You are on page 1of 2

W . Y . M . W W .1 Y .C M.

W 10 0 O W W 0 0 O W
. .C .T W . 1 .C . T
W W 00Y O M W W 00Y M
W . 1 .C . T W .1 C O . T W SMT International. LLC
W 00Y M W W 00Y . M
W W
WAMTECH
WAdvanced
W 00 .
W
1
. 1
Y
SMT0
. C
Y
O
C O
. Solder
M .
M
T W
T W
.Products
W
W
W
W W 00Y
W
.1
.1
. C
Y
O
O M . T WP.O. Box 989
T W
Deep River, CT 06417
.C M. Toll free: 800.435.0317
WW W.1
0 . C O . T W W . 1 00 .CO . T W 860.526.8300
Phone:
0Y M W W 00Y M Fax: 860.526.8243
W 10 O W W .1 O TW
W W . Y .C M.T W W Y .C
M .
www.amtechsolder.com
W . 100 .CO . T W An ISO 9001 Certified
W . 1 0 0 Company
C O . T W
W W .
W ProductW W Sheet
Data 1 0 0Y O M W W W 00Y OM .TW
W . .C .T W . 1 . C
W W W 00Y O M W W 00Y M
T NC-559-ASM W . 1 No-Clean . C Solder
. T Paste W .1 C O . T W
W 00Y M W W 00Y . M
. TW Product Description W W . 1 .C O . T W
Viscosity W
W . 1 .C O .T W
M W Y M W 00Y+/-10%OM
. TWI Exceptional printW W
definition
. 100 .CO . T W Printing applications: W
W
900 to 1,200Kcps
. 1 .C . TW
M I Long stencil life W Y
00 .COM .TW Dispensing applications: 425Kcps W +/-10% 0 Y M
O . TI W Wide process window W W . 1 Tested according to W W
IPC-TM-650 . 1 0 . C O . TW
M W wetting compatibility W Y
00 finishes OM .TW W 0 Y M
CO II.TExcellent W W on most1board
. .C W W . 1 0 .C O . T W
O M Low voiding W W W 00Y O M TackW Value W 00Y M
.C .T W . 1 .C . T W .1 C O . T W
Y I Contains
M
UV Tracer
W 00Y M
Typical tackiness: 54g force W W 00Y . M
C O I Clear residue
T W W 1 O T W W 1 O
. . W . .C Printing . W . .C M.T
0Y Alloys M W W 0 Y M W 0 Y
Y .CO M.T W W
W . 10
Y . C OThe print.T W of NC-559-ASMW
definition
W is ideal for.1 0 pitch .CO
fine

100 uniformly
AMTECH
C O manufactures
T W a low-oxide, spherical W and
10 0 applications.O M TheWstencil life of this no-clean W W virtually
product
1 0 0Y O M
Y. Osized . powder. NC-559-ASM W .
is available in the
Y C
.eliminatesMwaste T
. of solder paste. Consult Wthe powder . .C
0 0 M W W 0 W W 0 Y
1 following
Y .C alloys:M63Sn/37Pb,
W. 043Sn/43Pb/14Bi,
T
.42Sn/58Bi, 62Sn/36Pb/2Ag, W
W
60Sn/Pb40,10
W . Y .CO chart
distribution
M . Tto determine your meshWsizeWrequirements.
W 00. 10
Y .C O
1 0 .CO 00Printer
10Sn/88Pb/2Ag and 10Sn/90Pb.
T W W 1 O W W
W . Y M . W W . Y C
. Operation M . T W W .1 Y .C
W 0 0
1Powder O
Distribution W W 0
0The following Oare general W W 0 0
. . C . T W . 1 . C . T guidelines for stencil printer
W . 1
W W Micron
. 1 00YSize .COType M
T WPitch Requirements
. 24mil & above W W W optimization
10 0Y withONC-559-ASM
. necessary
M
T W . Some adjustments mayW
C on your. process requirements. W W . 1 0 0Y
W W 75 - 45 0Y M W be
Y .based M W
10
Type-2
O W 0
WW 45W- .25 Y .CType-3 M .T16mil to 24 mil W W
W 00. 10
Y . C O
M . TW W W
W .10
W . 1 00 Type-4 .C O .T W W
Print Speed:
. 1
25–100mm/sec
C O . T W W .1
W 38 -
W 20
Y M
12mil to 16mil W Squeegee
W
Pressure:
Y .
0.2–0.7kg/inch
M
of blade W W
W- 15 .10 Type-5 0 O <12mil.TW W 0
Under Stencil0Wipe: OnceO every 10–25W prints or as necessary W
W25 Y .C W . 1 . C . T W
15 -W 5 W 0 0
Type-6 O M
<8mil W W 0 0 Y O M W W
W . 1 . C . T W
Stencil . 1
Cleaning C . T W
W W 00Y O M W
W Automated Wstencil cleaning
0 0 Y. systems O Mfor both stencil
W and
W
Available
W .1
Packaging
.Care available .T W W .1ManualYcleaning
.C using T isopropyl
.99% W
W Y M misprinted boards.
W M W
The following packaging
W and.1dispensing00 .C
options
O
applications:.T
W W
alcohol (IPA) 1
works.well. 00 .CO .T W
Wprinting
for stencil
W and Y M W W 00Y M W
250g and 500gW jars; 250g 1 0 0700g cartridges;
O W W O W
W cassettes; W .35g and 100gY .Csyringes;M.T Storage Wand Handling W .1 ProceduresY .C M.T
750g ProFlow ®

