Professional Documents
Culture Documents
Submitted by
Chew Jun Teck
A0165246A
Supervisor:
Assistant Professor Wang Hao
Examiner:
Associate Professor A Senthil Kumar
This Final Year Project (FYP) report, aim to design at the functionally graded material (FGM)
which can be fabricated by 3D printing technology, to make elastic polishing pad for the
sake of achieving uniform material removal rate in chemical mechanical polishing (CMP).
Comprehensive analysis and careful experiment were conducted on various selected auxetic
lattice structure with certain compression speed at compression length on building direction
of lattice sample. This able to provide handful of data for analysis to select the suitable
auxetic reinforced composite elastic polishing pad. Icosahedron lattice structure has the
highest compression force and Young’s modulus follow by Hexagon, Snowflake and X at
compression speed at 5mm/min and compression distance at 35mm. Hexagon and X lattice
specimens has share almost the same similar Young’s modulus with X lattice specimens
when the compression speed and compression distance at much lower value.
Additionally, the capability of the new formed auxetic lattice reinforced composite elastic
polishing pad was aimed to reduce the abrupt change of boundary stress and the contact
stress in the single gradient ring at constant. The new creation may explore on solving
inconsistent problem of central stress under static and dynamic condition in the future work.
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ACKNOWLEDGEMENT
The author sincerely appreciates and thank from the bottom of my heart to FYP supervisor,
Dr Wang Hao, and graduate tutors Mr Zhang Jiong and Ms Hong Ruochen for their precious
time and guidance throughout the entire project journey. Their relevant experience in the
industry, advice and feedback were of paramount important in helping the author to improve
as well as to generate better ideas. Help and support were also provided whenever the author
faced challenges from create CAD file to conversion of STL files with suitable software.
The author would like to thank National of Singapore (NUS) Manufacturing Department for
allocating the necessary equipment and fabrication services as well as giving the author
permission to conduct experiments in Mechanical Lab. It was due to recent pandemic issue
that causes NUS has tighten restriction on visitor on entering the school premise and
operating machine. With the help of Mr Zhang Jiong on collecting lattice samples from
Center for Additive Manufacturing (AM.NUS) once ready for collection and Mr Zhang Jiong
The author learnt a great deal and gained an in-depth understanding of concepts pertaining to
stakeholder management skills, internal surface finishing methodology and lab investigation
techniques.
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TABLE OF CONTENTS
CONTENTS
ABSTRACT.............................................................................................................................. i
ACKNOWLEDGEMENT...................................................................................................... ii
ABBREVIATIONS ................................................................................................................. x
6.1 Gather more data through experiment on selected lattice structure specimens .. - 48 -
6.2 Working on lattice cell modeling with Finite Element Analysis (FEA) software . - 48
-
7.REFERENCES.............................................................................................................. - 51 -
8.APPENDICES ............................................................................................................... - 53 -
Table 1 ............................................................................................................................... - 53 -
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LIST OF TABLES
parameters
parameters
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LIST OF EQUATIONS
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LIST OF FIGURES
Fig 2: Wafer manufacturing without CMP (a) and with CMP (b) [6] ................................. - 7 -
Fig 6: FormLab Form 2 Desktop 3D SLA 3D Printer and its available printing materials- 14 -
Fig 12: First batch of 40 lattice specimens of Hexagon, Icosahedron, Snowflake and X -
20 -
Fig 13: Unwanted printing support found on the lattice structure specimen ..................... - 21 -
Fig 15: Lattice specimen after compression test until densification .................................. - 22 -
Fig 19: Second Batch Hexagon Lattice Structure of Force-Stroke and Stress-Strain Graph- 25
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Fig 21: Second Batch Icosahedron Lattice Structure of Force-Stroke Graph ................... - 27 -
Fig 22: Second Batch Icosahedron Lattice Structure of Stress-Strain Graph .................... - 28 -
Fig 24: Second Batch Snowflake Lattice Structure of Force-Stroke and Stress-Strain Graph .. -
31 -
Fig 26: Second Batch Snowflake Lattice Structure of Force-Stroke and Stress-Strain Graph .. -
34 -
Fig 28: Reference from [14] schematic lattice structures design ....................................... - 43 -
Fig 29: Unwanted printing support found on the lattice structure specimen ..................... - 44 -
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LIST OF SYMBOLS
Symbols
µm Micrometer
mm Millimeter
N Newton
Min Minute
E Young’s Modulus
Engineering Stress
Engineering Strain
Radius
V Relative Velocity
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ABBREVIATIONS
3D 3-Dimensional
AM Additive Manufacturing
SLA Silithography
STL Stereolithograpghy
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CHAPTER 1 INRODUCTION
Chemical mechanical polishing (CMP) is the most important processing technology that
could provide global and local planarization. However, the critical problem of material
removal uniformity remains to be solved. CMP models based on the Preston equation
represented the material removal rate (MRR) as a function of the pressure and relative
velocity.
