the voltage level is
into a valid range.

Rev 3.2 (21-12-2016)
The polarization of the V1 and V2 voltages is supplied externally from the module. Even though two power supplies are
option, that is, C1 or C2 (see section 7.3.2.3).
 For option C1, the 19(+) terminal (B1) must be interconnected with the 19(+) terminal (B2) and the 20(-) terminal
(B1) with the 20(-) terminal (B2).
 For option C2, see Figure 7-20.
7.3.2.3 Commons (Command Permission Outputs)

The polarization voltage is only applied to the receivers when there is a command in progress. Each acquisition block has
the capability to control the application of the polarization to the receivers or not. This polarization output is called a
permission or common.
The SM_DO32T module monitors status of the permission. A voltage presence in the permission when it has not been
requested is considered a compromised situation for the security. In this case, all commands are rejected..
 For option C1, these commons are present in the terminals 9 and 18 of each connector.
 For option C2, see Figure 7-20.
The following sections show the configuration of the connection terminals.
7.3.2.4 Field Connection Schematics (option C1)

To make the diagram as clear as possible, it only displays the wiring of the first block of digital outputs. The second block
shall be wired using analog outputs through COM2.
Figure 7-19. SM_DO32T - Field connection schematics (option C1).

Some terminal blocks within the Saitel DP platform have been specifically designed to be used with the SM_DO32T
module (option C2). These terminal blocks include 16 relays with different breaking capacities.
The SM_DO32T module includes, apart from the two flat-ribbon cable connectors, a 4-wire terminal connector – MC 1.5/4-
STF-3.81 (Phoenix Contact) – used to connect the polarization inputs.
This connector has the following pin assignments:
 Pin 1: Common output of block 1 (signals 1 to 16).
 Pin 2: V1+ positive polarization input.
 Pin 3: Common output of block 2 (signals 17 to 32).
 Pin 4: V2+ positive polarization input.
The wiring is carried out the following way:
 Flat-ribbon connectors: Connected using flat-ribbon cables to the relay terminal blocks.

Rev 3.2 (21-12-2016)
 Polarization. For each terminal block:

o The terminal block’s polarization negative input is connected to the negative output from the polarization
source.
o The terminal block’s polarization positive is connected to pin 1 (for connector 1) and pin 3 (for connector
2) of the SM_DO32T polarization connector.
o Pins 2 and 4 are to be connected to the positive output from the polarization source.
WARNING
In the terminal blocks, when jumper J1 is connected, the outputs would be polarized directly, bypassing the internal
safety mechanism to execute commands.
VERY IMPORTANT: The location of jumper J1 is marked in the electrical diagram for each terminal block and it must
be disconnected. It is recommended to cut the jumper’s pins to avoid mistakes.
Cabling schematic is depicted below:
Figure 7-20. Cabling of the SM_DO32T module connected to terminal blocks via flat-ribbon cables.

Rev 3.2 (21-12-2016)
7.3.2.6 Compact Terminal Block with Medium Breaking Capacity TB_DO16/S

Technical Specifications of TB_DO16/S
Reference (code) – 24 VDC T-UM 108/SA/16REL-G24/21 DP (0625738)
Reference (code) – 48 VDC T-UM 108/SA-16RELS-G48/21 DP (E0625747)
Assembly DIN rail
Rated voltage UN. 24 VDC / 48 VDC ±10% depending on the reference
Dimensions. 127.9 x 125.4 mm.
Input/output isolation. 2 kV, 50 Hz, 1 min.
Figure 7-21. TB_DO16/S
Field connector. Simple terminal connector – screwed.
Compact terminal block with 16
relays & medium breaking capacity Cross-section 0.2 - 2.5 mm2.
Polarization connectors. Cross-section 0.2 - 2.5 mm2.
Maximum sustained current per output. 5 A.
Maximum operating voltage. 250 VRMS.
Contact type. NO & NC available.
Module connector. 20-way DIN 41651 connector.
Consumption per channel (24 VDC) 35 mA.
Consumption per channel (48 VDC) 18 mA.
Service voltage. 24 VDC ± 10%.
Operate (set) time. 7 ms.
Release (reset) time. 3 ms.
Input circuit. Parallel protection diode.
Series protection diode per channel.
Used with modules. SM_DO32T
Electrical diagram
17 19
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 18 20 - +
J1
1 3 5 7 9 11 13 15
2 4 6 8 10 12 14 16
11 14 12 31 34 32 51 54 52 71 74 72 91 94 92 111 114 112 131 134 132 151 154 152
21 24 22 41 44 42 61 64 62 81 84 82 101 104 102 121 124 122 141 144 142 161 164 162
Figure 7-22. TB_DO16/S – Electrical diagram – Phoenix Contact.
These terminal blocks include 16 relays controlled by a SM_DO32T module as well as the polarization input. The input
signals are taken from a 20-way flat-ribbon DIN-41651 connector. These signals act on a set of 16 socket-mounted
switched relays. Each relay activation (low-level) is signalled by a green LED.
Each coil has an associated protection diode in disconnection. This diode is itself protected against polarity inversions by
additional diodes connected serially with each signal.
Outputs are given through 48 PCB terminal connectors admitting flexible wires with cross-sections up to 2.5 mm2.
For the external polarization, the device includes two PCB terminal connectors admitting wires with cross-sections up to
2.5 mm2 , a polarity inversion protection diode and a green LED to indicate voltage availability.
The 16 relays are placed in two separate rows to optimize the panel’s available surface.

Rev 3.2 (21-12-2016)
7.3.2.7 Terminal Block with Medium Breaking Capacity TB_DO16/T
Technical Specifications of TB_DO16/T

Reference (code) T-UM 108/SA-16SD 24VDC-S2 DPMT (2905729)
Assembly DIN rail
Rated voltage UN. 24 VDC ±10%.
Dimensions. 76 x 126 x 266 mm.
Field connector. Screw connection. Cross-section 0,2 - 2,5 mm2
Polarization connectors. Cross-section 0.2 – 2.5 mm2
Maximum sustained current per output. 5 A @ 40º C.
Figure 7-23. TB_DO16/T
Terminal block with 16 relays and Maximum operating voltage. 250 VRMS.
medium breaking capacity Contact type. Configurable NA or NC.
Consumption per channel. 35 mA.
Series protection diode per channel.
Used with modules SM_DO32T
These terminal blocks include 16 relays controlled by a SM_DO32T module as well as the polarization input. Breaking
capacity of the included relays is 16 A/250 VRMS and 16 A/30 VDC. These relays are used in applications that need to
switch loads of 48 VDC or lower voltages. These terminal blocks also include diodes to prevent current reflows between
relays, active output LED indications and enable the selection of ‘Normally Open’ or ‘Normally Closed’ behavior of each
relay.
Electrical Diagram
17 19
1 2 3 4 15 16 18 20
J1
K1 K2 K3 K4 K15 K16
NA NC NA NC NA NC NA NC NA NC NA NC
1 2 3 4 5 6 7 8 29 30 31 32 33 34
Figure 7-24. TB_DO16/T - Electrical diagram – Phoenix Contact.

Rev 3.2 (21-12-2016)
7.3.2.8 Terminal Block with 16 DO & High Breaking Capacity TB_DO16/P
Technical Specifications of TB_DO16/P

Reference (code) T-UM 108/SA-LSDS16 P&B-KDDP24T (0625757)
Assembly DIN rail
Rated Voltage UN. 12/24 VDC.
Dimensions. 512.54 x 125.4 mm.
I/O isolation. 2.5 kV, 50 Hz, 1 min.
Field connector. Knife disconnect terminals with PCB test point.
Figure 7-25. TB_DO16/P Cross-section 0.2 - 2.5 mm2.
Terminal block with 16 digital
Cross-section 0.2 - 2.5 mm2.
outputs and high breaking capacity
Maximum sustained current per output. 8 A.
Maximum operating voltage. 250 VRMS / 150 VDC.
Contact type. NO or NC, configurable.
Consumption per channel. 1.2 W.
Series protection diode per channel
Used with modules. SM_DO32T
These terminal blocks include 16 relays controlled by a SM_DO32T module as well as the polarization input. Breaking
capacity of these relays is 10 A/240 VRMS and 10 A/150 VDC. These relays are used in applications that need to switch
loads of voltages over 48 VDC. These terminal blocks also include diodes to prevent current reflows between relays, active
output LED indications and enable the selection of ‘Normally Open’ or ‘Normally Closed’ behavior of each relay.
Electrical diagram
17 19
1 2 3 4 15 16 18 20
J1
1 2 3 4 5 6 7 8 29 30 31 32 33 34
Figure 7-26. TB_DO16/P – Electrical diagram – Phoenix Contact.

Rev 3.2 (21-12-2016)

DIA RUN STx DOx Description
Normal status. The module is ready to run commands to field.

NOTE: If in this situation commands aren’t executed, please consult action
number 6.
Incorrect address assigned to the module (0 or greater than 96).

If the address is correct, the type of the module is different to the configured
(1) for this address (and a module with correct type and this address isn’t
inserted on the bus).

Digital output x activated.
Polarization failure without active digital output.

(4)
Polarization error and at least one active digital output.

(4) (4)
In this case, 8 digital outputs are blinking because a short-circuit has been
detected between two blinking signals or one blinking signal and the mass
(5) (5) line. All commands in the module are blocked.

1. Check the type of the module and the selected address with the rear switches.
4. If any of the ST1 and ST2 LEDs is On, the polarization voltage is lower than the minimum required. In this case, if
there is an active command, the led DIA is also blinking.
5. If any of the DOn indicators is flashing, it means the input self-verification system has detected a fault in the
associated output. In this case, the DIA indicator is also blinking.
The section “7.3.2.3” provides information about the SM_DO32T cabling procedure in order to prevent self-verification
conflicts. If the wiring is correct, then you should contact the support service.
6. Check the following:

 Each terminal block must be connected in the correct order. The terminal block associated to the upper
connector and lower connector have to be according to the wiring on the polarization terminal. See Figure
7-20.
 Can’t exist other module with the same address on the bus, on the other hand, commands will be blocked.

Rev 3.2 (21-12-2016)

SM_DO32T - 32 Digital Outputs (Transistor)
Number of outputs. 32 (2 blocks with 16 outputs each)
Number of commons. 2 (1 per block)
Number of polarization inputs. 2 (1 per block)
Polarization voltage (PV). 12 / 24 / 48 VDC
Polarization range. ±20% PV
Maximum output current (transistor). 500 mA (no simultaneous).
Isolation (between acquisition blocks). By optocoupler 2.5 kVRMS.
Isolation (between control and acquisition). By optocoupler 2.5 kVRMS.
Output and polarization test. Permanent.
Transient voltage protection (outputs and polarization). Peak pulse power dissipation 4,2 J (2 ms).
Undervoltage supply monitor (module) < 4.9 VDC.
Overvoltage supply monitor (module) > 6.5 VDC
Field connection. Terminal / Flat ribbon.
Processing of digital outputs. Pulsed (fixed time) .
Latched.
Single and double.
Safety mechanism. Auxiliary permission by block.
Software output verification.
Output timing. 100 - 25,500 ms.
Environmental Conditions
Operating temperature range. From -40 ºC to 70 ºC.
Humidity limit. 95%.
Coating. Standard coating. (Depending on ordering options).
Protection level. IP 20.
Standard Compliance
CE Mark
See paragraph 9.2.
Oscillatory wave

Rev 3.2 (21-12-2016)
SM_DO32T - 32 Digital Outputs (Transistor)

Electric Safety
Environmental
Ordering options

Rev 3.2 (21-12-2016)
7.4 SM_DO16R Module. 16 Digital Outputs (Relay)

The SM_DO16R module support up to 16 standalone outputs of the following types:
 Single: pulsed (fixed time) or preset (latched).
 Double: pulsed or preset.

