Key Factors

Tenting (Hoz)
Tenting (1oz)
Line Width Cu Thickness
Tenting (2oz)
Tenting (3oz)
Tenting (Hoz)
Line to Line Tenting (1oz)
(Including
line compensation) Tenting (2oz)
Tenting (3oz)
Tenting (Hoz)
Pad to Pad Tenting (1oz)
Space (Including
Tenting (2oz)
line compensation)
Tenting (3oz)
Tenting (Hoz)
Inner Pad to Line Tenting (1oz)
Image (Including
Tenting (2oz)
line compensation)
Tenting (3oz)
3oz
2oz
Tolerance Cu Thickness
1oz
Hoz
3oz
Line Cu Thickness
2oz
Compensation 1oz
Hoz
Thickness (Based on Hoz ↑)
Min
Work Size
Max
Tenting - 20~30um
Tenting - 31~40um (foil+plating)
Tenting - 41~50um (foil+plating)
Trace Width Cu Thickness
Tenting - 51~60um (foil+plating)
Tenting - 61~70um (foil+plating)
Tenting - 70um ↑ (foil+plating)
Tenting - 20~30um (foil+plating)
Tenting - 31~40um (foil+plating)
Line to Line Tenting - 41~50um (foil+plating)
(Including
line compensation) Tenting - 51~60um (foil+plating)
Tenting - 61~70um (foil+plating)
Tenting - 70um ↑ (foil+plating)
Tenting - 20~30um (foil+plating)

Pad to Pad
Space (Including
line compensation)
 Tenting - 31~40um (foil+plating)
Pad to Pad Tenting - 41~50um (foil+plating)
Space (Including
Tenting - 51~60um (foil+plating)
line compensation)
Tenting - 61~70um (foil+plating)
Tenting - 70um ↑ (foil+plating)
Tenting - 20~30um (foil+plating)
Tenting - 31~40um (foil+plating)
Pad to Line Tenting - 41~50um (foil+plating)
Outer (Including
Image line compensation) Tenting - 51~60um (foil+plating)
Tenting - 61~70um (foil+plating)
Tenting - 70um ↑ (foil+plating)
20~30um (foil+plating)
31~40um (foil+plating)
41~50um (foil+plating)
Tolerance Cu Thickness
51~60um (foil+plating)
61~70um (foil+plating)
70um ↑ (foil+plating)
20~30um (foil+plating)
31~40um (foil+plating)
Line Cu Thickness
41~50um (foil+plating)
Compensation 51~60um (foil+plating)
61~70um (foil+plating)
70um ↑ (foil+plating)
Tenting Hole Size (D/F 40um)
Thickness (Based on Hoz ↑)
Auto Exposure
Tolerance (Pad to Pad)
LDI
MIN.
Work Size
MAX.
 Capability
Grade 1 Grade 2 Grade 3
(Mass Volume) (Proto & Develop) (No capability)
 Key Factors

Oxide Core Thickness

20L under
21~30L
D2M 31~40L
41~50L
Layup 61~70L
Size
Pin
Core Thickness
Lamination Size
Pinless
CCL Thickness
Press Material
4.0T ↓
Total Thickness 4.1~7.0T
Product Probe / Semi-Conductor
Network
Bow & Twist
Probe
 Capability
Grade 1 Grade 2
(Mass Volume) (Proto & Develop)
 Grade 3
(No capability)
 Capability
Key Factors Grade 1 Grade 2 Grade 3 Remark
(Mass Volume) {Proto & Develop) (No capability)
Drill dia. DHS -
Layer -
Thikness
Single
0.075/0.100Φ
Flip
Single
0.125/0.130Φ
Flip
Single
0.150Φ
Flip
Single
0.200Φ
Drill type Flip Flip/Triple applies only to
Single semiconductor products
0.250Φ
Flip
Drill 0.300Φ Single
~0.350Φ Flip
0.400Φ Single
~0.45 Flip
Single
0.5Φ ↑
Flip
0.075/0.100Φ Flip
0.125/0.130Φ Flip
Slant
0.150Φ Flip
0.200Φ↑ Fiip
Annual ring - -
D2M - -
Work size - -
Hole accuracy - -
0.30Φ -
(DHS : 0.20Φ)
0.45Φ
Back drill size (DHS : 0.25Φ) -

0.55Φ↑
-
(DHS : 0.35Φ↑)
0.30Φ -
(DHS : 0.20Φ)
0.45Φ
Drill Depth (Max) (DHS : 0.25Φ) -

Back 0.55Φ↑
Drill -
(DHS : 0.35Φ↑)
0.0~2.0T
0.30Φ
(DHS : 0.20Φ) 2.1T~4.0T
4.0T↑
0.0~2.0T
0.45Φ 2.1T~4.0T
Stub Length (Max) (DHS : 0.25Φ)
4.0T↑
0.0~2.0T
0.55Φ↑ 2.1T~4.0T
(DHS : 0.35Φ↑)
4.0T↑
 Key Factors

Work size

Plaing
Aspect Ratio Thickness
(Sumamry)

Common item Aspect Ratio

df : 0.015~0.01
Plasma
Plating df : 0.01~0.005
Material
df : ≤0.005
Teflon (df≤0.005)
Thickness
Desmear, Structure, Aspect Ratio
Electroless plating Aspect Ratio
BUM ( Laser )