The vital of uniform removal of workpiece surface, and meant to regulate the stress and
mechanical properties in the process of polishing hard and brittle materials through various
techniques. Previous studies suggested that stress could be regulated and composites would
be used in the polishing process However, the Young’s modulus of conventional single
polishing tool remained the same, so the stress distribution in contact zone was theoretically
the same.
This Final Year Project (FYP) is dedicated to have a novel research on through designing
and fabrication of auxetic lattice composites elastic polishing pad to remove the abrupt
phenomenon of edge stress and working on stabilize the central stress and boundary stress as
well. The further studies on characterization of auxetic lattice will also be investigated via
experimental verification. Over the course of two academic semesters, the design of the
several batches and different machine parameter input to generate more data for analysis.
The auxetic lattice structure will be designed by author through the careful study on other
reference lattice structure. Finite Element Analysis of deformation modes of lattice cells will
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decide by intermediate reports and analyses of the experimental results were carried out to
illustrate the compressive data through different parameter in terms of compression speed
Lastly, with this novel method that was established, limitations and recommendation for
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CHAPTER 2 LITERATURE SURVEY
Additive Manufacturing or 3D printing is the official industry standard term (ASTM F2792)
for all applications of the technology. It is defined as the process of joining materials to make
freeform fabrication.
AM technologies are the use of 3D modeling software (Computer Aided Design or CAD),
machine equipment and layering material. Once a CAD sketch is produced, the Additive
Manufacturing equipment reads in data from the CAD file and lays downs or adds successive
3D object. However, the latter is more accurate in that it describes a professional production
Instead of milling a workpiece from solid- block, for example, AM builds up components
layer by layer using materials which are available in fine powder form. A number of material
option are available including composite materials, metals, thermoplastics, rigid prototyping
plastics and nylon. Each selected material was researched are perfectly fit within tolerances
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Additive Manufacturing was rose above the other process in 1980s and rapidly developed at
the fast pace from the past until today. AM technology involves in many sectors such as
industrial companies also adopted AM technology as their part of company development too.
As the commercialized of AM technology, the price has drop drastically which inversely
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2.2 Material Removal in Chemical Mechanical Polishing (CMP)
The chemical mechanical polishing (CMP) has emerged in the last two decades and grown
rapidly as a basic technology and is widely used in semiconductor device fabrication because
of its excellent planarization capacity. The CMP process is composed of a rotating table, a
polishing head, a pad and slurry. The CMP process is affected by several factors, such as the
type of abrasive, downward pressure on the specimen, relative velocity between the
polishing pad and specimen, the material quality of the polishing pad, and the slurry
chemistry.
The CMP process occurs when the wafer surface is moved across the pad, mechanical
motion down force are applied to the wafer with elastic polishing pad in the presence of
slurry by the polishing machine. The pad surface provides the rough points which make
contact with the wafer. The slurry (commonly a colloid) provides the abrasive particles and
the appropriate chemistry for the CMP process to proceed. This smoothens or removes on the
surface of irregular topography making the wafer flat. Typical depth-of-field requirements
CMP tools are consists of a rotating and extremely flat plate which is covered by a pad to
protect it from damaged it flatness. The wafer that mounted on the opposite of flat plate is
polished by with the retaining ring keep the wafer in the correct horizontal position. With the
present of slurry, it washes away the unwanted particles from stacking up on the wafer
surface. A downward pressure is applied to the carrier, pushing it against the pad with the
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down force on the contact point/area. Typically pads roughness has 50 μm; contact is made
by asperities (which typically are the high points on the wafer) and, as a result, the contact
area is only a fraction of the wafer area. If the wafer has a slightly bowed structure, the
pressure will be greater on the edges than it would on the center, which causes non-uniform
polishing. Pressure can be applied to the wafer's backside in order to compensate for the
wafer bow, which will contribute the centre-edge differences. The pads used in the CMP tool
should be rigid in order to uniformly polish the wafer surface. However, these rigid pads
The material removal rate depends on the pad micro texture which defined as localized
roughness of the pad surface. Pad conditioning has a strong effect on the removal rate and
direct related to the removal rate stability. The role of the conditioning process is to create
asperities on the pad surface which contact the wafer. It is known that the pad surface
features deform during the polishing and as a result the polishing ability of the drastically
weaken without the presence of conditioning process. The material removal rate (MRR)
rapidly declines with the increase of the polishing time without regeneration of the pad
The surface roughness parameters can be separated into three basic types: amplitude
characterize the pad surface with a single parameter [5]. Hybrid parameters are Rpk, Rk and
Rvk were often chosen were specially design for control of potential wear. The Rpk means
―reduced peak height‖ and is an estimate of the peaks above the main plateau and is related
to the wear characteristics of the pad. These peaks will be the area of most rapid wear when
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the polishing is performed. The Rk means ―Core roughness depth‖ and is referring to the
depth of the working part of the surface, which carries the load and closely contacts the
wafer surface. The Rvk means the reduced valley depth of the valleys and is related to the
ability of the surface to retain polishing slurry. Rpk should be considered to understand
correlation with the removal rate, because the Rpk is the area of most rapid wear when the
polishing is first run. Therefore, this research will focus on the Rpk among the hybrid
Fig 2: Wafer manufacturing without CMP (a) and with CMP (b) [6]
The roughness of the pad surface is influenced by the pad conditioning process. The Rpk
increases according to the pad break-in time and the conditioning pressures. Therefore, the
pad conditioning is necessary to obtain the required steady state condition of the pad surface.
