inventions

Article
Recycling and Refurbishing of Epoxy Packaging
Mold Ports and Plungers
Wan-Chiech Huang 1 , Chao-Ming Hsu 2 and Cheng-Fu Yang 1, *
1 Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung 811,
Taiwan; ac96454789@gmail.com
2 Department of Mechanical Engineering, National Kaohsiung University of Applied Science, Kaohsiung 807,
Taiwan; jammy@kuas.edu.tw
* Correspondence: cfyang@nuk.edu.tw; Tel.: +886-7-591-9283; Fax: +886-7-591-9277

Academic Editors: Chien-Hung Liu and Shoou-Jinn Chang

Received: 10 April 2016; Accepted: 31 May 2016; Published: 6 June 2016

Abstract: During the integrated circuit (IC) packaging process, acid or alkaline chemical ingredients
in the packaging material and in the mold cleaning cake are the major contributor to the corrosion
of mold ports and plungers. To prolong the service life of these parts, this study concentrates of
three aspects of the problem: First, after recycling and cleaning the plungers and ports, a special
vacuum coating is applied to counteract corrosion and reduce abrasion. This coating is resistant to
acid and alkali and has a hardness of up to HV4000. This makes it both resistant to abrasion and
prolongs working life. Halogen-free packaging material has now been introduced to produce Green
Electric Membership Corporations (EMC). However, this material is more viscous than the older,
more polluting, plastic cake and this shortens the time between mold cleaning and subsequently
reduces time for production as well. Also, most abrasion of the plunger occurs within 3 mm of the
tip. We have developed a silver welding technique for this portion and a process in which several
materials are used for the main body of the plunger. The procedure involves cutting off the tip and
welding on a compound material, we have used DC53 + F10 Steel. These techniques allow recycling
and refurbishment of the plungers and ports of packaging molds to prolong their service life to a
considerable degree. Take Advanced Semiconductor Engineering Inc. as an example, if each plant
uses 1000 sets a month, 12 plants will use 144 thousand sets every year. The saving on each set is
about NT$1600. This represents a saving of half the expenditure on mold ports and plungers.

Keywords: ports and plungers; packaging molds; diamond-like coating; plunger tip chamfering;
plunger tip recycling

PACS: J0101

1. Introduction
The rapid development of technology now allows the manufacture of thin, light-weight, eminently
functional notebook computers, smart phones, players and very many other small electronic devices.
The integrated circuit (IC) elements needed for all these advanced devices need to be multifunctional
and consequently have a very high pin out numbers, in addition they need to be very compact. The
packaging processes have become much more challenging. The technology of IC Packaging is complex
and involved. The processes include wafer slitting, crystal sticking, lead soldering, packaging, cutting
and forming, marking, and testing. In the packaging process, packing material (epoxy) is injected into
a mold to enclose the IC chip as a package which is removed from the mold after forming. In general,
a packaging mold assembly must be cleaned after 500 to 600 chips have been packaged. This cleaning

Inventions 2016, 1, 11; doi:10.3390/inventions1020011 www.mdpi.com/journal/inventions

Inventions 2016, 1, 11 2 of 9

takes 3 to 4 h and involves the removal of hardened plastic from the mold surface. This residual plastic
adhering to the mold will result in reduced production efficiency [1].
Most IC packaging material consists of Epoxy and non-organic Silica additives, generally divided
into General-purpose Cresol Block and high-class Bis-phenol. However, most of the solid packaging
materials used today are Epoxy Molding Compounds (EMCs). Epoxy resins are extremely complicated
mixtures of resin, additives, hardener, promoter, catalyst, and other substances added for special
purposes [2]. Furthermore, since epoxy resins are cured at an elevated temperature, this also affects
the service life of ports and plungers of the packaging molds, which are shortened by 30% or more at
high-temperature. Since the ports and plungers are both in the top ten consumables of the process, it is
very important to find a way to prolong working life or to find ways to recycle them.
In the early years, plastic cakes contained halogens and other materials that were harmful to the
environment. Now, advanced counties such as the USA and the European Union have introduced laws
that ban the import of products containing such hazardous material and manufacturers now use green
EMCs free of harmful substances. However, these EMCs are much stickier than the older ones and they
reduce production counts. In other words, molds have to be cleaned much more often. In fact, use of
the new green EMCs shows a 37.5%–50% decrease in production count compared to the old processes
under identical packaging conditions. This has increased the cost to the packaging companies. The
main reason that ports and plungers are corroded is due to acidic and alkaline chemicals in the plastic
cake and mold cleaning cake. Furthermore, plungers wear during use and accumulate residual plastic,
this affects stability of the filling pressure and the number of defective (not good, NG) packages [3].
Sticking of the packaging material in the mold is a persistent problem and urgently requires a solution.
This is especially troubling in the ports and plungers using organic epoxy packaging. The sticky
material forms hardened residues in the mold that can result in defective packaging such as breakage
or short shot [4–6].
A dirty mold can also affect the bonding, which causes packaging failure, with a significant
decrease of IC yield [7]. Excessive adhesion to the mold causes three major problems:
(1) Adhesion hinders ejection of the product and de-molding because a higher pushing force is
needed to release the package from the mold. This can cause deformation or breakage of the product,
as well as wear of the surface of the ports and plungers.
(2) Hardened packages tend to stick to the mold surface and affect production yield.
(3) A large force is needed for mold cleaning which has a serious effect on production efficiency.
Therefore, packaging plants discard these parts after a certain amount of use. Increased wear
of the ports and plungers or an increase in the number of NG packages constitutes a major cause of
increased cost. A reduction of adhesion to the mold would be an important topic for IC packagers.
However, it is even more worthwhile to study the recycling and refurbishment of mold ports and
plungers and epoxy resin filling to lower cost as well as the NG ratio of the packaging process.
In this process IC packaging material known as plastic cake (epoxy resin) is injected into the molds
to enclose the IC chip. Competition in the IC packaging industry dictates that transfer molding using
Epoxy resin be used to accomplish this enclosing action. The process involves placing the semi-finished
IC chip with all the bonding leads attached into the mold and then feeding the pre-heated epoxy in
after the machine closes the two halves of the mold. The softened epoxy is injected into the cavity by
way of the respective runners and gates and the packaged IC is removed after the setting reaction has
completed, see Figure 1. During the process several problems may arise: (1) The surfaces of the mold,
ports and plungers may suffer damage and this will increase costs and the NG ratio; (2) The plungers
tend to stick in the mold and this causes de-molding problems which also increase the opportunity for
the mold and plunger surfaces to sustain damage. This makes a search for methods to improve the
surface coating of these components an important part of this study.
Inventions 2016, 1, 11 3 of 9
Inventions 2016, 1, 11 3 of 9