 Two blocks with 8 digital outputs each.
 An advanced command safety mechanism.
Figure 7-27. SM_DO16R - Front view.
Digital Output
Each digital output block admits 8 signals which perform the following functions:
 Permanent output verification.
 Independent outputs.
 External polarization.
 Number of operations (resistive load) >30*106.
 Number of operations (L/R = 80 ms, 24 V / 1.25 A) > 2*105.
 Automatic polarization test.
Controller Block
 Parameterization and control of the digital output blocks.
 Advanced digital outputs processing.
 Updating the Indications block with the module status information.
 Interface with the Profibus communication bus to connect with the CPU.
Indications
The SM_DO16T module integrates 22 indicators with the following functions.
 ST1 - ST2: Indicates whether there is a polarization fault in the specific signal block. These LEDs work differently
depending on whether the outputs are configured in current or voltage.
Rev 3.2 (21-12-2016)
 DOn: Indicates whether the input n is active or inactive.

 COM: Indicates that an output is active in this block. There is two indicators, one per block of outputs.
7.4.2 Installation
The SM_DO16R can be connected to the field using two different procedures defined by option C1 (terminal connection),
and option C2 (flat-ribbon connection). The paragraph 3.9.1 in this manual describes the major differences between these
two connection options.
This section provides information about polarization, commons and cabling.

The following figure shows the pin allocation of the connectors for connection C1. The connector B1 is located at the top
and the connector B2 at the bottom.
Figure 7-28. SM_DO16R - Direct connection (option C1).
Where
 DOxx: Digital output xx.
 NC: Not connected.
 Mi. Command i
 +Vi: Polarization voltage positive terminal.
 -Vi: Polarization voltage negative terminal.
The digital outputs need a polarization voltage for operation (see technical specifications table in the section 7.4.4).
The 16 outputs of the SM_DO16R module are divided into two polarization 8-output blocks. Each block can be polarized
independently but both must have the same value.
The polarization of V1 and V2 voltages is supplied externally from the module. Even though two power supplies are
option, that is, C1 or C2.
 For the option C1, the B1/19(+) terminal must be interconnected with the B2/19(+) terminal and the B1/20(-) terminal
with the B2/20(-) terminal.
 For option C2, the V+ and V- terminals of power supply must be interconnected with the V+ and V- terminals of the
terminal block.
7.4.2.3 Commons (Command Permission Outputs)

In the SM_DO16R module the outputs to field are unpowered NO (“normally open”) contacts.
Apart from the sixteen output contacts, the option C1 has two additional outputs available in the module. These two
outputs are defined as Command 1 and Command 2, which correspond to a 8-output block respectively; internally, these
outputs are connected to the positive of each polarization voltage through the contact of a command relay. These relays
are activated automatically, providing there is an active output.
Rev 3.2 (21-12-2016)
Therefore, the field receivers can be powered with polarization voltage (V1 and V2) through the command outputs.
The connectors of Command 1 and Command 2 correspond to the B1-18 and B2-18 terminals, respectively. The option
C2 does not integrate the Command 1 and Command 2 outputs.
Figure 7-29. SM_DO16R - Field connection schematics (option C1).
Figure 7-30. SM_DO16R - Field connection schematics (option C2).
7.4.3 Terminal blocks

Some terminal blocks within the Saitel DP platform have been specifically designed to be used with the SM_DO16R
module. These terminal blocks can help to simplify wiring, use thicker cables for field signals and provide different
connectors than those offered by the option C1.
Terminal blocks are connected to the module using one 40-way flat-ribbon cable – divided in two 20-way cables to
connect the module. The module is polarized through the terminal block.

Rev 3.2 (21-12-2016)
7.4.3.1 Standard Terminal Block (TB_DO16/E)
Technical Specifications of TB_DO16/E

Reference (code) T-UM 45/16-RO-E (060307-04)
Assembly DIN rail
Rated Voltage UN. 60 VRMS/VDC (max).
Maximum current capacity per branch. 1 A.
Figure 7-31. TB_DO16/P Number of wires. 32.
Standard terminal block Dimensions 130.5 x 45 mm.
Field connector. 34-way PCB terminal connector.
Min/Max wire cross section (rigid). 0.2 / 4 mm2.
Min/Max wire cross section (flexible). 0.2 / 2.5 mm2.
Min/Max wire cross section AWG/kcmil. 24 / 12.
Module connector. Two 20-way flat-ribbon cable connectors.
Used with modules. SM_DO16R
The TB_DO16/E is a commercial terminal block manufactured by Phoenix Contact or Weidmüller, that converts two 20-
way flat-ribbon cables to field terminal connectors. This terminal block is DIN-rail mountable.
Electrical diagram
Figure 7-32. TB_DO16/E - Electrical diagram – Phoenix Contact.

Technical Specifications of TB_DO16E
Reference (code) TB_DO16E (7508000584)
Assembly DIN rail
Maximum current capacity per branch. 1,5 A.
Dimensions 115 x 45 mm.
Figure 7-33. TB_DO16E Field connector. 34-way PCB terminal connector.

Standard terminal block Connector type. PCB header with fixing screws.
Min/Max wire cross section (rigid). 0.5 / 6 mm2
Min/Max wire cross section (flexible). 0.5 / 4 mm2.
The TB_DO16E is a commercial terminal block manufactured by Weidmüller, that converts two 20-way flat-ribbon cables
to field terminal connectors. This terminal block is DIN-rail mountable.

Rev 3.2 (21-12-2016)
Electrical diagram
Figure 7-34. TB_DO16E – Electrical diagram – Weidmüller.
7.4.3.2 Normalized terminal block (TB_DO16/N)
Technical Specifications of TB_DO16/N

Reference (code) T-UM 45/16RO (060307-3)
Assembly DIN rail
Rated Voltage UN. 60 VRMS/VDC (max.)
Figure 7-35. TB_DO16/N Number of wires. 32.
Normalized terminal block Dimensions 194 x 45 mm
Min/Max wire cross section (rigid). 0,2 / 4 mm2.
Min/Max wire cross section (flexible). 0,2 / 2,5 mm2.
The TB_DO16/N is a commercial terminal block manufactured by Phoenix Contact that converts two 20-way flat-ribbon
cables to field terminal connectors. This terminal block is DIN-rail mountable. Connector type; knife disconnect terminals
using fixing screws.
Electrical diagram
Figure 7-36. TB_DO16/N - Electrical diagram – Phoenix Contact.

Rev 3.2 (21-12-2016)
Technical Specifications of TB_DO16N

Reference (code) TB_DO16E (7508000583)
Assembly DIN rail
Maximum current capacity per branch. 1,5 A.
Figure 7-37. TB_DO16N Dimensions 194 x 45 mm.
Normalized terminal block
Min/Max wire cross section (rigid). 0.5 / 6 mm2
Min/Max wire cross section (flexible). 0.5 / 4 mm2.
The TB_DO16N is a commercial terminal block manufactured by Weidmüller, that converts two 20-way flat-ribbon cables
to field terminal connectors. This terminal block is DIN-rail mountable.
Electrical diagram
Figure 7-38. TB_DO16N – Electrical diagram – Weidmüller.

Normal status. The module is ready to run commands to field.

If the address is correct, the type of the module is different to the configured
(1) for this address (and a module with correct type and this address isn’t
inserted on the bus).

Digital output x activated.

Rev 3.2 (21-12-2016)
Polarization failure without active digital output.

(4)
Polarization error and at least one active digital output.

(4) (4)
In this case, 8 digital outputs are blinking because a short-circuit has been
detected between two blinking signals or one blinking signal and the mass
(5) (5) line. All commands in the module are blocked.

1. Check the type of the module and the selected address (rear switches).
4. If any of the ST1 and ST2 LEDs is On, the polarization voltage is lower than the minimum required. In this case, if
there is an active command, the led DIA is also blinking.
5. If any of the DOn indicators is flashing, it means the input self-verification system has detected a fault in the
associated output. In this case, the DIA indicator is also blinking.
The section “7.3.2.3” provides information about the SM_DO32T cabling procedure in order to prevent self-verification
conflicts. If the wiring is correct, then you should contact the support service.
SM_DO16R - 16 Digital Outputs (Relay)

Number of outputs. 16.
Outputs per polarization block. 8.
Polarization voltage (PV). 12 / 24 / 48 VDC.
Polarization range. 80% VP.
Maximum output current. 16 A (relay), 5 A (terminals).
Output switching capacity:
 Resistive load. 125 VDC/450 mA, 48 VDC/1.4 A, 12-24 VDC/5 A.
 L/R = 20 ms. 125 VDC/150 mA, 48 VDC/500 mA, 24 VDC/2 A, 12 VDC/5 A.
 L/R = 40 ms 48 VDC/400 mA, 24 VDC/1.2 A, 12 VDC/5 A.
Isolation (polarization block). By optocoupler 2.5 kVRMS.
Isolation (between output and power). By optocoupler 2.5 kVRMS.
Output and polarization test. Permanent.
Transient voltage protection (outputs). Peak pulse power dissipation 600 W on 10/1000µs waveform.
Bidirectional.
Processing of digital outputs. Pulsed (fixed time) .
Preset (latching).
Single.
Double.
Safety mechanism. Auxiliary permission by block.
Software output verification.
Hardware output verification (CPLD).
Output timing. 100 - 25,500 ms.

Rev 3.2 (21-12-2016)
SM_DO16R - 16 Digital Outputs (Relay)

Standard Compliance
CE Mark
See paragraph 9.2.
Oscillatory wave

Electric Safety
General requirements (EN 61010-1). Compliant with all the standard's requirements.
Environmental
Ordering Options

Rev 3.2 (21-12-2016)
7.5 SM_AI16 Module. 16 Analog Inputs

The SM_AI16 module supports up to 16 analog inputs which can be configured separately.

 Two blocks with 8 analog inputs each.
 A controller block
 An indication block
Figure 7-39. SM_A16 - Front view.
NOTICE
From revision C0 and later, this module allows be safely inserted and removed from a live backplane (hot-swaping). In
addition, the module provides protection against overvoltage, undervoltage, overcurrent and inrush current.
Analog Input
Each analog input block admits eight channels in differential configuration, which perform the following functions:
 Multirange voltage inputs, with the possibility of injecting current signals using an external resistor (250 Ω). Accuracy
of 0.1% between input terminals (included in the terminal blocks).
 Double input protection against electromagnetic disturbance; by surge arrester (in common and differential mode)
and TVS (in differential mode)
 Eight channel multiplexing.
 High resolution converter.
 Network noise filtering for 50 / 60 Hz.
 Conversion cycle with filtering.
For compatibility with older systems, the analog inputs support the ranges ±2.5 V, 0-2.5 V, ±1.25 V and 0-1.25 V, although
the current configuration tools don't allow to configure these ranges.
Controller Block
The controller block performs all the analog inputs preprocessing, which allows configuring the following parameters
separately:
 Input range.
 Measurement scaling.
 Network filtering interval.
The parameters below can also be configured in the real-time database for analog inputs:
 Scaling at engineering units.
 Up to 4 out-of-range alarms.
 Change threshold and event generation.

Rev 3.2 (21-12-2016)
Indications
The SM_AI16 module integrates 4 indicators, with the following functions.
 ST1 and ST2: Indicate whether there is a hardware fault in the specific block.
7.5.2 Installation
The SM_AI16 module can be connected to the field using two different procedures defined by option C1 (terminal
connection), and option C2 (flat-ribbon connection). Chapter “Installation” above describes the major differences between
these two connection options.
 Commons.

The following figure shows the pin allocation of the connectors for connection C1. The connector B1 is located at the top
and the connector B2 at the bottom.
Figure 7-40. SM_AI16 - Direct connection (option C1).
Where:
 AIxx: Analog input xx.
The analog inputs of the SM_AI16 module are differential, so there are no common terminals. Each connector has 8 pairs
of signals corresponding to 8 analog inputs.
Chapter “Installation” of this manual includes several cabling recommendations which are specifically provided for the
SM_AI16 and SM_AI8AO4 modules.
7.5.2.2 Commons
The analog inputs are differential, so there are no common terminals.

Rev 3.2 (21-12-2016)
Figure 7-41. SM_AI16 - Field connection schematics (option C1).

The following scheme shows the connection to the terminal block of the first analog input. The other inputs will be wired
using the same procedure.
Figure 7-42. SM_AI16 - Field connection schematics (option C2).

Some terminal blocks of the Saitel DP family have been specifically designed to be used with the SM_AI16 and
SM_AI8AO4 modules. These terminal blocks can help to simplify cabling, use wider section field wires and include
different terminal connectors than those offered with the option C1.
These terminal blocks incorporate, for each pair of signals, two terminals that allow soldering a resistance for the current
signals conversion.