Also, the removal rate and the Rpk drop off significantly according to the polishing time
without the pad conditioning. Without the pad conditioning, the pad surface becomes
smoother according to the polishing time so that the Rpk decreases according to the
polishing time which cause a decrease of the removal rate. In addition, the removal rate and
the friction force are proportional to the Rpk of the pad surface
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In CMP process, the conventional polishing pad results in uneven material removal rate
along the radial direction of the polishing pad due to the linear increase of the polishing
velocity along the redial direction of the polishing pad due to linear increase of the polishing
velocity. Hence, there is a need to design auxetic lattice composite elastic polishing pad to
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CHAPTER 3 EXPERIMENTAL PROCEDURES AND RESULTS
Young’s modulus, Eq. (1) where is the stress and is the strain
E is the Young’s modulus or the modulus of elasticity in tension is mechanical property that
measures the tensile stiffness of a solid material. It quantifies the relationship between
uniaxial stress (force per area) axial strains (proportional deformation) in the linear elastic
region of a material. The polishing pressure and velocity is expressed as Eq. (2) and Eq. (3)
respectively [7].
Eq. (2)
Rotational angular velocity, of the elastic polishing pad and r represents the distance of the
When and are constants, MRR at a point (x,y) of contact area would keep constant if E is
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Elastic polishing pad are designed composite material sandwiched with rubber with mixing
different kinds of mass ratio. Young’s modulus changed in the radial direction where forced
Before start with experimental analysis and verification, Autodesk Inventor Professional and
Autodesk Netfabb were selected among other choices such as Simpleware ScanIP and
Materialise 3-Matic.
The reasons of chose both software due to 3 main reasons- software integrations on the same
modeling software with Autodesk software and lastly was the 1 year subscription free for
registered student.
lattice structure
Autodesk Netfabb allows to venture for creation of body-centered cubic (BCC) of lattice
structure. Four lattice structure designs were selected as below Hexagon, Icosahedron,
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a)
b)
c)
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d)
Data for the designed lattice structure was stored in step file and transfer to Netfabb in
50 respectively. The selected printing material is clear resin to use on FormLabs Form 2
3D printer. Density acquired from Safety Data Sheet of clear resin is 1.09 (SI Unit:
1090 ) [9].
Lattice
Average
Design Average
Mass (kg) Density (kg/m3) Density
X- Mass (kg)
(kg/m3)
Lattice
#1 0.0107 0.0107 0.0107 85.730 85.735 85.732
85.10
#2 0.0106 0.0106 0.0106 0.011 85.033 85.034 85.034
#3 0.0106 0.0106 0.0106 84.529 84.530 84.532
Hexa
-gon
#1 0.0159 0.0159 0.0159 127.288 127.286 127.287
#2 0.0157 0.0157 0.0157 0.016 125.964 125.985 125.982 125.95
#3 0.0156 0.0156 0.0156 124.580 124.594 124.594
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Icosahe
-dron
#1 0.0312 0.0312 0.0312 249.914 249.916 249.912
#2 0.0307 0.0307 0.0307 0.031 245.578 245.578 245.576 247.72
#3 0.0308 0.0308 0.0307 246.696 246.694 245.576
Snow
-flake
#1 0.0197 0.0197 0.0197 157.824 157.822 157.822
#2 0.0198 0.0198 0.0198 0.020 158.418 158.419 158.417 156.63
#3 0.0192 0.0192 0.0192 153.643 153.642 153.642
Table 1: Lattice Density of Second Batch Lattice Specimens
To prepare arrangement on the 3D printer in order to maximize the space efficiency and
print at one go, virtual arrangement able to showcase on Autodesk Netfabb with selected 3D
printer Formlab Form 2 and preset parameter given. Thus, 3D files in either mesh triangle or
CAD parametric was generated thru Autodesk Netfabb and sent for laboratory for printing.