Figure 1. The
Figure packaging
1. The packaging process,
process,the
thegreen
green part
part isisthe
theepoxy,
epoxy,and
and
thethe arrow
arrow is index
is the the index to step.
to next next step.
(a) put
(a) down
put downthe the
ICs,ICs,
(b)(b)
cover the
cover theupper
upperplate, (c) put
plate, (c) putthe
theepoxy
epoxyin,in,
(d)(d) pro-heat,
pro-heat, (e) and
(e) and (f) plunger
(f) plunger
add in
addand press,
in and (g) (g)
press, plunger leaves,
plunger leaves,(h)
(h)plates
plates leave, andthe
leave, and thepackage
package is formed
is formed in the
in the mold.
mold.

2. Experimental Methods
2. Experimental Methods
The problem of adhesion between the packaging material and the mold has been a problem
The problem of adhesion between the packaging material and the mold has been a problem from
from the start. Hardened organic packaging material (epoxy) adheres and accumulates in the mold
the start. Hardened
over time. If left, organic
this debrispackaging material
will eventually cause(epoxy)
problemsadheres and in
and result accumulates in the mold
defective packaging that over
time.may
If left, this broken
include debris packages
will eventually
or short cause problems
shots. Another and result
problem in defective
involves difficultiespackaging that may
in de-molding.
include
The IC package in the cavity needs to be released from the mold and adhesion will hinder this The
broken packages or short shots. Another problem involves difficulties in de-molding.
IC package
process.in the cavity adhesion
Furthermore, needs tocan be also
released
cause from
damage thetomold and adhesion
the coatings will hinder
on the surface thisand
of the ports process.
plungers, adhesion
Furthermore, which willcan increase wear of
also cause these parts
damage andcoatings
to the also affect
onthe
theproduct
surfaceNG ratio.
of the Consultation
ports and plungers,
whichwith theincrease
will supplierswear
of theofmold
thesecleaning
parts andmaterial
also confirmed
affect the that the amine
product ingredient
NG ratio. could damage
Consultation with the
the mold ports. Significant surface damage is seen in molds after ~50,000 fillings.
suppliers of the mold cleaning material confirmed that the amine ingredient could damage the mold The same amount
of damage occurs to filling plungers. Some discarded ports taken from a packaging plant are shown
ports. Significant surface damage is seen in molds after ~50,000 fillings. The same amount of damage
in Figure 2. Figure 3a shows an original Port and two Ports with visible adhesion and severe
occurs to filling plungers. Some discarded ports taken from a packaging plant are shown in Figure 2.
abrasion are shown in Figures 3b,c. These severely contaminated ports and plungers were cleaned
Figure
by 3a shows an
sonication andoriginal Port and
then polished two
using thePorts with visible
publishing machineadhesion
shown in and
Figuresevere
4. Theabrasion
picture forarethe
shown
in Figure 3b,c. These severely contaminated
published ports is shown in Figure 5. ports and plungers were cleaned by sonication and then
polished using the publishing
A Restriction machine
of Hazardous shown(RoHS)
Substances in Figure 4. Theenforced
directive picture for the Europa
by the published (EU)ports is shown
requires
in Figure 5.
that international enterprises must completely cease the use of six chemicals containing heavy
metals (such asoflead
A Restriction and mercury)
Hazardous in all electronic
Substances products including
(RoHS) directive enforced IC by packaging
the Europa and plastic
(EU) requires
computer parts. Conventional coating processes can no longer tackle the problem
that international enterprises must completely cease the use of six chemicals containing heavy metals of the significantly
(suchincreased
as lead andmoldmercury)
cleaning time.
in allThe use of environmentally
electronic products including friendlyICpackaging
packaging material has resulted
and plastic computer
in more down time for mold cleaning and lower productivity. The plunger is made of tungsten
parts. Conventional coating processes can no longer tackle the problem of the significantly increased
carbide, with some added cobalt to ensure high strength and resistance to abrasion. There are two
mold cleaning time. The use of environmentally friendly packaging material has resulted in more
main causes of wear in ports and plungers:
down time for mold cleaning and lower productivity. The plunger is made of tungsten carbide, with
1. Wear
some added in the
cobalt mold caused
to ensure by vertical
high strength andandresistance
horizontaltodeviation
abrasion.which
Thereresults in friction
are two and
main causes of
subsequent abrasion.
wear in ports and plungers:
2. Corrosion caused by the acidic and alkaline ingredients in plastic cake and mold cleaning
chemicals.
1. Wear inThe
theprimary result being
mold caused worn off
by vertical cobalt
and metal and
horizontal distortions
deviation of theresults
which circularity of the and
in friction
inner diameter
subsequent of the ports.
abrasion.
2. Corrosion caused by the acidic and alkaline ingredients in plastic cake and mold cleaning
chemicals. The primary result being worn off cobalt metal and distortions of the circularity of the inner
diameter of the ports.
Inventions 2016, 1, 11 4 of 9