Rev 3.2 (21-12-2016)
7.5.3.1 Standard Terminal Block (TB_AI8/E)
Technical Specifications of TB_AI8/E

Reference (code) T-UM 72/TELVENT/8AI-E (0625778)
Assembly DIN rail
Rated voltage UN. 60 VRMS/VDC (max).
Dimensions 47.9 x 89.6 mm.
Figure 7-43. TB_AI8/E
Standard terminal block Field connector. 16-way PCB terminal connector.
Connector type. PCB header with fixing screws..
Module connector. 20-way flat-ribbon cable connector.
Connector Type Pluggable.
Used in modules SM_AI16, SM_AI8AO4.
Electrical Diagram
Figure 7-44. TB_AI8/E – Electrical diagram – Phoenix Contact.

Technical Specifications of TB_AI8E
Reference (code) TB_AI8E (7508000622)
Assembly DIN rail
Maximum current capacity per branch. 1.5 A.
Figure 7-45. TB_AI8E
Standard terminal block Min / Max wire cross section (rigid). 0.5 / 6 mm2
Used in modules. SM_AI16, SM_AI8AO4.
Electrical Diagram
Figure 7-46. TB_AI8E – Electrical diagram – Weidmüller.

Rev 3.2 (21-12-2016)
7.5.3.2 Normalized Terminal Block (TB_AI8/N)
Technical Specifications of TB_AI8/N

Reference (code) T-UM 72/TELVENT/8AI (0625777)
Assembly DIN rail
Figure 7-47. TB_AI8/N
Normalized terminal block Dimensions 84.6 x 89.6 mm.
Min / Max wire cross section (flexible). 0.2 / 2,5 mm2.
Electrical Diagram
Figure 7-48. TB_AI8/N – Electrical diagram – Phoenix Contact.
Technical Specification of TB_AI8N

Reference (code) TB_AI8N (7508000585)
Assembly DIN rail
Figure 7-49. TB_AI8N
Normalized terminal block Field connector. 16-way PCB terminal connector.
Min / Max wire cross section (rigid). 0,5 / 6 mm2
Min / Max wire cross section (flexible). 0,5 / 4 mm2.
Connector Type Pluggable..

Rev 3.2 (21-12-2016)
Electrical Diagram
Figure 7-50. TB_AI8N – Electrical diagram – Weidmüller.
NOTICE
The 250Ω-resistor for conversion isn’t included in the terminal block.

This module integrates a watchdog mechanism to detect the hardware faults in the two input blocks. Furthermore, the user
may also define up to 4 different alarm levels, that is, lower-level and high-level alarms.
DIA RUN STx Description
Normal status. The module is communicating with the master.

If the address is correct, the type of the module is different to the configured for this address (and
(1) a module with correct type and this address isn’t inserted on the bus).
Module not configured or disconnected. If the module is connected, the address is between 1 and
(2) 96 but this address haven’t been configured.
It lights briefly during startup. If it remains on, an error has been detected in the firmware or during
(3) the startup process.
Hardware failure in the block x.

(3) (3)

1. Check the type of the module and the selected address (rear switches).

NOTICE
All technical data included in the following table are related to the revision C0 and later of SM_AI16. For information
about previous revisions, please, consult the previous version of this manual.

Rev 3.2 (21-12-2016)
SM_AI16 - 16 Analog Inputs

Number of inputs 16
Input type Differential (±10 V)
Input range. Multi-range voltage inputs. Conversion to current input using an external
resistor (included in terminal blocks).
Voltage inputs ±5 VDC / 0-5 VDC / ±10 VDC / 0-10 VDC
Current inputs Intensity / voltage (mA/V) conversion, using an external resistor (250 Ω)
and 0.1% of accuracy between the two input terminals for inputs from 0 to
5 V, and 500 Ω and 0.1% for inputs from 0 to 10 V, in the TB_AI8
terminal block.
Conversion. Eight channels multiplexing.
Resolution Sigma-delta converter (Effective resolution of 22 bit).
Accuracy. Error < 0.1 % - 25 ºC.
Thermal drift Better than 20 ppm/ºK.
Input impedance. >200 kΩ.
Common mode voltage tolerance. >30 V.
Isolation. By optocoupler (3,75 kVRMS UL1577 recognized).
Protection (module) Overvoltage, undervoltage, overcurrent, inrush current and short-circuit.
Protection of transient voltages (inputs). Double protection: By surge arrester (in common and differential mode)
and TVS (in differential mode)
 Surge arrester: Discharge current of 10 kA on 8/20 µs waveform.
 TVS: Peak pulse power dissipation 600 W on 10/1000µs
waveform. Bidirectional.
Preprocessing. Digital filtering.
Range limits detection.
Value change detection.
Zero-values suppression.
Measurement scaling (Gain and offset).
Line noise filtering. 80 dB rejection for 50/60 Hz.
Parameterization. Configurable range by channel:
 0-5 VDC / ±5 VDC.
 0-10 VDC / ±10 VDC.
 ±20 mA / ±10 mA / ±5 mA
 0-5 mA / 0-10 mA / 0-20 mA

Standard Compliance
CE Mark
See paragraph 9.2.
Oscillatory wave

Rev 3.2 (21-12-2016)
SM_AI16 - 16 Analog Inputs

Electromagnetic Emission (EN 61000-6-4):
Electric Safety
Environmental
Ordering Options

Rev 3.2 (21-12-2016)
7.6 SM_AI8AO4 Module. 8 Analog Inputs & 4 Analog Outputs

The SM_AI8AO4 module supports up to 8 analog inputs and 4 analog outputs, which can be configured separately.

 A block with 8 analog inputs.
 A block with 4 analog outputs.
Figure 7-51. SM_AI8A04 - Front view.
NOTICE
From revision C0 and later, this module allows be safely inserted and removed from a live backplane (hot-swaping). In
addition, the module provides protection against overvoltage, undervoltage, overcurrent and inrush current.
Analog Inputs
Each analog input block admits 8 channels with the following features:
 Configurable multi-range current inputs. Conversion to voltage inputs using a resistor.
 Eight channel multiplexing.
 High resolution converter.
 Network noise filtering for 50 / 60 Hz.
 Separate calibration adjustment by channel.
 Conversion cycle with filtering.
 Double input protection against electromagnetic disturbance; by surge arrester (in common and differential mode)
and TVS (in differential mode).
Analog Outputs
The analog outputs block admits 4 channels with the following features:
 Voltage (using a external resistor) or current multirange outputs, configurable up to ±10 V and ±20 mA.
 16-bit digital-analog conversion.
 Separate calibration adjustment by channel.
 Signals validation per channel.
 Output protection against electromagnetic disturbance by surge arrester (in common and differential mode).

Rev 3.2 (21-12-2016)
Controller Block
The following parameters can be configured separately for each input:
 Input range.
 Measurement scaling.
 Network filtering interval.
With respect to the inputs, the following parameters can also be configured in the real-time database:
 Up to 4 out-of-range alarms.
 Change threshold and event generation.
The configurable features related to the outputs are:
 Maintenance if communication fails.
 Reset value.
Indications
The SM_AI8AO4 module integrates 12 indicators with the following functions.
 ST1 - ST2: Indicates whether there is a hardware fault in the specific block.
 Break: Break in analog output current loop.
 PFailn: D/A converter fault in the analog outputs.
7.6.2 Installation
 Analog output validation.

The SM_AI8AO4 module can be connected to the field using two different procedures defined by option C1 (terminal
connection), and option C2 (flat-ribbon connection).
The following figure shows the pin allocation of the connectors for C1 option. The connector B1 is located at the top and
the connector B2 at the bottom.
Figure 7-52. SM_AI8A04 - Direct connection (option C1).

Rev 3.2 (21-12-2016)
Where:
 AI0x: Analog input x.
 AOx: Analog output x.
 AOxValid: Shows the validity of the assigned value.
 AOxShield: Terminal for shield connection.
The analog inputs of the SM_AI8AO4 module are differential, so there are no common terminals. The connector B1 has 8
pairs of signals corresponding to the 8 analog inputs. The analog outputs are differential, and they have two validation and
an "A0xShield" signals associated to connect the cable’s shield.
7.6.2.2 Analog Output Validation

Each analog output has a signal which is used to indicate the validity of the allocated output value. Such signal
(AOxValid1 and AOxValid2) is provided by a contact of a solid state relay supporting alternating and direct voltages (320
VMAX and 150 mA).
Those relays will be active (closed contacts) provided the corresponding analog output board and channel have been set
properly. If the module stops communicating with the CPU or the analog output channel has a Break or PFail diagnostic,
then the solid state relay will be deactivated.
Figure 7-53. SM_AI8A04 - Field connection schematics (option C1).
Figure 7-54. SM_AI8A04 - Field connection schematics (option C2).

Rev 3.2 (21-12-2016)
7.6.3 Configuration
NOTICE
 The information included in this section only applies to revisions Bx of the module.
 The electronic board in modules with revision Bx, has four configuration jumpers for each analog output, which
are used to select the output mode (current or voltage). It is necessary to open the enclosure of the module to
access the ST_AI8AO4 board
The following figure shows both the jumper positions on the circuit board as pin 1 for the placement of the bridges.
Figure 7-55. SM_AI8AO4 - Jumpers for output configuration as Voltage / Current.
Depending on the output type that we want to set, we have to set the jumpers as is indicated in the following tables:
Voltage Outputs Configuration
Channel Jumper Position

RP3 1-2
RP4 2-3
AO01
RP5 1-2
RP6 2-3
RP7 1-2
RP8 2-3
AO02
RP9 1-2
RP10 2-3
RP11 1-2
RP12 2-3
AO03
RP13 1-2
RP14 2-3

Rev 3.2 (21-12-2016)

RP15 1-2
RP16 2-3
AO04
RP17 1-2
RP18 2-3
Table 7-1. SM_AI8AO4 - Voltage outputs configuration
Current Outputs Configuration

RP3 2-3
RP4 1-2
AO01 RP5 2-3
RP6 1-2
RP7 2-3
RP8 1-2
AO02
RP9 2-3
RP10 1-2
RP11 2-3
RP12 1-2
AO03
RP13 2-3
RP14 1-2
RP15 2-3
RP16 1-2
AO04
RP17 2-3
RP18 1-2
Table 7-2. SM_AI8AO4 - Current outputs configuration.

Some terminal blocks of the Saitel DP family have been specifically designed to be used with the SM_AI16 and
SM_AI8AO4 modules. These terminal blocks can help to simplify cabling, use wider section field wires and include
different terminal connectors than those offered with the option C1.
Furthermore, these terminal blocks can include the converter resistance for current inputs.
The available terminal blocks for analog inputs are the same as those used for the SM_AI16, see section 7.5.3 in this
document.
7.6.4.1 Standard Terminal Block (TB_AO4/E)

Technical Specifications of TB_AO4/E
Reference (code) T-UM 45/TELVENT/4AO-E (0625780)
Assembly DIN rail
Number of wires. 8.
Figure 7-56. TB_AO4/E Dimensions 66 x 45 mm.
Standard terminal block Field connector. 8-way PCB terminal connector.
Used in modules SM_AI8AO4.

Rev 3.2 (21-12-2016)
Electrical Diagram
Figure 7-57. TB_AO4/E – Electrical diagram – Phoenix Contact.
Technical Specifications of TB_AO4E

Reference (code) TB_AO4E (7508000588)
Assembly DIN rail
Figure 7-58. TB_AO4E Min / Max wire cross section (rigid). 0,5 / 6 mm2
Standard terminal block
Min / Max wire cross section (flexible). 0,5 / 4 mm2.
Electrical diagram

Rev 3.2 (21-12-2016)
7.6.4.2 Normalized Terminal Block (TB_AO4/N)

Technical Specifications of TB_AO4N
Reference (code) TB_AO4N (7508000587)
Assembly DIN rail
Figure 7-60. TB_AO4N Dimensions 62 x 47 mm.
Normalized terminal block Field connector. 8-way PCB terminal connector.
Min / Max wire cross section (rigid). 0.5 / 6 mm2
Electrical diagram

Technical Specifications of TB_AO4/N
Reference (code) T-UM 45/TELVENT/4AO (0625779)
Assembly DIN rail
Number of wires. 8.
Figure 7-62. TB_AO4/N
Normalized terminal block Connector type. PCB header with fixing screws.
Connector Type Pluggable..