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Fig 6: FormLab Form 2 Desktop 3D SLA 3D Printer and its available printing materials
All of the lattice structures were manufactured through Stereolithography (SLA) process in
commercial desktop 3D printer FormLab Form 2 in NUS Center for Additive Manufacturing
(AM.NUS).
Material clear V4 material and the printed specimens are post processed with IPA washing.
Mechanical properties can vary with part geometry, print orientation, print settings and
temperature. Data was obtained from the clear datasheet. [Refer to Appendices Table 1]
Temperature guide from FormLabs SLA printers automatically heats resin to a set
temperature before starting a print. Once the ideal temperature for the inserted consumable is
met, the print begins. The printer may periodically pause to sense the resin temperature and
adjust it accordingly. Pre-heating may take up to 15 minutes. Print start temperature starts at
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There are 2 important finishing post processes such as perform Form Cure to help 3D printed
parts achieve highest possible strength and stability. Optimal post-curing settings depend on
equipment and the geometry of the part. The interactive tool below recommends Form Cure
settings for each Formlabs resin to achieve ideal mechanical performance. Formlabs updates
Second post process is the Form Wash removes uncured resin from the surface of printed
parts by simultaneously soaking and moving them in a solvent. The Form Wash can be used
with isopropyl alcohol (IPA) or tripropylene glycol monomethyl ether (TPM). When using
TPM, wash your printed parts as you would with IPA. Use longer wash times if necessary—
some resins will not absorb TPM or swell as much with exposure to the solvent. When
washed in TPM, standard resins remain waxy when printed with a layer thickness of 50
microns or 100 microns. Post-curing removes the waxiness. Without post-curing, the
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3.2 Compression tests on lattice specimens
These experiments look at the parameterizing of lattice structure design in terms of overall
specimen unit cell size while also refer to different lattice structure designs. Specimens were
tested on a Shimadzu AGX-V Series Universal Testing Machines with a 50kN load cell.
Specimen sample were placed between two metal platens – the lower one fixed and the upper
one movable to building direction at desire compression speed to compress the specimens up
to densification. Grease was suggested to apply on the surface of the loading platens to
reduce frictions. Specimen sample were placed between metal plates and compressed along
the longitudinal building direction. The compressive force (N) and displacement of the
moving platen were recorded. Two batches of printed lattice specimen design – first batch 1
each of 40 lattice design specimens and second batch 3 each (total 12pcs) 50 of
lattice design specimens were tested to verify consistency of compressive test results. Videos
were recorded of the deformation process with normal phone camera for further analysis.
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Fig 8: Blue marking on top corner of lattice specimens
Blue marking on the top corner of the lattice specimens to distinguish number label on
printed lattice structure. Next, the bottom of latice specimens are marked with blue marking
to indicate on the building direction of lattice specimen base. The reason of agreed upon on
the printing direction with compression direction is to improve reproductibility of the overall
compression tests for the subsequent batches and elimante one parameter that may affect on
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3.2.2 Mechanical properties of tested lattices
Compression tests are underwent and data are collected for analyzing to have comparison
between the mechanical properties and energy absorption characteristic of each lattice
structure from batch 1 (40 ) and batch 2 (50 ). Based on the force-stroke data
recorded, engineering stress-strain curves are constructed as below. The engineering stress
and strain are based on the initial cross-sectional area and height of the cubic sample
respectively. A total of 16 specimens were fabricated and tested to verify the repeatability of
the experimental results in term of change of compression speed and compression length as
shown.
Load Cell
Printed Sample
Rigid Plate
Printing
direction
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Red arrow pointing downward indicates direction of compression against the building the
direction. Blue arrow pointing upward indicates building direction against the compression
direction.
Model of stress strain curves can be sections it into three distinct regions- linear elastic zone,
strain that obey to Hooke’s law and the slope is formed with stress over strain to form
Young’s modulus. The graph reaches the elastic limit and hit yield point to enter plastic zone.
The material undergoes only elastic deformation. The highest point of the graph will be
ultimate tensile strength and the end of the stage is the initiation point of plastic deformation.
The second stage is the strain hardening region. The region starts as the stress goes beyond
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the yield point. The materials will reach a maximum at the ultimate strength point which is
the maximal stress and is called the ultimate tensile strength (UTS). The stress of the flat
region is defined as the lower yield point (LYP). Plastic deformation forms bands at the
upper yield strength and these bands carrying with deformation spread along the sample at
the lower yield strength. This stage is the most significant in term of quantifying the energy
absorption capacity.
