M ic ro cutting -

clas s ific ations

2
 MicroTurning
Diamond Turn Machining
(DTM)

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Diamond Turn Machining (DTM)

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DTM Process

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DTM Tools

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 Too
l
• Diamond tipped tools (inserts) are used for DTM
• Tool should be clamped properly to tool shank
• Presence of air gap between tool and shank reduces
rigidity of the machining process, so it should be
eliminated.

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 Requirements of DTM tools
❖ Tools should retain sharpness a long period of
over time.
❖ Tool should also have good
1. Strength
2. Hardness & hot hardness
3. Heat conduction
4. Wear resistance
5. Toughness
6. Elastic & shear modulus to withstand deformation

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 Tool Measurement System

• The main function of tool measurement system is to set-

up the tool with respect to machine co-ordinate system.
• Parameters to be considered for a tool
measurement system are
1. X and Z offset values of the cutting tool
2. Tool nose radius
3. Position of the centre of the tool nose radius
4. Tool center height
5. Waviness of the cutting edge

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 Tool Measurement Systems

1. LVDT Type (Linear Variable Differential Transformer)

2. Optical Type (Machine Vision)

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 Material Removal Mechanism
Ductile Material
❖ Material in front of cutting tool is pushed ahead
and the material slides on the shear plane.
The shear plane offers least resistance to the flow of
material which becomes a chip.
Controlled material removal process which produces
good surface finish.
❖ Point defects, grain boundary defects,
voids facilitates easy material removal.
 Material Removal Mechanism
Brittle Material
❖ Material is removed by crack propagation
❖ When the cutting load exceeds the critical value, radial and
axial cracks beneath the surface are generated.
❖ The crack grows until it reach the surface and a chip of
material is formed.
Process is difficult to control and results in poor surface finish as
the cracks extent below machined surface.
 Applications of DTM
1. Non spherical lenses & mirrors
2. Aluminium substrate for compact discs
3. Drums of photo copying machines
4. Moulds for lens manufacturing
5. Metal mirrors for laser applications
6. Aerospace and military applications.....
Applications of DTM
 Micro drilling
• Micro - drilling is the process of generating
holes of diameter less than 1 mm on a work
piece.
• Removes metal with micro level accuracy
and surface finish.
• Uses micro drilling tool with micron level
accuracy.
• Entire process is CNC controlled.
Micro drilling
Micro drilling
 Micro drilling
applications
• Graphite electrodes
• Optical & medical
applications
• Electronic components
• Circuit board prototyping
• Aero space applications
• Electronic industry
 Micro
milling
• Similar to conventional milling process.
• Uses precise micro milling cutters.
• Removes metal with micro level accuracy
and surface finish.
• CNC controlled.

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Macro V s Micro
milling
Micro
milling
Micro milling
applications
Micro grinding
 Micro grinding
• Removes metal with micro level accuracy
and surface finish.
• Uses microdrillingtool with ultra fine
abrasive particles.
• Entire process is CNC controlled.
 Micro grinding
applications
• Electronic industry
• Aerospace applications
• For finishing micro holes and
orifices
• Medical applications
“Micro-EDM processes”

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Outline
 Principle of EDM process
 Characteristics of EDM process
 Control of Discharge location
 Micro-manufacturing
 Scope of micromachining
 Classification of micromachining processes
 Role of micro-EDM in micromachining
 Micro-reverse EDM
 Research issues in micro-EDM related processes
 Experiments I micro-reverse EDM
 Future of micromachining

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Electrode gap monitoring and control
10 MHz

• Mathematical adaptive control theory

•Advances in computer technology and advanced algorithms for machine control
(Artificial intelligence, ANN)
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Micro-Manufacturing - What is it?
 Manufacture of products with the following features:
 about 100 m to about 10 mm in size
 contain very complex 3-D (free-form) surfaces
 employ a wide range of engineering materials
70 µm - Human
Hair 25 µm -
Characters
 possess extremely high relative accuracies in the 10-3 to 10-5 range

Micro-milling
Fanuc - Japan

Zeiss - Germany
Micro-parts

Micro-structures manufactured by micro-SLA Micro-EDM

Klocke Nanotechnik
Japan NTU - Taiwan
Micro-Motor
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Why Miniaturization?
• Minimizing energy and materials used for the
manufacture of devices
• Integration with electronics; simplifying
systems
• Cost/performance advantages
• Faster devices
• Increased selectivity and sensitivity
• Drawback-Size effect in mechanical
micromachining

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Scope of micromachining processes
MICRO MACHINING
Micro Machining

Removal of material at micro level

Macro components but material removal is at micro/nano level

Micro/nano components and material removal is at micro/nano level

Unfortunately, the
Definition
present day notion is
Material removal is micro/nano level
with no constraint on the size of the
component
Machining of highly miniature
components with miniature
features – NOT CORRECT