10 0 O W Refrigerated storage 00will prolong


2,500g FreshMix WW ®
Kits.
W . Y .C
M .T W W at 42–47°F
life to no less thanW
. 1
Y . C O the solder . TW paste

Stencil Life W
W . 100 .CO .T W shelf W . 1 0 tip.C OM
6 months.0Syringes & cartridges
. T
should
W
W Y be stored verticallyW with the
W dispensing
Y down. Solder paste
>8 hrs. @ 30–45% RH W & 22–25°C 00
. 1 .C OM .TWshould be allowed to reach W ambient 0
. 1 0
temperature
C O M priorW
naturally,
.T
~4 hrs. @ 45–70% RH W & 22–25°C W Y M to use (about 6-8 hours).W NEVER W FREEZEYSOLDER . M
PASTE.
0 0 O W 0
WW W.1 . C .T W W . 1 0 .C O(continued) .T W
W 1 0 0Y O M W W W 00Y O M W
NC-559-ASMWNo-Clean . . C
Solder .T
Paste W . 1 . C .T
W 0Y M W 0Y M
W . Y . M . W W .1 Y .C M.
W 10 0 O W W 0 0 O W
. . C . T W .1 . C . T
W W 00Y O M W W 00Y M
W . 1 . C . T W .1 C O . T W
W 00Y W .
W NC-559-ASM 1 O MNo-Clean W Solder W W Paste 1 0 0Y O M W P.O. Box 989
W . Y .C . T W . T
.C M. Deep River, CT 06417
W 0 O M W W 0 Y
W
WJ-STD-004 . 10 .C . T W W . 1 0 . C O . T WToll free: 800.435.0317
W (IPC-TM-650)0 0 Y O MTest Results
W W 00Y M Phone: 860.526.8300
W .1 .C .T W .1 O W
T 860.526.8243
WTest W Y Standard
M ValuesW
W Results Y .C M.Fax:
W 0
10 IPC-TM-650 O 2.3.35 W 0
FluxWDesignator W . Y . C . T NA W W ROLO.10
Y .C . TW
O www.amtechsolder.com
W 00 IPC-TM-650 M
O 2.3.32.TW NA W W 0 0 O M W
Copper Mirror
W . 1 .C W PASS
. 1 .C . T
W Silver Chromate W W 0IPC-TM-650
1 0Y O M
2.3.33 W NA W
PASS
W 00Y OM .TW
W . .C
Y 2.6.3.3 .T WPASS W . 1 .C
W SIR Test
W W IPC-TM-6500 0 O M W 2.66E+10 0Y M
T W . 1 .C . T W .1 0 C O . T W
W 00Y M W W 00Y . M
. TW W W . 1 .C O . T W
W W . 1 .C O . T W
M W 0 Y M W 00Y M
. TWRecommendedW W
Profiles: . 1 0 . C O . T W
W W . 1 .C O . TW
M W Y M Profile-A for Sn62 & W 00
Sn63 alloy Y M
W was designed to serve as a 100
Ramp Profile
O . TProfile-A W . C O . T W W . 1 C O
Topside temperature of board