The third stage is the necking region. A neck forms where the local cross-sectional area
becomes significantly smaller than the average beyond the tensile strength. The necking
deformation will reinforce itself as the stress concentrates more at small section. The positive
feedback leads to quick development of necking and leads to fracture. With the pulling force
is decreasing, the work strengthening is still progressing, the true stress keeps growing but
the engineering stress decreases because the shrinking section area is not considered. This
region ends up with the fracture. After fracture, percent elongation and reduction in section
specimen designs
Fig 12: First batch of 40 lattice specimens of Hexagon, Icosahedron, Snowflake and X
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First batch of lattice specimens are printed for experimental verification. Compression test
parameters are defined with compression speed at 5mm/min with average compression
The lattice structures are placed on between metal plates to be compressed until densification.
The lattice structures internal plays vital part of providing strength to withstand 50kN force
on compression machine.
Fig 13: Unwanted printing support found on the lattice structure specimen
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Fig 15: Lattice specimen after compression test until densification
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Fig 17: First Batch Lattice Structure of Stress-Strain Graph
The descending orders of highest Young modulus, ultimate tensile strength and able to
withstand highest compression force is Icosahedron, Hexagon, and Snowflake and X lattice
and ultimate tensile strength around 12MPa due to its rigid and close
arrangement of BCC lattice structure to form strong support to withstand loaded pressure.The
reason of X stress-strain graph having minor up and down on the graph due to human error.
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Fig 18: Second batch of 50 Hexagon lattice specimens
The polishing force exerted on contact point of elastic polishing pad during polishing with
downward pressure will not cause permanent transform on the physical structure. Thus, the
compression test on the second batch of lattice specimens will have optimal downward
pressure that will not cracks the lattice structure to densification as well.
Second batch of 3 lattice specimens are printed and placed on between metal places for
experimental verification. Compression test parameters are defined with compression speed
The lattice structures internal plays vital part of providing strength to withstand 50kN force
on compression machine. At the start of the experiment, the force seems unstable due to 2
reasons: (1) force exerted only on the peak of lattice points before fully compressed and (2)
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there are some unwanted support stuck in between lattice specimens that unable to remove
Fig 19: Second Batch Hexagon Lattice Structure of Force-Stroke and Stress-Strain Graph
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Based on the 3-graphs shown, slow start on the beginning of the experiments reflected a flat
region whereby the compression values remain relatively low due to top movable metal plates
touched on the peak of lattice specimens. The top movable metal plates fully conform on the
top surface of lattice structure and, the force able to contact more point on the top surface of
lattice structures. This is the region where graph reflected actual compressed region. The
The average lattice structure specimens have Young’s Modulus around from
3 Hexagon lattice specimens with 3 different parameters and ultimate tensile strength unable
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Second batch of 3 lattice specimens are printed placed on between metal plates for
experimental verification. Compression test parameters are defined with compression speed
The lattice structures internal plays vital part of providing strength to withstand 50kN force
on compression machine. At the start of the experiment, the force seems unstable due to 2
reasons: (1) force exerted only on the peak of lattice points before fully compressed and (2)
there are some unwanted support stuck in between lattice specimens that unable to remove
Based on the 3-graphs shown, there were no sign of slow start on the beginning of the
experiments reflected a flat region whereby the compression values remain relatively low due
to top movable metal plates touched on the peak of lattice specimens. The compression
experiments took no longer time to proceed with actual compressed region further on the
experiments without having the same issue on Hexagon lattice specimens. The graph
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Lattice Specimens: Icosahedron
Young's Modulus (MPa)/ 0.05mm 0.40mm 1.20mm
Parameter Compressed at 2.0mm Compressed at 5.0mm Compressed at 5.0mm
Beginning Flat Region - - -
Actual Compressed Region 7.273 4.889 7.121
Final Value
(Actual Compressed Region 7.273 4.889 7.121
-Beginning Flat Region)
Average Young's Modulus
6.428
Value
Table 3: Average Young’s Modulus of 3 Icosahedron lattice specimens in 3 different
parameters
from 3 Icosahedron lattice specimens with 3 different parameters and ultimate tensile
strength unable to determine to experiment was halt before reach densification. The stress-
strain graph with compression speed at 0.05mm/min and compression distance at 2mm
unable to provide accurate data due to experiment halted before yield point reached.