Inventions 2016, 1, 11 4 of 9
To reduce corrosion, a protective layer, which can be deposited by physical deposition (PVD)
Inventions 2016, 1, 11 4 of 9
process, isToformed on the surface. In this study, the diamond-like coating
reduce corrosion, a protective layer, which can be deposited by physical deposition (PVD)
is laid down by vacuum
electron beam
process, Tois(E-gun)
reduce deposition
formedcorrosion,
on the surface. andInforms
a protective a very
thislayer,
study, hard
which
the protective
can surface
be deposited
diamond-like coatingby on the down
physical
is laid ports. The
deposition
by deposition
vacuum(PVD)
time of diamond-like
process, is formed coating
on theis used
surface.to control
In this the
study, thickness
the and
diamond-like
electron beam (E-gun) deposition and forms a very hard protective surface on the ports. The the deposition
coating is temperature
laid down by is
vacuumused to
control the hardness.
electron beam Most
(E-gun) of the sticking
deposition and or wear
forms aof the
very epoxy
hard filling
protective
deposition time of diamond-like coating is used to control the thickness and the deposition plungers
surface occurs
on the within
ports. about
The
deposition
3 mmtemperature
of the tip. Two time
is used of diamond-like
to control
methods can be coating
the used
hardness. is used
for a Most
repairofandto control the
the improvement thickness
sticking or wear of of and
thethe the deposition
epoxy filling
plungers: one is by
temperature
plungers
machining occursis within
a chamfer used
angletoabout
oncontrol
the3end theofhardness.
mm ofthe tip.Most
theplunger. TwoTheofmethods
the sticking
value can or
be wear
of chamfer of
usedangleforthe epoxy
a isrepair filling
and
an important
plungers
factorimprovement
to affect the occurs
of thewithin
stickingplungers: about
or wear 3isthe
oneof mm of thefilling
by epoxy
machining tip.a chamfer
Two methods
plungers.angleTheoncanthebeend
addition used
ofof for
the a repair
plunger.
chamfer The
angle andnot
improvement
value of chamfer of angle
the plungers: one is byfactor
is an important machining a chamfer
to affect angle on
the sticking the end
or wear of of
thethe plunger.
epoxy fillingThe
only reduces abrasion but also increases the space for the cleaning and removal of organic debris.
value ofThe
plungers. chamfer
addition angle is an important
of chamfer angle notfactor to affectabrasion
only reduces the sticking or wear
but also of the
increases theepoxy
spacefilling
for
The other method is to cut off the worn out tip and attach a high-strength end by silver welding to
theplungers.
cleaningThe andaddition
removalofofchamfer
organic angle
debris.not Theonly reduces
other methodabrasion but off
is to cut alsothe
increases
worn out the tip
spaceandfor
strengthen
attach
the tip of
the cleaning and
a high-strength
theremoval
plunger.
end byof
The silver
organic
silver
welding
debris.
welding
temperature
The other
to strengthen method
the
is to
tip ofisthe
anplunger.
important
cut off the factor
Thewornsilverout
totip
affect
welding andthe
adhesive force of the
attach a high-strength
temperature new
is an importantadded metal.
end byfactor
silver toBoth
welding methods
affect to can
thestrengthen be
adhesive the used to
tip of the
force recycle
the plunger. plungers
new added The silver which
metal.welding
Both would
otherwise
methods be discarded.
temperature
can beisused an toimportant factor towhich
recycle plungers affectwould
the adhesive
otherwiseforce of the new added metal. Both
be discarded.
methods can be used to recycle plungers which would otherwise be discarded.

Figure 2. Recycling of discarded Ports.

Figure 2. Recycling of discarded Ports.
Figure 2. Recycling of discarded Ports.

(a) (b)
(a) (b)

(c)
(c)
Figure 3. (a) An original port; (b) port showing severe internal adhesion; (c) port showing severe
Figure on
abrasion 3. the
(a) An original
internal port; (b) port showing severe internal adhesion; (c) port showing severe
surface.
Figure 3. (a) An original port; (b) port showing severe internal adhesion; (c) port showing severe
abrasion on the internal surface.
abrasion on the internal surface.
Inventions 2016, 1, 11 5 of 9
Inventions 2016,
Inventions 2016, 1,
1, 11
11 55 of
of 99

Figure
Figure 4.
Figure 4. Polishing fixture.
4. Polishing fixture.