TW
to be @ 205-220°C

M W W Y . 250
W W Y . .
CO using
starting point for process optimization
. TW W . 1 00 .COM .TW 220
W . 1 0 0
C O M
. T W
NC-559-ASM. A cool
Mof (-) 2–4°C/second W down rate
W 00Y
200
183 W
Liquidus Temperature for Sn62 & Sn63 alloys

M W 00Y . M
C O . T W is ideal for the W . 1 C O T W W 1
Reflow Time:

C O T W
. W . .
Flux Activation Temperature
. 30-60 Sec.
. .
Temp. (ºC)

Y M
formation of a fine grain structure W 00Y
150
M W W 00Y
RAMP @ < 1.0°C/Second
M
C O T W W 1 O T W Soaking Zone
W 1 O
. without .risking damage to thermally
W . 100
.C M. W . .C M.T
0Y sensitive M W W 0 Y W 0 Y
.CO M.T 10 O TW Soak Time 60-90 SecWW
Soak Temp 140-180°C
components.
W W . . C . .10 C O
Y W 00 50
Y M W 00Y . M
100 .CO W Pre-heat 1 Pre-heat 2 Cooling

. T W . 1 C O T W W
Reflow Zone

1 O
0 Y M W W 0
Y . M . W W . Y .C
0 O W 0
0 30 60 90
W 120 150 180 210 240
0 270 300
1
W. 00Y.C OM. W
T WW W.1
0
Y .CO M.T Time (Sec.)
W W
W 00. 10
Y .C O
1 A profile.Cutilizing a soak W 10 0 O W W
. Y .T of up to two W . C .T
. forMSn62 & Sn63 alloy W .1 .C
W W 0
0 at .155°C M
O may help W W 0 Y
Profile-B W 0 Y
. 1minutes C . T to minimize W Soak Profile

. 10 C O . T W W
Topside temperature of board

1 0
to be @ 205-220°C
.
W 250
. W
W W voiding
10 0inYBGA assembles.
O M ThisW will allow 220
W W 00Y O M W W W 00Y
W . C
more time for .solvent components
Y T
. of the W
200 . 1 .C M.
Liquidus Temperature for Sn62 & Sn63 alloysT W .1
W 00 to outgas M 183
W Y W
WW W.1
solder paste
.C Oprior to reflow.
. T W W . 100 .CO
Flux Activation Temperature
. TW
Reflow Time:
W
30-60 Sec.
.10
W W
Temp. (ºC)

150
Y
00 .COM .TW W 00 Y M
RAMP @ < 1.0°C/Second
W
W W . 1 W . 1 C O T W
Soaking Zone
.
Reflow Zone
W Cooling
.1
W Y M
100
W W Y .Temp 140-180°C
M W W
0 0 O W 0
WW W.1 O Sec .TW
Soak
. C . T W . 1 0 Soak Time.C90-120 W
Y M 50 W W Y M W W
W . 1 00 .CO . T W W
Pre-heat 1

. 1 0 0
C O Pre-heat 2

. T W W
W W 00Y M 0 W W 00Y. OM W
W .1 O W 0 30
W 60 90

.1
120 150 180
W
210 240 270
W 300

W W Y .C M.T W W Y .C M.T
Time (Sec.)
W
00 is based
W contained.1herein . C O
on technical.T
W
data that we believe to be reliableW . 1 00for use by.Cpersons
O having.TtechnicalW skill,
W
The information
Wof our products Y Mtheir ownW W and is intended
Weach product Yfor their particular
M process.WAMTECH W
at their own risk. Users
W 0 0 should make
O tests to determine the suitability of
W 0 0 O
.1 obtainedY.orCdamages incurred
will assume no liability for results
W W .T through the applicationW .1
of the data presented.
Y .C M.T
0 0 O M W W 00 .CO
WW W.1 Y . C .T W W .
W 00
1
Y .TW
W . 1 00 .COM .TW AMTECH W . 1 C O M Rev.05/10
.TW
W W Y W W Y .
W . 1 00 Advanced .C OM SMT .T WSolder Products W
. 1 0 0
C O M
.T W
W W 00Y M W W 00Y . M
W . 1 C O .T W W . 1 C O T W
W W 00Y . M W W 00Y . M .
W . 1 C O . T W W . 1 C O T W
W F I L L I .
N G T H E V O I DW . .
W 0Y M W 0Y M

You might also like