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Fig 23: Second batch of 50 Snowflake lattice specimens
Second batch of 3 lattice specimens are printed placed on between metal plates for
experimental verification. Compression test parameters are defined with compression speed
The lattice structures internal plays vital part of providing strength to withstand 50kN force
on compression machine. At the start of the experiment, the force seems unstable due to 2
reasons: (1) force exerted only on the peak of lattice points before fully compressed and (2)
there are some unwanted support stuck in between lattice specimens that unable to remove
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Fig 24: Second Batch Snowflake Lattice Structure of Force-Stroke and Stress-Strain Graph
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Based on the 3-graphs shown, there were 2 out of 3 graphs shown sign of slow start on the
beginning of the experiments reflected a flat region whereby the compression values remain
relatively low due to top movable metal plates touched on the peak of lattice specimens. The
compression experiments took no longer time to proceed with actual compressed region
further on the experiments. There was only a set of data able to carry out compression
experiments smoothly and the graph response to normal stress-strain graph behavior
parameters
from 3 Snowflake lattice specimens with 3 different parameters and ultimate tensile strength
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Fig 25: Second batch of 50 X lattice specimens
Second batch of 3 lattice specimens are printed placed on between metal plates for
experimental verification. Compression test parameters are defined with compression speed
The lattice structures internal plays vital part of providing strength to withstand 50kN force
on compression machine.
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Fig 26: Second Batch Snowflake Lattice Structure of Force-Stroke and Stress-Strain Graph
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Based on the 3-graphs shown, slow start on the beginning of the experiments reflected a flat
region whereby the compression values remain relatively low due to top movable metal plates
touched on the peak of lattice specimens. The top movable metal plates fully conform on the
top surface of lattice structure and, the force able to contact more point on the top surface of
lattice structures. This is the region where graph reflected actual compressed region. The
Lattice Specimens: X
Young's Modulus (MPa)/ 0.20mm 0.20mm 0.20mm
Parameter Compressed at 3.0mm Compressed at 3.0mm Compressed at 3.0mm
Beginning Flat Region 0.769 1.231 1.000
Actual Compressed Region 1.267 1.969 1.297
Final Value
(Actual Compressed Region - 0.497 0.738 0.297
Beginning Flat Region)
Average Young's Modulus
0.511
Value
Table 5: Average Young’s Modulus of 3 X lattice specimens in 3 different parameters
from 3 X lattice specimens with 3 different parameters and ultimate tensile strength unable to
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3.2.4 Summary of experimental results
Based on the numerical data analysis and experimental verification, first batch lattice
structure specimens were printed under same printing condition with printing volume at
Quasi-static compression tests were run on 1 each lattice specimens design with same
Although metal plates will touched of peak of lattice structure specimens and unwanted
lattice supports existed in lattice specimens, it did not reflect on the beginning of the
experiment compared to second batch lattice specimens due to high force generated with
high compression speed compressed till densification. Thus, ultimate tensile strengths were
able to determine from the stress-strain graph and higher Young’s Modulus shown compared
From the first batch, the stress-strain graph reflected that Icosahedron has the highest
Young’s Modulus follows by Snowflake, Hexagon and X; whereas from the second batch,
the stress-strain graph reflected that Icosahedron has the highest Young’s Modulus follows
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Lattice Specimens Average Young’s Modulus (MPa) Ignore Flat Region
Icosahedron 6.428 No
X 0.511 Yes
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3.3 Analyses of deformation modes
The unit cell geometry leads to alteration of the cell deformation mode and thus determine
the global deformation pattern of lattice. The evolutions of deformation of cells in different
designs at different global nominal strains are examined in details as shown in Table 1.
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X
The strain values are less than 0.1mm with compression speed less than 1.2mm/min and
compression length around 5mm. The reasons of naming only 2 specimens are some
specimens has not recorded properly due to long duration of experiment such as Hexagon #1
at compression speed at 0.05mm/min and stress-strain curves behaved different from average
such as one of lattice specimens from Icosahedron, Snowflake and X. With strain value less
than 0.1mm and experiment halts before densification, the portion of cell did not fully
collapses and the bottom half did not begin to deform as well.
Although a dominant strut-axis loading structure results in a high stiffness and initial yield
stress, the lattice specimens’ layer should collapse in layer-by-layer cell mode leads to a
fluctuating post-yield response. Hence, the octet is preferable for non-deforming load-
bearing applications. The inner lattice structures are rigid and able to withstand incoming
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The shorter strut linked connection and visible lattice support on Hexagon, Icosahedron and
Snowflake lattice structure design provides larger strain value and able to withstand lattice
deformation at higher rate. Although the strain value of X lattice structure specimens are
closer to other 3 design, the visible supports were affecting the overall consistency and
Based on the earlier analysis and summary from quasi-static compression test, it can be
deduced that stress-strain reflects and lattice deformation modes of the lattices are the
fabrication technique. The chosen additive manufacturing method was SLA determines the
mechanical properties of the lattice structures and consistency is the key of this experiment.