Rev 3.2 (21-12-2016)
Electrical Diagram
Figure 7-63. TB_AO4/N – Electrical diagram – Phoenix Contact.

The modules integrate a watchdog mechanism to detect hardware faults in both the input and output block. With respect
to the analog inputs, the user may also define up to 4 different alarm levels, that is, lower-level and high-level alarms. The
module features a detection system for current loop break and a permanent monitorization of D/A converter for outputs.
DIA RUN ST1 ST2 PFail(x) Break(x) AIx AOx Description
Normal status. The module is communicating with the

master.
Firmware failure.
(3)
Incorrect address assigned to the module (0 or greater

than 96).
If the address is correct, the type of the module is different
(1) to the configured for this address (and a module with
correct type and this address isn’t inserted on the bus)
Module not configured or disconnected. If the module is

connected, the address is between 1 and 96 but this
(2) address haven’t been configured.
Ax out of range.
AOx out of range.
Internal failure in the analog input block.

(3) (3)
Internal failure in the analog output block.

(3) (3)
Hardware failure in AOx.

(3) (3)
Opened current loop for AOn.

(4)

Rev 3.2 (21-12-2016)
NOTICE
The LED Break only will be switched on if the signals are configured for current outputs.

1. Check the module’s address.
2. Check that module’s address corresponds to configured address.
4. Verify that the wiring of the module is correct.

NOTICE
All technical data included in the following table are related to the revision C0 and later of SM_AI8AO4. For information
about previous revisions, please, consult the previous version of this manual.
SM_AI8AO4 – 8 Analog Inputs & 4 Analog Outputs

Protection Overvoltage, undervoltage, overcurrent, inrush current and short-circuit.
Analog Inputs
Number of inputs 8
Input type Differential (±10 V)
Input range. Multi-range voltage inputs. Conversion to current input using an external resistor
(included in terminal blocks)
Voltage inputs. ±5 VDC / 0-5 VDC / ±10 VDC / 0-10 VDC
Current inputs Intensity / voltage (mA/V) conversion, using an external resistor (250 Ω) and 0.1%
of accuracy between the two input terminals for inputs from 0 to 5 V, and 500 Ω
and 0.1% for inputs from 0 to 10 V, in the TB_AI8 terminal block.
Preprocessing. Digital filtering.

Range limits detection.
Value change detection.
Zero-values suppression.
Measurement scaling.
Common mode rejection 120 dB (typ) for 50 Hz and 100 db (min) for DC.
Parameterization. Configurable input range:
 0-5 VDC / 0-10 VDC.
 0-5 mA / 0-10 mA / 0-20 mA
 ±5 VDC / ±10 VDC (only revisions Bx).
 ±20 mA / ±10 mA / ±5 mA (only revisions Bx)
Conversion. Eight channels multiplexing.

Resolution Sigma-delta converter (Effective resolution of 22 bit).
Accuracy. Error < 0.1% - 25 ºC.
Input impedance. >200 k.
Common mode voltage tolerance. >30 V.
Protection. Double protection: By surge arrester (in common and differential mode) and TVS
(in differential mode)
 Surge arrester: Discharge current of 10 kA on 8/20 µs waveform.
 TVS: Peak pulse power dissipation 600 W on 10/1000µs waveform.
Bidirectional.
Isolation. By optocoupler (3,75 kVRMS UL1577 recognized).

Rev 3.2 (21-12-2016)
SM_AI8AO4 – 8 Analog Inputs & 4 Analog Outputs

Analog Outputs
Number of outputs 4
Output type Multirange current outputs (voltage inputs using a resistor)
Voltage outputs (revision C0 and later) 0-5 V (resistor: 250 ) and 0-10 V (resistor: 500 ), max 10 mA
Current outputs (revision C0 and later) 0-20 mA in 500 .
Resolution. 16-bit converter.
Accuracy. Error < 0.15% with 25 ºC.
Thermal drift Better than 20 ppm/ºK
Maximum output power. 200 mW.
Transient voltage protection. Surge arrester: Discharge current of 10 kA on 8/20 µs waveform, in common and
differential mode.
Isolation. By optocoupler (3.75 kVRMS UL1577 recognized).
Processing. Selection of scaling at engineering units.
Maintenance if communication fails.
Reset value.
Parameterization. Configurable output range:
 0-5 VDC / 0-10 VDC
 0-20 mA / 4-20 mA.
Standard Compliance
CE Mark
See paragraph 9.2.
Electromagnetic Immunity (EN 61000-6-2):
Oscillatory wave (IEC 60255-22-1,
according to EN 61000-4-12). Class III, ±2.5 kV / 5 kHz (Level 3).
Environmental
Cold test (IEC 60068-2-1). From -40 ºC during 16 h.
Ordering Options

Rev 3.2 (21-12-2016)
Chapter 8. Backplane Modules

8.1 General Information
All Saitel DP modules (power supply, CPU, communications, I/O acquisition) are installed into a backplane. These
backplanes work as an electromechanical device which provides the following functions:
 Mechanical function. Allow insertion and removal of the modules into the system and its physical support.
The backplane provides the mechanical integration in the location or enclosure that it is located.
 Electrical function. It allows and assures the distribution of:
o The power supply to the modules need.
o The internal bus for the modules installed in the backplane.
 Expansion. Allow electrical connection (at data level) between different backplanes to increase the number
of modules integrated into the system.
From revision D0, the backplane allows the following functions:
 Supervision: Monitoring and control of the power supply to the modules and signaling Profibus
communication lines between modules.
 Protection: Protection against permanent damages for overload from external power supplies.
Each Saitel DP subsystem is made up by:
 A main "backplane" where the CPU is installed. If you have redundant CPUs, both modules could be
installed into the same backplane or you could install each CPU into a different backplane.
 Depending on the needs, the system will have one or more acquisition backplanes.
A main backplane and as many expansion backplanes as required.
The main backplane supports one or two control units, acquisition modules, and SM_SER communication modules, if
necessary.
Acquisition backplanes are used when the available positions in the main backplane are occupied, or when implementing
a distributed system of I/O modules. These secondary backplanes do not include any control units or communication
modules.
There are two basic backplane models. The only difference between the two models is the mechanical solution used.
 SM_BPX, panel mounted.
 SM_CHX, chassis mounted.
Figure 8-1. SM_BPX. Figure 8-2. SM_CHX
Both models are based on the same board called ST_BPX4S or ST_BPX9S depending on the ordering options (number
of slots).
NOTICE
Revisions previous to D0 of SM_CHX and SM_BPX mount the board ST_CHBPx. This board could not have some
functionality detailed below.

Rev 3.2 (21-12-2016)
8.1.1 Electrical Features

Both backplane models have the same electrical features:
 4 or 9 slots to connect the Saitel DP modules.
 High-speed internal bus for the communication between the CPU and the communication modules SM_SER.
 High-speed internal bus for the communication between the CPU modules (in redundant CPU configurations).
 High-speed internal bus (Profibus) for the communication between the acquisition modules and the CPU.
 Profibus (TTL) - Profibus (RS-485) conversion for backplane interconnection. See Figure 2-6.
 Double power-supply bus (redundant). Both can be used in two way (mutually exclusive):
o Using Saitel DP power supplies (SM_PS or SM_PS40), in simple or redundant configuration.
o Using external power supplies, in simple or redundant configuration.
WARNING
Don't use the modules SM_PS40 or SM_PS together with external power sources. Doing so may cause permanent
damage to the equipment.
8.2 SM_BPXx Model

In this model, the electronic board is installed in a metal enclosure where the electronic is hidden. Only the necessary
elements for the configuration are accessible. There are two models:
 SM_BPX4, with 4 slots.
 SM_BPX9 with 9 slots.

The difference is the number of modules that it can mount. The other features are identical.
The following figure shows an example of this type of backplane:
Figure 8-3. SM_BPX9 – Front view.
8.2.1 Mechanical Features

The modules can be mounted in a panel or flat wall made of any material capable of supporting the total weight of the
assembly. The module’s weight and connection cables must be taken into account.
If several backplanes need to be mounted in a column structure, you must leave a minimum space (57 mm) between the
lower and upper fixing flanges of the backplanes. Never cover the modules’ ventilation grilles with feed-through, cable
trays or any other assembly elements.
The necessary space around the backplane must be respected in order to allow assembly and disassembly of the
modules. See the following figure:

Rev 3.2 (21-12-2016)
Figure 8-4. Necessary space for assembly and disassembly the modules.
The SM_BPX module has two fixing flanges located at the upper and lower parts respectively. There are several drill holes
of 4 mm in diameter for wall or panel fixing. The number and location of the drill holes depending on the model, 6 in the
SM_BPX4 and 8 in the SM_BPX9.
Figure 8-5. SM_BPX4 - Drill-hole arrangement.
Figure 8-6. SM_BPX9 - Drill-hole arrangement.

Rev 3.2 (21-12-2016)
The dimension values are given in millimetres . All connectors are located in the front and right side of the module
Figure 8-7. SM_BPX9 – Front view.
 1: Connectors (slots) for the Saitel DP modules. The female connectors are installed on the backplane and on the
rear panel for each module the male connector is installed.
 2: Jumper to configure redundant communication systems. If the jumper is mounted, it enables redundant Profibus-
DP.
 3: Two connectors in order to expand the internal bus to other backplanes. See Figure 2-7.
 4: Configuration switches for the expansion of the internal bus.
 5: External power supply connector. It allows connecting up to two different power supplies: primary and secondary.
 6: Guides for supporting Saitel DP modules when they are mounted on the backplane.
 7: Fixing nuts that allow screwing the module and securing it to the metal enclosure.
 8: Drill-holes to fix the backplane to the bottom panel.
 9: Lighted indicators (Only for revision D0 and later of SM_BPX and SM_CHX)
8.2.2 SM_BPX Power Supply

There are two power supply options for the modules, through the backplane:
 Using Saitel DP power supply (SM_PS or SM_PS40).
 Using external power supply.
8.2.2.1 External Power Connector

The SM_BPX module integrates a connector at the right side to connect one or two external power supplies. In Figure 8-7,
it is identified as number 5.
Note that pin 1 is the first one from the right when the backplane is horizontal or the upper one when the backplane is on
vertical position. The connection is as follow:

Rev 3.2 (21-12-2016)
Pin Signal Description

1 Earth Ground protection.
2 - Don’t connect.
3 +5 V1
Primary power supply.
4 GND
5 +5 V2
Secondary power supply.
6 GND
Table 8-1. Pinout of the connector for external power supplies.

SM_BPX - Panel Mounted
SM_BPX4 SM_BPX9
Slots 4 9
Dimensions (including chassis) 268 x 204 x 25.5 mm. 268.5 x 430 x 25.5 mm.
Weight 1.25 kg. 3.35 kg.
Saitel DP modules connection 48-contact DIN 41612 connectors (4 or 9 depending on the model)
External power supply connection 6-way screw terminal (1.5 mm² / 15 AWG)
VSENSE connection 3-way screw terminal (1.5 mm² / 15 AWG)
Profibus expansion 2 female DB9 connectors
Operating nominal voltage 5.4 ±0.2 VDC
Startup nominal voltage > 5.3 VDC
Maximum current (for each power supply bus) 7A
Maximum consumption (for the entire backplane) 38 W
Overcharge voltage without risk for the electronic < 24 VDC
Overcharge voltage with damages > 30 VDC
Safety power-off (for overvoltage) > 5.9 VDC
Safety power-off (for undervoltage) < 4.9 VDC
Standard Compliance
CE Mark
See paragraph 9.2.
Special level: Voltage falls 30% during 10 ms.
Voltage falls 60% during 100 ms.
Voltage falls >95% during 5000 ms.
Oscillatory wave

Rev 3.2 (21-12-2016)
SM_BPX - Panel Mounted

Electric Safety
Environmental
Ordering Options
8.3 SM_CHX Model

8.3.1 General Features
The SM_CHX model uses the same electronic board that SM_BPX, but it is mounted using a standard 19’’-chassis. There
are two models:
 SM_CHX4, with 4 slots.
 SM_CHX9 with 9 slots.