Figure 5.
Figure 5. After
After polishing.
polishing.
Figure 5. After polishing.

3. Results
3. Results
3. Results
The study
The study cancan bebe divided
divided into
into three
three parts
parts to to investigate
investigate thethe results:
results: Part
Part 1—How
1—How do do we
we rectify
rectify
The study can be divided into three parts to investigate the results: Part 1—How do we rectify
the surface
the surface abrasion
abrasion of of ports
ports and
and plungers
plungers to to increase
increase the the service
service life
life of
of recycled
recycled ports
ports and
and plungers.
plungers.
the surface abrasion of ports and plungers to increase the service life of recycled ports and plungers.
Plungers are
Plungers are made
made of of tungsten
tungsten carbide
carbide doping
doping with with little
little cobalt
cobalt because
because they
they are
are required
required to to have
have
Plungers are made of tungsten carbide doping with little cobalt because they are required to have very
very high
very high strength
strength and and abrasion
abrasion resistance.
resistance. The The abrasions
abrasions of of both
both ports
ports and
and plungers
plungers havehave two
two main
main
high strength and abrasion resistance. The abrasions of both ports and plungers have two main causes:
causes:
causes:
(1) Wear in the mold caused by vertical and horizontal deviations which result in friction
(1) Wear
(1) Wear in in the
the mold
mold caused
caused byby vertical
vertical and
and horizontal
horizontal deviations
deviations which
which result
result in
in friction
friction and
and
and abrasion.
abrasion.
abrasion.
(2) Corrosion caused by acidic and alkaline ingredients in both the plastic cakes and mold cleaning
(2) Corrosion
(2) Corrosion causedcaused by by acidic
acidic andand alkaline
alkaline ingredients
ingredients in in both
both the
the plastic
plastic cakes
cakes and
and moldmold
chemicals. This mainly results in the wearing off of the cobalt metal and unevenness in the circularity
cleaning chemicals.
cleaning chemicals. This This mainly
mainly results
results inin the
the wearing
wearing off off of
of the
the cobalt
cobalt metal
metal and
and unevenness
unevenness in in the
the
of the inner diameter of the port.
circularity of the inner diameter of
circularity of the inner diameter of the port. the port.
When we discussed with the suppliers of the mold cleaning materials, we had confirmed that
When we
When we discussed
discussed with with the
the suppliers
suppliers of of the
the mold
mold cleaning
cleaning materials,
materials, wewe hadhad confirmed
confirmed that that
an amine ingredient can damage the surfaces of ports in the mold. Figure 6 shows significant surface
an amine
an amine ingredient
ingredient can can damage
damage the the surfaces
surfaces ofof ports
ports in
in the
the mold.
mold. Figure
Figure 66 shows
shows significant
significant surface
surface
abrasion on a port surface after ~50,000 epoxy fillings, the damage is really observed. The abrasion in
abrasion on
abrasion on aa port
port surface
surface after
after ~50,000
~50,000 epoxy
epoxy fillings,
fillings, the
the damage
damage is is really
really observed.
observed. The The abrasion
abrasion
the port is even more severe after 100,000 fillings, this is also the case for the plunger, the more serious
in the
in the port
port isis even
even more
more severe
severe after
after 100,000
100,000 fillings,
fillings, this
this is
is also
also the
the case
case for
for the
the plunger,
plunger, thethe more
more
damage is also really observed.
serious damage
serious damage is is also
also really
really observed.
observed.
Ductile metals are prone to produce adhesion when they are machined or ground, especially at
Ductile metals are prone
Ductile metals are prone to to produce
produce adhesion
adhesion when when they
they are
are machined
machined or or ground,
ground, especially
especially at at
high-temperature, this results in solidification of the metal or alloy which causes processing difficulty
high-temperature, this results in solidification of the metal or alloy
high-temperature, this results in solidification of the metal or alloy which causes processing which causes processing
and shortens the service life of tools. Problems in such a metal or alloy can be resolved by applying
difficulty and
difficulty and shortens
shortens the the service
service life
life of
of tools.
tools. Problems
Problems in in such
such aa metal
metal oror alloy
alloy can
can be
be resolved
resolved by by
a diamond-like coating to protect the metal from corrosion or scratching. Due to its compact nature
applying a diamond-like coating to protect the metal from corrosion
applying a diamond-like coating to protect the metal from corrosion or scratching. Due to its or scratching. Due to its
compact nature
compact nature thethe diamond-like
diamond-like coating
coating cancan block
block moisture
moisture andand oxygen
oxygen andand isis eminently
eminently suitable
suitable
Inventions 2016, 1, 11 6 of 9

Inventions 2016, 1, 11 6 of 9
Inventions
the 2016, 1, 11 coating
diamond-like can block moisture and oxygen and is eminently suitable for use in this 6 of 9

application.
for use in thisThe coating also
application. Thefacilitates heatfacilitates
coating also dissipation.
heatItdissipation.
is evenly applied to both
It is evenly the internal
applied to bothand
the
for use in
external and this application.
partsexternal
and increases The coating
abrasion also facilitates
resistance very heat dissipation.
well. Figure It is evenly applied to both the
internal parts and increases abrasion resistance very7well.
shows how 7weshows
Figure try tohow
recycle
weand
try
internal
increase and external parts and increases abrasion resistance very well. Figure 7 shows how was try
we
to recycleservice lifespanservice
and increase of ports to overcome
lifespan of portscorrosion problems
to overcome [8,9].problems
corrosion The solution
[8,9].for
The this
solutiona
to recycle
diamond-like and increase
coating service
obtained by lifespan
E-gun of ports
deposition to overcome
[10–14]. corrosion problems [8,9]. The solution
for this was a diamond-like coating obtained by E-gun deposition [10–14].
for this was a diamond-like coating obtained by E-gun deposition [10–14].