Understand that printing a perfect a support free FCC lattice specimen are nearly impossible,
lattice support are required to generate to withstand the internal constitute structure of lattice.
The fabrication process may results the irregular of strut thickness, voids and micro damage
during removal.
Thus, FE analyses are required to deliver on simulation results on lattice deformation from
lattice structure from the top to bottom, it able to show more data via FE models.[14] Dr Sun
indicated that the cell geometries of all three lattices generate localized
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deformation associated with the buckling of axially-loaded struts, because none of them
deformation localization is evident, as they are widespread and generally occur across the
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CHAPTER 4 DISCUSSIONS
Overall, it is evident that the use of high compression speed not able to fully shown data in
details with comparison of first and second batch of lattice structure. With cubic lattice
specimen placed on between two metal plates of compression test fitted with a 50kN load
cell, the experiments should carried out at a constant speed of 0.0064m/s, corresponding to a
global nominal strain rate of ~0.001 to compress the specimens down with movable top
plate till densification to complete the each compression test. The compressive cyclic true
stress-strain curve shown varies in value even with same parametric setup and same
Overall, it is evident that compression distance are required to remain longer such as 35mm
in first batch of lattice specimens to have full experiment data for analysis. With the number
of lattice specimens included for second batch lattice specimen, it will take much longer time
to complete the data collection and analysis. Under such circumstance, the author has
compromised on keep compression distance at much shorter range of 2mm~5mm where the
Overall, it is evident that lattice structure size of 40 and 50 did not effect on
compressive test results. With the increases of contact area, the force exerted will increase
proportionally as well.
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Fig 27: Reference from [14] schematic lattice structures design
Lattice structure design was inspired with fellow researches and thesis that author analyzed.
With handpicked of 4 available mesh lattice from available designs from Autodesk Netfabb
with reference to [14] lattice structure on Fig 28. The reason of having different strut distance
and strut arrangement on lattice structure to have range of compressive results to pick a
Elastic polishing pad operates with constant force downward on movable top plates between
fixed bottom plates to perform polishing on wafer. It involved on the compressive force
instead of pulling force. Thus, the introduction of uniaxial compressive testing machine are
introduced to obtain the ultimate strength, ultimate strain and Young’s modulus of the lattices
which was prepared into a cubic shape BCC lattice specimens and tested at room temperature
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4.4 Effect of Fabrication and Post Processing Technique
Mesh lattice structures were designed using Autodesk Netfabb and verified with Autodesk
Inventor. The strut thickness was set at 2-3 mm and the outcome of the 3D printed lattice
specimens has range of strut thickness. Knowing the fact the SLA 3D printer has laser spot
size as 140 . Thus, this may contribute to the explanation on working on several same
Another factor was post processing technique such as washing on the finishing printed part
by washing-soaking and moving simultaneously parts in solvent to remove the thin layer of
liquid resin from the surface of printed parts. Thigh spot in between lattice structure may
have lattice supports were unable to move. Thus, this may contributes of the accuracy of
compressive results.
4.5 Limitation
Fig 28: Unwanted printing support found on the lattice structure specimen
2. Lattice support unable to remove from the printed lattice structure specimens
3. Lattice specimens printed as BCC cell structure may not be accurate as face-centered
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cubic (FCC) structure due to several of peak contact point on the outer wall of BCC cell
structure. More contact area for compressive test data are gathered for FCC structure.
deformation and the machine error. Calibration is required to determine machine error
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CHAPTER 5 CONCLUSION
Overall of the experiment concluded that low Young’s modulus, ultimate tensile strength and
high strain value that affected elastic deformation are suitable to select as suitable lattice
Thus, with experiments verification and numerical data analysis shown that Snowflake
design is suitable to select as auxetic lattice reinforced composites work with elastic layer as
The auxetic lattice reinforced composites exhibit enhanced stiffness and energy absorption
under uniaxial compression. The degree of auxetic behavior can be used to tune the stiffness
and energy absorption of the composites. The author hopes that chosen lattice structure able
deformation, compared to existing composite material in elastic polishing pad. Aiming at the
mechanical properties of the auxetic lattice reinforce composites, it also able to help the edge
stress mutation of the contact was out of the effective material removal range.
compression distance at 70% of lattice specimens to compress the specimens down with
movable top plate till densification to complete the each compression test.
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The following conclusions could be drawn based on this research:
1. The auxetic lattice structure exhibits enhanced stiffness and energy absorption under
compression load.