Common item Aspect Ratio

PNL Plating
Depth drill Depth drill size

Work size
VIA fill V/F Plating Thickness
VIA FILL,
 Capability
Grade 1
(Mass Volume)

1.6T ↑
1.61~2.9T
2.91~3.6T
3.61~4.0T
4.01~5.0T
5.01~6.0T
6.01~7.0T
7.01~7.7T
1.61T~ 7.7T
1.6T ↓

1.61~8.0T

Thickness
Aspect Ratio
A/R 1↓
200 Line
300 Line
0.35￠
0.40￠
Work size
Thickness
A/R 1↓
 Capability
Grade 2 Grade 3
(Proto & Develop) (No capability)
Remark
 Key Factors

Work size
Thickness
60um
80um
Cu direct
100um
[ MITSUBISHI]
Core thickness 120um
150um
180um
200um
Laser drill Work size
Thickness
60um
Cu open 80um
( Large window )
100um
Core thickness 120um
[ HITACHI]
150um
180um
200um
Material
 Capability
Grade 1
(Mass Volume)
ze
ss
60um
80um
100um
120um
150um
180um
200um
ze
ss
60um
80um
100um
120um
150um
180um
200um
 Capability
Grade 2 Grade 3
(Proto & Develop) (No capability)

-
 Key Factors

Panel thickness max thickness

Cu Thickness Base Cu + PNL total thickness
Product
Work size Based on horizontal
Hole Size Bassed on DHS

Spray Coater

PSR Material Ink Type

Screen Print

PSR Spray Coater

Tolerance
Screen Print
SR Thickness Ground Thickness
Thickness Line Edge Thickness (Based on 4mil)
Crest Thickness (Based on 4mil)
Smallest opening size
SM opening (SMD type)
SM opening (NSMD type)
PSR SM Develop
SM opening tolerance

SM registration

Dam Width
PSR Dam Develop
Dam size
 Capability
Grade 1
(Mass Volume)
kness
+ PNL total thickness
horizontal
n DHS

ater

rint

ater
rint
Thickness
e Thickness (Based on 4mil)
ckness (Based on 4mil)
opening size
ing (SMD type)
ing (NSMD type)
ing tolerance

tration

th
 Capability
Grade 2 Grade 3
(Proto & Develop) (No capability)
 Key Factors

A/R
Thickness
Work size
Vacuum H/P
Hole Size
Dimple
Hole Ink type
Pluggign Thickness
Work size
Hole Size
Screen H/P
Dimple
Ink type
Design
Panel thickness
Product Cu Thickness
Work size

Trace width
Alkaline (foil+plating)
ETCH
Trace width / space

Space
(foil+plating)

Marking Inkjet M/K Product

ey Factors Grade 1
(Mass Volume)
Aspect Ratio
Panel Thickness
Based on horizontal
Min Hole size (Based on DHS)
Dimple Level
Type
Panel Thickness
Based on horizontal
Min Hole size (Based on DHS)
Dimple Level
Type
Min distance between HP holes and PTH/NPTH
max thickness
Base Cu + PNL total thickness
Based on horizontal
Plating thickness 30~40um
Plating thickness 40~50um
Plating thickness 50~60um
Plating thickness 60~70um
Plating thickness 30~40um
Plating thickness 40~50um
Plating thickness 50~60um
Plating thickness 60~70um
Restrictions
Registration
Work Size
Printing area
Resolution (Line width of legend)
 Capability
Grade 2 Grade 3
(Proto & Develop) (No capability)
 Capability
Key Factors Grade 2
(Proto & Develop)
UTRON AUTO max. Height: 350 mm
Jig Type UTRON MANUAL
350 mm x 410 mm
Maximum Test Area KIMS MANUAL

Flying Probe Type ATG-A3 520 mm x 400 mm

UTRON AUTO max. Height: 350 mm

Jig Type UTRON MANUAL 350 mm x 410 mm
Maximum board size KIMS MANUAL 350 mm x 410 mm

Flying Probe Type ATG-A3 540 mm x 490 mm

Number of Probes Flying Probe Type ATG-A3 8 probe pins (4 top, 4 bottom)

Camera Flying Probe Type ATG-A3 2 cameras -CCD (1 top, 1 bottom)

Repeatability Flying Probe Type ATG-A3 Repetition accuracy : ±10 µm

Scanning Accuracy : 5 µm
Accuracy Flying Probe Type ATG-A3
Positioning Accuracy: ±35 µm

Minimum Pad size Flying Probe Type ATG-A3 10 mils

Minimum Pitch Flying Probe Type ATG-A3 19 mils

BBT
Testing speed Flying Probe Type ATG-A3 60 mm/sec

UTRON AUTO
Jig Type UTRON MANUAL
Test Voltage KIMS MANUAL 250 volts

Flying Probe Type ATG-A3

UTRON AUTO
Jig Type UTRON MANUAL 20 MΩ
Isolation Threshold KIMS MANUAL

Flying Probe Type ATG-A3 10 MΩ

UTRON AUTO
Jig Type UTRON MANUAL
Continuity Threshold KIMS MANUAL 50 Ω

Flying Probe Type ATG-A3

UTRON AUTO max. 8192 test Points

Min. 3968 testpoints
Jig Type UTRON MANUAL Max. 9144 testpoints
Testpoints
KIMS MANUAL max. 2049 testpoints

Flying Probe Type ATG-A3 N/A (defending on program)