Figure 6. Wear of ports of epoxy resin IC packaging molds

molds after
after 50,000
50,000 and
and 100,000
100,000 operations.
operations.
Figure6.6.Wear
Figure Wearofof
ports ofof
ports epoxy resin
epoxy ICIC
resin packaging
packaging molds after 50,000 and 100,000 operations.

Figure 7. Scheme showing the recycling of epoxy resin IC packaging mold ports.
Figure
Figure 7. 7.Scheme
Schemeshowing
showing the
the recycling
recycling ofof epoxy
epoxy resin
resin ICIC packaging
packaging mold
mold ports.
ports.
The diamond-like coating, which is very hard, is resistant to both acid and alkali and has a
The diamond-like coating, which is very hard, is resistant to both acid and alkali and has a
smoothThesurface with a low
diamond-like coefficient
coating, whichofis friction.
very hard, Theisdiamond-like
resistant to both coatingacidisand
alsoalkali
a material
and has witha
smooth surface with a low coefficient of friction. The diamond-like coating is also a material with
the characteristics of abrasion resistant, has good heat conductivity,
smooth surface with a low coefficient of friction. The diamond-like coating is also material with the and a low processing
the characteristics of abrasion resistant, has good heat conductivity, and a low processing
temperature,
characteristicsand it can extend
of abrasion the working
resistant, has goodlife heatofconductivity,
a mold fromand 2 toa 10lowtimes. Although
processing graphite
temperature,
temperature, and it can extend the working life of a mold from 2 to 10 times. Although graphite
coating has been used to protect the ports of Epoxy filling molds, it
and it can extend the working life of a mold from 2 to 10 times. Although graphite coating hasis uneven and coverage is poor.
been
coating has been used to protect the ports of Epoxy filling molds, it is uneven and coverage is poor.
The
used technique
to protect the for ports
coating the ports
of Epoxy fillingofmolds,
moldsit is with
unevena diamond-like
and coverage carbon is poor. film has been
The technique
The technique for coating the ports of molds with a diamond-like carbon film has been
accomplished
for coating the in thisofstudy
ports moldsand withcoatings have been
a diamond-like thoroughly
carbon film hastested. We have found
been accomplished in thisthat the
study
accomplished in this study and coatings have been thoroughly tested. We have found that the
coating can increase the abrasion resistance of recycled ports and increase
and coatings have been thoroughly tested. We have found that the coating can increase the abrasion their service life. The
coating can increase the abrasion resistance of recycled ports and increase their service life. The
coating is applied
resistance evenly
of recycled ports toand
the inside
increase and outside
their serviceof life.
the port
The and optical
coating microscopy
is applied evenly hasto been used
the inside
coating is applied evenly to the inside and outside of the port and optical microscopy has been used
to
andverify the of
outside quality of the
the port andsurface.
opticalHardness
microscopy testshas
of been
the deposited diamond-like
used to verify carbon
the quality of thefilms were
surface.
to verify the quality of the surface. Hardness tests of the deposited diamond-like carbon films were
also performed.
Hardness tests of The results ofdiamond-like
the deposited the study, which carbonwerefilmsincluded
were alsoinperformed.
specifications presented
The results to
of the
also performed. The results of the study, which were included in specifications presented to
Advanced
study, which Semiconductor
were includedEngineering Inc. presented
in specifications (ASE Inc.,toKaohsiung,
Advanced Taiwan) and other
Semiconductor companies,
Engineering Inc.
Advanced Semiconductor Engineering Inc. (ASE Inc., Kaohsiung, Taiwan) and other companies,
show the coatings to be 2 ± 0.2 μm in thickness. The coating is capable of
(ASE Inc., Kaohsiung, Taiwan) and other companies, show the coatings to be 2 ˘ 0.2 µm in thickness. resisting a friction of 150kg,
show the coatings to be 2 ± 0.2 μm in thickness. The coating is capable of resisting a friction of 150kg,
and coating
The it has a ishardness
capable up to Hv 3300.
of resisting Figureof8 150
a friction shows
kg, the
andsurface
it has a observation
hardness upoftoaHv port coated
3300. Figurewith8
and it has a hardness up to Hv 3300. Figure 8 shows the surface observation of a port coated with
diamond-like
shows the surface carbon film. The
observation of a performances
port coated with ofdiamond-like
the originally normal
carbon film.and
The recycled
performances portsofand
the
diamond-like carbon film. The performances of the originally normal and recycled ports and
plungers are checked by ASE Inc. The service life of originally normal ports
originally normal and recycled ports and plungers are checked by ASE Inc. The service life of originally and plungers is about 4
plungers are checked by ASE Inc. The service life of originally normal ports and plungers is about 4
months, and the
normal ports andservice
plungers lifeisofabout
recycled ports and
4 months, plungers
and the servicewith diamond-like
life of recycled ports carbon films is about
and plungers with
months, and the service life of recycled ports and plungers with diamond-like carbon films is about
8diamond-like
months. Those results
carbon filmsreally
is aboutprove the diamond-like
8 months. Those resultscarbon films the
really prove on the surfaces of
diamond-like portsfilms
carbon and
8 months. Those results really prove the diamond-like carbon films on the surfaces of ports and
plungers can really increase their service life.
on the surfaces of ports and plungers can really increase their service life.
plungers can really increase their service life.
Inventions 2016, 1, 11 7 of 9
Inventions 2016, 1, 11 7 of 9

Figure 8. Two different directions to view the repaired worn area of a port.