2. The effect of pad conditions has directly influenced on the pad surface roughness.
4. 3D printed end product may have printing defect such as lattice support unable to remove
5. FE analyses are required to further study and analysis on the deformation modes of unit
In the next section, recommendations of further work would be made as an extension and
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CHAPTER 6 RECOMMENDATIONS FOR FURTHER WORK
6.1 Gather more data through experiment on selected lattice structure specimens
Consistency is the key to deliver excellent results with minimum error. Thus, experiments
suggested continuing effort on printing several batches of selected suitable lattice structure to
Overall of experiments, author noticed that the data analyses are fairly important to minimize
the affected parameter such as fabrication technique. By identified the issues, experiment
6.2 Working on lattice cell modeling with Finite Element Analysis (FEA) software
structure in unit cells are required to establish with FEA software such as ANSYS FEA
ANSYS FEA mechanical not only able to work closely with Autodesk platform such as
Fusion 360 seamless without thinking of data transfer issue and it also provide fatigue and
material analysis. Being able to understand the immediate stresses and deformations a part
undergoes is critical to structural analysis. Any part undergoing repeated loading may
accumulate damage that will eventually result in part failure even though the loading is not
close to the material’s strength limits. Fatigue analysis lets you visualize damage during
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cyclic loading and can help to predict when and where failure may occur and increase
product durability.
With explicit tool, it allows user to stimulate the quasi-static compression tests this enabled
As with simulation experiments, BBC lattice structure were construct with the suggested
mesh sensitivity at 0.6~0.8mm, all the degrees of freedom were fixed on the building
direction that placed on the bottom plate. A prescribed parametric data such as compression
speed at a speed of 0.064mm/s, corresponding to a global strain rate of 0.001 are required
to input as well. A general contact algorithm, with the friction coefficient set at 0.35 was
employed as well. With the high sensitivity of mesh sensitivity, it will take longer time to
Fabrication of actual auxetic lattice reinforced composites with define lattice structure are
suggested with back up comprehensive data of stress-strain curve, cell deformation data, and
FEA.
It required to find a suitable epoxy to adhere on the on the bottom of rubber before proceed
to mount on work module for simulation. The aim is to counter check with the increasing the
gradient rings could reduce the abrupt change of boundary stress and the contact stress in the
single gradient ring was basically keep in minimum and constant basis.
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Comparison of actual elastic polishing pad and auxetic lattice reinforce composites elastic
polishing pad in term of boundary stress analysis and central stress analysis are required.
Both pads are required to dry run to examine on the both analyses and observed under high
power microscope.
Comparison specimens with the mass ratio of 20phr and 50phr respectively, were prepared
according to identical composites. It was not only to simplify the experiment, but also verify
whether the identical composites could replace the FGMs served as the elastic layer applied
Thermal expansion was reported in several thesis and researches .the heats are created
through friction that might influence of the consistency of mechanical properties and
efficiency application of polishing. Coefficient of thermal expansion will involves with the
temperature rises. Further experiment on polishing around room temperature with 30 +/-
10 is suggested.
The existing work only focuses on uniform lattice structure for fundamental mechanical
properties testing. Thus, the future work should consider changing the lattice density, strut
diameter, and lattice type to achieve the adjustable /tunable Young’s modulus of the lattice
specimens so that we are able to produce the ideal polishing pad with uniform material
removal rate.
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7. REFERENCES
printing
[2]. https://www.economist.com/technology-quarterly/2013/09/05/3d-printing-scales-up
[3]. http://www.theengineer.co.uk/in-depth/the-big-story/the-rise-of-additive-
manufacturing/1002560.article
Chemical-mechanical polishing
[5]. K.H. Park, H.J. Kim, O.M. Chang, H.D. Jeong (2007), - Effects of pad properties on
[7]. Mingsheng Jin, Xiaoxing Dong, Liming Wang, Dongjie Zhu, Jie Kang (2019), Design
[8]. https://www.researchgate.net/figure/Color-online-Schematic-illustration-of-chemical-
mechanical-planarizer-and-the-contact_fig11_241472740
[9]. https://formlabs-media.formlabs.com/datasheets/Safety_Data_Sheet_EN_-_Clear.pdf
[10]. https://support.formlabs.com/s/article/Form-Cure-Time-and-Temperature-
Settings?language=en_US – Form Cure time and temperature setting for FormLab Form
2 machine
[11]. https://support.formlabs.com/s/article/Form-Wash-Time-Settings?language=en_US –
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[12]. https://support.formlabs.com/s/article/Maintaining-Resin-
machine
[13]. https://www.sciencedirect.com/topics/engineering/stress-strain-curve
[14]. Z.P. Sun ∗, Y.B. Guo, V.P.W. Shim (2021), Characterization and modeling of
[15]. Tiantian Li, Yanyu Chen, Xiaoyi Hua, Yangbo Li, Lifeng Wang (2018), Exploiting
properties
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8. APPENDICES
Table 1
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