The difference is the number of modules that it can mount. The other features are identical.
8.3.2 Mechanical Features

Both, SM_CHX9 and SM_CHX4 backplane modules are designed to be fixed on a metallic panel 19’’ wide, 6 U high and
180 mm deep. This chassis provides the mechanic support to fix all the modules. The SM_CHX4 has a format that allows
to mount two boards in the same chassis (one next to the other).
This option is the most suitable in solutions which give access to the rear part of the electronic components.
For SM_CHX, the power connector, bus expansion connectors and configuration switches are located on the back side of
the card to be accessible from the back of the chassis.
The necessary space around the backplane must be respected in order to allow assembly and disassembly of the
modules. See the following figure:
Figure 8-8. Necessary space for assembly and disassembly the modules into a chassis.
It is necessary to distinguish between the component side or front and soldering side or rear, as it has connectors on both
sides.

Rev 3.2 (21-12-2016)
Figure 8-9. SM_CHX4 – Front view.
Where:
 1: Connectors (slots) for the Saitel DP modules. The female connectors are installed on the backplane and on the
rear panel for each module the male connector is installed.
 2: Jumper to configure redundant communication systems. If the jumper is mounted, it enables redundant Profibus-
DP.
Figure 8-10. SM_CHX4 – Rear view.
Where:
 1: Two connectors in order to expand the internal bus to others backplanes. See Figure 2-7.
 2: Configuration switches for the expansion of the internal bus.
 3: External power supply connector. It allows connecting up to two different power supplies: primary and secondary.
 4: SENSE input. It is available in case the system requires to connect a “SENSE input” from an external power
supply.
8.3.3 SM_CHX Power Supply

There are two power supply options for the modules, through the backplane:
 Using Saitel DP power supply (SM_PS or SM_PS40).
 External power supply through.

Rev 3.2 (21-12-2016)
8.3.3.1 Connectors for External Power Supply

In case of backplane SM_CHX, we have to distinguish between models with 4 positions and models with 9 positions,
because the model with 9 positions has the connectors J14 and J15 for primary and secondary power supply and the
models with 4 positions only have connector J15.
To check the external power supply, there are terminals in the rear face of the board which allows accessing the following
signals:
 VS1+, VS2+ and VS-: (VSENSE) Feedback voltage output supplied to the power supply in order to be auto-
adjusted. These signals correspond to connector J13.
PFAIL1, PFAIL2: signals that indicate to the CPU modules, that there is a failure in the power supply, they are located in
connector J12. It is necessary that the signal level is TTL open collector. The power supply failure is indicated with a low
level in input PFAILx
There is a terminal in the rear face of the board (ST_SPS_PRIM) in order to power the SM_CHX using an external power
supply. It has the following pinout:
Signal Description
+5 V1 Primary power supply.
GND Ground connection.
+5 V2 Secondary power supply.
GND Ground connection.
In the back face, there is a SENSE input too, that could be wired to the external power supply if it’s required:
Signal Description
VS - Negative sense (primary power supply)
VS1 + Positive sense (primary power supply)
VS - Negative sense (secondary power supply)
VS2 + Positive sense (secondary power supply)
NOTICE
Other connectors may be installed in the back of the board, such as EARTH, PFail and ST_SPS_SEC. These mustn't
be wired. They are only included for compatibility with previous versions of the module.

SM_CHX - Chassis Mounted
Hardware Features SM_CHX4 SM_CHX9
Slots 4 9
Dimensions 19-inch rack.
Saitel DP modules connection 48-contact DIN 41612 connectors (4 or 9 depending on the model)
External power supply connection 6-way screw terminal (2.5 mm² / 13 AWG)
VSENSE connection 3-way screw terminal (2.5 mm² / 13 AWG)
Profibus expansion 2 female DB9 connectors
Operating nominal voltage 5.4 ±0.2 VDC
Startup nominal voltage > 5.3 VDC
Maximum current (for each power supply bus) 7A
Maximum consumption (for the entire backplane) 38 W
Overcharge voltage without risk for the electronic < 24 VDC
Overcharge voltage with damages > 30 VDC
Safety power-off (for overvoltage) > 5.9 VDC
Safety power-off (for undervoltage) < 4.9 VDC
Standard Compliance
CE Mark
See paragraph 9.2.
Rev 3.2 (21-12-2016)
SM_CHX - Chassis Mounted

Special level: Voltage falls 30% during 10 ms.
Voltage falls 60% during 100 ms.
Voltage falls >95% during 5000 ms.
Oscillatory wave
Electric Safety
Environmental
Ordering Options

Rev 3.2 (21-12-2016)
8.4 Profibus Configuration

For each backplane, the user must configure:
 Profibus-DP redundancy or not.
 Activation of the RS-485 termination resistors or not.

About the redundancy of Profibus-DP; the jumper used to configure the internal bus as redundant or nor is identified with
number 2 in Figure 8-7 (SM_BPX) and Figure 8-9 (SM_CHX). If the jumper is mounted, the internal bus is redundant.
NOTICE
If you do not use the configuration of redundant Profibus-DP, you must remove the jumper, as
indicated in the following image.
Apart from the expansion connectors, there are several micro-switches in the backplane front panel to set the RS-485
termination resistors.
The RS-485 standard defines a asynchronous serial communication with differential levels, which requires termination
resistors to be included in the bus ends. When interconnecting the backplanes, it is necessary to include the termination
resistors in the first and the last backplane of the bus. In order to connect the termination resistors, the micro-switches
next to the expansion connectors must be set to on. Where PF1 is associated with Profibus 1, PF2 with Profibus 2 and
SYN with the synchronization bus.
Figure 8-11. Backplane microswitches.
8.5 Backplane Expansion

The first point to consider is whether the PPS(Pulse Per Second signal) is required or not, and if the communications are
simple or redundant. The SM_BPX and SM_CHX include electronic for expansion of the three buses, including the
terminating resistors.
Once buses to expand are known, please, note that although there are two connectors for expansion (identified with the
number 3 in Figure 8-7 and Figure 8-10) from the electrical point of view both are the same.
Figure 8-12. Connectors for expansion
The backplanes can be expanded by interconnecting the channels GND, SYN and Profibus of the different backplanes
(PF1 and PF2).

Rev 3.2 (21-12-2016)
WARNING
Pin 6 (+5V) only should be connected in order to power a BP2F (bus expansion through fiber optic).
In the backplane the female connector is installed and the male connector will be installed in the cable used for the
expansion. It is recommended to use a metallic and shielded connector with an output angle for the cable of 180º
(reference: FCK1GA):
Figure 8-13. Expansion cable connector.
Each bus in use (PF1, PF2, SYN) requires a shielded twisted-pair connection cable. There are two types of cables
depending on the distance between the backplanes (according to EIA RS-485):
 Cable type A:
o Impedance: 135 - 165 Ω (f = 3 to 20 MHz).
o Capacity < 30 pF/m.
o Resistance < 110 Ω/km
o Conductor area ≥ 0.34 mm2 (22 AWG).
 Cable type B:
o Impedance: 100 - 130 Ω (f <100 kHz).
o Capacity < 60 pF/m.
o Conductor area ≥ 0,22 mm2 (24 AWG).
The following table shows the maximum length of cable type A and cable type B for the different transmission speeds:
Rate (kbit/s) 9.6 19.2 93.75 187.5 500 1500
Cable A length (m) 1200 1200 1200 1000 400 200
Cable B length (m) 1200 1200 1200 600 200 70
Table 8-2. Cable length for the different transmission speeds.
The cable’s shield must be connected to the protection earth using the fixing screws of the connector.
If the expansion needs to be installed outside the cabinet a BP2F is recommended (see TE-00-0000-ARQ-F850, Auxiliary
Modules Manual). Otherwise, a cable with mechanical protection must be used.
An example of a cable can be: Belden 9841.
The following section details how to wire the bus expansion depending on the system needs. For each backplane, the
position of the switches is shown.
8.5.1 Expansion using RS-485 (Copper)

NOTICE
If the expansion needs to be installed outside the cabinet a BP2F is recommended (see “Auxiliary Modules Manual”).
Otherwise, a cable with mechanical protection must be used.
The following scenarios are described:

 One main backplane (with single or dual CPU) and a single cable for PF1, PF2 and SYN.
 One main backplane (with single or dual CPU), a cable for PF2 and another cable for PF1 and SYN.
 Two main backplanes, a cable for PF2 and another cable for PF1 and SYN.

Rev 3.2 (21-12-2016)
A Main Backplane / A Single Cable for PF1, PF2 and SYN

There is a main backplane and other acquisition backplanes. Regarding bus redundancy, although there is a double bus,
in this case both use the same cable for the expansion.
Figure 8-14. Backplane expansion (using copper) – A main backplane / A single expansion cable
A Main Backplane / A Cable for PF1 and SYN / A Cable for PF2
If the system requires a redundant cable (a cable for each profibus), the configuration is shown in the following figure:
Figure 8-15. Backplane expansion (using copper) – A main backplane / A cable for each profibus
NOTICE
It is important to consider that the synchronization bus (SYN) only can be expanded using one cable. You could expand
it using the PF1 or PF2 cable, but only one of them. Otherwise the system could have problems with the
synchronization in the acquisition backplanes.
Two Main Backplanes / A Cable for PF1 and SYN / A Cable for PF2
If you have two main backplanes but you don’t need to use a double wiring, the backplane expansion is shown in Figure
8-14, where the second main backplane is considered as an acquisition backplane. These backplanes, all switches must
be set to OFF.
If you need a cable for each profibus, see the following figure:

Rev 3.2 (21-12-2016)
Figure 8-16. Backplane expansion (Copper) – Two main backplanes / Two expansion cables.
8.5.2 Using BP2F for Expansion (Fiber Optic)
NOTICE
For more information about the BP2F, see the document TE-00-0000-ARQ-F850, Auxiliary Modules Manual.
The following situations are detailed:

 A main backplane (with single or dual CPU) and a single cable for PF1, PF2 and SYN.
 A main backplane (with single or dual CPU), a cable for PF2 and another cable for PF1 and SYN.
 Two main backplanes, a cable for PF2 and another cable for PF1 and SYN.
A Main Backplane / A Single Cable for PF1, PF2 and SYN

The best way to do the bus expansion is shown in the following figure:
Figure 8-17. Backplane expansion (Fiber optic) – A main backplane / A single cable for PF1, PF2 and SYN.

Rev 3.2 (21-12-2016)
A Main Backplane / A Cable for PF2 / A Cable for PF1 and SYN
Figure 8-18. Backplane Expansion (Fiber optic) – A main backplane / A cable for PF2 / A cable for PF1 and SYN.
Two Main Backplanes / A Cable for PF2 / A Cable for PF1 and SYN
Figure 8-19. Backplane expansion (Fiber optic) – Two main backplanes / A cable for PF2 / A cable for PF1 and SYN.

Rev 3.2 (21-12-2016)
8.6 Backplanes Power Supply

Each backplane can be powered using two ways:
 By using Saitel DP power supplies (SM_PS or SM_PS40).
 By using external power supplies.
Whatever the origin of the power, both modules, SM_BPX and SM_CHX, have two redundant power buses without a
defined priority and without switching. The modules are powered indistinctly by both buses, maintaining its functionality
without a reset (at least one of the power buses has to be available).
WARNING
Maximum current for each power bus is 7 A (equivalent to 38 W of power). Please, have in account that the system
must be dimensioned for that only one bus have to support all consumption (Maximum consumption for a backplane is
38W).
NOTICE
Each backplane is powered independently either with Saitel DP modules or with external power supplies. The RS-485
expansion connector does NOT expand the power supply voltage to the next backplane.
8.6.1 Saitel DP Power Supplies

These power supply module is installed in slot 1 in simple configuration and in slots 1 and 2 in redundant power
configuration.
WARNING
Never install a PS module in a slot different of 1 or 2.
8.6.2 Recommendations for External Powering

WARNING
The voltage input for the backplane is 5.4 ± 0.2 VDC. The external voltage input isn't protected against overvoltage, so
an incorrect wiring or an incorrect adjustment of the supply voltage could damage the electronics.
On a voltage drop, the backplane is shutdown when the voltage level falls to 5.0 VDC, and on a power surge, the
backplane is shutdown when the voltage level comes to 5.8 VDC.
The best way to power the backplanes is depending on both the number of available power supplies as the distance from
these power supplies up to the backplanes.
The total power of the power supplies used must be the equal or greater than the sum of the powers required for all
backplanes powered more a reserved margin (usually from 25% to 50% of the total power).
A Power Supply for Each Backplane

The distance between each power supply and the backplane can’t be greater than 0.75 m. :
Figure 8-20. Backplane powered using two independent and redundant power supplies.