Part 2—The surfaces of the used plungers tend to wear out after a considerable number of
operations. Also, the volume of accumulation plastic debris will increase after a considerable
number of operations. The halogen-free green EMCs are now used for environmental reasons and
they have the problem of much stickier than the old ones do. When the ports and plungers are used
for production process, the time needed to clean the stickier halogen-free green EMCs becomes
more necessary and much shorter. To address this issue, we developed a technique for chamfering
the plunger tip, as shown in Figure 9. Current chamfering and polishing methods are mostly
performed manuallyFigure 8.on a milling
Two differentmachine,
directionswhere
to viewthethemain problem
repaired worn is theofachievement
area a port. of even
Figure 8. Two different directions to view the repaired worn area of a port.
beveling of the edges. But an automated milling machine can easily carry out the necessary
machining
Part 2—The without trouble.
surfaces of the used plungers tend to wear out after a considerable number of
Part Figure
2—TheAlso,
operations. 9a shows
surfaces the
of pattern
the volume the of of
used a plungers
new product,
accumulation where
tend
plastic port
wearand
todebris outplunger
will after are
increase closely
after alinked
a considerable with
number of
considerable
merely
numberAlso,
operations. a very small
of operations.
the volume gap
Theofleft for movement;
halogen-free
accumulation green since they
EMCsdebris
plastic are
are nowlinked
willusedclosely, wear as
for environmental
increase well as sticking
reasons and
after a considerable number
issues
they havewill
the eventually
problem ofoccur.
much Figure
stickier9bthan
shows surface
oneswear issues the
in ports
portsand plungers after a
of operations. The halogen-free green EMCs arethe
nowoldused do. environmental
for When and plungers
reasons and theyare used
have the
fornumber
problem of be
much
of Epoxy
production stickier
resin the
process, filling
than the
actions.
timeoldneededWhento the
onesofdo. clean
When
wear
the reaches a certain
thestickier
extent, agreen
halogen-free
ports This
andresidue
plungers
film of epoxybecomes
EMCs
areresult
used for
resin
production
will left on both the port and plunger the packaging mold.
more necessary and much shorter. To address this issue, we developed a technique for chamfering is the of unused
process,resin
the time needed to clean the stickier halogen-free green EMCs becomes
and adhesion. Since the residue is small and difficult to remove, cleaning takes a long time more necessary and
the plunger tip, as shown in Figure 9. Current chamfering and polishing methods are mostly
much shorter. To address this issue, we developed a technique for chamfering the plunger tip, as
and this reduces the time available for production. To solve this problem, we developed a plunger
performed manually on a milling machine, where the main problem is the achievement of even
shown tip Figure
in with a chamfered
9. Current end formed by and
chamfering milling, as shown in Figureare9c. mostly
This technology can increase
beveling of the edges. But an automatedpolishing methods
milling machine can easily performed
carry out the manually
necessary on a
the volume of the remaining resin and this actually facilitates cleaning and reduces the time taken
milling machine, where
machining without trouble. the main problem is the achievement of even beveling of the edges. But an
for the process to be completed. After much trial and error, we have found the optimal chamfering
automated milling
Figure
angle
machine
to be9aabout
shows 15 the
can easily
pattern
degrees. of acarry out the necessary
new product, where portmachining
and plungerwithout
are closely trouble.
linked with
merely a very small gap left for movement; since they are linked closely, wear as well as sticking
issues will eventually occur. Figure 9b shows surface wear issues in ports and plungers after a
number of Epoxy resin filling actions. When the wear reaches a certain extent, a film of epoxy resin
will be left on both the port and plunger of the packaging mold. This residue is the result of unused
resin and adhesion. Since the residue is small and difficult to remove, cleaning takes a long time
and this reduces the time available for production. To solve this problem, we developed a plunger
tip with a chamfered end formed by milling, as shown in Figure 9c. This technology can increase
the volume of the remaining resin and this actually facilitates cleaning and reduces the time taken
for the process to be completed. After much trial and error, we have found the optimal chamfering
angle to be about 15 degrees.