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Classification of micromachining processes
FABRICATION

Macro-fabrication Micro-fabrication

Hybrid Micro-machining µ-nano finishing

Processes

Mechanical - µ Beam energy based Chem. & EC -µ

machining - µ machining machining

USM EBM PCMM

AJM LBM ECMM

AWJ EDM
M
WJM IBM

PBM
Micromachining processes
Energy Used Principle Processes and Features
Mechanical Material removal via highly Cutting, grinding, sandblasting.
Force concentrated force
UR ~ 100 nm, edge radius<1 m
Melting and Material removal via melting EDM, LBM, EBM. Small UR by
and/or vaporization and reduced the pulse energy,
vaporization debris by high pressure gas concentration of energy via ultra
short pulse duration and/or sharply
focused beam by optics

Ablation Decomposition of atoms Excimer/Femto second laser. High

using incident photon energy dimensional accuracy, less HAZ but
or direct vaporization of low machining speed and high cost
material via high energy of equipment
pulses

Solidification Liquid or paste is solidified in Injection molding, die casting, etc.

a mold and shape of the mold curing may be required after molding
is replicated and porosity

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Micromachining processes
Energy Used Principle Processes and Features
Dissolution Chemical or electrochemical Chemical, PCM and ECM. Small UR,
reaction based ionic negligible force. Inter-electrode gap,
dissolution flow of electrolyte influences
accuracy

Plastic Shape of the product Micro-punching, extrusion, etc.

Deformation specified by die/punch/mold No UR is involved, high speed,
spring-back and difficulties in die or
mold making

Lamination Material in solid powder or Stereolithography, internal as well as

liquid form is solidified layer- external profiles can be formed
by-layer. easily.

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Role of EDM in micromachining

 Non-contact machining
 3D machining
 Physical characteristics such as hardness,
brittleness dose not affect the process
 Use of deionized water as dielectric
 Absence of Size Effect

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Comparison of EDM and micro-EDM
 The Resistance Capacitance Relaxation (RC-
relaxation) circuit used in EDM is replaced by the RC-
pulse circuit in micro-EDM.
 In the RC-relaxation circuit, current and gap voltage
are controlled at a pre-defined level throughout the
pulse on-time but in modeling attempts in micro-
EDM based on RC pulse circuits, the current and
voltage are frequently assumed to be constant.
 On the other hand, in a single discharge of RC-pulse
generator, the voltage and current are not
maintained to any pre-defined level but depend
upon the capacitor charge state at any instant.

E = V I Duty cycle

E = ½ CV^2
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Comparison of EDM and micro-EDM
EDM Micro-EDM

Circuitry Elements
• RC relaxation type • RC single pulse discharge
• Single spark process • Single spark process
•Forced process for constant voltage •Single capacitance discharge, no
and current const V and I
• User defined pulse on time • No control – gap characteristics

Scaling Effects
• Interelectrode gap is 10’s of µm • Interelectrode gap is 1-5 µm
• Low efficiency • High efficiency
Typical single spark crater

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Micro-analysis of Debris
 Large number of Spherical particles with few
non- spherical particles
 Spherical particles are rich in workpiece material
and non-spherical particles are rich in tool material
 Understanding of Erosion Mechanism and Oxide
free power production
 Important parameters affecting Debris morphology are
 Current
 Voltage
 Pulse On-time Input Energy
 Capacitance
Micro-analysis of Debris
 Micro analysis reveals that there is movement of material from
workpiece to cathode and vice-versa
 Normal distribution of particle size (Stochastic nature)
 Structures of Debris
 Large Size & Small Size Low Energy

 Hollow & Solid Debris

 Satellite structure
 Hollow Spheres
 Dents
 Burnt Cores

High Energy
EDM process stability How will you measure?
 Ignition delay time
 Effect of Tool Rotation
 Effect of Ultrasonic Vibrations
Effect of workpiece-tool material
combination
 Effect of polarity
 PMEDM
 Effect of dielectric

Group Number Group 1 Group 2 Group 3

Planetary Motion Yes No No
External material layer Yes Yes No
Micro-EDM process stability
 Indication of constantly moving spark
 Importance of eroded material in inter-electrode gap
 Discharge conduction through debris chain
 Effect on surface cracks
 Process stability primarily depends on discharge
transitivity rather than breakdown strength – Yo et al.
 Absence of metallic particles can be one of the causes of
arching

