Grinding and Finishing: Illegitimi Non Carborundum

Grinding and Finishing
Illegitimi non carborundum
ver. 1
ME 338: Manufacturing Processes II

Instructor: Ramesh Singh; Notes: Profs. 1
Singh/Melkote/Colton
Overview
• Processes
• Analysis

Horizontal Grinding

Horizontal grinding Vertical grinding

Centered grinding
Centerless grinding

Creep Feed Grinding
• Full depth and stock is removed with

one or two passes at low work speed
• Very high forces are generated
• High rigidity and power
Advantages
• Increased accuracy
• Efficiency
• Improved surface finish
• Burr reduction
• Reduced stress and fatigue

Grinding Wheels

Grinding Wheels

Grinding Wheel Information

Correctly Mounted Wheel

Grinding Wheel Surface

Grind Wheel Dressing

Grinding Wheel Dressing

Grinding Chips

Chip formation geometry
l D
t
q
V
t
d l

Instructor: Ramesh Singh; Notes: Profs.
Chip geometry
• As with rolling contact length, the chip length,

l
– D = wheel diameter, d = depth of cut
l  Dd
• Material removal rate, MRR
– v = workpiece velocity, d = depth of cut, b = width
of cut
MRR  v  d  b
Material removal rate
• The chips have a triangular cross-section,

and ratio (r) of chip thickness (t) to chip width
w
(w)
w
r   10 to 20 t
l
t
• So, the average volume per chip
1 1 1
Volchip  w  t  l  wtl
2 2 4
Chips
• The number of chips removed per unit time

(n), where c = number of cutting edges
(grains) per unit area (typ. 0.1 to 10 per mm2,
and V = peripheral wheel velocity
n V bc

Combining
MRR  v  d  b  n Volchip
1
v  d  b  Vbc  wtl
4
w  r t l  Dd
1
vd b V cb r t t  Dd
4
Chip thickness
4v  d
t 
2
V cr Dd
or
4v d
t
V cr D

Specific grinding energy, u
• Consist of chip formation, plowing, and sliding
u  uchip  u plowing  usliding

Total grinding force
• Get force from power
Power  u  MRR
Fgrinding V  u  v  d  b
v  d b
Fgrinding  u 
V

• From empirical results, as t decreases, the

friction component of u increases
1 1
u or u  K1 
t t
substituting
1 v  d b
Fgrinding  K1  
t V
Substituting for t
v  d b
1
Fgrinding  K1  
4v d V

V cr D
rearranging
d cr v
Fgrinding  K1  b   Dd
4V
Singh/Melkote/Colton ME 6222: Manufacturing Processes and
Systems Prof. J.S. Colton © GIT 2006
Force on a grain
• The force per grain can be calculated
Fgrain  u  Area
1
w  rt
Fgrain  u  wt and
u  K1 
1
2 t
1 1
Fgrain  K1    r  t  t
t 2
Force on a grain
substituting for t, and rearranging
K1 4v d
Fgrain   r 
2 V cr D
vr d
Fgrain  K1 
V c D

Singh/Melkote/Colton ME 6222: Manufacturing Processes and
Systems Prof. J.S. Colton © GIT 2006
Grinding temperature
• Temperature rise goes with energy delivered
per unit area
Energy input
T  K2 
area
u bl  d 1
T  K2   K2  K1   d
bl t
1
T  K1  K2  d 
4v d
Vcr D
Grinding temperature
• Rearranging
3 𝑉𝑐𝑟
∆𝑇 = 𝐾1 𝐾2 𝑑 4 𝐷
4𝑣
• Temperatures can be up to 1600oC, but for a

short time.

Grinding – Ex. 1-1
• You are grinding a steel, which has a specific

grinding energy (u) of 35 W-s/mm3.
• The grinding wheel rotates at 3600 rpm, has a
diameter (D) of 150 mm, thickness (b) of 25 mm, and
(c) 5 grains per mm2. The motor has a power of 2
kW.
• The work piece moves (v) at 1.5 m/min. The chip
thickness ratio (r) is 10.
• Determine the grinding force and force per grain.
• Determine the temperature (K2 is 0.2oK-mm/N).
Room temperature is 20oC.
• First we need to calculate the depth of cut.

We can do this from the power.
Power  u  MRR  u  v  d  b
W s m 6 mm
2
min
2000 W  35 3
1.5  d  25 mm 10 2

mm min m 60 sec
d  91.4 106 m

• Now for the total grinding force
v  d b
Fgrinding  u 
V
mm 3
W s 1500  91.4  10 mm  25 mm
Fgrinding  35  min
mm3 3600 rev 150 mm  m
min rev 1000 mm
Fgrinding  70.7 N

• Next, the force per grain

1 w  rt
Fgrain  u  wt and
2
1
Fgrain  u  r  t  t
2
we need t
mm
4v d 4  1500 91.4 103 mm
t  min
V cr D 3600  150
mm grains
5  10 150 mm
min mm2
t  1.32 103 mm
• Substituting
1 1
Fgrain  u  r  t  t  35  10  1.32 10
2 2
3 2
 
4
Fgrain  3.05 10 J / mm

• For the temperature, we need K1 and K2. K2 is

given, so we need to calculate K1.
1 1 1 1
Fgrain  u   r  t  t  K1    r  t  t  K1   r  t
2 t 2 2
1
3.0510 N  K1  10 1.32106 m
1
2
3 N
K1  46.2 10
m
• substituting
1
T  K2  K1   d
t
K m N 1 6
T  0.2  46.2  
 91.4  10 m  640K
N m 1.32 10 m6
T  Tinitial  T  20  640  660C

Honing and Superfinishing
Honing tool used to improve

the surface finish of bored or
ground holes.
Schematic
illustrations of the
superfinishing
process for a
cylindrical part.
(a) Cylindrical
mircohoning, (b)
Centerless
microhoning.
Lapping
(a) Schematic illustration of the lapping process. (b)

Production lapping on flat surfaces. (c) Production lapping
on cylindrical surfaces.