Figure 9. (a) Normal New Product; (b) Organic Substance residue resulting from wear and tear; (c)
9. (a) Normal
Figure Chamfered New Product; (b) Organic Substance residue resulting from wear and tear;
Plunger Tip. The yellow part was the residual epoxy.
(c) Chamfered Plunger Tip. The yellow part was the residual epoxy.
Part 3—The recycling and re-use of plungers with worn out tips. Although the service lifespan
of plungers generally used for the epoxy resin filling operation can be prolonged using the two
Figure 9a shows the pattern of a new product, where port and plunger are closely linked with
methods described earlier, the plungers will eventually become unusable. Also, as compared with
merely a very small gap left for movement; since they are linked closely, wear as well as sticking
issues will eventually occur. Figure 9b shows surface wear issues in ports and plungers after a number
of Epoxy resin filling actions. When the wear reaches a certain extent, a film of epoxy resin will be
left on both the port and plunger of the packaging mold. This residue is the result of unused resin
and adhesion. Since the residue is small and difficult to remove, cleaning takes a long time and this
reduces theFigure
time9. available
(a) Normal New Product; (b) Organic
for production. Substance
To solve residue resulting
this problem, from wearaand
we developed tear; (c)tip with a
plunger
Chamfered Plunger Tip. The yellow part was the residual epoxy.
chamfered end formed by milling, as shown in Figure 9c. This technology can increase the volume of
the remaining resin and this actually facilitates cleaning and reduces the time taken for the process to
Part 3—The recycling and re-use of plungers with worn out tips. Although the service lifespan
be completed.
of plungersAfter muchused
generally trialfor
and
theerror,
epoxywe have
resin found
filling the optimal
operation can bechamfering anglethe
prolonged using to betwoabout
15 degrees.
methods described earlier, the plungers will eventually become unusable. Also, as compared with
Part 3—The recycling and re-use of plungers with worn out tips. Although the service lifespan of
plungers generally used for the epoxy resin filling operation can be prolonged using the two methods
described earlier, the plungers will eventually become unusable. Also, as compared with the ports
Inventions 2016, 1, 11 8 of 9

Inventions 2016,
the plungers 1, 11 have a shorter service life time as compared that of ports. Existing plungers,
always 8 of 9

which are made in one piece, undergo great torsion and strain during the push-pull action of the filling
the ports the plungers always have a shorter service life time as compared that of ports. Existing
operation. In addition to surface roughening caused by the excessive friction, the threaded holes also
plungers, which are made in one piece, undergo great torsion and strain during the push-pull
tend to break.
action Because
of the fillingof this, we In
operation. investigated
addition to asurface
new welding
rougheningtechnique
caused to
byincrease the service
the excessive friction,life of
the plungers.
the threaded holes also tend to break. Because of this, we investigated a new welding technique to
Most of the
increase abrasion
the service lifetakes
of theplace within 3 mm of the tip of the plungers. To recycle worn plungers
plungers.
for reuse weMostdeveloped a seam-less
of the abrasion silverwithin
takes place welding3 mmtechnique
of the tiptoof attach a new tip
the plungers. Toonto the worn
recycle plungers.
plungers for reuse we developed a seam-less silver welding technique
The worn tip is cut off and replaced by one new tip made of DC53 + F10 steel with super-fine to attach a new tip onto thegrain
plungers. The worn tip is cut off and replaced by one new tip made of DC53
tungsten carbide, the processes are revealed in Figure 10. As the Figure 10 shows, this material stands + F10 steel with
super-fine
up very well to grain tungsten
the forces carbide,
involved in the
the processes
operationare andrevealed
transfersin Figure 10. As the
and absorbs the torque
Figure 10 veryshows,
well. We
this material stands up very well to the forces involved in the operation and transfers and absorbs
have found that the use of DC53 + F10 steel as the tip of the plungers can substitute the original metal
the torque very well. We have found that the use of DC53 + F10 steel as the tip of the plungers can
of thesubstitute
plungers. The DC53 + F10 steel can really increase the service life of the plungers. When we
the original metal of the plungers. The DC53 + F10 steel can really increase the service life
combine the three
of the plungers. techniques
When we investigated in this
combine the three study, we
techniques can reuse in
investigated thethis
ports andwe
study, plungers.
can reuseAlso,the we
couldports
realistically save more
and plungers. Also,than 50% of
we could the production
realistically fee of
save more ICs’
than 50%packages because we
of the production feeinvestigated
of ICs’
the reused
packagestechniques
because we of the ports and
investigated theplungers.
reused techniques of the ports and plungers.

(a)

(b)
Figure 10. (a) The treated cycle for the plunger; (b) The indication for the recycle of plungers.
Figure 10. (a) The treated cycle for the plunger; (b) The indication for the recycle of plungers.
4. Conclusions
4. Conclusions
In the IC packaging process, the green EMS packaging material is stickier than the old material
In theproduction
and IC packaging process,
run counts the green
between EMS
mold packaging
cleaning material
have been is stickier
reduced. Whenthan the oldtomaterial
compared the old and
material
production and
run process,
counts the use
between moldof cleaning
green EMCs havematerial can cause
been reduced. When a decrease
compared of to37.5%~50% in
the old material
production count. In other words, the Green EMCIC packages cost more
and process, the use of green EMCs material can cause a decrease of 37.5%~50% in production count. to produce. We have
successfully
In other words, the investigated
Green EMCICthe new technology
packages costtomore
recycle
toports and plungers.
produce. We haveAt first, the surfaces
successfully of
investigated
ports and plungers are cleaned and the diamond-like coating with a thickness of 2 ± 0.2 μm is
the new technology to recycle ports and plungers. At first, the surfaces of ports and plungers are
successfully deposited on their surfaces. The coating is capable of resisting a friction of 150 kg, and
cleaned and the diamond-like coating with a thickness of 2 ˘ 0.2 µm is successfully deposited on their
has a hardness up to Hv 3300. To address the problem of the accumulation of plastic debris in the
surfaces. The coating
plungers’ surfaces,is capable
we developedof resisting a friction
a technique for of 150 kg, and
chamfering thehas a hardness
plunger tip and uptheto Hv 3300. To
optimal
address the problem
chamfering angleofis the accumulation
15 degrees. of plastic
The service life of debris in the
originally plungers’
normal surfaces,
ports and plungersweisdeveloped
about 4 a
technique for and
months, chamfering thelife
the service plunger tip and
of recycled theand
ports optimal chamfering
plungers is about 8angle is 15
months. Thedegrees.
findingsThe service
in this
life ofstudy
originally
can helpnormal portssuch
companies andasplungers is reuse
ASE Inc. to aboutworn
4 months,
ports andand the service
plungers life of production
and reduce recycled ports
and plungers is about 8 months. The findings in this study can help companies such as ASE Inc. to
Inventions 2016, 1, 11 9 of 9