Rev 3.2 (21-12-2016)
A Power Supply for Several Backplanes

In this case a distribution terminal should be installed. The distance (length of the cable) between this terminal and the
backplanes should be 0.75 m maximum:
Figure 8-21. Several backplanes powered by a power supply
WARNING
The powering of several backplanes mustn't be wired cascade, i.e., the power of the first backplane mustn't be
extended to the others. For each backplane, the power is received directly the source, using a star configuration, as
shown in the previous figures.
8.7 Supervision
INFORMACIÓN
Supervision is only available for revision D0 and later of the modules SM_BPX and SM_CHX.
By the light indicators above the expansion connectors (see Figure 8-7) the user can monitor the activity of the Profibus
communications and the status of the power.
Each led is identified as follow:
Figure 8-22. Supervision leds on the backplane.

Rev 3.2 (21-12-2016)
Where:
 MST: Supervision of the transmission from CPU.
 SLV: Supervision of the transmission from slave modules.
 OV1 / UV1: Supervision of the power bus PW1 (see Figure 2-7). This power bus is associated with the SM_PS or
SM_PS40 installed on slot 1 or with the external power supply at left in the connector, identified previously as
“secondary power supply” or +5 V2.
 OV2 / UV2: Supervision of the power bus PW2 (see Figure 2-7). This power bus is associated with the SM_PS or
SM_PS40 installed on slot 2 or with the external power supply at right in the connector, identified previously as
“primary power supply” or +5 V1.
8.7.1 Supervision of the Profibus

The yellow leds MST and SLV show the status of the Profibus communications. Following table describes the meaning of
these leds:
MST SLV Status Description
Idle No questions or answers have been detected from master nor slave module.
Questions have been detected from a master in both channels (with

Correct
redundancy) and answers from an slave in both channels.
Questions have been detected from a master in both channels, but any slave
No answer
module is responding.
Questions have been detected from a master in both channels (with

Degraded,
redundancy) and answers have been detected from an slave in only one
answer.
channel.
Questions have been detected from a master in only one channel (with
Degraded,
redundancy) and answers have been detected from an slave in both
question
channels.
The transmission lines of the master modules in both channels are blocked.
Fail in Impossible to communicate with the slaves modules.
question
A fail in the supervisor of Profibus is possible too.
The transmission lines of the slaves modules in both channels are blocked.
Fail in answer Impossible to communicate with the slaves modules.
A fail in the supervisor of Profibus is possible too.
On Off
Fast blinking Slow blinking
8.7.2 Supervision of the Power

Revision D0 and later of the backplane include a supervisor of the power. It has three main functions:
 Prevent the modules are powered with incorrect voltages.
 Indication of the “quality” of the power supplied by the backplane to the modules.
 Limit the number of startup when a problem is detected about the consumption.
The power status is displayed by the leds OV1/OV2 and UV1/UV2 (see Figure 8-22). The following table shows the status
of these indicators and the meaning:
OVx Uvx Status Description
Power-off for
Power voltage above the maximum.
overvoltage
High-high voltage Power voltage much higher than the nominal value. The system can
(dangerous voltage) startup but cannot work fine.

Rev 3.2 (21-12-2016)
OVx Uvx Status Description
High voltage Power voltage slightly above the nominal value. Correct state for startup
(warning voltage) and working.
Power voltage into the nominal value range. Optimum state for startup
Optimum
and working. Both leds are lighted each 3 s.
Power voltage slightly under the nominal value. Correct state for working
Low voltage
but not for the startup. Depending on voltage level the system could be
(warning voltage)
restarted.
Power voltage much higher than the nominal value. The system can
Low-low voltage
startup but cannot work fine. Unsafe state for working and startup. If the
(dangerous voltage)
voltage level is decreased, the backplane could be power off.
Power-off for
The voltage level is much lower than the minimum.
undervoltage
The maximum number of retries to boot has been exceeded. The

Blocked supervisor will not attempt more reconnections until the power supply is
completely removed.
No operative Without power supply or the voltage supervisor is broken.
On Off
Fast blinking Slow blinking

Rev 3.2 (21-12-2016)
Chapter 9. Technical Data

9.1 Environmental Conditions
Environmental conditions to consider for Saitel DP modules are:
 Protection level:
o Module: IP 20
o Cabinet: IP54 (typical)
 Operating temperature range: From -40 ºC and 70 ºC.
 Humidity limit: 95%.
9.2 Coating
The electronic boards may be coated (normal option) or not depending on the ordering option. The available coating is
AVR80, by ABchimie Company. More information about this type of finish in http://www.abchimie.com/.
9.3 CE Mark
Saitel is according to the European Directive of Low Voltage 73/23/CEE, replaced by 2006/95/CE y and the
Electromagnetic Compatibility Directive (EMC) 89/336/CE, replaced by 2004/108/CE.
To get a CE Mark Certificate, please, contact with the Saitel Support Service sending an e-mail to
es-infoSaitel@schneider-electric.com.
9.4 Mechanical and Consumption

The following table shows dimensions, weight and typical consumption for each module:
Module Weight Typical Consumption Battery Dimensions

3.5 W (option ETH1)
SM_CPU866 664 g CR 2032 (3 V, Panasonic)
6 W (option ETH4)
SM_CPU866e 700 g 10 W CR 2450N (3 V, Renata)
SM_SER 677 g 4.4 W
SM_PS 900 g (*)
SM_PS40 900 g (*)
SM_DI32 675 g 0.7 W 245 x 170 x 45 mm
SM_AI16 638 g 2.4 W
SM_AI8AO4 638 g 5W
1.1 W +
SM_DO16R 830 g
210 mW/relay (constant)
1.1 W +
SM_DO32T 830 g 0.53 W (TB_DO16T)
1.2 W (TB_DO16P)
SM_BPX4 1.25 kg 100 mW - 268 x 204 x 25.5 mm
SM_CHX4 - 100 mW - Standard 19-inch chassis
SM_BPX9 3.35 kg 100 mW - 268.5 x 430 x 25.5 mm
SM_CHX9 - 100 mW - Standard 19-inch chassis
Table 9-1. Mechanical and Consumption data.
(*) Typical efficiency (full load) of the module:
 SM_PS: greater than 70%
 SM_PS40: 79%.

Rev 3.2 (21-12-2016)
Chapter 10. I/O Information

Processing
10.1 Introduction
Saitel DP acquisition modules preprocess input signals and adjust field signals. Previous sections have described how
modules actuate on its inputs/outputs. Below, you will find a detailed explanation of the information preprocessing.
10.1.1 Digital Input Acquisition

10.1.1.1 Digital filtering
Digital filtering allows eliminating the changes made to the inputs if these changes are not retained for a minimum amount
of time “Filtering Time” or TF.
The filtering response from a digital input is shown in the following figures:
Figure 10-1. Digital filtering in digital inputs.
10.1.1.2 Change memory

The memory for changes can store the changes made to the inputs for predefined period “Memory Time” or TM.
The change memory response from a digital input is shown in the following figure:

Rev 3.2 (21-12-2016)
Figure 10-2. Change memory in digital inputs.
NOTICE
Does not apply in counter mode.
10.1.1.3 Chronological record

This feature is applicable to the inputs configured as indications or numeric values. The inputs configured with
chronological record generate an input with time marking when a status change is made to the inputs.
10.1.1.4 Input Functional Allocation

With respect to the functional allocation of digital inputs, the available types of signals are:
 Simple indication.
 Double indication.
Simple Indication
It takes a module's input and represents a boolean value (YES/N0). The next figure shows its processing:
Figure 10-3. Simple indication.
The diagram shows that inversion, digital filtering, change memory, and chronological treatments are allocated to the
input.
Hardware diagnostics are available, which indicates whether the value is invalid when detecting a fault after a module’s
internal test.
Double Indication (IDOB)

It takes two module's inputs and represents a status with four possible values. The next figure shows its processing:

Rev 3.2 (21-12-2016)
Figure 10-4. Double indication.
The diagram shows that inversion, digital filtering, change memory, and chronological treatments are allocated to the
inputs.
The state validation is controlled by the “Settling Time” or TS. It is defined as the time delay required after a change to
accept a new signal status. The two inputs need to be fixed for that period. Otherwise, the time counter will resume
operation.
Processed inputs take one or more inputs of the module and represent a slow counter type analog value.
Slow Counter (ICNT)

The processed inputs take one or more inputs in the module and represent an analog value (slow counter). It is used to
acquire counting pulses from a an external generator. The next figure shows its processing:
Figure 10-5. Slow counter.
The diagram shows that inversion is associated to the inputs. It also shows that the counter supports a physical input. This
input accumulates the values from the module’s slow counter. This input always exists.
Inversion Memory Filter and Simple/Double Edge are configurable.
The capture performed by the CPU can be set using the “Filter Time” or TF. This time indicates the writing period of the
counter's value into the data tables which are accessible for the CPU.
10.1.2 Digital Output Actuation

10.1.2.1 Actuation Timing
Actuation timing defines how long the actuation is run “Actuation Time” or ExeTime.
An output signal can also be set to be held on a high level, until a zero command is executed.
10.1.2.2 Digital Output Functional Allocation

The module’s outputs can have different allocated functionalities, so that they represent the different types of control:
 Simple commands.
 Double commands.

Rev 3.2 (21-12-2016)
Simple command (SIM)

A single output is used to run the command:
 Running command -> Activated output.
 Completed command -> Deactivated output.
Double command (DOB).

Two outputs are used to run the command:
 Deactivation command -> Output 1 “ON”, Output 2 “OFF”.
 Activation command -> Output 1 “OFF”, Output 2 “ON”.
 Two outputs can never be activated simultaneously.
10.1.3 Analog Input Acquisition

Scaling at Engineering Units and Out of Range Detection
It is an input-specific feature. It is possible to perform a lineal conversion of the measurement to engineering units. (i.e. kV,
Amperes, Degree, Flow, etc.). Conversion and two scaling limits can be enabled:
 Scaling (enable or not).
 Lower Engineering Limit: It is an integer value which expresses in engineering units the lowest value of the
signal's range in the converter.
 Upper Engineering Limit: It is an integer value which expresses in engineering units the highest value of the
signal's range in the converter.
The next figure shows the possible configuration of this feature:
Figure 10-6. Scaling at engineering units.
Engineering values can range:

 Bipolar inputs  -32000 /+32000.
 Unipolar inputs  0 /+64000.
The decimal point position is implicitly defined when designing the system.

Rev 3.2 (21-12-2016)
Chapter 11. Redundant

Configurations in Saitel DP
11.1 Introduction
Due to the wide range of redundant configurations supported by Baseline Software Platform and Saitel DP, it is necessary
to make a detailed analysis in order to determine the concepts applicable to functionalities and to set a common
terminology.
It should be highlighted that redundancy always intends to increase the level of reliability and availability of the critical
elements within a control system.
Redundant configurations are defined to strengthen the following parts of the control system:
 Power supply: This is the first doubled element in the system, since a power supply failure would mean a total
failure of the system. Power supply units are also devices which transfer powers, sometimes extremely high and
could cause a significant wear of the components. All Saitel P modules and most auxiliary elements support a
redundant power supply.
 CPU: The SM_CPU866 and SM_CPU866e modules allow defining configurations with CPU redundancy with a
high level of flexibility meeting the specific requirements of any system.
 Acquisition bus: The acquisition bus allows the CPU to acquire data from acquisition modules. Saitel DP
backplanes include a double acquisition bus. The CPU module together with the acquisition modules implement
the functions to make an efficient use of these redundant communications.
 Communication channels: Several master and slave communication protocols support a double communication
channel, which are switched with certain rules according to the protocol.
 System’s duality: All the system’s components are doubled under this configuration. This is the typical
configuration of data hubs and communication front-ends.
Different types of redundancy can be combined in order to make the system as much robust as possible with doubled
elements.
11.2 Power Supply Redundancy

Power supply redundancy consist of the use of multiple power supply units for the same backplane. Thus, the power
supply reliability is much improved.
The SM_BPX and SM_CHX backplane have two different power supply options available:
 Power supply using SM_PS or SM_PS40 units
 Power supply using external power supply units.
In both cases, it is possible to have a simple or redundant configuration.
11.2.1 Power Supply Redundancy in SM_BPX

In the redundant configuration, the first PS module is connected to the slot 1 in the backplane and the second PS module
is connected to the slot 2 in the backplane.

