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Semiconductor manufacturing process : Hitachi High-Tech GLOBAL

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What are semiconductors?

Semiconductor Manufacturing

1. Semiconductor
manufacturing process

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1. Semiconductor manufacturing process
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A semiconductor chip is an electric circuit with many components such as transistors and wiring formed on a
semiconductor wafer. An electronic device comprising numerous these components is called “integrated circuit
(IC)”. The layout of the components is patterned on a photomask (reticle) by computer and projected onto a Related Links
semiconductor wafer in the manufacturing processes described below.
Semiconductor Manufacturing
Equipment
1) Wafer processing Index by device: Hitachi High-
Tech
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In the manufacturing process of IC, electronic circuits with Semiconductor Room
components such as transistors are formed on the surface of a
silicon crystal wafer.
Basics of IC formation

1. A thin film layer that will form the wiring, transistors and
other components is deposited on the wafer (deposition).
2. The thin film is coated with photoresist. The circuit pattern
of the photomask (reticle) is then projected onto the
photoresist using Photolithography technology.
Silicon single crystal and silicon wafers
3. The developed photoresist is used as a mask for etching
to process the thin film into the shape of the wiring and
other components.
Refer to figure 2) Front-end process and back-end process.

With this, one layer of the circuit is formed. The transistors are formed on the lowest layer. Similar process is
then repeated, and many layers of circuits are formed on top of one another.

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4/2/2021 1. Semiconductor manufacturing process : Hitachi High-Tech GLOBAL

Silicon substrate (wafer)

In the process of the integrated circuit creation, there are inspection and measurement steps to check whether or
not the patterns are fabricated as designed. If defects are found, the fabrication will be interrupted to remove the
defects from the process and to make small changes in the fabrication conditions for correction purposes. More
than one hundred semiconductor dies are fabricated on a single wafer. At present, the largest silicon wafer is
300mm in diameter. Semiconductor manufacturers are looking into 450mm diameter silicon wafers for use in the
future.

2) Front-end process and back-end process

Semiconductor devices are completed through the front-end process (wafer processing operation) and the back-
end process (assembly process) described below.
(In the following description of the element process, a very small area of a wafer surface is magnified and shown
schematically.)

The finished semiconductor devices have been used in a

variety of products such as personal computers, smartphones
and cars in everyday life (see also “Semiconductors in
everyday life”).

See the flow of the front-end process and back-end

process.

Front-end process and back-end process

Magnify the image.

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What are Semiconductor Semiconductor OK

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1. Properties of semiconductors 1. Semiconductor manufacturing 1. Glossary
2. Semiconductors in everyday life process

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4/2/2021
3. The semiconductor material
silicon
4. History of semiconductors
5. Integrated circuit (IC)
1. Semiconductor manufacturing process : Hitachi High-Tech GLOBAL
2. Semiconductor
- Metrology and Inspection
3. Semiconductor
- Accuracy and Precision

6. Semiconductor 4. CD-SEM - What is a Critical

Power Devices and MEMS Dimension SEM?
5. Wafer defect inspection system
6. Review SEM
- What is a Review SEM?
7. Etch System
- What is an Etch System?

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