reuse worn ports and plungers and reduce production costs. If ASE Inc. is taken as an example: if each
plant uses 1000 sets a month, 12 plants will use 144 thousand sets each year. The savings on each set
can be aboutNT$1600 and this equates to a saving of roughly half the present expenditure on ports
and plungers.

Acknowledgments: We wish to express our sincere gratitude for technical help from Mazak Technology Co
Ltd (Kaohsiung, Taiwan) and the grant of a subsidy from the 2014 Kaohsiung City Local Industry Innovation
Development Promotion Project.((Local SBIR)—Recycling Project of Ports and Plungers of EMC Packaging Molds)
and MOST 104-2622-E-390-004-CC3.
Author Contributions: The study was designed by Cheng-Fu Yang and Mazak Technology Co Ltd; The data
collection was performed by Wan-Chiech Huang and Chao-Ming Hsu; The data analysis was performed by
Chao-Ming Hsu and Cheng-Fu Yang. The overall planning was directed by Cheng-Fu Yang.
Conflicts of Interest: The authors declare no conflict of interest.

References
1. Yang, S.Y. Optimal Design on Twin Die Stacked Packages Using Regression Analysis. Master’s Thesis,
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan, July 2006.
2. Pang, J.H.L.; Seetoh, C.W.; Wang, Z.P. CBGA solder joint reliability evaluation based on elastic-plastic-creep
analysis. J. Electron. Packag. 2000, 122, 255–261. [CrossRef]
3. Hwan, C.L. Surface Treatment Effect of IC Package Mold on the Formation of Green Compound. Master’s
Thesis, Department of Materials and Fabrication Engineering, Feng Chia University, Taichung, Taiwan,
July 2008.
4. Zhon, L.Y. Molding Analysis of the IC Package Wire-Sweep. Master’s Thesis, Department of Materials and
Fabrication Engineering, Feng Chia University, Taichung, Taiwan, July 2006.
5. Lin, Z.S. Surface Treatment Effect of IC Package Mold on the Formation of Green Compound. Master’s
Thesis, Department of Materials and Fabrication Engineering, Feng Chia University, Taichung, Taiwan,
July 2006.
6. Sheu, I.D. A Study of Chip Thickness Effect on the Wire Sweep of IC Packages. Master’s Thesis, Department
of Mechanical Engineering, National Yunlin University of Science and Technology, Yunlin County, Taiwan,
June 2009.
7. Chiou, S.M.; Lu, J.Y.; Yang, G.Y. The Anti-Stacking Surface Treatment on Precision Parts Application.
J. Mechatro. Indus. 2008, 301, 63–68.
8. Yun, Z.S. The Format Technology of Single-Crystal Diamond Thin Film. In Proceedings of the Conference
of The Application of Diamond Thin films, Department of Physics, Tamkang University, New Taipei City,
Taiwan, 10 October 2013.
9. Haenen, K. The Science, Technology and Application of Nanodiamond Films. In Proceedings of the
conference of the Application of Diamond Thin Films, Department of Physics, Tamkang University,
New Taipei City, Taiwan, 10 October 2013.
10. Robertson, J. Diamond-like amorphous carbon. Mater. Sci. Eng. R. 2002, 37, 129–281. [CrossRef]
11. Konishi, T.; Yukimura, K.; Takaki, K. Fabrication of diamond-like carbon films using short-pulse HiPIMS.
Surf. Coat. Tech. 2016, 286, 239–245. [CrossRef]
12. Kimura, T.; Nishimura, R.; Azuma, K.; Nakao, S.; Sonoda, T.; Kusumori, T.; Ozaki, K. Surface treatment
of diamond-like carbon films by reactive Ar/CF4 high-power pulsed magnetron sputtering plasmas.
Nucl. Instru. Methods Phys. Res. B 2015, 365, 155–158. [CrossRef]
13. Kimura, T.; Nishimura, R. Formation of hydrogenated diamond-like carbon films by reactive Ar/CH4 . Jpn. J.
Appl. Phys. 2014, 53, 090301. [CrossRef]
14. Ishihara, M.; Suzuki, M.; Watanabe, T.; Nakamura, T.; Tanaka, A.; Koga, Y. Synthesis and characterization of
fluorinated amorphous carbon films by reactive magnetron sputtering. Diam. Relat. Mater. 2005, 14, 989–993.
[CrossRef]

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