Polishing Using Magnetic
Fields
Schematic illustration of polishing of balls and rollers

using magnetic fields. (a) Magnetic float polishing of
ceramic balls. (b) Magnetic-field-assisted polishing of
rollers. Source: R. Komanduri, M. Doc, and M. Fox.

Abrasive-Flow Machining
Schematic illustration of
abrasive flow machining to
deburr a turbine impeller.
The arrows indicate
movement of the abrasive
media. Note the special
fixture, which is usually
different for each part
design. Source: Extrude
Hone Corp.

Robotic Deburring
A deburring operation on a robot-held die-cast

part for an outboard motor housing, using a
grinding wheel. Abrasive belts or flexible
abrasive radial-wheel brushes can also be used
for such operations. Source: Courtesy of
Acme Manufacturing Company and
Manufacturing Engineering Magazine,
Society of Manufacturing Engineers.

Conformal Hydrodynamic Nanopolishing:
Case-study
Applications Challenges
• Most processes can polish only flat
• Optics
surfaces; concave/profiled surfaces
• Defence & Nuclear are difficult to superfinish
• Electronics • Concave surface on hard brittle
• Industrial materials, such as single crystal
sapphire can not be finished via form
Existing Methods grinding due to process-induced
• Diamond Turning cracks
• Precision Grinding • Diamond turning center can be used
for non ferrous materials but it is a
• Lapping super-precision machine-tool (The
• Ion Beam Polishing equipment cost is ~ 20 crores besides
• Spot Hydrodynamic Polishing the expensive operational cost)
Singh/Melkote/Colton 1
Conformal Hydrodynamic
Nanopolishing Process and Machine
Process Description
• Improvement over existing
spot hydrodynamic polishing
methods
• Superfinish hard and brittle
concave surfaces, specially,
sapphire and hardened steels
• Mitigates existing surface
microcracks
• Polishing action due to
elastohydrodynamic film in
the slurry submerged
rotating conformal contact
(silicone ball in the cavitynd
being polished) 12st Generation Conformal Hydrodynamic Nanopolishing Machin
Delivered to Precison Engineering Division BARC
Generation (designed and fabricated in the Machine Tools Lab
at IIT Bombay)
Novelty and Technology Breakthrough
• Existing hydrodynamic polishing employs spot polishing unable to
polish small cavities (< 6mm in dia)
– More than 3 degrees of freedom required to polish the entire cavity
effectively
– Small actuation system and polishing tool is required
• Conformal contact has a rotating soft tool which conforms to the shape
of the cavity
• Axis of this tool is inclined at 45˚ and the workpiece is rotated inside a
slurry filled tank which ensures non-zero relative motion between tool
and workpiece at every location in the cavity
• The entire cavity can be polished at once which will be much cheaper
and faster than programming the tool path
• Alternative to expensive Diamond Turning
• Can finish wide range of materials ceramics (sapphire, glass) and
hardened steels
Technology Outcomes
• Superfinished surfaces in
steels (< 3nm 3D surface
roughness)
• Crack-free surface of < 100
nm 3D surface roughness in
single crystal sapphire
cavity
• Process knowhow and
machine transferred to
Precision Engineering Nanometric finish on hardened steel
Division, BARC for strategic
applications in a nuclear
device
• The superfinished obtained
at a fraction of cost of
Diamond turning
• It can also be used by gem
polishers which could
reduce the health hazard by
reducing the dust inhalation Crack-free superfinished surface on single
and automation is possible
crystal sapphire cavity
Economics of Grinding and Finishing
Operations
Increase in the cost of

machining and finishing a
part as a function of the
surface finish required.
This is the main reason
that the surface finish
specified on parts should
not be any finer than
necessary for the part to
function properly.
Summary
• Overview of processes
• Analysis of process
• Example problem


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Grinding and Finishing

Illegitimi non carborundum

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

• Full depth and stock is removed with

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

• As with rolling contact length, the chip length,

• The chips have a triangular cross-section,

• The number of chips removed per unit time

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

• Consist of chip formation, plowing, and sliding

u  uchip  u plowing  usliding

ME 338: Manufacturing Processes II

• Get force from power

ME 338: Manufacturing Processes II

• From empirical results, as t decreases, the

• The force per grain can be calculated

substituting for t, and rearranging

ME 338: Manufacturing Processes II

• Temperatures can be up to 1600oC, but for a

ME 338: Manufacturing Processes II

• You are grinding a steel, which has a specific

• First we need to calculate the depth of cut.

ME 338: Manufacturing Processes II

• Now for the total grinding force

ME 338: Manufacturing Processes II

• Next, the force per grain

ME 338: Manufacturing Processes II

• For the temperature, we need K1 and K2. K2 is

T  Tinitial  T  20  640  660C

ME 338: Manufacturing Processes II

Honing tool used to improve

(a) Schematic illustration of the lapping process. (b)

ME 338: Manufacturing Processes II

Schematic illustration of polishing of balls and rollers

ME 338: Manufacturing Processes II

ME 338: Manufacturing Processes II

A deburring operation on a robot-held die-cast

ME 338: Manufacturing Processes II

Increase in the cost of

ME 338: Manufacturing Processes II

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