Rev 3.2 (21-12-2016)
Figure 11-1 SM_BPX backplane with two Saitel DP PS modules
If an external power supply module is used to power the backplane, it is connected to the lateral connector (see connector
5 in Figure 8-7). The connector pinout is shown in paragraph 8.2.2.1.
The combination of an external power supply unit and a Saitel DP PS module is possible providing they both are not the
primary or secondary power supplies.
WARNING
If two power supplies are connected as primary or secondary power supplies, the electronic components may be
damaged.
100% of the power is provided by one of the two power supply units, regardless if Saitel DP PS, an external power supply
or a combination of the two options is used. Therefore, there are four possible redundant configurations:
2 Saitel DP PS
2 external PS

Rev 3.2 (21-12-2016)
1 Saitel DP PS
(primary) and 1
external PS
(secondary)
1 Saitel DP PS
(secondary) and 1
external PS
(primary)
Figure 11-2 Power redundant configurations (SM_BPX)
For any of the configurations described above, the polarization redundancy is achieves using the adequate wiring..
11.2.2 Power Supply Redundancy in SM_CHX

The SM_CHX backplane has the same power supply options as the SM_BPX backplane, so the redundancy configuration
is similar.
The difference is that the connectors for external power sources are located at the back of the circuit board rather than on
the side (see item 3 in Figure 8-10). The pinout of this connector is detailed in section 8.3.3.1 of this manual.
There are four possible redundant configurations:
2 Saitel DP PS

Rev 3.2 (21-12-2016)
2 external PS
1 Saitel DP PS
(primary) and 1
external
(secondary)
1 Saitel DP PS
(secondary) and 1
external PS
(primary)
Figure 11-3 Power redundant configuration (SM_CHX)

Rev 3.2 (21-12-2016)
11.3 CPU Redundancy

The SM_CPU866 and SM_CPU866e modules, together with the backplanes (SM_BPX and SM_CHX), support the
definition of different redundancy configurations of the CPU.
The redundancy types are defined by:
 Physical site: The two CPU are installed consecutively in the same backplane or in different backplanes.
 Switching mechanism: The switching can be arbitrated by the MSAC module or managed by the CPU modules
themselves.
 Switching type: Both "cold" and "hot" switching are possible. In the first case, the database of the STANDBY
device is not updated with the ONLINE device’s database, but it only updates when switching is triggered. In the
second case, the STANDBY device is constantly updating the database with the ONLINE device.
 IP address allocation: Baseline Software Platform allows configuring a number of IP addresses associated to the
ONLINE CPU. These addresses are assigned dynamically to allow CPU modules in redundant systems to inter-
communicate and use the same IP address after switching.
The different options are described below.
11.3.1 CPU Physical Site

11.3.1.1 Two CPU Modules in the Same Backplane
This is the simplest redundant configuration as it makes the best use as possible of the features of the backplanes
(SM_BPX and SM_CHX).
It is the only configuration which allows the two CPU modules to share the SM_SER communication modules. It also
allows (alike in other configurations) acquisition modules to be shared.
NOTICE
The two CPU modules must be installed in consecutive slots in the backplane.
If there are two CPU modules in the same backplane, the switching mechanism can be controlled by the MSAC module or
be managed by the two CPU. In this case, Both CPU can intercommunicate through a dedicated high-speed channel
included in the backplanes or through a serial or Ethernet link.
Its main disadvantage is that a failure in the CPUs’ backplane, caused by any of the modules, affects the two CPU
similarly. Therefore, there are simple faults which might make the two CPU fail.
Figure 11-4 Two CPU modules in the same backplane

Rev 3.2 (21-12-2016)
11.3.1.2 Two CPU Modules in Different Backplanes

This configuration requires an additional backplane; moreover, the number of SM_SER communication modules, which
are doubled, cannot communicate with the CPU if they are nor in the same backplane.
The switching mechanism is controlled by the MSAC module or managed directly by the two CPU modules. In this case,
both CPU can intercommunicate through a serial or Ethernet link.
This configuration prevents a simple failure in the backplane from affecting the system completely.
NOTICE
No other acquisition module can be installed in the backplanes in which the CPU modules are located, since the CPU
will not be able to access the acquisition data of the modules located in the backplane of the other CPU.
Figure 11-5. Two CPUs in different backplanes
11.3.2 Switching Mechanisms

11.3.2.1 MSAC Module
MSAC (Signaling, Arbitration and Switching Module) can, in redundant CPU configurations, perform the following
functions:
 Using a powerful "hardware" protocol, it detects if a CPU is operational or in failure. It arbitrates which of the two
CPU is ONLINE or STANDBY.
 If a GPS is used for synchronization, the synchronization signal is broadcasted to the two CPU.
 It links each CPU to a relay output, which is activated if the device is operational (ONLINE or STANDBY) and
deactivated if a FAIL status is detected. This relay output can interrupt the output polarization, signaling, etc.
The MSAC module includes a set of LEDs to indicate the state of each CPU.

Rev 3.2 (21-12-2016)
Figure 11-6. Switching using the MSAC module
The CPU (A or B) reports its status to the MSAC. If it is ONLINE, it generates a pulse train, which is not generated if it is
FAIL. The MSAC reports the other CPU whether it should switch to ONLINE or not, and if the other CPU is in a FAIL
status.
11.3.2.2 RCAP Protocol

If there is no MSAC module installed, the switching van be performed through the RCAP (Redundancy Control
Asymmetric Protocol) protocol.
In this case, there is a communication channel, which can also be redundant, between the CPU modules. Using this
channel, the CPU modules manage the switching through a Schneider Electric proprietary protocol (RCAP). The
communication channels include:
 Ethernet. Communications are established using an IP address through an Ethernet port.
 Serial. The CPU modules communicate using a serial port in the SM_CPU866 module.
 Communication through the backplane (only available when the two CPU are installed in the same backplane).
The backplane incorporates a dedicated serial channel so that the CPU modules can communicate.
This switching mechanism is specially recommended when the two control modules are installed in the same backplane or
when they are installed at a short distance.
11.3.3 Switching Mode

There is two types of switching: “Cold Data” and “Hot Data”.
11.3.3.1 Cold Data

Under this mode, there is no communication between the two CPU, and when the switching is performed, the new
ONLINE CPU initializes with a database with default values.

Rev 3.2 (21-12-2016)
Figure 11-7. Switching status under Cold Data mode
There are three status defined for each CPU:

 STANDBY: Under this status, the CPU is operational, the defined software modules (coreDb, synchronization,
web server,...) in AutoLoad.cfg, the supervision module and ISaGRAF are loaded. The other BinControllers are
not executed. The CPU does not access to the acquisition bus, the SM_SER communication bus or generate the
PPS. The database is not updated.
 ONLINE: Under this mode, the CPU is operational and all applications are executing. The protocol BinControllers
are executed. The communication is activated through the acquisition bus and SM_SER communication bus; the
PPS is generated.
After the switching, communications and acquisition are resumed, and all parameters use default values.
 FAIL: Under this status, the CPU is not operational.
By adding a second CPU to a control system, this configuration has the advantage of improving availability considerably
so that maintenance, database modifications and testing tasks can be carried out over the STANDBY CPU, not
comprising the system’s performance.
11.3.3.2 Hot Data

Under Hot Data mode, there is a high-speed communication channel (Ethernet or backplane) between the two CPU,
which is used to update the STANDBY CPU’s database with the ONLINE CPU’s database. When a switching is
performed, the new ONLINE CPU starts with updated values. In this operation mode, database IDs must be the identical.
The update is performed by exception; it only sends the values of the points which have changed, except for the first time
when the entire database is updated.
The information which is shared by the two CPU is exclusively related to coreDb points; internal information about the
BinControllers is not shared. This is the reason why, some information may be lost after a switching. Examples of this type
of information are events and commands.
The use of a BinController of the laq type which uses a Profibus protocol sending the status of the outputs constantly
assures that the values sent as outputs will match the values corresponding to the actuations performed on the points
associated in coreDb.
For BinControllers using other protocols (101,104, DNP) which send commands by exception, no command is sent after a
switching.
ISaGRAF and supervision BinControllers are executed in the STANDBY CPU. The points with sources in the supervision
BinController are not shared by the two CPU.
Both CPU can initialize in different moments, so there is no guarantee that ISaGRAF sequential program is under the
same status in both CPU. If status synchronization between both programs is required, it must be implemented in the
program itself using ISaGRAF variables mapped to coreDb signals.

Rev 3.2 (21-12-2016)
Figure 11-8. Switching status under Hot Data mode
There are three status defined for each CPU:

 STANDBY: Under this status, the CPU is operational, the defined software modules in AutoLoad.cfg (coreDb,
synchronization, web server,...), the supervision module and ISaGRAF are executed. The other BinControllers are
not executed. The CPU does not access to the acquisition bus, the SM_SER communication bus; the PPS is not
generated and dbNET is disabled. Data related to the point status are received from the other CPU and updated in
coreDb.
 ONLINE: Under this mode, the CPU is operational and all applications and protocol BinControllers are executing.
The communication is activated through the acquisition bus and communication bus; the PPS is generated.
 FAIL: Under this status, the CPU is not operational.
NOTICE
Hot Data switching has several peculiarities. We recommend you to contact Telvent technical support services in
es-infoSaitel@schneider-electric.com to analyses each particular case.
11.4 Acquisition Bus Redundancy

The backplanes in Saitel DP include four communication buses for module interconnection.
Figure 11-9. Communication buses in the backplane
These four buses are:

 Double Profibus-DP communication bus for the communication between I/O modules and control module (PF1
and PF2).
 Communication bus for synchronizing acquisition modules (SYN).

Rev 3.2 (21-12-2016)
 High-speed communication bus for the communication between the control module and communication modules,
SM_SER.
 High-speed communication bus for the communication between the two control modules installed at the same
backplane (CPU).
The acquisition bus redundancy in Saitel DP is achieved by the Profibus DP (RS-485) double bus. This bus enable
distributed acquisition architectures to be defined; it is highly flexible and robust and can cover distances of up to 1500
meters. The communication rate for these channels is selectable from 9.6 kbps and 1.5 Mbps.
Profibus redundancy is expandable to other backplanes since the channels: PF1, PF2 and SYN are outputs in the
backplane through the expansion connectors.
NOTICE
The backplanes in Saitel DP family have a jumper (J2) which is required to configure the system with Profibus-DP
redundant communications. If the jumper is installed, the Profibus-DP redundancy is enabled.
Profibus implementation for Saitel DP has the following features:

 There is only one serial controller for the two Profibus buses.
 Messages both from the master and the slaves are broadcasted through the two buses.
 Both the master and the slaves select the reception bus.
 The redundant bridge must be installed in the backplane in order to be able to select the listening bus. If
uninstalled, the listening bus will always be the bus 1.
 When there is no response in the master (including the attempts), the system switches to the active listening bus.
 If communication is lost between a slave and the master through the two channels during more than 8 seconds,
this event is detected and the adequate diagnostic led is lit.
 The buses are alternatively monitored every minute. Therefore, both fault detection and recovery may be delayed
one minute.
11.5 System’s Duality

The system’s duality is the last option in order to maximize the system’s availability. Duplicity means that all system's
elements are doubled. This is the typical configuration of data hubs and communication front-ends.
In terms of redundancy, there are two CPU in different backplanes with a specific number of communication modules
associated. Both hot and cold switching, which is arbitrated by the MSAC module, are possible. Even though generally
there is no acquisition, it is possible to have acquisition modules installed in the CPU's backplanes in this case.
Communication channels are multiplexed by using a logic device.