1 –Low energy
2 – High Energy
Variants of micro-EDM


Figure : Micro rods machining processes

Process Capability
BEDG Min. 3 µm diameter electrode, maximum 10
aspect ratio, 0.6 µRa surface finish
Micro-WEDG Min. 5 µm diameter electrode, maximum 10
aspect ratio, 0.8 µRa surface finish
Micro-WEDM Best results obtained are 10x10 square array (23
µm width, 700 µm height), minimum
machining size achievable is 20 µm, surface
finish 0.07-0.35 µm Ra, and maximum aspect
ratio 100
Limitation
Only single electrodes can be machined
Cylindrical electrodes as well as arrayed
electrodes can’t be machined
Cylindrical arrayed structures can’t be
machined

Diamond milling micro tower of 1 mm in height and 25 μm square Mechanical process involves machining87
stresses 87
Research issues in micro-EDM
Micro-EDM Research Areas

Handling Electrode and Machining

Measurement
workpiece Process
preparation
Surface
Electrode Off-machine electrode Process Sources of
preparation Parameter Errors
quality
Parts s Dimensions
Mfg. Micro 3D Machine
Drilling,
electrode
threading Electrode
holes (WEDM)
Jigs and
Fixture
On-machine electrode
Electrode
Stationery wear and
Rotating Disk
Guided block machining
running wire strategies

Uniform wear Multi Wear

Z-compensation
method electrode monitoring
system88
Applications
 Machining of mould and die in high strength materials
(Carbides, die steel, conducting ceramics) – Recently replaced by
high speed milling process
 Chemical aspects of EDM
– Production of fine particle powders
– RESA (for ultrafine powders)- Reactive Electrode Submerged Arc EDM
– Diamond like carbon and nano-tubes (solidification of
evaporated material)
– Large amount of energy is consumed in the chemical action during EDM
– Supplying oxygen can enhance the MRR during the process

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Micro Electro Chemical Machining
(MECM)
Micro Electro Chemical Machining
(MECM)
Working principle of MECM
Electro Chemical Machining (ECM)
Elements of MECM

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Influence of process parameters of MECM
Feed Rate: High feed rate results in
higher metal removal rate.
Voltage: Low voltage results in better surface finish and
tolerance control
Nature of power supply: Pulse
machining improves accuracy and surface finish
Electrolyte Flow:
Tool : Tool materials used in ECM must have good
thermal and electrical conductivity and corrosion
resistance
Applications of MECM
Advantages of MECM
Disadvantages of MECM
MICRO LASER
BEAM
MACHINING
Micro Laser Beam Machining (MLBM)
MLBM
 Why Laser…?
1. Directional - This refers to light divergence over
long distances. A laser is collimated and will travel
long distances without the beam spreading .

2. Monochromatic - Monochromatic means single

colour - Lasers emits light that consists of a very
narrow spectral range.

3. Coherent - All of the light waves emitted by a

laser are in phase with each other. All the peaks and
valleys are perfectly in line with each other.
 Laser Material Interaction

• Energy absorbed by the workpiece, I

I = (1-R) I0 e(-αz)

• Where R = Reflectivity of the material,

• 1-R = Absorptivity of the material (A),
• I0 = Incident intensity,
• α = Absorption coefficient,
• z = Depth of machining.
Laser Material Interaction

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 Process Parameters of LBM

Process Parameters Effect

1. Wave length / Focal length of lens Feature size, Ablation rate

2. Beam shape (Gaussian/Square Wave) Feature shape, Uniformity of the process

3. Beam energy, Pulse width Size of HAZ

4. Pulse repetition range Depth of material removal

5. Depth of focus Aspect ratio

6. Vacuum / Inert gas environment Accuracy of the process

Long Vs Short Pulse Laser
Machining
Short Pulse Laser Machining
 Short Pulse Laser Machining

1.Nanosecond Pulse Micromachining

Pulse duration: 1-10 ns (1 ns = 10-9 Sec. )

2.Picosecond Pulse Micromachining

Pulse duration: 1-10 ps (1 ps = 10-12 Sec. )

3.Femtosecond Pulse Micromachining

Pulse duration: 1-10 fs (1 fs = 10-15 Sec. )
 Advantages & Disadvantages of LBM
• Advantages
1. No limit to cutting path as the laser point can move in any path.
2. The process is stress less, allowing very fragile materials
to be laser cut without any support.
3. Very hard and abrasive material can be machined.
4. It is a cost effective and flexible process.
5. Non metals like plastic & rubber can be also machined.
6. No cutting lubricants required
7. No tool wear
8. Narrow heat affected zone
• Disadvantages
1. Skilled labour & expert CNC programmer is required
2. Limitations on thickness due to taper
3. High capital cost & maintenance cost
4. Safety precautions are required
 Applications of LBM
1. Machining of small/ micro holes
2. Cutting complex profiles on thin & hard materials.
3. Partial cutting and engraving,
4. Sheet metal trimming,
5. Blanking
6. Precise aerospace applications,
7. Making cellular phone parts, Ink jet heads,
surgical equipments, medical devices…
Applications of LBM