Professional Documents
Culture Documents
1. Background
2. Introduction
3. μ-CMM in NMIs
4. Commercial μ-CMMs
5. Applications
6. Conclusion
1. Background
Interested Areas
Frame
Framedesign
design Probe
Probedesign
design
•• Thermo-mechanically
Thermo-mechanically •• Small
Smallradius
radius
stable •• Small
stable Smallstylus
stylus
•• Minimize
Minimizestructural High
structural Highstiffness
stiffness
distortion
distortioneffect
effecton
on •• Low
measurement Lowprobing
probingforces
forces
measurement Isotropic
•• Minimize Isotropic
MinimizeAbbeAbbeerrors
errors Low
•• Good Lowmoving
movingmassmass
Goodreference
referencepoints
points •• High
•• Finite Highresolution
resolution
Finitestiffness
stiffness •• High
Highstability
stability
•• Low
Lownoise
noiselevel
level
3.1 NPL System
• Measurement volume:
50 mm x 50 mm x 50 mm
• Measurement uncertainty: 50-100 nm
• Leitz CMM to provide motion control,
CNC programming and data analysis
• Metrology frame
• Six-axis heterodyne laser
interferometer measurement
system
• Miniature 3D probe
3.1 NPL System
Miniature 3D probe
• Stylus: Φ 1 mm or Φ 0.5 mm
• X, Y & Z measurement range: ± 20 μm
Schematic view of NPL μ-CMM • Three capacitance transducers embedded
3.2 PTB System
• Measurement volume:
25 mm x 40 mm x 25 mm
• Expected 3D measurement
uncertainty: <0.1 μm
• Werth CMM with high resolution
line scales (10 nm) and
improved air bearings
• Metrology frame
• Optical coordinate measurement
system
• Tactile micro probes:
Fibre probe (Φ 0.025 mm)
Boss micro probe (eg Φ 0.5 mm)
3.2 PTB System
3D Boss probe
• Stylus: Φ 0.5 mm
• X & Y measurement range: 20 μm
Schematic view of PTB μ-CMM • Z measurement range: 5 μm
3.3 METAS System
• Measurement volume:
90 mm x 90 mm x 38 mm
• Expected measurement
uncertainty: 50 nm
• Ultra precise
• Metrology frame
• Three laser interferometers for
X, Y & Z displacement
measurements
• 3D touch probe
3.3 METAS System
3D touch probe
• Stylus diameter: 0.1 mm to 0.3 mm
• Probe force: <0.5 mN
• Measurement range: ±0.2 mm
• Inductive sensors are used to measure
the translational motion
3.4 NIST Activities
• Obtained in 2004
• The instrument is under characterization and will serve as a cross
reference for probe development work
4.1 NANOCORD, Mitutoyo Corp
• Measurement volume:
300 mm x 200 mm x 100 mm
• Measurement uncertainty:
E2 (XY)= ± (0.3+2L/1000) µm
• Resolution: 1 nm
• Probe: Vision & UMAP or LNP
• Measurement capability:
UMAP for point measurement - Contour, Step & Coordinate
LNP for scanning measurement - Contour & Step in Z-axis only
Measurable angle - max 40 deg
4.1 NANOCORD, Mitutoyo Corp
• Measurement volume:
100 mm x 100 mm x 40 mm
• Measuring uncertainty:
U1 = 15 nm (X & Y)
U1 = 25 nm (Z)
U3 = 30 nm (volumetric)
• Stationary probe, moving table
• Table position measured in 3D Abbe
free using plane mirror interferometers
• Measurement capability:
Point & scanning measurements (3D) in
distance, diameter, profile of aspheric optics etc
4.2 ISARA, IBS Precision Engineering
Probe 1 Probe 2
• Si-wafer
• Capacitive measurement system
• Strain gauges
• Parallel kinematics
• Parallel kinematics
• Probe diameter 300 μm
• Probe diameter 500 μm
• Stiffness: 100 N/m Non-isotropic • Stiffness: 10 N/m Isotropic
• Moving mass 20 mg • Moving mass 370 mg
• Resolution 1 nm • Resolution 3 nm
4.3 F25, Carl Zeiss
• Measurement volume:
100 mm x 100 mm x 100 mm
• Measurement uncertainty:
MPE_E = (0.25+L/666) µm
MPE_P = 0.25 µm
• Vision probe & Touch probe
• Measurement capability:
Vision probe - 2D + step height
Tactile probe - 3D measurement point & scanning measurement in
distance, diameter, profile of aspheric optics etc
4.3 F25, Carl Zeiss
Touch probe
• On a silicon chip membrane
• Integrated with piezo-resistive elements
• Single point & scanning measurements
• Stylus tip down to 120 μm
• Probe force of 500 μN
Vision probe
• For 2D measurements
• 13X magnification
• 15 mm working distance
• Probing tolerance of 0.4 μm
5. Applications
2. Dental Technology,
implants, medical
technology
1. Precision
3. Optical
mechanics
(micromotors, ball bearings,
components
guidance systems,
watches etc)
4. Plastics
technology and
6. Printing presses mold making
(inkjet nozzles)
5. Automotive
(fuel injectors)
Others
Disk drive (baseplates &
components), Semicon
(packaging) etc
6. Conclusion
Learning Points
Future work