Rev 3.2 (21-12-2016)
Figure 11-10. Dual system
11.6 Recommendations
Following paragraphs provide information about the different types of existing redundancies and which is the most
adequate redundancy for each case. Due to the wide range of redundancy possibilities available for Saitel 2000DP, these
proposals are general and open, so it is possible that the least recommended options here are the most appropriate for a
specific project
11.6.1 Power Supply

In non-redundant configurations, the use of an external power supply module is recommended as the most appropriate
option for the backplanes. For the same reasons, it is the recommended option here.
In this case, two slots are not occupied; they can be used for communication or acquisition modules. Moreover, since the
power supply source is different to the polarization source (if acquisition is available), one can fail without affecting the
other.
The table below summarizes the options in order of preference:
Configuration
2 external PS
+
1 Saitel DP PS (primary) and 1 external PS (secondary)
1 external PS (primary) y 1 Saitel DP PS (secondary)
2 Saitel DP PS -
Table 11-1 Combination of redundant power supplies

Rev 3.2 (21-12-2016)
11.6.2 Control Unit

It should be noted that all options are not possible sometimes, especially due to location restrictions in the CPU modules,
database specifications or other requirements.
This section does not cover the switching modes, since it is case-specific.
Regardless these aspects, the preferences both in terms of the control mechanism of the CPU modules and the exchange
methods for the database are explained in detailed in further sections. The recommendations below take into
consideration not only the reliability but also the communication rate provided by each option.
Configuration Features
The dedicated communication channel integrated in the

Backplane backplane for switching is very robust and accessible for the
CPU modules only. +
A direct wiring between the configured serial ports should be
Channel through a
used, preferably ports in the CPU module although the
serial port.
SM_SER module is also possible.
A crossed Ethernet cable must be used, since it allows longer

Channel through a distances than serial communication to be covered. In this
Ethernet port. case, a dedicated channel is not required but very
recommended.
-
This option allows for a single synchronization source for the
MSAC
entire system.
Table 11-2 Control options for redundant CPU modules
Configuration Features
The dedicated communication channel integrated in the

Backplane backplane to transmit the database values is the same as the +
channel for switching control.
It is less robust than the existing channel in the backplane, but

it is the only method available to update the database of the
Channel through a
stand-by CPU if it is installed in a different backplane.
Ethernet port.
Whenever possible, it is recommended to have this channel in
a dedicated network.
-
Table 11-3 Communication options for “Hot Data” CPU modules
11.6.3 Acquisition Bus: Profibus

If the specific subsystem consists only on a backplane, a Profibus redundancy (that is, setting the enabling jumper or not)
has no effect. Nevertheless, when communications with the acquisition must be established outside the backplane, then
they must be more secured.
To do so, it is possible to take two channels from the same expansion connector or obtain each channel for a connector.
When distances are relatively long, copper wires should not be used, but optic fiber instead. In this case, the
recommended converter is BP2F.
NOTICE
Cooper wired are generally recommended for the connection within a cabinet and optic fiber wires between different
cabinets.

Rev 3.2 (21-12-2016)
For the particular case of a system with redundant CPU modules in different backplanes, the status of Profibus
communications in the STANDBY (inoperational) CPU can be monitored by the ONLINE CPU.
To do so, at least one acquisition module is required in the CPU backplanes. The ONLINE CPU will be able to access to
those modules, and the status of the module’s diagnostic signals of the STANDBY CPU will be the status of the Profibus
channel (or channels) of the STANDBY CPU.
Therefore, the status of the Profibus channel in the backplane of the STANDBY CPU will be provided by the acquisition
module.
The figure below illustrates an example of the described architecture with only one Profibus channel:
Figure 11-11. Example of a redundant architecture
If the bottom CPU is the ONLINE CPU will be able to know that the upper CPU in STANDBY status has lost the Profibus
channel when the I/O module does not respond.

Rev 3.2 (21-12-2016)
Glossary
Acronym Description
Ω Ohm.
µ Micrometer.
µs Microsecond.
A Ampere.
AC Alternate current.
A/D Analog to digital.
AI Analog input.
AM Amplitude modulation.
A/m Ampere per meter.
AO Analog output.
ARMS Ampere, expressed in RMS (Root Measure Square).
AWG American Wire Gauge.
bps Bits per second.
ºC Degrees Celsius.
COMx Communications port.
CON Console port.
CPLD Complex Programmable Logical Device.
CPU Central Processing Unit.
CTS Clear To Send.
DC Direct current.
dB Decibel.
dB/km Decibel per kilometer.
DB-9 9-pin analog connector, mainly used in serial connections.
DCD Data Carrier Detect.
DI Digital input.
DIN Deutsche Industrie Norm.
DO Digital output.
DRAM Dynamic Random Access Memory.
DSP Digital Signal Processor.
DTR Data Terminal Ready.
Easergy Builder Configuration tool for Telvent Baseline Platform products.
EIA Electronic Industries Association.
EMC Electromagnetic Compatibility.
ESD Electrostatic Discharge Association.
Ethernet Technology used to implement networks through different physical media, including twisted
pair and coaxial cables.
TCP/IP is the protocol normally used with these types of networks.
Firmware Programs and/or data structures that internally control various electronic devices in a ROM or
Flash-Memory.
Flash memory Type non-volatile memory such as EPROM.
FTP File Transfer Protocol – The TCP/IP protocol is used for transferring files from a system to
another.
g Gram.
GND Connection line to Ground Protection.
GPS Global Positioning System.
A Saitel DP Modules
Rev 3.2 (21-12-2016)
Acronym Description
h Hour.
Hz Hertz.
I Input.
IED Intelligent Electronic Device.
I/O Input / Output.
IP Address that identifies each device on a TCP/IP network.
IPx International code that describes the degree of protection against intrusion of solid objects or
liquids. (The x value indicates the protection level).
ISO 9001 The international standard that specifies requirements to be met by a quality management
system.
J Joules.
kΩ Kiloohm.
kaud Kilobaud.
KB Kilobyte.
kbps Kilobit per second.
kcmil Circular mil.
kg Kilogram.
kHz Kilohertz.
km Kilometer.
kV, kVRMS y kVDC Kilovolt.
kW Kilowatt.
LAN Local Area Network.
LED Light Emitting Diode.
Linux Unix-like operating system. Licensed under GPL v2 (General Public License)
m Meter.
MΩ Megaohm.
mA Milliampere.
Mbaud Megabaud.
MB Megabyte.
M.B. Modal Bandwidth.
Mbps Megabits per second.
MHz Megahertz.
min Minute.
mm Millimeter.
M.B. Modal Bandwidth.
MMF MultiMode Fiber
mm2 Square millimeter.
ms Millisecond.
MUX Multiplexer.
mW Milliwatt.
N/A Not applicable.
NC Normally closed.
nm Nanometer.
NO Normally open.
NVRAM Non-Volatile Random Access Memory.
O Output.
PC Personal Computer.
Saitel DP Modules B
Rev 3.2 (21-12-2016)
Acronym Description
PCB Printed Circuit Board.
pF Picofarad.
PLC Programmable Logic Controller.
ppm Parts per million.
PPS Pulses per Second.
Profibus Standard for field bus communication in automation technology.
PS Power Supply.
PWR Power.
RAM Random Access Memory.
RH Relative humidity.
RJ-45 Physical interface that is normally used to connect a device to a wired network.
RTD Resistance Temperature Detector.
RTS Request To Send.
RTU Remote Terminal Unit.
Rx Reception.
s Second.
Saitel DP Hardware platform designed by Telvent.
Saitel Webtool Supervision and maintenance tool for products Telvent Baseline Platform products.
SCADA Supervisory Control And Data Acquisition
SDRAM Synchronous Dynamic Random Access Memory.
SM_AI16 16 analog inputs module.
SM_AI8AO4 8 analog inputs and 4 analog outputs module.
SM_BPXx Backplane with 4 or 9 slots mounted in a panel on the cabinet with expansion possibility.
SM_CHXx Backplane with 4 or 9 slots mounted in a chassis with expansion possibility.
SM_CPU866 Basic-Performance CPU for Saitel DP.
SM_CPU866e High-Performance CPU for Saitel DP..
SM_DI32 32 digital inputs module.
SM_DO16R 16 digital outputs to relay module.
SM_DO32T 32 digital outputs to transistor module.
SM_PS Power supply module.
SM_PS40 Power supply module.
SM_SER Asynchronous serial communication module.
SMF SingleMode Fiber.
SRAM Static Random Access Memory.
TCP/IP Transmission Control Protocol/Internet Protocol. Standardized protocol stack based on IP
and TCP protocols.
TF Filter time.
TFTP Trivial File transfer protocol.
TM Memory time.
TTL Transistor-Transistor Logic.
Tx Transmission.
UART Universal Asynchronous Receiver Transmitter.
V Volt.
VRMS Volt of alternate current.
VDC Volt of direct current.
V/m Volt per meter.
V/m/MHz Volt per meter for some ranges of megahertz.
C Saitel DP Modules
Rev 3.2 (21-12-2016)
Acronym Description
Vpol or PV Polarization voltage.
Vpp Volt peak to peak.
VRMS Volt, expressed in RMS (root square measure)..
VxWorks Real time operating system for embedded systems, designed by Wind River.
W Watt.
Saitel DP Modules D
Fax:
E-mail:
Phone:
Seville, Spain
C/ Charles Darwin s/n
Schneider Electric
+34 95 492 09 92
+34 95 541 33 75
Saitel Team
www.schneider-electric.com
Parque Científico y Tecnológico de la Cartuja
es-infoSaitel@schneider-electric.com
© 2016 All rights reserved. The information contained in this document is confidential and is owned by Schneider Electric. It cannot
be copied or distributed in any way, unless there is express written authorization by Schneider Electric. Although this information was
verified at the time of publication, may be subject to change without notice
Rev. 3.2 – December 2016

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Document nº: TE-HG-0000-MOD-F700

4.3.4 Diagnostic & Troubleshooting................................................................................................................... 4-10

7.5.1 General Description.................................................................................................................................. 7-30

11.2 Power Supply Redundancy .............................................................................................................................. 11-1

Figure 7-1. SM_DI32 - Front view. ..................................................................................................................................... 7-1

Figure 7-47. TB_AI8/N Normalized terminal block .................................................................................................. 7-34

Figure 11-2 Power redundant configurations (SM_BPX).................................................................................................. 11-3

II. Target Audience

Chapter 1: Safety & Health

Chapter 2: First Approach

Chapter 4: Control Units

Chapter 5: Communication Modules

Chapter 6: Power Supplies

Chapter 7: Acquisition Modules

Chapter 8: Backplane Modules

Chapter 9: Technical Data

Chapter 10: Input/Output Information Processing

Chapter 11: Redundant Configurations

Chapter 1. Safety & Health

Risk of electric chock

In this manual you can find the following message types:

1.2 Restricted Liability

1.3 Handling Electronical Components

1.4 Installation and Operation

Following image shows an example:

Figure 1-1. Protection barrier for elements handling dangerous voltage.

1.5 Protective Grounding

Saitel must be grounded for two different reasons:

1.5.1 Electric Safety

Figure 1-2. Yellow and green cable for ground.

1.6 Replacing the Battery and Recicling the Product

Figure 2-1. Saitel DP in a chassis. Figure 2-2. Saitel DP in a backplane

Figure 2-3. Saitel DP architecture.

2-1 Saitel DP Modules

2.2 Saitel DP Modules

2.2.1 Available Module Types

2.2.2 General Features

Figure 2-4. A Saitel DP module.

Saitel DP Modules 2-2

Figure 2-5. Module’s switches.

2.3 System Buses

Figure 2-6. Profibus TTL and Profibus RS-485.

These buses integrate the following bus lines:

2-3 Saitel DP Modules

Figure 2-7. Buses in a backplane.

Saitel DP Modules 2-4

Please note the following precautions to avoid electrostatic damages:

3.3 Module Location within the Chassis

Figure 3-1. Backplane`s positions.

3.4 Power Requirements

3-1 Saitel DP Modules

3.5 Polarization and Commons

3.6 Identification and Profibus Speed

Figure 3-2. Profibus switches for module configuration.

Table 3-1. Profibus speed.

Saitel DP Modules 3-2

3.8 LED Indicators

3-3 Saitel DP Modules

3.9.1.1 C1 – Terminal Connection

An example is shown in the following figure:

Manufacturer: Phoenix Contact

Figure 3-5. Header connector for Saitel DP acquisition modules.